Switch assembly module

Abstract

The utility model discloses a switch assembly module, which is provided with a first circuit board and a second circuit board, and is characterized in that the first circuit board is provided with an amplification power division assembly; a first isolation area and a second isolation area are arranged on the second circuit board, the first isolation area is used for being provided with mutually isolated radio frequency switch assemblies, and the radio frequency switch assemblies are in communication connection with the amplification power division assembly; the second isolation area is provided with a power supply assembly and a control assembly, the power supply assembly is electrically connected with the radio frequency switch assembly and the amplification power division assembly, and the control assembly is in communication connection with the radio frequency switch assembly and the amplification power division assembly. The power supply assembly and the control assembly are arranged in the second isolation area, and especially the radio frequency switch assembly is arranged in the first isolation area, so that the space radiation among the assemblies is small, the isolation degree is high, and the technical problem that the switch assembly module is difficult to meet the isolation degree index is solved.

Description

Technical Field

[0001] The present application relates to the technical field of switch components, and in particular to a switch component module. Background Art

[0002] There are many difficulties in using switch components in communication systems to achieve arbitrary switching between different channels of the same signal. The main difficulties are insertion loss, isolation, amplifier linearity, temperature stability, size and integration that are difficult to meet requirements.

[0003] In R&D and production, it is extremely difficult to control indicators such as noise and channel isolation of switch components. In addition, switch switching requires corresponding control instructions, so a complex digital control module is needed as a control unit. However, the digital control module has a greater impact on the isolation index of the entire module. If the isolation of power lines, control lines and signal lines is not considered, it will be difficult to meet the index requirements.

[0004] The switch component modules are generally small in size, the devices are densely arranged, and the RF signals cross-talk with each other. It is difficult to meet the isolation index by relying solely on the isolation between PCB layers. Utility Model Content

[0005] The main purpose of the present application is to provide a switch component module, aiming to solve the technical problems that the switch component module is generally small in size, the devices are densely arranged, the RF signals cross-talk with each other, and it is difficult to meet the isolation index only by isolation between PCB layers.

[0006] To achieve the above-mentioned purpose, the present application provides a switch component module, a first circuit board, a surface of which is provided with an amplifying power division component; a second circuit board, a surface of which is provided with a first isolation area and a second isolation area, the first isolation area is provided with a plurality of mutually isolated radio frequency switch components, and the radio frequency switch components are communicatively connected to the amplifying power division component; the second isolation area is provided with a power supply component and a control component, the power supply component is electrically connected to the radio frequency switch component and the amplifying power division component, respectively, and the control component is communicatively connected to the radio frequency switch component and the amplifying power division component, respectively; the amplifying power division component is used to amplify each input signal to generate a plurality of groups of output signals with the same output amplitude, and send each output signal to each corresponding radio frequency switch component respectively; the radio frequency switch component is used to select one of each group of output signals for output using the instruction of the control component; the power supply component is used to supply power to the radio frequency switch component and the amplifying power division component respectively.

[0007] Optionally, the switch assembly module also includes: a first shell, whose outer wall is provided with multiple signal input ports; a second shell, whose outer wall is provided with multiple first signal output ports and a second signal output port, the second shell is arranged opposite to the first shell, and forms a cavity with the first shell; the first circuit board is located in the cavity and fixed in the first shell; the second circuit board is located in the cavity and fixed in the second shell.

[0008] Optionally, the first isolation region includes: a plurality of first isolation sub-regions and a plurality of second isolation sub-regions, a plurality of first partition bars are provided between adjacent first isolation sub-regions, between second isolation sub-regions, and between a second isolation sub-region and an adjacent second isolation region, the plurality of first partition bars are all higher than the plane where the first circuit board is located, and the first shell is connected to the second circuit board through the first partition bars.

[0009] Optionally, the RF switch component includes: a first RF switch component, including multiple first RF switch groups, each of the first RF switch groups includes a plurality of first RF switches of the same number, and each of the second RF switch groups is respectively located in each of the second isolation sub-areas; a second RF switch component, including multiple second RF switches, each of the second RF switches is connected to a first RF switch in each of the first RF switch groups through each of the first connecting wire groups located in different conductive layers, each of the second RF switches is respectively located in each of the second isolation sub-areas, and each of the second RF switches is correspondingly connected to each of the first signal output ports.

[0010] Optionally, the second circuit board includes: a bottom layer; a control layer, stacked above the ground layer; first to sixth ground layers, stacked above the control layer; first to fifth conductive layers, alternately stacked between the first to sixth ground layers; each of the first to fifth conductive layers is provided with a first connecting wire group, and each of the first connecting wire groups is connected to a second RF switch and a first RF switch in each of the first RF switch groups after punching and changing layers, wherein the distance between each first connecting wire of each first connecting wire group located on the same conductive layer is greater than or equal to 3 mm, and a plurality of through holes connected to the ground layer are provided between each of the first connecting wires, and the orthographic projections of each first connecting wire located between different conductive layers on the ground layer do not overlap with each other; a surface layer, stacked above the sixth ground layer.

[0011] Optionally, the first circuit board includes: a third isolation area and a fourth isolation area; the third isolation area is provided with an amplifying power division component; the fourth isolation area is provided with a current detection component, the current detection component is communicatively connected to the control component and the amplifying power division component respectively, and the current detection component is used to detect the power supply current value of the amplifying power division component and supply the power current value to the second signal output port.

[0012] Optionally, the third isolation region includes: a plurality of third isolation sub-regions and a plurality of fourth isolation sub-regions, a plurality of second partition bars are provided between adjacent third isolation sub-regions, between adjacent fourth isolation sub-regions, and between a fourth isolation sub-region and an adjacent third isolation region, the plurality of second partition bars are all higher than the plane where the second circuit board is located, and the second shell is connected to the first circuit board through the second partition bars.

[0013] Optionally, the amplifying power division component includes: an amplifying component, including a plurality of amplifying circuits, each of the amplifying circuits is respectively located on the surface of each third isolation sub-area of ​​the first circuit board, and each of the amplifying circuits is connected to each of the signal input ports; a power distribution component, including a plurality of power distribution circuits, each of the power distribution circuits is correspondingly connected to each of the amplifying circuits through a second connecting line, each of the power distribution circuits is respectively located on the surface of each of the fourth isolation sub-areas of the first circuit board, and each of the power distribution circuits is correspondingly connected to multiple second RF switches of each of the second RF switch groups through multiple third connecting lines.

[0014] Optionally, a plurality of grooves are provided on one side of the first shell and the second shell opposite to each other, and the grooves are used to place the amplifying power component, the radio frequency switch component, the power supply component and the control component.

[0015] Optionally, the inner side walls of the first shell and the second shell are respectively provided with the third partition bar and the fourth partition bar, the third partition bar is screwed to match the second partition bar, and the fourth partition bar is screwed to match the first partition bar.

[0016] A switch component module proposed in an embodiment of the present application is provided with a first circuit board and a second circuit board, wherein an amplifying power division component is provided on the first circuit board; a first isolation area and a second isolation area are provided on the second circuit board, wherein the first isolation area is used for providing mutually isolated radio frequency switch components, and the radio frequency switch components are communicatively connected with the amplifying power division component; a power supply component and a control component are provided in the second isolation area, wherein the power supply component is electrically connected to the radio frequency switch component and the amplifying power division component respectively, and the control component is communicatively connected to the radio frequency switch component and the amplifying power division component respectively, and by physically isolating the amplifying power division component, the switch component, the power supply component and the control component, the power supply component and the control component are provided in the second isolation area, and in particular, the radio frequency switch component is provided in the first isolation area, so that the spatial radiation between the components is small and the isolation is high, thereby solving the technical problem that the switch component module is difficult to meet the isolation index. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A circuit schematic diagram of a switch assembly module provided in one embodiment of the present application;

[0018] Figure 2 A schematic diagram of the structure of a first circuit board of a switch assembly module provided in an embodiment of the present application;

[0019] Figure 3 A schematic diagram of the structure of a second circuit board of a switch assembly module provided in an embodiment of the present application;

[0020] Figure 4 A schematic diagram of the internal structure of a first housing of a switch assembly module provided in an embodiment of the present application;

[0021] Figure 5 A schematic diagram of the internal structure of the second shell of the switch assembly module provided in one embodiment of the present application.

[0022] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0023] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0024] Figure 1 The circuit schematic diagram of the switch assembly module provided in one embodiment of the present application is shown in FIG. Figure 1 , each intermediate frequency input 70MHz signal, after fixed attenuation, temperature compensated attenuator, amplifier, power divider, SPDT switch and RF switch, the module can realize the function of switching signals in any channel. Channel isolation is an important indicator to measure the degree of mutual interference between channels in a multi-channel system. In multi-channel applications such as wireless communications, radar systems, and medical imaging equipment, channel isolation is critical to ensuring system performance and signal quality. The channel isolation index mainly depends on the following factors: 1. Isolation of RF switch: RF switch is used to switch signals between multiple input and output channels. Ideally, when one channel is activated, other channels should be completely isolated to avoid signal cross contamination. The isolation of RF switch is defined as the signal attenuation on the non-activated channel, usually expressed in decibels dB. RF switches with high isolation can reduce interference between channels. 2. Spatial radiation: In a multi-channel system, signals may interfere with each other through spatial radiation. The isolation of spatial radiation depends on many factors, including circuit board layout, shielding effect, cable routing, and the distance between components. Good circuit design and layout can significantly improve spatial isolation.

[0025] The present application provides a switch component module for meeting the channel isolation design requirements of a radio frequency switch. Figure 2 This is a schematic diagram of the structure of the first circuit board of the switch assembly module provided in an embodiment of the present application. Figure 3This is a schematic diagram of the structure of the second circuit board of the switch assembly module provided in an embodiment of the present application, referring to Figure 1-Figure 3 The switch component module may include a first circuit board 1 and a second circuit board 2; the first circuit board 1 is provided with an amplifying power division component on its surface; the second circuit board 2 is provided with a first isolation area 201 and a second isolation area 202 on its surface, the first isolation area 201 is provided with a plurality of mutually isolated radio frequency switch components, and the radio frequency switch component is communicatively connected to the amplifying power division component; the second isolation area 202 is provided with a power supply component 3 and a control component 4, the power supply component 3 is respectively connected to the radio frequency switch component, the amplifying power division component and the control component 4, and the control component 4 is respectively communicatively connected to the radio frequency switch component and the amplifying power division component; the amplifying power division component is used to amplify each input signal and then output a plurality of output signals with the same amplitude, and send each output signal to each corresponding radio frequency switch component respectively; the radio frequency switch component is used to select one of each output signal for output; the power supply component 3 is used to supply power to the radio frequency switch component, the amplifying power division component and the control component 4 respectively.

[0026] Among them, the first circuit board 1 is stacked on one side of the second circuit board 2, and the first circuit board 1 and the second circuit board 2 can both be PCB circuit boards. The amplifying power division component can be used to enhance the amplitude of the signal, especially after the signal is attenuated, it can compensate for the attenuation. The large power division component may include an amplifier and a power divider, wherein the amplifier may be linear or have a specific gain. The signal output by the amplifier is divided by the power divider into multiple output signals of equal or unequal amplitudes to provide signals to multiple channels at the same time. The switch component is often a radio frequency switch, which is used to quickly switch between multiple radio frequency signal paths. The radio frequency switch may be a single-pole multi-throw SPDT, DPDT, etc. The radio frequency switch is used to selectively route signals between multiple channels. It should be noted that the radio frequency switch is controlled by the control component 4, and the control component 4 may be an ARM chip. The power supply component 3 is used to supply power to the amplifying power division component, the switch component and the control component 4.

[0027] Specifically, the embodiment of the present application is provided with a first circuit board 1 and a second circuit board 2, and an amplifying power division component is provided on the first circuit board 1; a first isolation area 201 and a second isolation area 202 are provided on the second circuit board 2, the first isolation area 201 is used to provide mutually isolated radio frequency switch components, and the radio frequency switch components are communicatively connected with the amplifying power division component; the second isolation area 202 is provided with a power supply component 3 and a control component 4, the power supply component 3 is electrically connected to the radio frequency switch component and the amplifying power division component, respectively, and the control component 4 is communicatively connected to the radio frequency switch component and the amplifying power division component, respectively, by physically isolating the amplifying power division component, the switch component, the power supply component 3 and the control component 4, the power supply component 3 and the control component 4 are arranged in the second isolation area 202, especially the radio frequency switch component is arranged in the first isolation area 201, so that the spatial radiation between each component is small and the isolation is high, thereby solving the technical problem that the switch component module is difficult to meet the isolation index.

[0028] In an embodiment of the present application, the switch assembly module may further include a first shell 5 and a second shell 6, wherein the outer wall of the first shell 5 is provided with a plurality of signal input ports 11; the outer wall of the second shell 6 is provided with a plurality of first signal output ports 9 and a second signal output port 10, the second shell 6 is arranged opposite to the first shell 5, and forms a cavity with the first shell 5; the first circuit board 1 is located in the cavity and is fixed in the first shell 5; the second circuit board 2 is located in the cavity and is fixed in the second shell 6.

[0029] In an embodiment of the present application, the first isolation region 201 may include a plurality of first isolation sub-regions 2011 and a plurality of second isolation sub-regions 2012, wherein a first partition bar 203 is provided between adjacent first isolation sub-regions 2011, between adjacent second isolation sub-regions 2012, and between a second isolation sub-region 2012 and an adjacent second isolation region 202, the first partition bar 203 being higher than the plane where the first circuit board 1 is located, and the second shell 6 is connected to the second circuit board 2 through the first partition bar 203.

[0030] Specifically, the first isolation sub-area 2011 can be set according to the number of the first RF switch components. First, a rectangular first sub-bar is set on the surface of the second circuit board 2 as the installation periphery of each device, and then a plurality of second sub-bars with the same length set along the first direction X can be extended on one side of the rectangle to isolate the second circuit board 2 into a plurality of first isolation sub-areas 2011. Next to the first isolation sub-area 2011, a plurality of third sub-bars along the second direction Y can be set, and then a plurality of fourth sub-bars are set along the first direction X between the plurality of second sub-bars adjacent to the second direction Y, and the third sub-bars along the second direction Y are divided into a plurality of isolation areas to form a second isolation sub-area 2012, and the plurality of second sub-bars with the same length set along the first direction X are closed by the third sub-bars. The first isolation sub-area 2011 and the second isolation sub-area 2012 form the first isolation area 201, and the remaining area is the second isolation area 202. The first sub-bar, the second sub-bar, the third sub-bar, and the fourth sub-bar form the first bar 203. The first partition bar 203 separates the signal of each channel and also separates the power supply and the radio frequency signal.

[0031] In an embodiment of the present application, the RF switch component may include a first RF switch component and a second RF switch component, wherein the first RF switch component may include a plurality of first RF switch groups, each first RF switch group includes a plurality of first RF switches 8 of the same number, and each first RF switch group is respectively located in each second isolation sub-area 2012; the second RF switch component may include a plurality of second RF switches 7, each second RF switch 7 is respectively connected to a first RF switch 8 in each first RF switch group through each first connecting wire group located in a different conductive layer, each second RF switch 7 is respectively located in each second isolation sub-area 2012, and each second RF switch 7 is correspondingly connected to each first signal output port 9.

[0032] Specifically, the number of the second isolation sub-areas 2012 can be the same as the number of the first RF switch groups, and a first RF switch group is set on the surface of the PCB circuit board in each second isolation sub-area 2012, and the first RF switch groups in different second isolation sub-areas 2012 are separated by the first partition bar 203, so that the spatial radiation between the first RF switch groups can be reduced. Exemplarily, the number of the first RF switch groups can be 5 groups, and each group of the first RF switch groups can be provided with 5 first RF switches 8. The number of the second isolation sub-areas 2012 is the same as the number of the first RF switch components, which can be 5. The first RF switch component includes 5 first RF switches 8, and the five first RF switches 8 are respectively located in different second isolation sub-areas 2012. Five second RF switches 7 are connected to the first signal output port 9 for communication. Each second RF switch 7 is connected to a first RF switch 8 in each first RF switch group through a first connecting line group composed of five first connecting lines. Exemplarily, the RF switch A outputs five connecting lines B1, B2, B3, B4 and B5, the RF switch assembly C may include RF switch groups C1, C2, C3, C4, C5, the RF switch group C1 may include RF switches C11, C12, C13, C14, C15, the RF switch group C2 may include RF switches C21, C22, C23, C24, C25, the RF switch group C3 may include RF switches C31, C32, C33, C34, C35, the RF switch group C4 may include RF switches C41, C42, C43, C44, C45, and the RF switch group C5 may include RF switches C51, C52, C53, C54, C55, wherein the RF switch A can be connected to C11 via B1, to C2 via B2, to C31 via B3, to C41 via B4, and to C51 via B5. And so on, each second RF switch 7 is connected to a first RF switch 8 in each RF switch group.

[0033] In an embodiment of the present application, the second circuit board 2 includes a bottom layer, a control layer, a first grounding layer to a sixth grounding layer, a first conductive layer to a fifth conductive layer and a surface layer, wherein the control layer is stacked on top of the bottom layer; the first grounding layer to the sixth grounding layer are stacked on top of the control layer; the first conductive layer to the fifth conductive layer are alternately stacked between the first grounding layer to the sixth grounding layer; each of the first conductive layers to the fifth conductive layer is provided with a first connecting wire group, and each first connecting wire group is connected to a second RF switch 7 and a first RF switch 8 in each first RF switch group after punching and changing layers, wherein the distance between each first connecting wire of each first connecting wire group located on the same conductive layer is greater than or equal to 3 mm, and a plurality of through holes connected to the grounding layer are provided between each first connecting wire, and the orthographic projections of each first connecting wire located between different conductive layers on the bottom layer do not overlap with each other; the surface layer is stacked above the sixth grounding layer.

[0034] Specifically, the second circuit board 2 is a 14-layer circuit board, which is a bottom layer, a control layer, a first ground layer, a first conductive layer, a second ground layer, a second conductive layer, a third ground layer, a third conductive layer, a fourth ground layer, a fourth conductive layer, a fifth ground layer, a fifth conductive layer, a sixth ground layer and a surface layer from bottom to top. When the second radio frequency switch 7 is connected to the first radio frequency switch 8, each second radio frequency switch 7 is connected to one of the five first radio frequency switch groups through five first connecting wires located in different layers, and the five connecting wires B1, B2, B3, B4 and B5 are all located in the same conductive layer, for example, any one of the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer or the fifth conductive layer. The distance between the five connecting wires B1, B2, B3, B4 and B5 located in the same conductive layer, for example, in the second conductive layer is at least 3 mm, and a plurality of through holes are provided between two adjacent first connecting wires of the five connecting wires B1, B2, B3, B4 and B5, and the plurality of through holes are connected to the second ground layer at the bottom of the second conductive layer for electromagnetic isolation. After the two ends of the first connecting wire groups located in different layers are punched and changed to the surface layer, they are respectively connected to the corresponding second RF switch 7 and the first RF switch 8. The orthographic projections of the first connecting wires in each first connecting wire group located in different layers do not overlap each other on the bottom layer, so that spatial isolation and channel isolation can be achieved at the same time. In the embodiment of the present application, components with smaller volume packaging can be selected to increase the distance between components and increase signal isolation. By isolating adjacent conductive layers using a ground layer, the isolation of the signal can be increased, thereby increasing the channel isolation.

[0035] In an embodiment of the present application, the first circuit board 1 may include a third isolation area 101 and a fourth isolation area 102; wherein the third isolation area 101 is provided with an amplifying power sub-assembly; the fourth isolation area 102 is provided with a current detection assembly 16, the current detection assembly 16 is respectively communicated and connected with the control assembly 4 and the amplifying power sub-assembly, and the current detection assembly 16 is used to detect the power supply current value of the amplifying power sub-assembly and output the power supply current value to the second signal output port 10.

[0036] Specifically, the power supply component 3 in the second circuit board 2 is connected to the current detection component 16 in the first circuit board 1 through a fourth connecting line. The current detection component 16 is located in the fourth isolation area 102 and is connected to each amplifying power sub-component through a connecting line on the surface of the second circuit board 2, thereby realizing power supply to each amplifying power sub-component. The current detection component 16 is also used to detect the power supply current value of the amplifying power sub-component and output the power supply current value to the second signal output port 10, so that the inspection personnel can detect whether the power supply current exceeds the threshold through the second signal output port 10, thereby judging whether the power supply status is good.

[0037] In an embodiment of the present application, the third isolation region 101 may include a plurality of third isolation sub-regions 1011 and a plurality of fourth isolation sub-regions 1012, and second partition bars 12 are provided between adjacent third isolation sub-regions 1011, between adjacent fourth isolation sub-regions 1012, and between the fourth isolation sub-region 1012 and the adjacent third isolation region 101, and the second partition bars 12 are all higher than the plane where the second circuit board 2 is located, and the second shell 6 is connected to the first circuit board 1 through the second partition bars 12.

[0038] Specifically, the fifth sub-strip is rectangular and is arranged on the surface of the first circuit board 1. The fifth sub-strip extends a plurality of sixth sub-strips along the first direction X to form a third isolation sub-area 1011. A plurality of seventh sub-strips are arranged in parallel along the second direction Y at a certain distance from the free end of the sixth sub-strip, and a plurality of eighth sub-strips for connecting the seventh sub-strip and the sixth sub-strip are arranged between the seventh sub-strip and the sixth sub-strip along the first direction X. A plurality of ninth sub-strips are arranged between adjacent sixth sub-strips along the first direction X. The area enclosed by the ninth sub-strip farthest from the first sub-strip and the first sub-strip is the third isolation area 101, and the remaining area is the fourth isolation area 102. The fifth sub-strip to the ninth sub-strip constitute the second partition 12, which separates the signal of each channel, and also separates the power supply and the radio frequency signal. With the above design scheme, the channel isolation index between the module input and the unselected output can reach more than 75dBc, and the isolation index between different outputs can reach more than 80dBc.

[0039] In an embodiment of the present application, the amplifying power division component may include an amplifying component and a power distribution component, wherein the amplifying component may include a plurality of amplifying circuits 13, each amplifying circuit 13 is respectively located in each third isolation sub-region 1011, and each amplifying circuit 13 is connected to each signal input port 11; the power distribution component may include a plurality of power distribution circuits 14, each power distribution circuit 14 is correspondingly connected to each amplifying circuit 13 through a second connecting line, each power distribution circuit 14 is respectively located in each fourth isolation sub-region 1012, and each power distribution circuit 14 is correspondingly connected to multiple second RF switches 7 of each second RF switch group through multiple third connecting lines.

[0040] In the embodiment of the present application, a plurality of grooves 18 are provided on the opposite sides of the first shell 5 and the second shell 6, and the grooves 18 are used to place the amplification power subassembly, the RF switch assembly, the power supply assembly 3 and the control assembly 4. Specifically, the plurality of grooves 18 can also be used for signal isolation, thereby improving the effect of channel isolation.

[0041] Figure 4 A schematic diagram of the internal structure of a first housing of a switch assembly module provided in an embodiment of the present application; Figure 5A schematic diagram of the internal structure of the second housing of the switch assembly module provided in one embodiment of the present application; Figure 4-Figure 5 In the embodiment of the present application, the inner side walls of the first shell 5 and the second shell 6 are respectively provided with a third partition bar 15 and a fourth partition bar 17, the third partition bar 15 is matched with the second partition bar 12 and screwed, and the fourth partition bar 17 is matched with the first partition bar 203 and screwed. In this way, the third partition bar 15 can be connected with the second partition bar 12 by means of screws 19, and the fourth partition bar 17 can be matched with the first partition bar 203 and screwed. In this way, the stability of the circuit board and the shell can be increased.

[0042] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A switch assembly module, characterized in that: include: A first circuit board (1) having a power amplifier subassembly disposed on its surface; A second circuit board (2) has a first isolation area (201) and a second isolation area (202) on its surface, wherein the first isolation area (201) is provided with a plurality of mutually isolated radio frequency switch components, wherein the radio frequency switch components are communicatively connected to the amplifying power division component; the second isolation area (202) is provided with a power supply component (3) and a control component (4), wherein the power supply component (3) is respectively connected to the radio frequency switch component, the amplifying power division component and the control component (4), and the control component (4) is respectively communicatively connected to the radio frequency switch component and the amplifying power division component; Wherein, the amplifying power subassembly is used to amplify each input signal to output a plurality of output signals with the same amplitude, and output each output signal to the corresponding RF switch assembly; The radio frequency switch component is used to select one of the output signals from each channel for output; The power supply component (3) is used to supply power to the radio frequency switch component, the amplifying power component and the control component (4) respectively.

2. The switch assembly module according to claim 1, characterized in that: The switch assembly module also includes: A first housing (5) having an outer wall provided with a plurality of signal input ports (11); A second shell (6), the outer wall of which is provided with a plurality of first signal output ports (9) and a second signal output port (10); the second shell (6) is arranged opposite to the first shell (5) and forms a cavity with the first shell (5); Wherein, the first circuit board (1) is located in the cavity and is fixed in the first shell (5); The second circuit board (2) is located in the cavity and is fixed in the second shell (6).

3. The switch assembly module according to claim 2, characterized in that: The first isolation region (201) comprises: a plurality of first isolation sub-regions (2011) and a plurality of second isolation sub-regions (2012); A first partition bar (203) is provided between adjacent first isolation sub-regions (2011), between adjacent second isolation sub-regions (2012), and between the second isolation sub-region (2012) and the adjacent second isolation region (202); the first partition bar (203) is higher than the plane where the first circuit board (1) is located; and the second shell (6) is connected to the second circuit board (2) via the first partition bar (203).

4. The switch assembly module according to claim 3, characterized in that: The radio frequency switch assembly comprises: A first radio frequency switch assembly, comprising a plurality of first radio frequency switch groups, each of the first radio frequency switch groups comprising a plurality of first radio frequency switches (8) of the same number, each of the first radio frequency switch groups being located in each of the second isolation sub-areas (2012); The second radio frequency switch assembly comprises a plurality of second radio frequency switches (7), each of the second radio frequency switches (7) being connected to a first radio frequency switch (8) in each of the first radio frequency switch groups through each of the first connecting wire groups located in different conductive layers, each of the second radio frequency switches (7) being located in each of the second isolation sub-areas (2012), and each of the second radio frequency switches (7) being connected to each of the first signal output ports (9) accordingly.

5. The switch assembly module according to claim 4, characterized in that: The second circuit board (2) comprises: bottom layer; A control layer, stacked on top of the bottom layer; The first grounding layer to the sixth grounding layer are sequentially stacked on the control layer; The first conductive layer to the fifth conductive layer are alternately stacked between the first ground layer to the sixth ground layer respectively; A surface layer, stacked on the sixth ground layer; Wherein, each layer from the first conductive layer to the fifth conductive layer is provided with the first connecting wire group, and each of the first connecting wire groups is respectively connected to one of the second radio frequency switches (7) and one of the first radio frequency switches (8) in each of the first radio frequency switch groups after punching and changing layers; The distance between each first connection line of each first connection line group located in the same conductive layer is greater than or equal to 3 mm, and multiple through holes connected to the ground layer are provided between each first connection line, and the orthographic projections of each first connection line located between different conductive layers on the bottom layer do not overlap with each other.

6. The switch assembly module according to claim 4, characterized in that: The first circuit board (1) comprises: a third isolation area (101) and a fourth isolation area (102); The third isolation area (101) is provided with the amplifying power subassembly; The fourth isolation area (102) is provided with a current detection component (16), the current detection component (16) is electrically connected to the amplifying power component, the current detection component (16) is used to detect the power supply current value of the amplifying power component and output the power supply current value to the second signal output port (10).

7. The switch assembly module according to claim 6, characterized in that: The third isolation region (101) comprises: a plurality of third isolation sub-regions (1011) and a plurality of fourth isolation sub-regions (1012); A second partition bar (12) is provided between adjacent third isolation sub-regions (1011), between adjacent fourth isolation sub-regions (1012), and between the fourth isolation sub-region (1012) and the adjacent third isolation region (101), the second partition bar (12) being higher than the plane where the first circuit board (1) is located, and the first shell (5) is connected to the first circuit board (1) via the second partition bar (12).

8. The switch assembly module according to claim 7, characterized in that: The amplifying power subassembly comprises: An amplifying component, comprising a plurality of amplifying circuits (13), each of the amplifying circuits (13) being located in each of the third isolation sub-regions (1011), and each of the amplifying circuits (13) being connected to each of the signal input ports (11); A power distribution component comprises a plurality of power distribution circuits (14), each of the power distribution circuits (14) being connected to each of the amplifying circuits (13) via a second connecting line, each of the power distribution circuits (14) being located in each of the fourth isolation sub-regions (1012), and each of the power distribution circuits (14) being connected to each of the plurality of second radio frequency switches (7) of the second radio frequency switch groups via a plurality of third connecting lines.

9. The switch assembly module according to claim 2, characterized in that: A plurality of grooves (18) are provided on one side of the first shell (5) and the second shell (6) opposite to each other, and the grooves (18) are used to place the amplifying power component, the radio frequency switch component, the power supply component (3) and the control component (4).

10. The switch assembly module according to claim 7, characterized in that: A third spacer bar (15) and a fourth spacer bar (17) are respectively provided on the inner side walls of the first shell (5) and the second shell (6); the third spacer bar (15) is screwed to the second spacer bar (12), and the fourth spacer bar (17) is screwed to the first spacer bar (203).

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