Intelligent cockpit domain controller structure

Abstract

An intelligent cabin area controller structure is characterized in that a bottom PCBA assembly and an installation support are arranged on a bottom shell, the installation support is located on the side of the bottom PCBA assembly, a tail socket support and an antenna cover are arranged on the bottom PCBA assembly, a top PCBA assembly is arranged on the tail socket support, the top PCBA assembly is connected with the bottom PCBA assembly through a board-to-board socket, and the antenna cover is arranged on the top PCBA assembly. A top heat dissipation shell is arranged on the top of the top PCBA assembly, a fan is installed on the side of the top heat dissipation shell, and a top shell is arranged on the top of the top heat dissipation shell. An audio digital signal processor, a cabin interaction module and a memory are arranged at the top of the top heat dissipation shell; the top PCBA assembly is provided with an audio input module and an audio controller. The integrated circuit is high in integration level, strong in chip performance and capable of integrating multiple extended functions in the future. And an active and passive heat dissipation technology is adopted, so that the thermal design requirement of a high-performance high-power chip is met.

Description

Technical Field

[0001] The utility model relates to an intelligent cockpit domain controller structure. Background Art

[0002] Led by advanced companies such as Tesla, the trend of rapid iteration of vehicle functions is becoming more and more obvious. All major passenger car OEMs are carrying out technological innovations around new centralized electronic and electrical architectures, software and hardware decoupling, and agile development models, in order to occupy the technological commanding heights and improve comprehensive competitiveness. The cockpit is gradually evolving from a traditional distributed architecture to a centralized architecture, becoming the mainstream development trend of the future cockpit.

[0003] In the prior art, the LCD instrument and the central control host are two independently operated systems. The LCD instrument can display driving data such as vehicle mileage and speed, fault alarm and other information, and the central control host can display navigation maps, multimedia, telephone, voice, air conditioning and other human-computer interaction information. The two systems operate independently and are supplied by their own suppliers, with a wide range of supply channels. However, since the LCD instrument and the navigation multimedia host are relatively independent, hardware costs are wasted, and the performance of the individual chips is low, there is no information interaction between them, such as map data sharing, and the human-computer interaction performance is poor.

[0004] In the past two years, the one-machine-multiple-screen domain controller solution has become the mainstream technology trend. Major OEMs have quickly made arrangements to seize the first-mover advantage, while the pace of commercial vehicles has lagged behind relatively. The domain controller solution adopts a virtualized multi-operating system software architecture and is integrated through a high-computing power hardware platform to meet future intelligent expansion and enhance the intelligence and networking level of the entire vehicle.

[0005] Existing products use separate controllers, and the cockpit system has no less than 7 controllers, mainly including instrument controller, integrated central control controller, station announcement controller, air conditioning control panel, 360 panoramic controller, low-speed warning controller, reversing alarm controller, etc. The products have single functions and are independent of each other. They need to be developed and purchased separately, which is expensive. There is no information interaction between multiple controllers, and only CAN can be supported for low-speed transmission. Some do not support OTA functions. It will be complicated to add functions in the future, and upgrading will be slow and the development cost will be high.

[0006] The traditional cockpit product structure is relatively scattered, with low integration and scalability, high cost, and complex installation; the hardware change cost is high and the heat dissipation effect is poor. Utility Model Content

[0007] The technical problem to be solved by the utility model is: to provide an integrated structure for a cockpit domain controller with a high degree of integration, so that the installation is convenient and the heat dissipation performance is good.

[0008] In order to achieve the above object, the utility model is realized by the following technical solutions:

[0009] A smart cockpit domain controller structure comprises a bottom shell, a bottom PCBA assembly and a mounting bracket are arranged on the bottom shell, the mounting bracket is located on the side of the bottom PCBA assembly, a tail socket bracket and an antenna cover are arranged on the bottom PCBA assembly, a top PCBA assembly is arranged on the tail socket bracket, the top PCBA assembly is connected to the bottom PCBA assembly through a board-to-board socket, a top heat dissipation shell is arranged on the top of the top PCBA assembly, a fan is installed on the side of the top heat dissipation shell, and a top shell is arranged on the top of the top heat dissipation shell;

[0010] An audio digital signal processor, a cockpit interaction module and a memory are arranged on the top of the top heat dissipation shell;

[0011] The top PCBA assembly has audio input modules and audio controllers installed on it;

[0012] The bottom shell is a die-casting part, and a first digital power amplifier, a second digital power amplifier and an A2B audio bus are placed on the bottom shell.

[0013] The top heat sink is made of aluminum alloy die-casting.

[0014] The tail socket bracket is a sheet metal part.

[0015] Heat dissipation holes are reserved around the bottom case.

[0016] An onboard ceramic antenna is arranged inside the antenna cover, and the antenna cover is made of plastic.

[0017] The cockpit domain controller includes an audio digital signal processor and a cockpit interaction module, an audio input module, a memory, an audio controller, a first digital power amplifier, a second digital power amplifier and an A2B audio bus connected thereto.

[0018] Compared with the prior art, the utility model has the following advantages:

[0019] 1. High integration, powerful chip performance, and many integrated expansion functions can be added in the future.

[0020] 2. Adopt active + passive heat dissipation technology to meet the thermal design requirements of high-performance and high-power chips;

[0021] 3. Reduce the number of controllers, save vehicle wiring harnesses, simplify installation, and save costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is an exploded view of the utility model;

[0023] Figure 2 This is the electrical structure diagram of the smart cockpit domain controller;

[0024] Figure 3 It is the principle diagram of the utility model. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0027] like Figure 1 , Figure 2 , Figure 3 As shown, an intelligent cockpit domain controller can be used for vehicle information display, audio and video entertainment, human-computer interaction and other functions of commercial vehicles, passenger cars and buses.

[0028] A smart cockpit domain controller includes a bottom shell 9, on which a bottom PCBA component 7 and a mounting bracket 8 are arranged, the mounting bracket 8 is located on the side of the bottom PCBA component 7, a tail socket bracket 4 and an antenna cover 5 are arranged on the bottom PCBA component 7, a top PCBA component 3 is arranged on the tail socket bracket 4, the top PCBA component 3 is connected to the bottom PCBA component 7 through a board-to-board socket, a top heat dissipation shell 2 is arranged on the top of the top PCBA component 3, a fan 6 is installed on the side of the top heat dissipation shell 2, and a top shell 1 is arranged on the top of the top heat dissipation shell 2.

[0029] Furthermore, the top heat dissipation shell 2 is designed with aluminum alloy die castings. The design is simulated by sufficient thermal simulation in the early stage, and the audio digital signal processor 11, cockpit interaction module 12 and memory 14 are placed on the top of the top heat dissipation shell 2. The heat dissipation is realized through the flow heat dissipation of the cavity structure of the top heat dissipation shell 2, and the active heat dissipation is coordinated with the fan 6. The active + passive heat dissipation technology is adopted to meet the thermal design requirements of high-performance and high-power chips. The product has been fully simulated and tested in reality to meet the heat dissipation requirements of different complex working conditions and ensure product reliability.

[0030] The top PCBA component 3 adopts high-speed communication technology, and an audio input module 13 and an audio controller 15 are installed on the top PCBA component 3, which supports 5-way vehicle-mounted 2-wire 100M Ethernet transmission, and supports 2-way Gigabit Ethernet compatible selection, and supports Ethernet switch function. The vehicle-mounted industry adopts power transmission G.vn high-speed communication for the first time, saving the whole vehicle wiring harness, and can transmit high-definition video of the station announcement road sign system. All use Ethernet dedicated sockets to meet high-speed signal transmission and shielding anti-interference, and meet EMC requirements.

[0031] The tail socket bracket 4 is made of sheet metal that can be flexibly configured and changed, and can be adjusted according to different hardware configurations to meet the needs of different configuration adaptations and save costs.

[0032] The bottom shell 9 is a die-casting, and a first digital power amplifier 16, a second digital power amplifier 17 and an A2B audio bus 18 are placed on the bottom shell 9. Heat dissipation holes are reserved around the bottom shell 9 for air duct convection, with high heat conversion rate, and the audio power output requirement can be met by heat dissipation at the bottom.

[0033] An onboard ceramic antenna is arranged in the antenna cover 5 . The antenna cover 5 has a built-in antenna anti-shielding structure design and adopts plastic parts to reduce shielding and ensure signal integrity.

[0034] A two-layer design of a top PCBA component 3 and a bottom PCBA component 7 is adopted to isolate high-speed signals and radio frequency signals.

[0035] like Figure 2 As shown, the cockpit domain controller includes an audio digital signal processor 11 and a cockpit interaction module 12, an audio input module 13, a memory 14, an audio controller 15, a first digital power amplifier 16, a second digital power amplifier 17 and an A2B audio bus 18 connected thereto.

[0036] The audio digital signal processor 11 is a DSP module, which is the audio processing core and is responsible for adjusting the audio volume, implementing audio strategies, improving sound quality, and allocating and prioritizing different audio source inputs and audio outputs.

[0037] The cockpit interaction module 12 is integrated with the central control and station announcer; it is responsible for multimedia playback, volume, and sound effect settings; it converts the sound output of human-computer interaction in different scenarios into recognizable signals for audio digital signal processing, uses TDM multi-channel audio signals, can support Android and TTS voice interaction, can support up to 16 channels, and can support dual-zone media, station announcers, and voice broadcast multi-scenario audio output.

[0038] The audio input module 13 is responsible for converting external audio sources, converting analog signals into digital signals, and converting them into signals recognizable by the audio digital signal processor 11; the audio input module 13 receives audio signal inputs from multiple radio stations, wired / wireless microphones, AUX, microphones, etc.

[0039] The memory 14 is used to store recorded fixed playback audio source files, which can be flexibly configured and selected.

[0040] The audio controller 15 uses a microcontroller unit (MCU) to perform parameter configuration and implement multi-scene and multi-object audio software algorithms.

[0041] The first digital power amplifier 16 is used to convert the multi-channel digital signal output by the audio digital signal processor (DSP) module 11 into power, drive the audio speakers, and support multi-zone and multi-channel.

[0042] The second digital power amplifier 17 is used to convert the multi-channel digital signal output by the audio digital signal processor (DSP) module 11 into power, drive the audio speakers, and support multi-zone and multi-channel.

[0043] The optional A2B audio bus 18 is used to convert the multi-channel digital signal output by the audio digital signal processor 11 (DSP) module into an A2B audio bus, and supports the connection of external high-performance A2B devices.

[0044] The above is only a preferred embodiment of the present invention. It should be pointed out that those skilled in the art can make several changes and improvements without departing from the overall concept of the present invention, and these should also be regarded as the protection scope of the present invention.

Claims

1. An intelligent cockpit domain controller structure, characterized in that: The invention comprises a bottom shell (9), on which a bottom PCBA component (7) and a mounting bracket (8) are arranged, the mounting bracket (8) being located on the side of the bottom PCBA component (7), a tail socket bracket (4) and an antenna cover (5) being arranged on the bottom PCBA component (7), a top PCBA component (3) being arranged on the tail socket bracket (4), the top PCBA component (3) being connected to the bottom PCBA component (7) via a board-to-board socket, a top heat dissipation shell (2) being arranged on the top of the top PCBA component (3), a fan (6) being installed on the side of the top heat dissipation shell (2), and a top shell (1) being arranged on the top of the top heat dissipation shell (2); An audio digital signal processor (11), a cockpit interaction module (12) and a memory (14) are arranged on the top of the top heat dissipation shell (2); An audio input module (13) and an audio controller (15) are mounted on the top PCBA assembly (3); The bottom shell (9) is a die-casting part, and a first digital power amplifier (16), a second digital power amplifier (17) and an A2B audio bus (18) are placed on the bottom shell (9).

2. The intelligent cockpit domain controller structure according to claim 1, characterized in that: The top heat dissipation shell (2) is made of aluminum alloy die casting.

3. The intelligent cockpit domain controller structure according to claim 1, characterized in that: The rear socket bracket (4) is a sheet metal part.

4. The intelligent cockpit domain controller structure according to claim 1, characterized in that: Heat dissipation holes are reserved around the bottom shell (9).

5. The intelligent cockpit domain controller structure according to claim 1, characterized in that: An onboard ceramic antenna is arranged inside the antenna cover (5), and the antenna cover (5) is made of plastic.

6. The intelligent cockpit domain controller structure according to claim 1, characterized in that: The cockpit domain controller comprises an audio digital signal processor (11) and a cockpit interaction module (12), an audio input module (13), a memory (14), an audio controller (15), a first digital power amplifier (16), a second digital power amplifier (17) and an A2B audio bus (18) connected thereto.

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