Backboard and electronic equipment

By designing connectors for multi-region circuit boards and different data transmission channels, combining programmable logic devices and control switch components, the problem of the large number of backplanes in existing electronic devices is solved, achieving higher compatibility and thinner adaptation sex.

CN222529772UActive Publication Date: 2025-02-25LENOVO (BEIJING) LTD
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Patent Information

Application Number
CN202421235875.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-31
Publication Date
2025-02-25
Estimated Expiration
2034-05-31

AI Technical Summary

Technical Problem

There are many different types of backplanes in existing electronic devices to meet the signal transmission needs of different storage components, resulting in increased equipment complexity and limited development of lightweight and thinning.

Method used

Design a backplane whose circuit board contains multiple areas, each area is equipped with a different number of connectors for data transmission channels, and realizes data interaction between different storage elements through programmable logic devices and control switch components, improving the compatibility of the backplane sex.

Benefits of technology

It reduces the number of backplanes that need to be set in electronic devices, improves equipment compatibility and thinness adaptability, and reduces equipment complexity.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a backboard and electronic equipment, and the backboard comprises a circuit board which comprises at least one first region and at least one second region; the first connector is located in the first area of the circuit board, the first connector is used for connecting a first storage element, and the first connector is provided with a first number of data transmission channels; the second connector is located in the second area of the circuit board, the second connector is used for connecting a second storage element, and the second connector is provided with a second number of data transmission channels; wherein the first number is greater than the second number.
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Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a backplane and an electronic device comprising the backplane. Background Art

[0002] With the development of storage technology, there are more and more types of storage elements. In current applications, different types of storage elements need to be inserted into different backplanes to achieve signal transmission between the storage elements and other elements. As a result, a large number of backplanes need to be set in existing electronic devices, affecting the development of lightweight electronic devices. Utility Model Content

[0003] In view of this, the present application provides a backplane and an electronic device, and the scheme is as follows:

[0004] A back plate, comprising:

[0005] A circuit board, the circuit board comprising at least one first area and at least one second area;

[0006] A first connector located in the first area of ​​the circuit board, the first connector being used to connect a first storage element, and the first connector having a first number of data transmission channels;

[0007] a second connector located in the second area of ​​the circuit board, the second connector being used to connect a second storage element, and the second connector having a second number of data transmission channels;

[0008] Wherein, the first number is greater than the second number.

[0009] Optionally, also include:

[0010] At least one hard disk interface and at least one control switch component, the hard disk interface includes a first group of data interfaces and a second group of data interfaces, wherein the first group of data interfaces interacts with the first connector, and the second group of data interfaces interacts with the first connector through the control switch component or interacts with the second connector through the control switch component.

[0011] Optionally, the second group of data interfaces includes a data output interface and a data input interface; the control switch assembly includes a first control switch and a second control switch;

[0012] Wherein, the input end of the first control switch is connected to the data output interface, the first output end is connected to the first connector, and the second output end is connected to the second connector;

[0013] The output end of the second control switch is connected to the data input interface, the first input end is connected to the first connector, and the second input end is connected to the second connector.

[0014] Optionally, also include:

[0015] A programmable logic device outputs a control signal to control the working state of the control switch component based on at least one of the state of a first storage element electrically connected to the first connector and the state of a second storage element electrically connected to the second connector.

[0016] Optionally, when the first storage element having the first number of data transmission channels is inserted into the first connector, the programmable logic device outputs a first control signal to control the control switch component to connect the path between the first connector and the hard disk interface; and when the first storage element having the second number of data transmission channels is inserted into the first connector, the programmable logic device outputs a second control signal to control the control switch component to connect the path between the second connector and the hard disk interface.

[0017] Optionally, the circuit board includes a plurality of first areas and a plurality of second areas arranged alternately in a first direction, a size of the first area along the first direction is larger than a size of the second area along the first direction; and the first direction is parallel to a surface of the circuit board.

[0018] Optionally, the first connector is a connector that uses the Gen-Z protocol for data interaction, the second connector is a connector that uses the Gen-Z protocol for data interaction, and a data transmission channel in the first connector is twice that of the data transmission channel in the second connector.

[0019] An electronic device, comprising: a backplane, a first storage element, and a second storage element, wherein the backplane comprises:

[0020] A circuit board, the circuit board comprising at least one first area and at least one second area;

[0021] a first connector located in the first area of ​​the circuit board, the first connector being used to connect the first storage element, the first connector having a first number of data transmission channels;

[0022] a second connector located in the second area of ​​the circuit board, the second connector being used to connect the second storage element, and the second connector having a second number of data transmission channels;

[0023] Wherein, the first number is greater than the second number.

[0024] Optionally, the number of data transmission channels of the first storage element is greater than the number of data transmission channels of the second storage element;

[0025] Alternatively, the number of data transmission channels of the first storage element is the same as the number of data transmission channels of the second storage element.

[0026] Optionally, if the number of data transmission channels of the first storage element is greater than the number of data transmission channels of the second storage element, the first storage element is a memory, and the second storage element is a hard disk. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the drawings required for use in the embodiments or descriptions of the prior art will be briefly introduced below. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0028] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which this application can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by this application, should still fall within the scope of the technical contents disclosed in this application.

[0029] Figure 1 A schematic diagram of the structure of a backplane provided in one embodiment of the present application;

[0030] Figure 2 A schematic diagram of the structure of a backplane provided in another embodiment of the present application;

[0031] Figure 3 A schematic diagram of the structure of a backplane provided in yet another embodiment of the present application;

[0032] Figure 4 A schematic diagram of the structure of a backplane provided in yet another embodiment of the present application;

[0033] Figure 5 A schematic diagram of the structure of a backplane provided in yet another embodiment of the present application;

[0034] Figure 6 A schematic diagram of the structure of an electronic device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the embodiments in the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0036] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0037] As described in the background technology section, in current applications, different types of storage components need to be inserted into different backplanes, which results in a large number of backplanes being required in existing electronic devices, affecting the development of lightweight electronic devices.

[0038] In view of this, an embodiment of the present application provides a backplane, such as Figure 1 As shown, the backplane includes:

[0039] A circuit board 10, wherein the circuit board 10 includes at least one first area 11 and at least one second area 12;

[0040] A first connector 20 located in the first area 11 of the circuit board 10, the first connector 20 is used to connect a first storage element, and the first connector 20 has a first number of data transmission channels;

[0041] a second connector 30 located in the second area 12 of the circuit board 10, the second connector 30 being used to connect a second storage element, and the second connector 30 having a second number of data transmission channels;

[0042] Wherein, the first number is greater than the second number.

[0043] It should be noted that, in the embodiment of the present application, a data transmission channel is a signal transceiver channel, which specifically includes a signal output channel and a signal input channel.

[0044] The backplane provided in the embodiment of the present application includes a first connector and a second connector. The data transmission channels of the first connector and the second connector are different, so that the backplane can be used to insert different types of storage elements, thereby improving the compatibility of the backplane. When applied to electronic devices compatible with multiple types of storage elements, the number of backplanes set in the electronic device can be reduced, which is suitable for the development of lighter and thinner electronic devices.

[0045] In addition, it should be noted that since the number of data transmission channels of the first connector is greater than the number of data transmission channels of the second connector, in this embodiment, the second connector can be used to connect a second storage element having a second number of data transmission channels, and the first connector can be used to connect a first storage element having a first number of data transmission channels, and can also be used to connect a first storage element having a second number of data transmission channels.

[0046] Optionally, in one embodiment of the present application, the first number is N times the second number, so that the backplane provided in the embodiment of the present application is compatible with the first storage element with the first number of data transmission channels and the first storage element with the second number of data transmission channels, and the maximum number of storage elements with the second number of transmission channels that can be inserted when the backplane is used to insert the storage element with the second number of data transmission channels is increased as much as possible.

[0047] Specifically, in one embodiment of the present application, the first number is 8, and the second number is 4. In this embodiment, the first connector has 8 data transmission channels, and the second connector has 4 data transmission channels; or, the first number is 16, and the second number is 8. In this embodiment, the first connector has 16 data transmission channels, and the second connector has 8 data transmission channels; or, the first number is 16, and the second number is 4. In this embodiment, the first connector has 16 data transmission channels, and the second connector has 4 data transmission channels. This application does not limit this, and it depends on the specific circumstances.

[0048] It should be noted that with the growing demand for high-performance storage and memory expansion in data centers, E3.S hard drives and CXL Memory (memory expander) have become important technologies to promote data processing capabilities. Among them, E3.S is a form factor specification of a storage component under the EDSFF (Enterprise and Data Center SSD Form Factor, which refers to the physical form and specifications of solid-state drives (SSDs) designed for enterprises and data centers) standard. CXL (Compute Express Link) Memory is a memory expansion technology based on the CXL standard that allows the CPU to directly connect to other devices (such as GPUs or dedicated accelerators) to achieve efficient data transmission and processing.

[0049] It should also be noted that in current applications, E3.S-type hard drives mostly use 4 data transmission channels, and E3.S memory expanders mostly use 8 data transmission channels. Therefore, in this embodiment, the backplane provided in the embodiment of the present application is described by taking the first number being 8 and the second number being 4 as an example. However, when the first number and the second number take other values, the solution provided in the present application is also applicable.

[0050] like Figure 2 As shown, in one embodiment of the present application, the backplane further includes: at least one hard disk interface 40 and at least one control switch assembly 50, the hard disk interface 40 includes a first group of data interfaces and a second group of data interfaces, wherein the first group of data interfaces performs data exchange with the first connector 20, and the second group of data interfaces performs data exchange with the first connector 20 through the control switch assembly 50 or performs data exchange with the second connector 30 through the control switch assembly 50. Optionally, in one embodiment of the present application, the hard disk interface is an MCIO interface. It should be noted that the MCIO interface is a high-speed, high-density interconnection technology designed for data centers, networks, and telecommunications markets, and is used to support multiple signal protocols such as SAS, PCIe, and Ethernet. In this embodiment, the signal between the hard disk interface and the first connector adopts the PCIe signal protocol, and the signal between the hard disk interface and the second connector adopts the PCIe signal protocol as an example for description.

[0051] Specifically, in the above embodiment, if the first connector is used to connect a first storage element having a first number of data transmission channels, the control switch component controls the path between the second group of data interfaces and the first connector to be connected, so that data interaction is performed between the second group of data interfaces and the first connector; if the first connector is used to connect a first storage element having a second number of data transmission channels, the control switch component controls the path between the second group of data interfaces and the second connector to be connected, so that data interaction is performed between the second group of data interfaces and the second connector.

[0052] Optionally, based on the above embodiment, in one embodiment of the present application, Figure 3As shown, the second group of data interfaces includes a data output interface and a data input interface, and the control switch component 50 includes a first control switch SW1 and a second control switch SW2; wherein the input end of the first control switch SW1 is connected to the data output interface in the second group of data interfaces, the first output end of the first control switch SW1 is connected to the first connector 20, and the second output end of the first control switch SW1 is connected to the second connector 30, for transmitting the data signal output by the data output interface in the second group of data interfaces to the first connector 20 or the second connector 30, that is, for transmitting the data signal output by the data output interface in the second group of data interfaces to the first storage element connected to the first connector 20, or to the second storage element connected to the second connector 30; the output end of the second control switch SW2 is connected to the data input interface in the second group of data interfaces, the first input end of the second control switch SW2 is connected to the first connector 20, and the second input end of the second control switch SW2 is connected to the second connector 30, for reading data in the first storage element connected to the first connector 20, or for reading data in the second storage element connected to the second connector 30.

[0053] It should be noted that, in the above embodiment, the first group of data interfaces also includes a data output interface and a data input interface, and the data output interface and the data input interface in the first group of data interfaces are always connected to the first connector.

[0054] It should also be noted that the data output interface in the second group of data interfaces can only interact with the first connector or the second connector at the same time. Optionally, in an embodiment of the present application, Figure 4 As shown, the backplane also includes: a programmable logic device CPLD, which outputs a control signal to control the working state of the control switch component based on at least one of the state of the first storage element electrically connected to the first connector 20 and the state of the second storage element electrically connected to the second connector 30.

[0055] Specifically, continue as Figure 4As shown, if a first storage element with a first number of data transmission channels is inserted into the first connector 20, the programmable logic device CPLD controls the first control switch SW1 to conduct the path between the data output interface in the second group of data interfaces and the first connector 20, and controls the second control switch SW2 to conduct the path between the data input interface in the second group of data interfaces and the first connector 20, so that both the first group of data interfaces and the second group of data interfaces perform data interaction with the first storage element inserted in the first connector 20; if a first storage element with a second number of data transmission channels is inserted into the first connector 20, the programmable logic device CPLD controls the first control switch SW1 to conduct the path between the data output interface in the second group of data interfaces and the second connector 30, and controls the second control switch SW2 to conduct the path between the data input interface in the second group of data interfaces and the second connector 30, so that the first group of data interfaces perform data interaction with the first storage element inserted in the first connector 20, and the second group of data interfaces perform data interaction with the second storage element inserted in the second connector 30.

[0056] Optionally, based on the above embodiments, in one embodiment of the present application, when the first storage element having a first number of data transmission channels is inserted into the first connector, the programmable logic device outputs a first control signal to control the control switch component to connect the path between the first connector and the hard disk interface; when the first storage element having a second number of data transmission channels is inserted into the first connector, the programmable logic device outputs a second control signal to control the control switch component to connect the path between the second connector and the hard disk interface.

[0057] Specifically, in one embodiment of the present application, Figure 4 and Figure 5 As shown, the programmable logic device CPLD determines to output a first control signal or a second control signal based on the received in-place information PRSNT, wherein the in-place information PRSNT represents the type of the first storage element inserted into the first connector 20 and the type of the second storage element inserted into the second connector 20.

[0058] Optionally, in one embodiment of the present application, if a first storage element with a first number of data transmission channels is inserted into the first connector 20, the in-position information PRSNT is 00 (i.e., PRSNT0=0, PRSNT1=0); if a first storage element with a second number of data transmission channels is inserted into the first connector 20, and / or if a second storage element with a second number of data transmission channels is inserted into the second connector 30, the in-position information PRSNT is 01 (i.e., PRSNT0=0, PRSNT1=1); if no storage element is inserted into the first connector 20 and the second connector 30, the in-position information PRSNT is 11 (i.e., PRSNT0=1, PRSNT1=1). In this embodiment, when the in-position information received by the programmable logic device CPLD is 00, a first control signal is output to control the control switch component to connect the path between the first connector 20 and the hard disk interface 40; otherwise, a second control signal is output to control the control switch component to connect the path between the second connector 30 and the hard disk interface 40, thereby realizing automatic control of the control switch component and further realizing automatic allocation of PCLe signals. Among them, PCIe (Peripheral Component Interconnect Express) is a high-speed serial computer expansion bus standard used to connect peripheral devices in a computer system to a high-bandwidth interface on the motherboard.

[0059] It should be noted that in actual applications, storage elements with the same number of data transmission channels may also have different thicknesses. For example, the storage element in the E3.S form has two thickness specifications, 7.5mm and 16.8mm, respectively, allowing E3.S to more flexibly adapt to the configuration requirements of different server chassis.

[0060] Therefore, in one embodiment of the present application, continue as Figure 1 As shown, the circuit board 10 includes a plurality of first areas 11 and a plurality of second areas 12 arranged in a first direction X, the size of the first area 11 along the first direction X is larger than the size of the second area 12 along the first direction X, and the first direction X is parallel to the surface of the circuit board, so that the first area 11 can not only place a first storage element with a smaller thickness, but also place a first storage element with a larger thickness, thereby further improving the compatibility of the backplane.

[0061] Continuing to take the storage element in the E3.S form as an example, the currently commonly used E3.S form hard disk usually uses 4 data transmission channels for data exchange, and the commonly used E3.S form hard disk is divided into 7.5mm and 16.8mm; the currently commonly used E3.S form memory expander usually uses 8 data transmission channels for data exchange, and its thickness is also divided into 7.5mm and 16.8mm. Now most manufacturers use 16.8mm thickness for CXL memory expanders. As shown in Table 1, Table 1 uses the size parameters of storage elements of different thicknesses in the E3.S form.

[0062] Table 1:

[0063] Storage device form high length thickness E3.S 76mm 112.75mm 7.5mm E3.S 2T 76mm 112.75mm 16.8mm

[0064] In this embodiment, if the first connector located in the first area has 8 data transmission channels and the second connector located in the second area has 4 data transmission channels, the first area can be used to place a hard disk or memory expander with a thickness of 16.8 mm, and the second area can be used to place a hard disk with a thickness of 7.5 mm.

[0065] It can be seen that the backplane provided in the embodiment of the present application can be inserted into a hard disk or memory expander with a thickness of 16.8 mm, and can also be inserted into a hard disk with a thickness of 7.5 mm, so that it can be compatible with three storage elements. Compared with setting up corresponding backplanes separately, the number of backplanes that can be set in the electronic device is significantly reduced.

[0066] It should be noted that, in this embodiment, a first connector and a second connector corresponding to the same hard disk interface will share the second group of data interfaces in the hard disk interface. Therefore, based on the above embodiment, in one embodiment of the present application, Figure 1 and Figure 4 As shown, the first area 11 and the second area 12 are arranged alternately in the first direction X, so that when the first connector 20 located in the first area 11 and the second connector 30 located in the second area 12 are connected to the same hard disk interface through the control switch component, the wiring difficulty of the electrical connection line when the hard disk interface is electrically connected to the first connector 20 and the second connector 30 through the control switch component can be reduced, saving the space occupied by the wiring. However, the present application is not limited to this. In other embodiments of the present application, when the backplane includes multiple first areas and multiple second areas, the first areas and the second areas may not be arranged alternately, depending on the specific situation.

[0067] It should be noted that the embodiment of the present application does not limit the number of first connectors and second connectors provided in the backplane, which depends on the requirements of the electronic device to which the backplane is applied.

[0068] On the basis of any of the above embodiments, in one embodiment of the present application, the first connector is a connector that uses the Gen-Z protocol for data exchange, the second connector is a connector that uses the Gen-Z protocol for data exchange, and the data transmission channel in the first connector is twice the data transmission channel of the second connector. Specifically, in one embodiment of the present application, the first connector can be a Gen-Z 2C connector, and the second connector can be a Gen-Z 1C connector. The present application does not limit this, and it depends on the specific situation. It should be noted that at the physical connection level, the "C" in Gen-Z 2C and Gen-Z 1C represents the configuration of the connector, where each "C" contains 8 pairs of differential signals, that is, 4 transceiver channels (that is, 4 signal transmission channels), 1C is 4 transceiver channels (that is, 4 signal transmission channels), and 2C is 8 transceiver channels (that is, 8 signal transmission channels).

[0069] Accordingly, the present application also provides an electronic device, such as Figure 6 As shown, the electronic device includes: a backplane 100, a first storage element 200 and a second storage element 300, wherein the backplane 100 can be the backplane provided by any of the above embodiments. Specifically, the backplane includes:

[0070] A circuit board, the circuit board comprising at least one first area and at least one second area;

[0071] a first connector 20 located in the first area of ​​the circuit board, the first connector 20 being used to connect the first storage element 200, and the first connector 20 having a first number of data transmission channels;

[0072] A second connector 30 located in a second area of ​​the circuit board, the second connector 30 being used to connect the second storage element 300, and the second connector 30 having a second number of data transmission channels;

[0073] Wherein, the first number is greater than the second number.

[0074] Optionally, in one embodiment of the present application, the first number is N times the second number, so that the backplane provided in the embodiment of the present application is compatible with the first storage element with the first number of data transmission channels and the first storage element with the second number of data transmission channels, and the maximum number of storage elements with the second number of transmission channels that can be inserted when the backplane is used to insert the storage element with the second number of data transmission channels is increased as much as possible.

[0075] It should be noted that, in the above embodiment, the number of data transmission channels in the first connector located in the first area is greater than the number of data transmission channels in the second connector located in the second area, the number of data transmission channels of the first storage element is not necessarily greater than the number of data transmission channels of the second storage element, and the number of data transmission channels of the first storage element and the number of data transmission channels of the second storage element may be the same or different.

[0076] Specifically, in one embodiment of the present application, the number of data transmission channels of the first storage element is greater than the number of data transmission channels of the second storage element; optionally, in one embodiment of the present application, the first storage element is a memory, and the second storage element is a hard disk. Specifically, the first storage element may be a memory expander in the form of E3.S, and the second storage element may be a hard disk in the form of E3.S, but the present application does not limit this and it depends on the specific circumstances.

[0077] In another embodiment of the present application, the number of data transmission channels of the first storage element is the same as the number of data transmission channels of the second storage element; optionally, in an embodiment of the present application, the first storage element is a hard disk, and the second storage element is a hard disk. Specifically, the first storage element may be a hard disk with a thickness of 16.8 mm in the E3.S form, and the second storage element may be a hard disk with a thickness of 7.5 mm in the E3.S form, but the present application does not limit this and it depends on the specific circumstances.

[0078] Based on any of the above embodiments, in one embodiment of the present application, the backplane also includes: at least one hard disk interface and at least one control switch component, the hard disk interface includes a first group of data interfaces and a second group of data interfaces, wherein the first group of data interfaces interacts with the first connector for data, and the second group of data interfaces interacts with the first connector through the control switch component or interacts with the second connector through the control switch component.

[0079] Optionally, in one embodiment of the present application, the second group of data interfaces includes a data output interface and a data input interface, and the control switch assembly includes a first control switch and a second control switch; wherein the input end of the first control switch is connected to the data output interface in the second group of data interfaces, the first output end of the first control switch is connected to the first connector, and the second output end of the first control switch is connected to the second connector, for transmitting the data signal output by the data output interface in the second group of data interfaces to the first connector or the second connector, that is, for transmitting the data signal output by the data output interface in the second group of data interfaces to the first storage element connected to the first connector, or to the second storage element connected to the second connector; the output end of the second control switch is connected to the data input interface in the second group of data interfaces, the first input end of the second control switch is connected to the first connector, and the second input end of the second control switch is connected to the second connector, for reading data in the first storage element connected to the first connector, or for reading data in the second storage element connected to the second connector.

[0080] It should be noted that the data output interface in the second group of data interfaces can only interact with the first connector or the second connector at the same time. Therefore, in one embodiment of the present application, the backplane also includes: a programmable logic device, which outputs a control signal to control the working state of the control switch component based on at least one of the state of the first storage element electrically connected to the first connector and the state of the second storage element electrically connected to the second connector.

[0081] Based on any of the above embodiments, in one embodiment of the present application, the circuit board includes a plurality of first areas and a plurality of second areas arranged in a first direction, a size of the first area along the first direction is larger than a size of the second area along the first direction, and the first direction is parallel to the surface of the circuit board, so that the first area can not only be used to place a first storage element with a smaller thickness, but also a first storage element with a larger thickness, thereby further improving the compatibility of the backplane.

[0082] It should be noted that, in this embodiment, a first connector and a second connector corresponding to the same hard disk interface will share the second group of data interfaces in the hard disk interface. Therefore, based on the above embodiment, in one embodiment of the present application, the first area and the second area are arranged alternately in the first direction, so that when the first connector located in the first area and the second connector located in the second area are connected to the same hard disk interface through the control switch component, the wiring difficulty of the electrical connection line when the hard disk interface is electrically connected to the first connector and the second connector through the control switch component can be reduced, saving the space occupied by the wiring. However, the present application does not limit this. In other embodiments of the present application, when the backplane includes multiple first areas and multiple second areas, the first area and the second area may not be arranged alternately, depending on the specific situation.

[0083] In summary, in the electronic device provided in the embodiment of the present application, the backplane includes a first connector and a second connector, and the data transmission channels of the first connector and the second connector are different, so that the backplane can be used to insert different types of storage elements, thereby improving the compatibility of the backplane. Further, when applied to electronic devices compatible with multiple types of storage elements, the number of backplanes set in the electronic device can be reduced, which is suitable for the development of lighter and thinner electronic devices.

[0084] In this specification, each embodiment is described in a progressive, parallel, or progressive and parallel manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0085] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A backplane, characterized in that: include: A circuit board, the circuit board comprising at least one first area and at least one second area; A first connector located in the first area of ​​the circuit board, the first connector being used to connect a first storage element, and the first connector having a first number of data transmission channels; a second connector located in the second area of ​​the circuit board, the second connector being used to connect a second storage element, and the second connector having a second number of data transmission channels; Wherein, the first number is greater than the second number.

2. The back plate according to claim 1, characterized in that: Also includes: At least one hard disk interface and at least one control switch component, the hard disk interface includes a first group of data interfaces and a second group of data interfaces, wherein the first group of data interfaces interacts with the first connector, and the second group of data interfaces interacts with the first connector through the control switch component or interacts with the second connector through the control switch component.

3. The back plate according to claim 2, characterized in that: The second group of data interfaces includes a data output interface and a data input interface; the control switch assembly includes a first control switch and a second control switch; Wherein, the input end of the first control switch is connected to the data output interface, the first output end is connected to the first connector, and the second output end is connected to the second connector; The output end of the second control switch is connected to the data input interface, the first input end is connected to the first connector, and the second input end is connected to the second connector.

4. The back plate according to claim 2 or 3, characterized in that: Also includes: A programmable logic device outputs a control signal to control the working state of the control switch component based on at least one of the state of a first storage element electrically connected to the first connector and the state of a second storage element electrically connected to the second connector.

5. The back plate according to claim 4, characterized in that: When the first storage element having the first number of data transmission channels is inserted into the first connector, the programmable logic device outputs a first control signal to control the control switch component to connect the path between the first connector and the hard disk interface. When the first storage element having the second number of data transmission channels is inserted into the first connector, the programmable logic device outputs a second control signal to control the control switch component to connect the path between the second connector and the hard disk interface.

6. The back plate according to claim 2, characterized in that: The circuit board comprises a plurality of first areas and a plurality of second areas arranged alternately in a first direction, wherein the size of the first area along the first direction is greater than the size of the second area along the first direction; The first direction is parallel to a surface of the circuit board.

7. The back plate according to claim 1, characterized in that: The first connector is a connector that uses the Gen-Z protocol for data exchange, the second connector is a connector that uses the Gen-Z protocol for data exchange, and the data transmission channel in the first connector is twice the data transmission channel in the second connector.

8. An electronic device, characterized in that: include: A backplane, a first storage element, and a second storage element, wherein the backplane comprises: A circuit board, the circuit board comprising at least one first area and at least one second area; a first connector located in the first area of ​​the circuit board, the first connector being used to connect the first storage element, the first connector having a first number of data transmission channels; a second connector located in the second area of ​​the circuit board, the second connector being used to connect the second storage element, and the second connector having a second number of data transmission channels; Wherein, the first number is greater than the second number.

9. The electronic device according to claim 8, characterized in that: The number of data transmission channels of the first storage element is greater than the number of data transmission channels of the second storage element; Alternatively, the number of data transmission channels of the first storage element is the same as the number of data transmission channels of the second storage element.

10. The electronic device according to claim 9, characterized in that: If the number of data transmission channels of the first storage element is greater than the number of data transmission channels of the second storage element, the first storage element is a memory, and the second storage element is a hard disk.