Wafer surface three-dimensional shape measuring device

Abstract

The utility model discloses a wafer surface three-dimensional shape measuring device. The device comprises a shell, one side face of the shell is provided with an opening, the bottom of the interior of the shell is used for installing a measured object, the top of the shell is provided with a camera, the middle of the shell is provided with an inclined semi-transparent and semi-reflecting mirror, the inner side face of the shell is provided with a vertical light source, the optical axis of the camera is perpendicular to the measured object, and the optical axis of the camera is perpendicular to the measured object. The included angle between the semi-transparent and semi-reflective mirror and the measured object is 45 degrees, and the light source is close to the bottom surface of the semi-transparent and semi-reflective mirror. The wafer surface three-dimensional shape measuring device can be used for realizing on-line and rapid measurement of the wafer surface three-dimensional shape, is small in size, and can be additionally arranged on any wafer processing equipment.

Description

Technical Field

[0001] The utility model relates to the field of optical measuring devices, in particular to a wafer surface three-dimensional shape measuring device. Background Art

[0002] For semiconductor manufacturing, 3D reconstruction of the wafer surface is crucial, especially in key steps such as ion implantation, chemical vapor deposition and photolithography. The wafer is often deformed due to high temperature processing and material deposition, and any irregular shape may affect the production quality and performance of the chip. Therefore, accurate 3D reconstruction can evaluate the shape and flatness of the wafer in detail, which is critical to ensure that the wafer is correctly positioned in the manufacturing equipment.

[0003] Compared with traditional offline measurement methods, online detection technology can monitor and analyze wafer morphology in real time during the production process, which can not only adjust production parameters to adapt to deformation, but also avoid chip defects caused by excessive deformation. Therefore, real-time feedback and adjustment of online technology can greatly improve production efficiency and chip quality.

[0004] However, most of the mainstream 3D measurement equipment on the market are offline. These devices are not only bulky, but also have timeliness issues in data update and processing, which often lead to the inability to respond to changes on the production line immediately. In addition, offline measurement equipment requires the wafer to be removed from the production line for measurement, which increases the production cycle and affects the overall production efficiency. Utility Model Content

[0005] To solve the above problems, the utility model provides a wafer surface three-dimensional topography measuring device, which can be used to achieve online and rapid measurement of the three-dimensional topography of the wafer surface, and has a small size and can be installed on any wafer processing equipment.

[0006] According to one aspect of the utility model, a wafer surface three-dimensional morphology measuring device is provided, comprising a shell, one side of which is open, the bottom of the shell is used to install the object to be measured, a camera is installed on the top, an inclined semi-transparent and semi-reflective mirror is arranged in the middle, and a vertical light source is arranged on the inner side of the shell, wherein the optical axis of the camera is perpendicular to the object to be measured, the angle between the semi-transparent and semi-reflective mirror and the object to be measured is 45°, and the light source is close to the bottom surface of the semi-transparent and semi-reflective mirror.

[0007] In some embodiments, the housing is made of sheet metal, which is advantageous in that the housing can have good light shielding properties and will not have excessive specular reflection.

[0008] In some implementations, the shooting range of the camera covers the object to be measured, which is beneficial in that the comprehensiveness of the camera shooting can be ensured.

[0009] In some embodiments, the horizontal projection of the semi-transparent and semi-reflective mirror is slightly larger than the object to be measured. This is beneficial in that it can ensure that the image reflected by the semi-transparent and semi-reflective mirror can completely cover the object to be measured.

[0010] In some embodiments, the size of the light source is slightly larger than the object to be measured, which is beneficial in that it can ensure that the image projected by the light source can completely cover the object to be measured.

[0011] In some embodiments, a plurality of cameras are mounted side by side on the top of the housing, and the common shooting range of all the cameras covers the object to be measured. The benefit of this is that a setting method is described when the size of the object to be measured is too large. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic structural diagram of a wafer surface three-dimensional topography measurement device according to an embodiment of the utility model;

[0013] Figure 2 for Figure 1 A schematic structural diagram of the other side of a wafer surface three-dimensional topography measuring device is shown;

[0014] Figure 3 for Figure 1 The figure shows a schematic diagram of the structure of a wafer surface three-dimensional topography measuring device when multiple cameras are installed.

[0015] In the figure: housing 1, object to be measured 2, camera 3, semi-transparent and semi-reflective mirror 4, light source 5, door panel 6. DETAILED DESCRIPTION

[0016] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0017] like Figure 1-2 As shown, the device includes a shell, which is roughly in the shape of a rectangular parallelepiped and has an opening on one side, and other main structures, including the object to be measured, a camera, a semi-transparent and semi-reflective mirror and a light source, are all installed inside the shell.

[0018] Preferably, the housing is made of sheet metal, has good light-shielding properties, and does not have excessive specular reflection.

[0019] Further preferably, a door panel that can be opened and closed can be provided on the side opposite to the opening on the housing as needed.

[0020] The object to be measured is a wafer, which is horizontally installed at the bottom of the housing, while the camera is installed at the top of the housing with its lens facing the object to be measured below. The optical axis of the camera is perpendicular to the object to be measured, and the camera's shooting range covers the object to be measured, thereby ensuring the accuracy and comprehensiveness of the camera's shooting.

[0021] The semi-transparent and semi-reflective mirror is arranged in the middle of the housing, wherein the semi-transparent and semi-reflective mirror is arranged to be inclined, and has a top surface and a bottom surface that are also inclined, and the angle between the semi-transparent and semi-reflective mirror and the object to be measured is 45°. At the same time, the horizontal projection of the semi-transparent and semi-reflective mirror is slightly larger than the object to be measured, thereby ensuring that its reflected image can completely cover the object to be measured.

[0022] The light source is vertically arranged and located on one of the inner sides of the housing, wherein the light source is close to the bottom surface of the semi-transparent and semi-reflective mirror. At the same time, the size of the light source is slightly larger than the object to be measured, so as to ensure that the image projected by it can completely cover the object to be measured.

[0023] When the wafer surface three-dimensional shape measuring device is used, it is placed on the front-end module of the wafer processing equipment, and the opening side of the housing faces the wafer processing equipment.

[0024] The wafer to be tested is then transported to the device by a robotic arm, and a computer controls the light source to project a variable sinusoidal fringe pattern. After being reflected to the surface of the wafer to be tested by a semi-transparent and semi-reflective mirror, the camera captures the deformed sinusoidal fringes reflected from the wafer surface. The relationship between the height and phase shift of the surface to be tested is then established through calculation, thereby realizing the measurement of the three-dimensional morphology of the wafer surface to guide the real-time adjustment of production parameters.

[0025] like Figure 3 As shown, when the size of the object to be measured is too large and the shooting range of a single camera is not enough to completely cover it, multiple cameras can be installed side by side on the top of the housing, and the common shooting range of all cameras can cover the object to be measured.

[0026] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A wafer surface three-dimensional topography measurement device, characterized in that: The invention comprises a shell (1), one side of which is open, the bottom of the shell (1) is used to install the object to be measured (2), the top is installed with a camera (3), the middle is provided with an inclined semi-transparent and semi-reflective mirror (4), and the inner side of the shell (1) is provided with a vertical light source (5), wherein the optical axis of the camera (3) is perpendicular to the object to be measured (2), the angle between the semi-transparent and semi-reflective mirror (4) and the object to be measured (2) is 45 degrees, and the light source (5) is close to the bottom surface of the semi-transparent and semi-reflective mirror (4).

2. The wafer surface three-dimensional topography measuring device according to claim 1, characterized in that: The housing (1) is made of sheet metal.

3. The wafer surface three-dimensional topography measuring device according to claim 1, characterized in that: The shooting range of the camera (3) covers the object to be measured (2).

4. The wafer surface three-dimensional topography measuring device according to claim 3, characterized in that: The horizontal projection of the semi-transparent and semi-reflective mirror (4) is slightly larger than the object to be measured (2).

5. The wafer surface three-dimensional topography measuring device according to claim 4, characterized in that: The size of the light source (5) is slightly larger than the object to be measured (2).

6. The wafer surface three-dimensional topography measuring device according to claim 1, characterized in that: A plurality of cameras (3) are installed side by side on the top of the housing (1), and a common shooting range of all the cameras (3) covers the object to be measured (2).

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