Electrostatic chuck
By designing a combination of multiple thimble body and side limit needles on the electrostatic chuck, all of which are distributed on the circumference of the chuck main body, the problem of existing electrostatic chuck bending and shrapnel after the wafer is released, and the improvement is achieved Uniform force transmission and structural simplification improve process efficiency.
Patent Information
- Application Number
- CN202421216883.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-30
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-05-30
AI Technical Summary
After the existing electrostatic chuck releases the wafer, the support force of the thimble and the Coulomb adsorption force of the wafer are difficult to balance, resulting in the wafer being easily bent or shrapneled, and the structure is complicated.
An electrostatic chuck is designed, using a combination of the first thimble body, the second thimble body and the third thimble body, which are all distributed on the circumference where the center of the chuck body is the center, and are equipped with a first side limiting needle and a second side The limiting needle and the third-side limiting needle, through the connection between these side limiting needles and the thimble body, create a more uniform force to avoid bending and shrapnel.
Through this design, the bending phenomenon of the wafer is reduced, the structure of the electrostatic chuck is simplified, and the shrapnel phenomenon of the wafer is effectively avoided, improving process efficiency.
Smart Images
Figure CN222507599U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductors, in particular to an electrostatic chuck. Background Art
[0002] In the prior art, a patent with publication number CN216957984U discloses an electrostatic chuck, including: a chuck body, used to support and clamp a wafer; an electrode, located in the chuck body, used to generate Coulomb attraction when a voltage is applied to adsorb the wafer on the chuck body; a first ejector pin, located at the edge of the chuck body; a second ejector pin, located at the center of the chuck body; wherein the first ejector pin and the second ejector pin move vertically in a direction perpendicular to the chuck body, and after the chuck body releases the wafer, the wafer is lifted up to separate from the chuck body. The electrostatic chuck provided by the utility model, when the electrostatic chuck releases the wafer and lifts up the wafer, the supporting force of the first ejector pin and the second ejector pin can reach a balance with the Coulomb adsorption force generated by the incomplete release of the wafer charge, so that the wafer does not bend / shrapnel phenomenon occurs, thereby improving process efficiency.
[0003] However, in this technology, multiple first ejector pins and multiple second ejector pins are provided, making the electrostatic chuck structure more complicated. In addition, the electrostatic chuck is subjected to different forces at the first ejector pin and the second ejector pin, and bending and / or spring fragments are still prone to occur when the first ejector pin and the second ejector pin are pushed up. Utility Model Content
[0004] The technical problem to be solved by the utility model is to provide an electrostatic chuck to solve the problem raised in the background technology.
[0005] In order to solve the above technical problems, the technical solution of the utility model is:
[0006] An electrostatic chuck comprises a chuck body for supporting and clamping a wafer and a pin assembly for lifting the wafer, wherein an electrode is arranged in the chuck body, and the pin assembly comprises a first pin body, a second pin body and a third pin body, wherein the first pin body, the second pin body and the third pin body are arranged between the edge of the chuck body and the center of the chuck body, and the pin assembly further comprises a first side limit pin, a second side limit pin and a third side limit pin, wherein the first side limit pin, the second side limit pin and the third side limit pin are all located on the side of the chuck body, the first side limit pin is connected to the first pin body through a first connecting piece, the second side limit pin is connected to the second pin body through a second connecting piece, and the third side limit pin is connected to the third pin body through a third connecting piece.
[0007] Preferably, the first ejector body, the second ejector body, the third ejector body and the center of the chuck body are equidistant from each other.
[0008] Preferably, the first ejector body, the second ejector body and the third ejector body are evenly distributed on a circumference with the center of the chuck body as the center.
[0009] Preferably, the radius of the circle is half the radius of the chuck body.
[0010] Preferably, the first side limiting needle, the second side limiting needle and the third side limiting needle are all cylindrical.
[0011] Preferably, the distance between the center line of the cylindrical first side limit pin and the center line of the chuck body is greater than the sum of the radius of the chuck body and the radius of the first side limit pin, the distance between the center line of the cylindrical second side limit pin and the center line of the chuck body is greater than the sum of the radius of the chuck body and the radius of the second side limit pin, and the distance between the center line of the cylindrical third side limit pin and the center line of the chuck body is greater than the sum of the radius of the chuck body and the radius of the third side limit pin.
[0012] The above technical solution has the following beneficial effects:
[0013] By arranging the first ejector body, the second ejector body and the third ejector body to lift the wafer, the bending of the wafer is reduced and the structure is simpler compared with the prior art;
[0014] The wafer is limited by setting the first side limiting pin, the second side limiting pin and the third side limiting pin to avoid wafer shrapnel. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 This is a schematic cross-sectional view of an electrostatic chuck of the utility model;
[0016] Figure 2 The utility model is a schematic diagram of a top view of an electrostatic chuck. DETAILED DESCRIPTION
[0017] The specific implementation methods of the present invention are further described below in conjunction with the accompanying drawings. It should be noted that the description of these implementation methods is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in each implementation method of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0018] refer to Figure 1 , Figure 2The electrostatic chuck includes a chuck body 1 for supporting and clamping a wafer 2 and a pin assembly for lifting the wafer 2. An electrode 4 and a gas channel 3 are arranged in the chuck body 1. The pin assembly includes a first pin body 5, a second pin body 6 and a third pin body 11. The first pin body 5, the second pin body 6 and the third pin body 11 are arranged between the edge of the chuck body 1 and the center of the chuck body 1 to facilitate better lifting of the wafer 2. Compared with the comparative document, the structure of the electrostatic chuck can be simplified. The pin assembly also includes a first side limit pin 7, a second side limit pin 8 and a third side limit pin 12. The first side limit pin 7, the second side limit pin 8 and the third side limit pin 12 are arranged between the edge of the chuck body 1 and the center of the chuck body 1. The second side limit pins 8 and the third side limit pins 12 are both located on the side of the chuck body, the first side limit pin 7 is connected to the first ejector body 5 through the first connecting piece 9, the second side limit pin 8 is connected to the second ejector body 6 through the second connecting piece 10, and the third side limit pin 12 is connected to the third ejector body 11 through the third connecting piece. By arranging the first side limit pin 7, the second side limit pin 8 and the third side limit pin 12, the position of the circumferential direction of the wafer 2 can be limited. When the first ejector body 5, the second ejector body 6 and the third ejector body 11 lift the wafer 2, the position of the wafer 2 is kept upward and separated from the electrostatic chuck;
[0019] The first ejector body 5, the second ejector body 6, the third ejector body 11 are at the same distance from the center of the chuck body 1, that is, the first ejector body 5, the second ejector body 6, the third ejector body 11 are located on the same circumference;
[0020] The first ejector body 5, the second ejector body 6, and the third ejector body 11 are evenly distributed on a circumference with the center of the chuck body as the center, and can provide a more uniform force when lifting the wafer 2, so as to facilitate the stable lifting of the wafer 2;
[0021] The radius of the circle is half of the radius of the chuck body 1. Compared with the prior art, the wafer 2 is lifted at the center and edge of the wafer 2. The forces at the two positions are different. If the wafer 2 is lifted at both positions at the same time, it is easy to cause spring fragments or bend. The lifting position is set on the circle, and the force is relatively more uniform, reducing the occurrence of spring fragments.
[0022] The first side limit pin 7, the second side limit pin 8, and the third side limit pin 12 are all cylindrical, the distance between the center line of the cylindrical first side limit pin 7 and the center line of the chuck body is greater than the sum of the radius of the chuck body and the radius of the first side limit pin 7, the distance between the center line of the cylindrical second side limit pin 8 and the center line of the chuck body is greater than the sum of the radius of the chuck body and the radius of the second side limit pin 8, and the distance between the center line of the cylindrical third side limit pin 12 and the center line of the chuck body is greater than the sum of the radius of the chuck body and the radius of the third side limit pin 12, so as to limit the circumferential position of the wafer 2 without contacting the electrostatic chuck and causing wear of the electrostatic chuck;
[0023] By providing the first ejector body 5, the second ejector body 6, and the third ejector body 11 to lift the wafer 2, the bending of the wafer 2 is reduced compared to the prior art, and the structure is simpler;
[0024] The wafer 2 is limited by setting the first side limiting pin 7 , the second side limiting pin 8 , and the third side limiting pin 12 to prevent the wafer 2 from being shrapnel.
[0025] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions and variations of these embodiments are made without departing from the principles and spirit of the present invention, and still fall within the scope of protection of the present invention.
Claims
1. An electrostatic chuck, characterized in that: The invention comprises a chuck body for supporting and clamping a wafer and a pin assembly for lifting the wafer, wherein an electrode is arranged in the chuck body, and the pin assembly comprises a first pin body, a second pin body and a third pin body, wherein the first pin body, the second pin body and the third pin body are arranged between the edge of the chuck body and the center of the chuck body, and the pin assembly further comprises a first side limit pin, a second side limit pin and a third side limit pin, wherein the first side limit pin, the second side limit pin and the third side limit pin are all located on the side of the chuck body, the first side limit pin is connected to the first pin body through a first connecting piece, the second side limit pin is connected to the second pin body through a second connecting piece, and the third side limit pin is connected to the third pin body through a third connecting piece.
2. An electrostatic chuck according to claim 1, characterized in that: The first ejector body, the second ejector body, the third ejector body and the center of the chuck body are equidistant from each other.
3. An electrostatic chuck according to claim 2, characterized in that: The first ejector body, the second ejector body and the third ejector body are all distributed on a circumference with the center of the chuck body as the center.
4. An electrostatic chuck according to claim 3, characterized in that: The radius of the circle is half the radius of the chuck body.
5. An electrostatic chuck according to claim 1, characterized in that: The first side limiting pin, the second side limiting pin, and the third side limiting pin are all cylindrical.
6. An electrostatic chuck according to claim 5, characterized in that: The distance between the center line of the cylindrical first side limit pin and the center line of the chuck body is greater than the sum of the radius of the chuck body and the radius of the first side limit pin, the distance between the center line of the cylindrical second side limit pin and the center line of the chuck body is greater than the sum of the radius of the chuck body and the radius of the second side limit pin, and the distance between the center line of the cylindrical third side limit pin and the center line of the chuck body is greater than the sum of the radius of the chuck body and the radius of the third side limit pin.