Simple optical module laser aging control system

Abstract

The utility model relates to the technical field of optical module laser aging, in particular to a simple optical module laser aging control system, which comprises a communication interface circuit, an MCU (Microprogrammed Control Unit), a current source, a current source control circuit, an optical module interface circuit and a system power supply circuit, the communication interface circuit is connected with the MCU, the system power supply circuit is connected with the MCU, the number of the current sources is N, N is a positive integer larger than or equal to 1, the current source control circuit is connected with the MCU and the N current sources, and the optical module interface circuit is configured to be an optical module matched with one or more packaging interface forms. According to the utility model, the optical module laser is aged in a mode that the optical module interface circuit is compatible with the optical module golden finger, and the device has the advantages of simple structure, low cost, simple operation and high aging efficiency, and is suitable for large-scale laser aging and testing of the optical module.

Description

Technical Field

[0001] The utility model relates to the technical field of optical module laser aging, in particular to a simple optical module laser aging control system. Background Art

[0002] With the development of the information industry, the use of optical modules in the communications industry has increased day by day, and has basically occupied more than 80% of the interface module share. As a key component of the optical module, the stability and reliability of the laser are crucial to the normal operation of the optical module. In order to effectively intercept and screen lasers with poor quality and reliability defects, laser aging is a very important production link. And for the production and manufacturing of large quantities of optical modules, how to improve the aging efficiency of the laser is an urgent problem faced by many optical module manufacturers.

[0003] The existing mechanical clamp assembly probe aging method has the following disadvantages:

[0004] 1. Too many probes are required. One laser requires at least one probe, and the production cost is high.

[0005] 2. The precision requirement for the probe to align with the laser pad is too high. Taking the VCSEL laser as an example, the VCSEL laser pad is a circular disk with a diameter of only about 69um, and there are many lasers, which increases the precision requirement for the probe alignment;

[0006] 3. There are many types of optical modules. Different generations of the same type of optical modules have different printed circuit board designs and laser positions. As a result, when replacing an optical module, the probe needs to be recalibrated and positioned so that the probe can accurately find the laser pad position. The operation is complicated and time-consuming, which seriously affects production efficiency. Utility Model Content

[0007] The purpose of the utility model is to provide a simple optical module laser aging control system, which ages the optical module laser by making the optical module interface circuit compatible with the optical module gold finger. The utility model has the advantages of simple structure, low cost, simple operation and high aging efficiency. The utility model is suitable for large-scale laser aging and testing of optical modules to solve the problems pointed out in the background technology.

[0008] The embodiment of the utility model is realized by the following technical scheme: a simple optical module laser aging control system, including a communication interface circuit, an MCU, a current source, a current source control circuit, an optical module interface circuit and a system power supply circuit;

[0009] The communication interface circuit is connected to the MCU to input a control command signal output by a host computer to the MCU and to feed back a monitoring signal output by the MCU to the host computer at the same time. The system power supply circuit is connected to the MCU and is controlled by the MCU to supply power to the MCU and to supply power to the communication interface circuit, the current source, the current source control circuit and the optical module interface circuit through the MCU at the same time. The current source is provided with N current sources, where N is a positive integer greater than or equal to 1. The current source control circuit is connected to the MCU and the N current sources and is controlled by the MCU to input a bias current to the optical module interface circuit through the N current sources under the regulation of the MCU.

[0010] According to a preferred embodiment, the current source is a high-precision current source or an IDAC.

[0011] According to a preferred embodiment, the current source control circuit includes a chip U15, whose output side includes a capacitor C84, a capacitor C85, a capacitor C86, a resistor R102 and a resistor R101;

[0012] Among them, the VOUT pin of the chip U15 is connected to the voltage output port via the first ends of capacitor C84 and capacitor C85 in sequence, the second ends of the capacitor C84 and capacitor C85 are grounded, the Vo Sense+ pin of the chip U15 is connected to the first ends of capacitor C86 and resistor R102 respectively via the first end of resistor R101, the Vo Sense- pin of the chip U15 and the second end of resistor R101 are grounded, and the second ends of capacitor C86 and resistor R102 are connected to the voltage output port.

[0013] According to a preferred embodiment, the input side of the chip U15 includes a resistor R1, and the MCU is connected to the PG pin of the chip U15 via the resistor R1.

[0014] According to a preferred embodiment, the input side of the chip U15 further includes a resistor R11, and the EN pin of the chip U15 is grounded via the resistor R11.

[0015] According to a preferred embodiment, the input side of the chip U15 also includes a capacitor C94, a resistor R100 and a resistor R4, the VCC pin of the chip U15 is connected to the first end of the capacitor C94, the MODE pin of the chip U15 is connected to the first end of the resistor R100, the CS pin of the chip U15 is connected to the first end of the resistor R4, and the second ends of the capacitor C94, the resistor R100 and the resistor R4 are grounded.

[0016] According to a preferred embodiment, the input side of the chip U15 further includes a capacitor C15, and the TRK pin and the REF pin of the chip U15 are grounded via the capacitor C15.

[0017] According to a preferred implementation, the optical module interface circuit is compatible with one or more interface types of SFP, QSFP, QSFP-DD, and OSFP.

[0018] The technical solution of a simple optical module laser aging control system provided by the embodiment of the utility model has at least the following advantages and beneficial effects: the utility model ages the optical module laser by means of an optical module interface circuit being compatible with the optical module gold finger, and has the advantages of simple structure, low cost, simple operation and high aging efficiency, and is suitable for large-scale laser aging and testing of optical modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the structure of a simple optical module laser aging control system provided in Example 1 of the utility model;

[0020] Figure 2 This is a schematic diagram of the current source control circuit provided in Example 1 of the utility model. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0022] Example 1

[0023] See also Figure 1 As shown, Figure 1 The schematic diagram of the structure of the simple optical module laser aging control system provided by the embodiment of the present invention. More specifically, the simple optical module laser aging control system includes a communication interface circuit, an MCU, a current source, a current source control circuit, an optical module interface circuit and a system power supply circuit, wherein the current source is a high-precision current source or an IDAC, preferably a high-precision current source, and the high-precision current source is used for the following description.

[0024] The communication interface circuit is connected to the MCU to input the control command signal output by the host computer to the MCU and simultaneously feed back the monitoring signal output by the MCU to the host computer; in some embodiments, the communication interface circuit inputs the control command signal output by the host computer to the MCU to control the high-precision current source control circuit, and feeds back the information that needs to be controlled and read to the host computer, thereby realizing the host computer's control over the aging control system.

[0025] In the aging control system, the MCU adopts a separate power supply design to control the power supply of other functional circuits, as follows: the system power supply circuit is connected to the MCU and controlled by the MCU to supply power to the MCU and simultaneously supply power to the communication interface circuit, current source, current source control circuit and optical module interface circuit through the MCU.

[0026] The current source is provided with N channels, N is a positive integer greater than or equal to 1, and the current source control circuit is connected to the MCU and the N-channel current sources and is controlled by the MCU to determine the number of channels of the current source and the current size of the current source according to different application requirements under the regulation of the MCU, and input the bias current to the optical module interface circuit through the N-channel current sources.

[0027] The optical module interface circuit is configured to match optical modules of one or more packaging interface forms to achieve docking with various types of modules, so that the bias current generated by the high-precision current source can be delivered to the laser inside each type of optical module; in addition, the number of interfaces required to be supported can be expanded according to application requirements. Specifically in this embodiment, the optical module interface circuit is configured to match one or more packaging interface forms of SFP, QSFP, QSFP-DD, and OSFP.

[0028] See also Figure 2 As shown, the current source control circuit includes a chip U15, and its output side includes capacitors C84, C85, C86, resistors R102 and R101; wherein the VOUT pin of the chip U15 is connected to the voltage output port via the first ends of the capacitors C84 and C85 in sequence, and the second ends of the capacitors C84 and C85 are grounded to achieve the effect of filtering and stabilizing the output voltage, and the Vo Sense of the chip U15 + The pins are connected to the first ends of capacitor C86 and resistor R102 through the first ends of resistor R101. The Vo Sense of the chip U15 - The pin and the second end of the resistor R101 are grounded, and the second ends of the capacitor C86 and the resistor R102 are connected to the voltage output port, which can significantly improve the output stability, reduce the output ripple, and enable fine voltage adjustment, thereby ensuring the voltage stability at the load end.

[0029] The input side of the chip U15 includes a resistor R1, and the MCU is connected to the PG pin of the chip U15 via the resistor R1. The pull-up resistor helps to keep the PG pin in a high level state, so that the state of the PG pin can be read by the MCU to enable the MCU to detect the power state of the current source.

[0030] The input side of the chip U15 also includes a resistor R11, and the EN pin of the chip U15 is grounded via the resistor R11; by adding a pull-down resistor to the EN pin and configuring the MCU pin to a push-pull mode, its output level can be increased, thereby enhancing the noise tolerance of the chip input signal and enhancing the anti-interference ability.

[0031] The input side of the chip U15 also includes a capacitor C94, a resistor R100 and a resistor R4. The VCC pin of the chip U15 is connected to the first end of the capacitor C94, the MODE pin of the chip U15 is connected to the first end of the resistor R100, the CS pin of the chip U15 is connected to the first end of the resistor R4, and the second ends of the capacitor C94, the resistor R100 and the resistor R4 are grounded; wherein, the grounding of the VCC pin can play a filtering and voltage stabilizing role, that is, maintaining the stability of the current source voltage and filtering out high-frequency noise and clutter; the MODE pin is grounded through a resistor to isolate the pin from interference with other parts, ensuring the purity and reliability of the signal, thereby improving the stability and response speed of the system; the CS pin is grounded through a resistor to select the chip by default without the need for an additional control signal, which makes it more convenient to use directly on an optical module interface circuit in the form of a single package interface.

[0032] The input side of the chip U15 also includes a capacitor C15, and the TRK pin and REF pin of the chip U15 are grounded via the capacitor C15, thereby significantly improving the stability, anti-interference ability, frequency compensation effect and common-mode suppression performance of the chip.

[0033] The following is a description of the usage process of the provided aging control system:

[0034] Place the aging device in the aging box and connect the power box and communication line. The communication line of the aging device can be a USB to Type B female elbow plug cable;

[0035] Configure the PC and open the corresponding host software. The host software sends a self-test command to the MCU through the communication interface circuit. The MCU obtains the status of the current source control circuit and the current source and checks whether the current source control circuit and the current source are normal, and feeds back the information to the host software through the communication interface circuit. The communication interface circuit can be designed with the CH341 series USB and I2C communication protocol conversion chip. After the host software confirms that the aging device is in a normal state, it sets the number of current source channels to be configured and the number of optical modules to be aged. If the host software confirms that the aging device is in an abnormal state, it alerts the operator.

[0036] Insert the optical module that needs to age the laser into the optical module interface circuit, and set the current output by the current source through the host computer software according to the laser aging condition of the optical module. It should be noted that due to the wide variety of interfaces, it is inconvenient to design them all on the same aging device, so it is possible to consider designing an independent optical module interface circuit for each packaging form.

[0037] After confirming that the optical module is correctly plugged in, turn on the current source. The current source and the current source control circuit can be selected and designed according to the laser type and the required aging current. For example, for VCSEL laser aging, the aging current is generally within 15mA. Shengbangwei's SGM90508 can be used to select the current source and the current source control circuit; adjust the temperature of the aging box to the target aging temperature, and further set the current source output current time according to the laser aging requirements. The upper computer software can control the aging time and process;

[0038] During the aging period, the host computer software continuously monitors the status of the aging device. If an abnormality is found, the system power supply circuit is shut down through the MCU to cut off the internal power supply to protect the optical module.

[0039] After the aging is completed, the MCU turns off the current source output current to prevent the laser from over-aging.

[0040] To sum up, the technical solution of a simple optical module laser aging control system provided by the embodiment of the utility model has at least the following advantages and beneficial effects: the utility model ages the optical module laser by means of an optical module interface circuit being compatible with the optical module gold finger, and has the advantages of simple structure, low cost, simple operation and high aging efficiency, and is suitable for large-scale laser aging and testing of optical modules.

[0041] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be subject to various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A simple optical module laser aging control system, characterized in that: It includes a communication interface circuit, an MCU, a current source, a current source control circuit, an optical module interface circuit and a system power supply circuit; The communication interface circuit is connected to the MCU to input a control command signal output by a host computer to the MCU and to feed back a monitoring signal output by the MCU to the host computer at the same time. The system power supply circuit is connected to the MCU and is controlled by the MCU to supply power to the MCU and to supply power to the communication interface circuit, the current source, the current source control circuit and the optical module interface circuit through the MCU at the same time. The current source is provided with N current sources, where N is a positive integer greater than or equal to 1. The current source control circuit is connected to the MCU and the N current sources and is controlled by the MCU to input a bias current to the optical module interface circuit through the N current sources under the regulation of the MCU. The optical module interface circuit is configured to match an optical module with one or more packaging interface forms.

2. The simple optical module laser aging control system as described in claim 1, characterized in that: The current source is a high-precision current source or an IDAC.

3. The simple optical module laser aging control system as described in claim 2, characterized in that: The current source control circuit includes a chip U15, and its output side includes a capacitor C84, a capacitor C85, a capacitor C86, a resistor R102, and a resistor R101; The VOUT pin of the chip U15 is connected to the voltage output port through the first end of the capacitor C84 and the capacitor C85 in turn, the second end of the capacitor C84 and the capacitor C85 is grounded, and the Vo Sense pin of the chip U15 is connected to the voltage output port through the first end of the capacitor C84 and the capacitor C85 in turn. + The pins are connected to the first ends of capacitor C86 and resistor R102 through the first ends of resistor R101. The Vo Sense of the chip U15 - The pin and the second end of the resistor R101 are grounded, and the second ends of the capacitor C86 and the resistor R102 are connected to the voltage output port.

4. The simple optical module laser aging control system as described in claim 3, characterized in that: The input side of the chip U15 includes a resistor R1 , and the MCU is connected to the PG pin of the chip U15 via the resistor R1 .

5. The simple optical module laser aging control system as described in claim 3, characterized in that: The input side of the chip U15 further includes a resistor R11 , and an EN pin of the chip U15 is grounded via the resistor R11 .

6. The simple optical module laser aging control system as described in claim 3, characterized in that: The input side of the chip U15 also includes a capacitor C94, a resistor R100 and a resistor R4. The VCC pin of the chip U15 is connected to the first end of the capacitor C94, the MODE pin of the chip U15 is connected to the first end of the resistor R100, the CS pin of the chip U15 is connected to the first end of the resistor R4, and the second ends of the capacitor C94, the resistor R100 and the resistor R4 are grounded.

7. The simplified optical module laser aging control system according to any one of claims 3 to 6, characterized in that: The input side of the chip U15 also includes a capacitor C15, and the TRK pin and the REF pin of the chip U15 are grounded via the capacitor C15.

8. The simple optical module laser aging control system as claimed in claim 1, characterized in that: The optical module interface circuit is configured to match one or more packaging interface forms of SFP, QSFP, QSFP-DD, and OSFP.

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