RFID tag for sealing sample management

Abstract

The utility model relates to the technical field of electronic tag application design, in particular to an RFID tag for sealing sample management. The tag comprises an RFID chip, a surface paper layer, an antenna layer, a first adhesive layer and a bottom paper layer, the surface paper layer, the antenna layer, the first adhesive layer and the bottom paper layer are sequentially stacked, the antenna layer comprises a first antenna circuit layer, a base material layer and a second antenna circuit layer which are sequentially stacked, and the first antenna circuit layer and the second antenna circuit layer are electrically connected through metal via holes formed in the base material layer. The RFID chip is electrically connected with the first antenna circuit layer or the second antenna circuit layer; and the bottom paper layer is torn down when the RFID tag is used, so that the first adhesive layer is adhered to the surface of an object. According to the anti-tamper anti-transfer RFID tag, the antenna layer can be easily torn after the anti-tamper anti-transfer RFID tag is uncovered by external force, so that the RFID tag loses efficacy, the anti-tamper anti-transfer RFID tag is provided with the RFID chip capable of storing rich information, the good anti-tamper anti-transfer effect is achieved, and the authenticity of objects in sample sealing management is guaranteed.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electronic tag application design, and in particular to an RFID (Radio Frequency Identification) tag for sample sealing management. Background Art

[0002] Sampling and testing of power materials is one of the important links in the procurement of power grid materials. In the current sampling management of power materials, the sampling samples are generally sealed in the form of seals, mainly using transparent tape, fragile stickers, etc. as seals, and then transported to the testing agency for inspection by logistics. This type of sealing method has low reliability, poor confidentiality of sampling information, and difficult supervision of sample circulation. In addition, the seals used are very easy to copy, resulting in the risk of artificial substitution of the sampled samples, which ultimately affects the authenticity of the sampling results of power materials.

[0003] Although there are existing technologies that apply RFID technology to the sealing of items, they generally only use double-sided tape to simply stick the RFID tag, and there is no guarantee that the antenna inside the RFID tag will be torn after it is peeled off. Therefore, the anti-transfer property is poor and the authenticity of the item sampling results cannot be well guaranteed. Utility Model Content

[0004] In order to solve the problems in the related technology, the embodiment of the present disclosure provides an RFID tag for sample sealing management. The antenna layer of the tag can be easily torn after being peeled off, and the tag will become invalid immediately, thereby having good anti-dismantling and anti-transfer effects. The tag can be used in the scenarios of sample delivery, sample storage and sample sealing management of various items, and can effectively eliminate the risk of sampled samples being replaced.

[0005] In an embodiment of the present disclosure, an RFID tag for sample sealing management is provided, the tag comprising an RFID chip and a surface paper layer, an antenna layer, a first adhesive layer and a bottom paper layer stacked in sequence, wherein:

[0006] The antenna layer comprises a first antenna circuit layer, a substrate layer, and a second antenna circuit layer which are sequentially stacked, the substrate layer is provided with a metal via, the first antenna circuit layer and the second antenna circuit layer are electrically connected through the metal via, and the RFID chip is electrically connected to the first antenna circuit layer or the second antenna circuit layer;

[0007] The bottom paper layer is torn off when the RFID tag is used so that the first adhesive layer can be attached to the surface of the object.

[0008] According to an embodiment of the present disclosure, the tag further includes a wave absorbing layer, the wave absorbing layer is arranged between the first adhesive layer and the antenna layer, and the wave absorbing layer is made of a high magnetic permeability magnetic material.

[0009] According to an embodiment of the present disclosure, the high magnetic permeability magnetic material is a flexible ferrite material.

[0010] According to an embodiment of the present disclosure, the thickness W1 of the wave absorbing layer is 0.05 mm ≤ W1 ≤ 0.2 mm.

[0011] According to an embodiment of the present disclosure, the surface paper layer is bonded to the first antenna circuit layer via a second adhesive layer;

[0012] The first antenna circuit layer is bonded to the substrate layer via a third adhesive layer;

[0013] The substrate layer is bonded to the second antenna circuit layer via a fourth adhesive layer;

[0014] The second antenna circuit layer is bonded to the absorbing layer via a fifth adhesive layer.

[0015] According to an embodiment of the present disclosure, the substrate layer is made of a flexible material that is easily separated from the adhesive layer; and the first antenna circuit layer and the second antenna circuit layer are both provided with RFID antenna coils.

[0016] According to an embodiment of the present disclosure, the RFID antenna coil is made of aluminum foil and / or copper foil.

[0017] According to an embodiment of the present disclosure, the thickness W2 of the RFID antenna coil is 0.02 mm ≤ W2 ≤ 0.05 mm.

[0018] According to an embodiment of the present disclosure, the surface paper layer is made of flexible paper material.

[0019] According to an embodiment of the present disclosure, the RFID chip is electrically connected to the first antenna circuit layer or the second antenna circuit layer, including: packaging the RFID chip in the first antenna circuit layer or the second antenna circuit layer using a packaging process.

[0020] According to the technical solution provided by the embodiment of the present disclosure, the RFID tag for sealing sample management includes an RFID chip and a sequentially stacked surface paper layer, an antenna layer, a first adhesive layer and a bottom paper layer, wherein: in the antenna layer, the first antenna circuit layer and the second antenna circuit layer are electrically connected through the metal vias on the substrate layer arranged in the middle, and the RFID chip is electrically connected to the first antenna circuit layer or the second antenna circuit layer; when the RFID tag is used, the bottom paper layer is torn off so that the first adhesive layer is attached to the surface of the object. When the RFID tag of the present disclosure is lifted by an external force, the antenna layer can be easily torn, that is, the first antenna circuit layer and the second antenna circuit layer are disconnected, thereby making the RFID tag invalid. Therefore, the present disclosure not only has an RFID chip that can store rich information, which is convenient for rapid writing and identification of information, but also achieves a good anti-disassembly and anti-transfer effect. When the present disclosure is applied to the scene of sample delivery, sample storage and sealing sample management of items, it can effectively eliminate the risk of sample replacement, etc., can ensure the authenticity of the sampling results of items, and realize the digital management of sampling information.

[0021] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Other features, objectives and advantages of the present disclosure will become more apparent through the following detailed description of non-limiting embodiments in conjunction with the accompanying drawings. In the accompanying drawings:

[0023] Figure 1 A schematic diagram showing the overall structure of an RFID tag for sample sealing management according to an embodiment of the present disclosure is shown;

[0024] Figure 2 A schematic diagram showing an RFID tag for sample sealing management using an embodiment of the present disclosure in a radio frequency identification application scenario;

[0025] Figure 3 A schematic diagram of the overall structure of another RFID tag for sample sealing management according to an embodiment of the present disclosure is shown.

[0026] In the figure: 1, surface paper layer; 2, antenna layer; 201, first antenna circuit layer; 202, substrate layer; 203, second antenna circuit layer; 3, first adhesive layer; 4, bottom paper layer; 5, second adhesive layer; 6, third adhesive layer; 7, fourth adhesive layer; 8, fifth adhesive layer; 9, RFID chip; 10, metal via; 11, absorbing layer. DETAILED DESCRIPTION

[0027] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement them. In addition, for the sake of clarity, parts not related to the description of the exemplary embodiments are omitted in the accompanying drawings.

[0028] In the present disclosure, it should be understood that terms such as "include" or "have" are intended to indicate the presence of features, numbers, steps, behaviors, components, parts, or a combination thereof disclosed in the present specification, and are not intended to exclude the possibility that one or more other features, numbers, steps, behaviors, components, parts, or a combination thereof exist or are added.

[0029] It should also be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0030] As mentioned above, in the current sampling management of power materials, the sampled samples are generally packaged in the form of seals such as transparent tape and fragile stickers. Such sealing means have low reliability, poor confidentiality of sampling information, and difficult supervision of sample circulation. In addition, the seals used are very easy to copy, resulting in the risk of artificial substitution of the sampled samples, which ultimately affects the authenticity of the sampling results of power materials. The present disclosure provides an RFID tag for sealing management, the tag includes an RFID chip and a sequentially stacked surface paper layer, an antenna layer, a first adhesive layer and a bottom paper layer, wherein: the antenna layer includes a first antenna circuit layer, a substrate layer and a second antenna circuit layer sequentially stacked, the first antenna circuit layer and the second antenna circuit layer are electrically connected through metal vias provided on the substrate layer, and the RFID chip is electrically connected to the first antenna circuit layer or the second antenna circuit layer; the bottom paper layer is torn off when the RFID tag is used so that the first adhesive layer is attached to the surface of the object. The antenna layer of the RFID tag disclosed in the present disclosure can be easily torn after being lifted by an external force, thereby rendering the RFID tag ineffective. Therefore, the present disclosure not only has an RFID chip that can store rich item information, but also achieves a good anti-disassembly and anti-transfer effect.

[0031] Figure 1 A schematic diagram of the overall structure of an RFID tag for sample sealing management according to an embodiment of the present disclosure is shown.

[0032] like Figure 1 As shown, the RFID tag for sample sealing management includes an RFID chip 9 and a surface paper layer 1, an antenna layer 2, a first adhesive layer 3 and a bottom paper layer 4 which are stacked in sequence.

[0033] According to an embodiment of the present disclosure, the surface paper layer 1 is made of flexible paper material.

[0034] For example, the face paper layer 1 may be made of PET composite paper, coated paper, etc. The face paper layer 1 is located at the outermost layer of the RFID tag, and can protect the radio frequency circuit inside the tag, and can also be printed with item identification information for distinguishing items. The size of the face paper layer can be any customized size. In a specific embodiment, the size of the face paper layer is 297*210mm (A4), and the antenna layer 2, the first adhesive layer 3 and the bottom paper layer 4 are the same size as the face paper layer.

[0035] According to an embodiment of the present disclosure, the antenna layer 2 includes a first antenna circuit layer 201, a substrate layer 202 and a second antenna circuit layer 203 which are sequentially stacked, the surface paper layer 1 is bonded to the first antenna circuit layer 201 through a second adhesive layer 5, the first antenna circuit layer 201 is bonded to the substrate layer 202 through a third adhesive layer 6, the substrate layer 202 is bonded to the second antenna circuit layer 203 through a fourth adhesive layer 7, and the second antenna circuit layer 203 is bonded to the bottom paper layer 4 through a first adhesive layer 3.

[0036] According to the embodiment of the present disclosure, the substrate layer 202 is made of a flexible material that is easily separated from the adhesive layer (e.g., the third adhesive layer 6 and / or the fourth adhesive layer 7), so that after the RFID tag is lifted by an external force, the first antenna circuit layer 201 and the second antenna circuit layer can be easily broken, rendering the RFID tag ineffective. The substrate layer 202 can be made of an easily separable paper substrate such as super calendered paper or coated paper.

[0037] In the present disclosure, the flexible and easily separable material can be understood as a material that can be separated from other materials when manually torn or pulled.

[0038] According to an embodiment of the present disclosure, a metal via 10 is provided on the substrate layer 202 , the first antenna circuit layer 201 and the second antenna circuit layer 203 are electrically connected through the metal via 10 , and the RFID chip 9 is electrically connected to the first antenna circuit layer 201 or the second antenna circuit layer 203 .

[0039] According to an embodiment of the present disclosure, both the first antenna circuit layer 201 and the second antenna circuit layer 203 are provided with RFID antenna coils.

[0040] For example, the first antenna circuit layer 201 and the second antenna circuit layer 203 use insulating materials such as glass fiber board and ceramic substrate, and the RFID antenna coil except for the antenna pin is encapsulated in the first antenna circuit layer 201 and the second antenna circuit layer 203, and the antenna pin of the RFID antenna coil is exposed outside the first antenna circuit layer 201 and the second antenna circuit layer 203.

[0041] According to an embodiment of the present disclosure, the RFID antenna coil is made of a metal material that is easily conductive. In a specific implementation, the RFID antenna coil is made of aluminum foil and / or copper foil.

[0042] According to an embodiment of the present disclosure, the thickness W2 of the RFID antenna coil is 0.02 mm ≤ W2 ≤ 0.05 mm.

[0043] Specifically, a metal via 10 is provided on the substrate layer 202, and the metal via 10 penetrates the substrate layer 202, so that the RFID antenna coils on the first antenna circuit layer 201 and the second antenna circuit layer 203 are electrically connected. The RFID chip 9 is provided on the antenna layer 2, for example, the RFID chip 9 is packaged in the first antenna circuit layer 201 or the second antenna circuit layer 203 by a packaging process, so that the RFID chip 9 and the RFID antenna coil are electrically connected inside the antenna layer 2. According to an embodiment of the present disclosure, the packaging process can be a conductive adhesive hot pressing process, a soldering process, and the like.

[0044] For example, the RFID chip 9 can be encapsulated in the first antenna circuit layer 201 and electrically connected to the antenna coil of the first antenna circuit layer 201 by using a conductive adhesive hot pressing or soldering process. When the RFID tag is torn by an external force, the RFID chip 9 and the first antenna circuit layer 201 are separated from the second antenna circuit layer 203, and the antenna of the RFID tag is broken, so that the RFID tag fails. Alternatively, the RFID chip 9 can be encapsulated in the second antenna circuit layer 203 and electrically connected to the antenna coil of the second antenna circuit layer 203 by using a conductive adhesive hot pressing or soldering process. When the RFID tag is torn by an external force, the RFID chip 9 and the second antenna circuit layer 203 are separated from the first antenna circuit layer 201, and the antenna of the RFID tag is broken, so that the RFID tag fails.

[0045] According to the embodiment of the present disclosure, the RFID chip 9 has a globally unique ID number, so that the RFID tag of the present disclosure can uniquely identify the item when in use, and cannot be copied, and has higher reliability. The RFID chip 9 can store a large amount of information. For example, when it is used in the scene of sample delivery, sample storage and sealing management of items, a large amount of sealing product information, relevant data in the sealing link, etc. can be entered, thereby providing a basis for subsequent digital management. Those skilled in the art should understand that the technical field applied by the present disclosure is not limited to the scene of sample delivery, sample storage and sealing management of the item, and can also be applied to other scenes for identifying items.

[0046] According to an embodiment of the present disclosure, the base paper layer 4 is torn off when the RFID tag is used so that the first adhesive layer 3 can be adhered to the surface of the object.

[0047] The present invention adds RFID recognition function on the basis of traditional identification, and can realize non-visual reading of RFID tags without physical or optical contact, and can store a large amount of information by utilizing the fast writing function of RFID chips. After the tag is peeled off by external force, the inside of the antenna layer will be easily torn, that is, the two layers of RFID antenna coils will be disconnected, causing the RFID tag to become invalid immediately, achieving good anti-disassembly and anti-transfer effects. When the RFID tag is used as a sample sealing label, it can effectively prevent the risk of sample replacement.

[0048] Figure 2 A schematic diagram showing an RFID tag for sample sealing management using an embodiment of the present disclosure in a radio frequency identification application scenario.

[0049] like Figure 2 As shown, the reading and writing device is connected to the RFID tag by radio frequency communication, and the reading and writing device is connected to the background management system by communication.

[0050] According to an embodiment of the present disclosure, the reading and writing device is a mobile terminal, such as a mobile phone, a tablet computer, and the like.

[0051] In the present disclosure, a terminal with a radio frequency function is used or an external module with a radio frequency function is added to a mobile phone as a reading and writing device to communicate with the RFID tag, read the information stored on the RFID tag, and transmit the read information to a background management system. The background management system can further process the read information, such as classified storage, marking and sorting, so as to not only quickly identify the RFID chip, but also digitally manage the acquired information.

[0052] Figure 3 A schematic diagram of the overall structure of another RFID tag for sample sealing management according to an embodiment of the present disclosure is shown.

[0053] Figure 3 The example shown is in Figure 1 On the basis of FIG. 1 , an absorbing layer 11 is added between the second antenna line layer 203 and the bottom paper layer 4. Figure 3 As shown, the RFID tag for sample sealing management further includes an absorbing layer 11, and the absorbing layer 11 is arranged between the first adhesive layer 3 and the antenna layer 2, and the absorbing layer 11 is made of high magnetic permeability magnetic material.

[0054] According to an embodiment of the present disclosure, the surface paper layer 1 is bonded to the first antenna circuit layer 201 through the second adhesive layer 5, the first antenna circuit layer 201 is bonded to the base material layer 202 through the third adhesive layer 6, the base material layer 202 is bonded to the second antenna circuit layer 203 through the fourth adhesive layer 7, and the second antenna circuit layer 203 is bonded to the absorbing layer 11 through the fifth adhesive layer 8.

[0055] According to an embodiment of the present disclosure, the high magnetic permeability magnetic material is a flexible ferrite material, but is not limited thereto.

[0056] According to an embodiment of the present disclosure, the thickness W1 of the wave absorbing layer 11 is 0.05 mm≤W1≤0.2 mm.

[0057] For example, when the RFID tag is affixed to the metal surface of an object, the presence of the absorbing layer is equivalent to inserting a magnetic material with high magnetic permeability between the RFID antenna coil and the metal surface, which can largely avoid the generation of eddy currents and eliminate electromagnetic interference reflected by the metal surface. Therefore, when the RFID tag is used as an electronic seal, the electronic seal has an anti-metal effect, allowing the RFID tag to be used safely on the metal surface.

[0058] The above description is only a preferred embodiment of the present disclosure and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the utility model involved in the present disclosure is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the concept of the utility model. For example, the above features are replaced with the technical features with similar functions disclosed in the present disclosure (but not limited to) by each other.

Claims

1. An RFID tag for sample sealing management, characterized in that: The label comprises an RFID chip (9) and a surface paper layer (1), an antenna layer (2), a first adhesive layer (3) and a bottom paper layer (4) which are stacked in sequence, wherein: The antenna layer (2) comprises a first antenna circuit layer (201), a substrate layer (202) and a second antenna circuit layer (203) which are sequentially stacked, a metal via (10) being provided on the substrate layer (202), the first antenna circuit layer (201) and the second antenna circuit layer (203) being electrically connected via the metal via (10), and the RFID chip (9) being electrically connected to the first antenna circuit layer (201) or the second antenna circuit layer (203); The base paper layer (4) is torn off when the RFID tag is used so that the first adhesive layer (3) can be adhered to the surface of an object.

2. The RFID tag for sample sealing management according to claim 1, characterized in that: The tag further comprises a wave absorbing layer (11), wherein the wave absorbing layer (11) is arranged between the first adhesive layer (3) and the antenna layer (2), and the wave absorbing layer (11) is made of a high magnetic permeability magnetic material.

3. The RFID tag for sample sealing management according to claim 2, characterized in that: The high magnetic permeability magnetic material is a flexible ferrite material.

4. The RFID tag for sample sealing management according to claim 3, characterized in that: The thickness W1 of the wave absorbing layer (11) is 0.05 mm≤W1≤0.2 mm.

5. The RFID tag for sample sealing management according to claim 2, characterized in that: The surface paper layer (1) is bonded to the first antenna circuit layer (201) via a second adhesive layer (5); The first antenna circuit layer (201) is bonded to the substrate layer (202) via a third adhesive layer (6); The substrate layer (202) is bonded to the second antenna circuit layer (203) via a fourth adhesive layer (7); The second antenna circuit layer (203) is bonded to the wave absorbing layer (11) via a fifth adhesive layer (8).

6. The RFID tag for sample sealing management according to claim 5, characterized in that: The substrate layer (202) is made of a flexible material that is easy to separate from the adhesive layer; the first antenna circuit layer (201) and the second antenna circuit layer (203) are both provided with RFID antenna coils.

7. The RFID tag for sample sealing management according to claim 6, characterized in that: The RFID antenna coil is made of aluminum foil and / or copper foil.

8. The RFID tag for sample sealing management according to claim 7, characterized in that: The thickness W2 of the RFID antenna coil is 0.02 mm ≤ W2 ≤ 0.05 mm.

9. The RFID tag for sample sealing management according to claim 1, characterized in that: The surface paper layer (1) is made of flexible paper material.

10. The RFID tag for sample sealing management according to claim 1, characterized in that: The RFID chip (9) is electrically connected to the first antenna circuit layer (201) or the second antenna circuit layer (203), comprising: packaging the RFID chip (9) in the first antenna circuit layer using a packaging process.

Images