Silicon wafer degumming frame
By designing an automatically clamped silicon wafer degumming rack, the damage and dumping problems caused by unstable clamping force during the silicon wafer degumming process in the prior art are solved, and higher silicon wafer production yield and dimensional compatibility are achieved.
Patent Information
- Application Number
- CN202420489956.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-13
- Publication Date
- 2025-02-21
- Estimated Expiration
- 2034-03-13
AI Technical Summary
During the clamping process of existing silicon wafer degumming racks, due to the uncertain length and placement position of the silicon rod, the clamping force needs to be adjusted manually, which can easily lead to excessive or too small clamping force, causing damage or overturn of the silicon wafer, affecting the impact of quality.
Design a silicon wafer degumming rack including two rotating shafts, two cardboard components, frames and support members. The cardboard components are composed of multiple cardboard units, rotated to the rotating shaft, and can automatically clamp the silicon wafer and reduce manual adjustment. demand.
Through the automatic clamping mechanism, the risk of dumping and damage of the silicon wafer during the degumming process is reduced, the yield of the silicon wafer is improved, and it is compatible with silicon wafers of different sizes and specifications.
Smart Images
Figure CN222514892U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of photovoltaic equipment, in particular to a silicon chip debonding frame. Background Art
[0002] At present, the main processes of silicon wafer slicing in the photovoltaic silicon wafer industry are: silicon rod incoming, crystal bonding, slicing, degumming, cleaning, sorting and packaging for shipment. Among them, the silicon wafer obtained by slicing silicon rods is adhered to the resin plate and cannot be directly put into the cleaning machine. The silicon wafer and the resin plate need to be put into the degumming machine for degumming to separate the silicon wafer from the resin plate. Since each silicon wafer is a completely independent sheet, there is no specific order for the separation of the silicon wafer from the resin plate during degumming, and it falls off randomly, which makes the silicon wafer very easy to tip over or bump and damage during the falling process, resulting in quality degradation.
[0003] In the prior art, a debonding rack is mainly used to clamp randomly fallen silicon wafers. The existing debonding rack is provided with two metal rods parallel to the entire silicon wafer and the resin plate to directly clamp the fallen silicon wafer so that it will not fall over. Due to cost control, the debonding rack is generally not equipped with a power or control system. At present, the clamping force of the clamping rod can only be adjusted by manpower. However, this structure has the following problems:
[0004] When the debonding rack is clamping silicon wafers, the length and placement of the silicon rod are uncertain, so technicians are required to manually adjust the position of the metal rod. The technicians' misadjustment may easily lead to excessive or insufficient clamping force, causing damage or tipping of the silicon wafers, resulting in quality problems with the produced silicon wafers. Utility Model Content
[0005] The utility model provides a silicon wafer degumming rack, which is used to solve the problems existing in the prior art.
[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0007] A silicon wafer debonding rack comprises two rotating shafts, two oppositely arranged card plate assemblies, a frame for supporting a crystal tray and a support for receiving silicon wafers; the two rotating shafts are arranged at intervals and located in the same horizontal plane, the rotating shafts are arranged along the length direction of the frame and are fixedly connected to the side wall of the frame; the ends of the card plate assemblies are rotatably connected to the rotating shafts, the card plate assemblies comprise a plurality of card plate units arranged in a row and parallel to each other, the length of the card plate assemblies being greater than the overall length of a plurality of silicon wafers to be debonded; the support is fixedly connected to the inner side of the frame and is located at the bottom side of the card plate assemblies.
[0008] Through the above technical solution, the silicon wafers after silicon rod slicing are placed vertically on the degumming rack, and the silicon wafers will naturally open the pallet assembly, so that the pallet assembly automatically clamps the silicon wafers to be degummed under the action of gravity, so there is no need for manual adjustment by technicians, and the clamping force is moderate. When the silicon wafer degumming rack is pushed into the degumming equipment, the pallet assembly can effectively reduce the possibility of the silicon wafer tipping over or being damaged after falling after degumming.
[0009] Preferably, the entire cardboard assembly is a gravity eccentric structure, and under natural gravity conditions, the center of gravity of the cardboard assembly is on the side of the center line close to the silicon wafer to be debonded.
[0010] Preferably, the card board unit is in the shape of a quadrilateral sheet, and includes a first acute angle portion, a second acute angle portion, an obtuse angle portion and a right angle portion. The first acute angle portion is penetrated and rotatably connected to the rotating shaft, and the second acute angle portion abuts against the silicon wafer to be debonded.
[0011] Preferably, the second acute angle portion is provided with an anti-collision block.
[0012] Preferably, the anti-collision block is made of, but not limited to, a bearing, a rounded corner component, a right-angled component or a soft material component.
[0013] Preferably, the middle portion of the card plate unit is hollowed out.
[0014] Preferably, the support member includes two rods, which are arranged along the length direction of the frame and fixedly connected to the side walls of the frame. The two rods are spaced apart and located on the bottom side of the card assembly, and the spacing between the two rods is smaller than the width of the silicon wafer to be debonded.
[0015] The beneficial effects of the utility model are:
[0016] 1. Compared with the existing technology, the silicon wafers after the silicon rod is sliced are placed vertically on the debonding rack. The silicon wafers will naturally open the pallet assembly, so that the pallet assembly provides force to the silicon wafer to be removed under the action of gravity, so that the silicon wafer slides vertically to prevent it from falling, so there is no need for manual adjustment by technicians. When the silicon wafer debonding rack is pushed into the debonding equipment, the pallet assembly can effectively reduce the possibility of the silicon wafer falling or being damaged after debonding.
[0017] 2. Compared with the prior art, the card board assembly is composed of multiple card board units, and the card board units are rotatably connected to the rotating shaft, and can be compatible with silicon wafers of different sizes.
[0018] 3. Compared with the prior art, the second acute angle portion is provided with an anti-collision block, which can reduce the possibility of damage due to bumps when the silicon wafer debonds and falls. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a structural schematic diagram of a silicon wafer degumming rack in an embodiment of the utility model;
[0020] Figure 2This is a schematic diagram of the internal structure of the silicon wafer degumming rack in the embodiment of the utility model;
[0021] Figure 3 It is a partial structural schematic diagram of a silicon wafer degumming rack in an embodiment of the utility model;
[0022] Figure 4 It is a structural schematic diagram of the card board unit in the embodiment of the utility model.
[0023] Description of reference numerals:
[0024] 100, crystal support; 300, silicon wafer to be debonded; 1, rotating shaft; 2, cardboard assembly; 21, cardboard unit; 211, first acute angle; 212, second acute angle; 213, obtuse angle; 214, right angle; 215, anti-collision block; 3, frame; 4, support member. DETAILED DESCRIPTION
[0025] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments; based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.
[0026] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.
[0027] In the prior art, during the silicon rod processing, after the silicon rod is sliced, a degumming machine is used to separate the silicon wafer and the resin plate according to the process requirements. Specifically, a crystal tray is used to transfer the silicon rod to be degummed with the resin plate adhered to the silicon wafer degumming rack, and then the silicon wafer degumming rack is sent into the degumming machine for silicon wafer degumming and separation, and the silicon wafer falls and is clamped by the silicon wafer degumming rack.
[0028] Among them, when the degumming rack is clamping the silicon wafer, due to the uncertainty of the length, size and placement of the silicon wafer after slicing, the technicians are required to manually adjust the position of the metal rod. It is easy for the technicians to make the clamping force too large or too small due to misadjustment, resulting in damage or tipping of the silicon wafer, and causing quality problems in the produced silicon wafers.
[0029] This embodiment discloses a silicon wafer debonding rack, which is used to solve the problems existing in the prior art.
[0030] Reference Figure 1-Figure 3 The silicon wafer debonding rack includes two rotating shafts 1, two oppositely arranged card board assemblies 2, a frame 3 and a supporting member 4.
[0031] Among them, the top of the frame 3 is used to support the crystal support 100 so that the silicon wafer 300 to be debonded faces the inside of the frame 3. In this embodiment, the two rotating shafts 1 are both steel shafts with high structural strength. The two rotating shafts 1 are arranged at intervals and located on the same horizontal plane. The rotating shaft 1 is arranged along the length direction of the frame 3 and is fixedly connected to the side wall of the frame 3. The end of the cardboard assembly 2 is rotatably connected to the rotating shaft 1. The cardboard assembly 2 is longer than the overall length of the plurality of silicon wafers 300 to be debonded. When the silicon wafer 300 to be debonded is debonded, the two relative cardboard assemblies 2 jointly clamp the fallen silicon wafer, and the free cardboard assemblies 2 at both ends can block the fallen silicon wafer to prevent the silicon wafer from tipping over. The support member 4 is fixedly connected to the inner side of the frame 3 and is located at the bottom side of the cardboard assembly 2. The support member 4 is used to receive the silicon wafer passing through the cardboard assembly 2.
[0032] Through the above technical solution, the technicians place the silicon wafer 300 to be debonded vertically on the debonding rack, and the silicon wafer will naturally open the card assembly 2, so that the card assembly 2 automatically clamps the silicon wafer 300 to be debonded under the action of gravity, so there is no need for the technicians to manually adjust, and the clamping force is moderate. When the silicon wafer debonding rack is pushed into the debonding equipment, the card assembly 2 can effectively reduce the possibility of the silicon wafer falling or being damaged after debonding, thereby improving the yield rate of silicon wafer production.
[0033] It should be noted that the specific structure of the above-mentioned card plate assembly 2 can be an elastic assembly or a force storage assembly.
[0034] In this embodiment, the support member 4 of the silicon wafer degumming rack of the utility model includes two rods, which are arranged along the length direction of the frame 3 and fixedly connected to the side wall of the frame 3. The two rods are arranged at intervals and are located on the bottom side of the card assembly 2. The interval between the two rods is less than the width 300 of the silicon wafer to be degummed.
[0035] Through the above technical solution, when the silicon wafer degumming rack is sent into the degumming machine for silicon wafer degumming and separation, when the silicon wafer falls, it slides vertically while being clamped by the clamping plate assembly 2, and the two rods can just hold the sliding silicon wafer to prevent the silicon wafer from being damaged after sliding vertically.
[0036] In other embodiments, the support member 4 may also be a plate, which is arranged along the length direction of the frame 3 and fixedly connected to the side wall of the frame 3 .
[0037] In other embodiments, the support member 4 may also be a film made of soft material.
[0038] like Figure 1 and Figure 4As shown, the cardboard assembly 2 includes a plurality of cardboard units 21 , and the mass of the bottom of the cardboard unit 21 is higher than the mass of the top of the cardboard unit 21 .
[0039] Specifically, the cardboard unit 21 is in the shape of a quadrilateral sheet, and includes a first acute angle portion 211, a second acute angle portion 212, an obtuse angle portion 213 and a right angle portion 214. The first acute angle portion 211 is penetrated and rotatably connected to the rotating shaft 1, and the second acute angle portion 212 abuts against the silicon wafer 300 to be debonded.
[0040] Through the above technical solution, the cardboard assembly 2 is composed of a plurality of cardboard units 21, and the cardboard units 21 are rotatably connected to the rotating shaft 1, and can be compatible with silicon wafers of different sizes. In addition, the cardboard assembly 2 is a gravity eccentric structure as a whole, and the center of gravity is on one side of the center line under natural gravity conditions, so that the cardboard assembly 2 automatically turns to the direction of the silicon wafer 300 to be debonded, thereby facilitating the clamping of the silicon wafer.
[0041] In this embodiment, the number and position of the card board units 21 can be freely assembled to achieve the purpose of being fully compatible with silicon wafers of different lengths and widths.
[0042] Preferably, the second acute angle portion 212 is provided with an anti-collision block 215, which can reduce the possibility of damage due to collision when the silicon wafer is debonded and falls.
[0043] In this embodiment, the anti-collision block 215 is a bearing. In other embodiments, the anti-collision block 215 can also be a rounded component, a right-angled component or a soft material component.
[0044] Preferably, the middle portion of the card board unit 21 is hollowed out to reduce the production cost of the card board assembly 2 and save material consumption.
[0045] The working principle of the embodiment of the utility model is:
[0046] The sliced silicon wafer is placed vertically on the debonding rack of the utility model, ready for debonding, and the debonded silicon wafer 300 naturally props up the card assembly 2 that droops by gravity. Since the crystal support 100 at the upper end of the silicon wafer is restricted on the frame 3, the whole will not move left and right or forward and backward;
[0047] After the debonded silicon wafer 300 and the debonding rack of the utility model are sent into the debonding machine as a whole, after several processing steps, the silicon wafer is separated from the crystal tray 100 and the resin plate in succession, and a single silicon wafer falls and is clamped by a corresponding pair of clamping plate units 21, so that the silicon wafer slides vertically in the clamped state to prevent the silicon wafer from tilting sideways, and the two rods can just hold the sliding silicon wafer to prevent the silicon wafer from being damaged after sliding vertically.
[0048] The above are all preferred embodiments of the present utility model, and are not intended to limit the protection scope of the present utility model. Therefore, any equivalent changes made based on the structure, shape, and principle of the present utility model should be included in the protection scope of the present utility model.
Claims
1. A silicon wafer degumming rack, characterized in that: The invention comprises two rotating shafts (1), two oppositely arranged cardboard assemblies (2), a frame (3) for supporting a crystal tray (100), and a support member (4) for receiving a silicon wafer; the two rotating shafts (1) are arranged at intervals and located in the same horizontal plane, the rotating shaft (1) is arranged along the length direction of the frame (3) and is fixedly connected to the side wall of the frame (3); the end of the cardboard assembly (2) is rotatably connected to the rotating shaft (1), the cardboard assembly (2) comprises a plurality of cardboard units (21) arranged in a row and parallel to each other, the length of the cardboard assembly (2) is greater than the overall length of the plurality of silicon wafers (300) to be debonded; the support member (4) is fixedly connected to the inner side of the frame (3) and is located at the bottom side of the cardboard assembly (2).
2. A silicon wafer degumming rack according to claim 1, characterized in that: The cardboard assembly (2) is a gravity eccentric structure as a whole, and the center of gravity of the cardboard assembly (2) under natural gravity conditions is on the side of the center line close to the silicon wafer (300) to be debonded.
3. A silicon wafer degumming rack according to claim 2, characterized in that: The cardboard unit (21) is in the shape of a quadrilateral sheet, and comprises a first acute angle portion (211), a second acute angle portion (212), an obtuse angle portion (213) and a right angle portion (214); the first acute angle portion (211) is passed through and rotatably connected to the rotating shaft (1); and the second acute angle portion (212) abuts against the silicon wafer (300) to be debonded.
4. A silicon wafer degumming rack according to claim 3, characterized in that: The second acute angle portion (212) is provided with an anti-collision block (215).
5. A silicon wafer debonding rack according to claim 4, characterized in that: The anti-collision block (215) is made of, but not limited to, a bearing, a rounded corner component, a right-angled corner component or a soft material component.
6. The silicon wafer debonding rack according to claim 2, characterized in that: The middle part of the card plate unit (21) is hollowed out.
7. The silicon wafer debonding rack according to claim 1, characterized in that: The support member (4) comprises two rods, which are arranged along the length direction of the frame (3) and fixedly connected to the side wall of the frame (3). The two rods are arranged at intervals and are located on the bottom side of the card assembly (2). The interval between the two rods is smaller than the width of the silicon wafer (300) to be debonded.