PCB assembly and vehicle

Abstract

The utility model relates to the technical field of PCB heat dissipation, in particular to a PCB assembly and a vehicle, which comprise a PCB component and a cooling module, the PCB assembly comprises a shell and a PCB, and the PCB is packaged in the shell; the cooling module is detachably connected with the shell, and heat conduction is formed between the cooling module and the PCB through the shell; the cooling module comprises a main flow channel, a heat exchange wall, an inflow port and an outflow port, wherein fluid in the main flow channel circularly flows through the inflow port and the outflow port. The main flow channel comprises straight flow channels and at least one circuitous flow channel which is communicated with at least two corresponding straight flow channels; the heat exchange wall is arranged in the straight flow channel, and at least one heat exchange wall is arranged in the length direction of the straight flow channel; according to the PCB assembly provided by the utility model, the compatibility of internal parts is good, the PCB assembly is convenient to disassemble and maintain, and the cooling effect of the built-in cooling module on the PCB assembly is good.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board heat dissipation, in particular to a PCB board assembly and a vehicle. Background Art

[0002] Smart electric vehicle technology is developing rapidly, and the industry trend is shifting from a distributed architecture to a centralized architecture. As the processing performance and integration level of the vehicle's main controller and / or regional controller increase, their energy consumption also increases accordingly, which poses a higher challenge to the heat dissipation of the core processor chip. Currently, the main heat dissipation methods include air cooling and liquid cooling, but traditional forced air cooling is no longer sufficient to meet the heat dissipation needs of high-energy consumption equipment.

[0003] In the liquid cooling solution, integrated water cooling design has become the mainstream. This design completely separates the cooling water channel from the printed circuit board (PCB) and shares an aluminum alloy shell with good thermal conductivity. The coolant flows in from the outside, circulates through the internal water channel and returns to the cooling system, forming a closed loop to achieve effective heat transfer and heat dissipation. Despite this, this integrated design still has shortcomings: difficult to upgrade. When the hardware module is upgraded, if the electronic components need to be replaced or the layout needs to be adjusted, the original shell may no longer be applicable and needs to be redesigned, molded, processed and verified; compatibility and versatility issues. Different models of PCB components may require the development of a dedicated water cooling plate shell, which increases production costs; inconvenient maintenance. When there is a problem with the PCB assembly or the water cooling plate shell, the entire integrated water cooling plate needs to be disassembled for maintenance, which is inconvenient to operate; limited heat dissipation efficiency; and the heat of the PCB board cannot be quickly and effectively dissipated. Utility Model Content

[0004] In view of the above shortcomings of the prior art, the purpose of the present invention is to provide a PCB board assembly and a vehicle, the upgrading difficulty of the PCB board assembly is reduced, the internal components are compatible, easy to disassemble and repair, and the cooling effect of the PCB board assembly is better.

[0005] In order to achieve the above-mentioned purpose and other related purposes, the utility model provides a PCB board assembly, including:

[0006] A PCB assembly comprises a housing and a PCB board, wherein the PCB board is encapsulated in the housing;

[0007] A cooling module is detachably connected to the housing, and the cooling module forms heat conduction between the housing and the PCB board; the cooling module includes:

[0008] A main flow channel, comprising a direct flow channel and at least one circuitous flow channel connecting at least two corresponding direct flow channels;

[0009] The heat exchange wall is arranged in the direct current channel, and at least one heat exchange wall is arranged along the length direction of the direct current channel.

[0010] and an inlet and an outlet for circulating the fluid in the main flow channel.

[0011] In an optional embodiment of the utility model, the PCB assembly includes at least a first heating zone and a second heating zone with a heat value less than or equal to that of the first heating zone;

[0012] In the cooling module for dissipating heat for the PCB assembly, within an area of ​​the same size, the total heat exchange area of ​​all heat exchange walls close to the first heating zone is greater than or equal to the total heat exchange area of ​​the heat exchange walls close to the second heating zone.

[0013] In an optional embodiment of the present invention, at least one of the straight flow channels is divided into a plurality of sub-flow channels by the heat exchange wall.

[0014] In an optional embodiment of the present invention, the cooling module comprises a heat-conducting shell having a heat exchange cavity, and the heat exchange cavity is divided by a built-in partition to form the main flow channel;

[0015] The heat-conducting shell is connected to a predetermined component via a fixing bracket, and the fixing bracket is configured to enable the cooling module to be arranged with a gap therebetween.

[0016] In an optional embodiment of the present invention, a plurality of protrusions are provided in the inner cavity of the shell, and the protrusions are provided to protrude from an inner wall of one side of the shell close to the cooling module toward the PCB board.

[0017] In an optional embodiment of the present invention, the cooling module includes an inlet and an outlet, the inlet is connected to one end of the main channel, and the outlet is connected to the other end of the main channel.

[0018] In an optional embodiment of the utility model, at least one inlet is provided, and at least two outlets are provided;

[0019] The two outflow ports are respectively connected to two ends of the main flow channel, and the inflow port is arranged at the circuitous flow channel between the two outflow ports.

[0020] In an optional embodiment of the present invention, one of the shell and the cooling module is provided with a recessed portion, and the other is provided with a protruding portion that is engaged with the recessed portion.

[0021] In an optional embodiment of the present invention, the shell and the cooling module are fixedly connected by a plurality of evenly arranged fasteners.

[0022] In an optional embodiment of the present invention, at least one plug interface is provided on an edge of the shell, and the plug interface is electrically connected to the PCB board.

[0023] To achieve the above-mentioned purpose and other related purposes, the utility model provides a vehicle, including the PCB board assembly.

[0024] In summary, the utility model completely separates the main channel from the PCB assembly and integrates the main channel into an independent cooling module. The PCB assembly and the cooling module are detachably connected, ensuring independent upgrade and maintenance of the two, greatly reducing the difficulty of upgrading the PCB board assembly, while also facilitating disassembly and maintenance, and improving adaptability and compatibility. The PCB board conducts heat with the cooling module through the shell, and the main channel in the cooling module is composed of a direct channel and a circuitous channel; wherein the direct channel promotes rapid flow of the fluid, while the circuitous channel generates turbulence in the main channel, which helps to achieve uniformity of fluid temperature and thus improves the heat dissipation efficiency of the PCB assembly; in addition, the heat exchange wall set in the main channel not only increases the contact area between the inner wall and the fluid, promotes the effective transfer of heat, but also helps to form turbulence, further improving the heat exchange efficiency. Such a setting can effectively take away the heat of the PCB board and significantly improve the heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 This is a schematic diagram of the overall structure of a PCB board assembly according to an embodiment of the utility model;

[0027] Figure 2 This is a schematic diagram of the overall structure of a PCB assembly according to an embodiment of the utility model;

[0028] Figure 3 This is a schematic diagram of the cooling module structure of an embodiment of the utility model;

[0029] Figure 4 This is a schematic diagram of the side structure of a PCB board assembly according to an embodiment of the utility model;

[0030] Figure 5 for Figure 4 The structural cross-sectional view at AA;

[0031] Figure 6 for Figure 4The structural cross-sectional view at BB;

[0032] Figure 7 for Figure 4 The structural cross-sectional view at CC;

[0033] Figure 8 A top view of a PCB assembly according to an embodiment of the present invention;

[0034] Fig. 9 for Figure 8 Structural cross-sectional view at DD;

[0035] Fig.10 This is a schematic diagram of the cooling module structure in another embodiment of the utility model;

[0036] Description of component reference numbers: PCB assembly 1, plug interface 10, plug connector 101, cavity 110, housing 11, protruding portion 111, mounting surface 1111, mounting hole 112, connector 113, PCB board 12, cooling module 2, main channel 21, DC channel 211, sub-flow channel 211, circuitous flow channel 212, heat exchange wall 22, thermal conduction shell 23, partition 231, inlet port 24, outlet outlet 25, recess 201, fixing bracket 3, patch 4. DETAILED DESCRIPTION

[0037] The following describes the implementation of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and the features in the embodiments can be combined with each other without conflict. It should also be understood that the terms used in the embodiments of the present invention are intended to describe specific implementation schemes, rather than to limit the scope of protection of the present invention. The test methods for which specific conditions are not specified in the following examples are usually carried out under conventional conditions or under the conditions recommended by the manufacturers.

[0038] See also Figures 1 to 10. It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the utility model, so they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects and purposes that can be achieved by the utility model, should still fall within the scope of the technical content disclosed by the utility model. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the utility model. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the utility model without substantially changing the technical content.

[0039] When numerical ranges are given in the embodiments, it should be understood that unless otherwise specified in the present invention, both endpoints of each numerical range and any value between the two endpoints can be selected. Unless otherwise defined, all technical and scientific terms used in the present invention are in accordance with the prior art mastery of those skilled in the art and the description of the present invention, and any prior art methods, equipment and materials similar or equivalent to the methods, equipment and materials in the embodiments of the present invention can also be used to implement the present invention.

[0040] In order to solve some problems in the background technology, it is necessary to develop a new PCB board assembly, which completely isolates the cooling water circuit from the controller or PCB assembly 1 and integrates it in an independent structural member, a heat-conducting shell 23, which is made of aluminum alloy material to utilize its good thermal conductivity. The coolant of the cooling system enters from the inlet 24 of the heat-conducting shell 23 of the cooling module 2, and after heat exchange through the main channel 21, it returns to the cooling system through the outlet 25 of the heat-conducting shell 23 to form a closed loop. Such a design can effectively take away heat and improve heat dissipation performance. The advantage of the detachable cooling module 2 is its excellent adaptability and compatibility, which can match different models of domain controllers or PCB assemblies 1 without having to develop a water cooling plate separately for each model of PCB assembly 1. In addition, the detachable cooling module 2 design is also easy to repair and disassemble, which helps to reduce costs and improve the efficiency of heat exchange. Therefore, the utility model provides a PCB board assembly for intelligent driving.

[0041] like Figure 1-5 As shown, the utility model provides a PCB board assembly, including a PCB component 1 and a cooling module 2; the PCB component 1 includes a housing 11 and a PCB board 12, and the PCB board 12 is encapsulated in the housing 11;

[0042] The cooling module 2 is detachably connected to the shell 11, and the cooling module 2 forms heat conduction between the shell 11 and the PCB board 12; the cooling module 2 includes a main channel 21, a heat exchange wall 22, and an inlet 24 and an outlet 25 for circulating fluid in the main channel 21; the main channel 21 includes a straight channel 211 and at least one detour channel 212 corresponding to at least two straight channels 211; the heat exchange wall 22 is arranged in the straight channel 211, and at least one is arranged along the length direction of the straight channel 211.

[0043] It should be noted that the heat exchange wall 22 is in the shape of a strip, a cylinder or a protrusion, and in this case, the strip shape is preferred; and the heat exchange wall 22 arranged in each direct current channel 211 can be one or more. When there are multiple heat exchange walls 22 in the direct current channel 211, each heat exchange wall 22 can be arranged in a straight line along the length direction of the direct current channel 211 or arranged in parallel with each other; the fluid in the main channel 21 is a coolant, such as water or cooling oil or other liquid that meets the use requirements; the PCB assembly 1 is a controller of an automobile intelligent driving module, for example, the PCB assembly 1 can also be a controller assembly ECU or a domain controller assembly DCU or a graphics processing assembly GPU; the cooling module 2 is used for heat dissipation of the PCB assembly 1, and the shell 11 of the PCB assembly 1 is generally a shell 11 of a metal material, such as an aluminum material or a copper material; by making the PCB assembly 1 and the cooling module 2 detachably connected, when the PCB assembly 1 is damaged or replaced, it is avoided that the PCB assembly 1 and the cooling module 2 are replaced as a whole to cause a large loss. A main channel 21 is arranged in the cooling module 2, and the main channel 21 is formed by a straight channel 211 and a circuitous channel 212. The straight channel 211 facilitates the rapid flow of the fluid, and the circuitous channel 212 can cause the fluid in the main channel 21 to form turbulence, which is beneficial to the temperature uniformity of the fluid, thereby improving the heat dissipation efficiency of the cooling module 2 to the PCB component 1; by arranging a heat exchange wall 22 in the main channel 21, on the one hand, the contact area between the inner wall of the main channel 21 and the fluid can be increased, so that the fluid can better take away the heat from the contact side of the cooling module 2 and the PCB component 1, thereby improving the heat exchange efficiency; on the other hand, the setting of the heat exchange wall 22 is also beneficial to the formation of turbulence in the fluid in the main channel 21, thereby further improving the heat exchange efficiency, which is beneficial to the heat dissipation of the PCB component 1 by the cooling module 2. Regarding the arrangement of the inlet 24 and the outlet 25 for the circulation of the fluid in the main channel 21, for example, the outlet 24 can be connected to at least one end of the main channel 21; the inlet 24 can be connected to the main channel 21, and the inlet 24 can be arranged away from the inlet 24 along the fluid flow path in the main channel 21, so that the fluid circulation can be formed. The coolant of the cooling system enters from the inlet 24 of the heat-conducting shell 23 of the cooling module 2, and after heat exchange through the main channel 21, it returns to the cooling system from the outlet 25 of the heat-conducting shell 23, forming a closed-loop circulation.

[0044] like Figure 7 As shown, as an optional embodiment of the present case, the PCB assembly 1 includes at least a first heating area and a second heating area with a heat generation less than or equal to that of the first heating area;

[0045] In the cooling module 2 for dissipating heat for the PCB assembly 1, within an area of ​​the same size, the total heat exchange area of ​​all heat exchange walls 22 close to the first heating zone is greater than or equal to the total heat exchange area of ​​the heat exchange walls 22 close to the second heating zone.

[0046] It should be noted that, by performing thermal analysis on the PCB assembly 1, key heating areas within the PCB assembly 1, such as the first heating area, are found. The first heating area is, for example, the location of the PCB board 12 within the PCB assembly 1. For another example, the first heating area may be the location of a power transistor or other component with a relatively high heat generation on the PCB board 12. For example, the number of the heat exchange walls 22 adjacent to the first heating area may be greater than or equal to the number of the heat exchange walls 22 adjacent to the second heating area, and the length of the heat exchange wall 22 adjacent to the first heating area may be greater than or equal to the length of the heat exchange wall 22 adjacent to the second heating area, so as to ensure that within an area of ​​the same size, under the same other conditions, the total heat exchange area of ​​all the heat exchange walls 22 adjacent to the first heating area is greater than or equal to the total heat exchange area of ​​the heat exchange walls 22 adjacent to the second heating area, so as to increase the heat dissipation intensity of the first heating area, thereby achieving key heat dissipation of the key heating area of ​​the PCB assembly 1, thereby reducing the peak of the thermal value within the PCB assembly 1, and avoiding overheating damage to the PCB assembly 1.

[0047] like Figure 8-9 As shown, as an optional embodiment of the present case, at least one of the direct flow channels 211 is divided into a plurality of sub-flow channels 2111 by the heat exchange wall 22 .

[0048] It should be noted that the direct flow channel 211 is divided into a plurality of sub-flow channels 2111 by the heat exchange wall 22, which increases the contact area between the fluid and the heat exchange wall 22, thereby improving the heat exchange efficiency. The design of the plurality of sub-flow channels 2111 helps to reduce the pressure drop of the fluid during the flow process. Since the friction loss of the fluid is reduced in a smaller channel, such a design helps to reduce the pressure that the pump that provides power to the fluid needs to overcome, thereby achieving an improvement in system efficiency; at the same time, the smaller sub-flow channels 2111 help to generate turbulence, increase fluid mixing, and improve the speed and efficiency of heat transfer.

[0049] like Figure 7 As shown, as an optional embodiment of the present case, the cooling module 2 includes a heat-conducting shell 23 having a heat exchange cavity, and the heat exchange cavity is separated by a built-in partition 231 to form the main channel 21;

[0050] The heat-conducting shell 23 is connected to a predetermined component via a fixing bracket 3 , and the fixing bracket 3 is configured to enable the cooling module 2 to be arranged with a gap therebetween.

[0051] It should be noted that the heat-conducting shell 23 is made of metal material, such as aluminum or copper; the predetermined component is the structure where the PCB assembly is installed on the vehicle, such as sheet metal or corresponding installation points in the vehicle. By setting one or more partitions 231 in the heat-conducting shell 23 of the cooling module 2, the heat exchange cavity is separated to form one or more main channels 21, thereby increasing the flow path of the cooling medium in the cooling module 2 and improving the efficiency of heat exchange; the fixed bracket 3 maintains the gap between the heat-conducting shell 23 and the predetermined component, avoiding the fastening connection between the heat-conducting shell 23 and the predetermined component due to thermal expansion and contraction, thereby improving the installation stability and reliability of the cooling module 2; the gap arrangement formed by the fixed bracket 3 reduces the heat conduction between the heat-conducting shell 23 and the predetermined component, thereby avoiding the cooling temperature of the cooling module 2. There is a large temperature loss before the heat is transmitted to the PCB board 12. At the same time, the gap between the heat-conducting shell 23 and the predetermined component is also conducive to the continuous heat dissipation of the side of the heat-conducting shell 23 close to the PCB assembly facing the PCB board 12, while the other side of the heat-conducting shell 23 releases the absorbed heat to the environment, which can slow down the temperature increase in the main channel 21, is conducive to the stability of the internal temperature of the cooling module 2, and improves the heat dissipation efficiency; and the cooling module 2 and the predetermined component are arranged with a gap, which can avoid or reduce the vibration of the predetermined component from affecting the PCB board 12 through the cooling module 2, thereby ensuring the installation stability of the PCB board 12.

[0052] like Figure 1 , 3 As shown, as an optional embodiment of the present case, the fixed bracket 3 is detachably connected to the heat-conducting shell 23. For example, four fixed brackets 3 are provided on the heat-conducting shell 23, and each of the fixed brackets 3 is connected to the heat-conducting shell 23 by a plurality of rivets or fasteners. Therefore, when the cooling module 2 is damaged, only the cooling module 2 can be replaced without replacing the fixed bracket 3, thereby reducing maintenance costs.

[0053] like Figure 6 , 8 As shown in Figure 9, as an optional embodiment of the present invention, a plurality of protrusions 111 are provided in the inner cavity of the shell 11, and the protrusions 111 are provided to protrude from the inner wall of one side of the shell 11 close to the cooling module 2 toward the PCB board 12.

[0054] It should be noted that the protruding portion 111 is provided in the inner cavity of the shell 11 for the following purposes or advantages: first, to enhance the structural strength. The protruding portion 111 can enhance the overall structural strength of the shell 11, so that it can better withstand external forces, such as impact and vibration, thereby protecting the PCB board 12 from damage; second, to improve the heat dissipation performance. The protruding portion 111 increases the absorption of the heat emitted by the PCB board 12 in its inner cavity by the shell 11, which is beneficial to the rapid transfer of heat, thereby improving the heat conduction efficiency between the PCB board 12 and the cooling module 2, and is beneficial to improving the heat dissipation effect of the PCB board 12; in this case, part of the protruding portion 111 can be the connection point between the first shell and the second shell of the shell 11, part of the protruding portion 111 can be the installation point or installation surface 1111 of the PCB board 12 in the shell 11, or part of the protruding portion 111 can be used to simply reduce the distance between the inner wall of the shell 11 and the PCB board 12, and increase the heat absorption area of ​​the inner wall of the shell 11 for the PCB board 12.

[0055] Furthermore, the fixing between the first shell and the second shell of the shell 11 and the fixing between the shell 11 and the heat-conducting shell 23 may use a common fastener, thereby reducing the usage of fasteners such as screws.

[0056] like Fig.10 As shown, as an optional embodiment of the present case, at least one inlet 24 is provided, and at least two outlets 25 are provided; the two outlets 25 correspond to and connect the two ends of the main channel 21 , respectively, and the inlet 24 is provided on the detour channel 212 between the two outlets 25 .

[0057] It should be noted that the two outlets 25 are respectively connected to the two ends of the main channel 21, that is, one of the outlets 25 is connected to one end of the main channel 21, and the other outlet 25 is connected to the other end of the main channel 21; the main channel 21 includes a straight channel 211 and a circuitous channel 212, and the two outlets 25 are respectively located at different ends of the straight channel 211; in the length direction of the straight channel 211, the outlet 25 can be located on the same side of the main channel 21 as the inlet 24, or on the opposite side of the outlet 25, which is determined according to the actual installation requirements and the cooling effect. It should be further noted that by setting the outlets 25 at both ends of the main channel 21, the cooling fluid can be more evenly distributed when flowing through the cooling module 2; when the fluid enters from the middle inlet 24, it is diverted in two directions, which helps to balance the temperature and pressure differences in the entire system; it helps to reduce the concentrated flow of the fluid in a single direction, avoid the occurrence of local overheating or overcooling, and thus ensure the consistency and efficiency of the cooling effect. When starting the cooling module 2, since the inlet 24 is located between the two outlets 25, the fluid can be quickly distributed to both ends of the main channel 21, which helps to quickly establish a stable flow state and reduce the time required for the cooling module 2 to reach a stable working state; especially in the cooling of the PCB assembly 1, quickly lowering the temperature can effectively prevent damage caused by overheating of the PCB assembly 1.

[0058] like Figure 1 , 4 As shown in FIG. 7 , as an optional embodiment of the present case different from the above-mentioned embodiments, the cooling module 2 includes an inlet 24 and an outlet 25 , the inlet 24 is connected to one end of the main channel 21 , and the outlet 25 is connected to the other end of the main channel 21 .

[0059] It should be noted that the cooling module 2 includes at least one inlet 24 and one outlet 25, and may also include one inlet 24 and multiple outlets 25 or multiple inlets 24 and one outlet 25; the inlet 24 and the outlet 25 are respectively arranged at both ends of the main channel 21, so that all the liquid in the main channel 21 can be exchanged with the outside as much as possible, avoiding or reducing the long-term retention of part of the fluid in the cooling module 2 and affecting the cooling effect of the cooling module 2 on the PCB assembly 1.

[0060] like Figure 1-3 As shown, as an optional embodiment of the present case, one of the shell 11 and the cooling module 2 is provided with a recess 201 , and the other is provided with a protrusion that is engaged with the recess 201 .

[0061] It should be noted that the snap-fit ​​connection method can simplify the assembly process, so that the pre-installation of the housing 11 and the cooling module 2 can be faster, and the holes between the housing 11 and the cooling module 2 can be aligned, so as to facilitate the next step of fastening the two together, thereby improving the assembly efficiency; and the snap-fit ​​connection provides a fastening mechanical connection method, which can prevent the loosening or falling of components caused by vibration or impact to a certain extent, thereby enhancing the structural stability of the connection between the PCB assembly 1 and the cooling module 2. It should be further noted that the protrusion and the recess 201 are matched with a snap-fit ​​or plug-fit connection, and the protrusion and the recess 201 are any shape or structure that meets the use requirements.

[0062] like Figure 1-3 As shown, as an optional embodiment of the present case, the shell 11 and the cooling module 2 are fixedly connected by a plurality of evenly arranged fasteners.

[0063] It should be noted that the shell 11 and the cooling module 2 are provided with matching mounting holes 112, and the positions of the mounting holes 112 between the two correspond one to one. Generally, the mounting holes 112 provided on one of the shell 11 and the cooling module 2 are through holes, and the mounting holes 112 on the other are threaded holes; the fasteners are provided in the mounting holes 112. The shell 11 of the PCB assembly 1 and the cooling module 2 are connected by a plurality of fasteners, and the fasteners are detachable fasteners such as screws or bolts; the fasteners are multiple, such as six, and are evenly arranged on the shell 11 and the cooling module 2, so that the connection between the shell 11 and the cooling module 2 is more uniformly stressed, such as giving each fastener the same pre-tightening force, so that the shell 11 and the heat-conducting shell 23 of the cooling module 2 are evenly stressed and tightly connected.

[0064] like Figure 1 , 5 As shown in FIGS. 6 and 9 , as an optional embodiment of the present invention, at least one plug-in interface 10 is provided at an edge of the housing 11 , and the plug-in interface 10 is electrically connected to the PCB board 12 .

[0065] It should be noted that, by setting a plug interface 10 that can be plugged into other devices or connectors 101 on connecting lines at the edge of the shell 11, the PCB board 12 can control other electronic devices or exchange data; for example, the plug interface 10 can be a power interface, a data communication interface, a control signal interface, and a special function interface (such as a sensor interface, an audio input interface); when there are multiple plug interfaces 10, each plug interface 10 can be set on a different side of the shell 11 or in a non-aligned state.

[0066] like Figure 6As shown, as an optional embodiment of the present case, the shell 11 includes at least two cavities 110, and the two cavities 110 respectively encapsulate PCB boards 12, so that the cooling module 2 with a large enough size can cool multiple PCB boards 12 at the same time.

[0067] like Fig. 9 As shown, further, the shell 11 and the heat-conducting shell 23 are pre-installed by bonding through a patch 4, and the patch 4 is a film, so that the PCB assembly 1 and the cooling module 2 are pre-fixed. For example, at least one of the shell 11 and the heat-conducting shell 23 is provided with a groove body for accommodating the patch 4, so that when the shell 11 and the heat-conducting shell 23 are bonded by the patch 4, a gap is generated between the two to affect heat conduction.

[0068] like Fig. 9 As shown, further, the shell 11 is provided with a connector 113 that penetrates the shell 11 and penetrates into the heat exchange wall 22, and the connector 113 is made of metal material, so as to improve the heat conduction efficiency between the shell 11 and the heat-conducting shell 23, thereby improving the heat dissipation efficiency of the PCB assembly 1; the connector 113 is a screw or bolt or other metal connection structure that meets the use requirements.

[0069] The utility model provides a vehicle, comprising the PCB board assembly, so that the vehicle is within the protection scope of the present case.

[0070] In summary, the utility model effectively overcomes some practical problems in the prior art and thus has high utilization value and use significance.

[0071] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.

Claims

1. A PCB assembly, characterized in that: include: A PCB assembly comprises a housing and a PCB board, wherein the PCB board is encapsulated in the housing; A cooling module is detachably connected to the housing, and the cooling module forms heat conduction between the housing and the PCB board; the cooling module includes: A main flow channel, comprising a direct flow channel and at least one circuitous flow channel connecting at least two corresponding direct flow channels; A heat exchange wall is disposed in the direct current channel, and at least one heat exchange wall is arranged along the length direction of the direct current channel; and an inlet and an outlet for circulating the fluid in the main flow channel.

2. The PCB assembly according to claim 1, characterized in that: The PCB assembly at least includes a first heating area and a second heating area with a heat value less than or equal to that of the first heating area; In the cooling module for dissipating heat for the PCB assembly, within an area of ​​the same size, the total heat exchange area of ​​all heat exchange walls close to the first heating zone is greater than or equal to the total heat exchange area of ​​the heat exchange walls close to the second heating zone.

3. The PCB assembly according to claim 1, characterized in that: At least one of the straight flow channels is divided into a plurality of sub-flow channels by the heat exchange wall.

4. The PCB assembly according to claim 1, characterized in that: The cooling module comprises a heat-conducting shell having a heat exchange cavity, wherein the heat exchange cavity is divided by a built-in partition to form the main flow channel; The heat-conducting shell is connected to a predetermined component via a fixing bracket, and the fixing bracket is configured to enable the cooling module to be arranged with a gap therebetween.

5. The PCB assembly according to claim 1, characterized in that: A plurality of protruding parts are arranged in the inner cavity of the shell, and the protruding parts are arranged to protrude from an inner wall of one side of the shell close to the cooling module toward the PCB board.

6. The PCB assembly according to claim 1, characterized in that: The inlet is communicated with one end of the main channel, and the outlet is communicated with the other end of the main channel.

7. The PCB assembly according to claim 1, characterized in that: The inlet is at least one, and the outlet is at least two; The two outflow ports are respectively connected to two ends of the main flow channel, and the inflow port is arranged at the circuitous flow channel between the two outflow ports.

8. The PCB assembly according to claim 1, characterized in that: One of the shell and the cooling module is provided with a recessed portion, and the other is provided with a protruding portion engaged with the recessed portion.

9. The PCB assembly according to claim 8, characterized in that: The shell and the cooling module are fixedly connected by a plurality of evenly arranged fasteners.

10. A vehicle, characterized in that: A PCB board assembly comprising any one of claims 1-9.

Images