Optical module

Abstract

The optical module provided by the utility model comprises the components of a circuit board which is provided with a golden finger on the surface of one end; the light receiving component is electrically connected with the circuit board and used for receiving the light signals and converting the light signals into initial receiving electric signals; the DSP chip is arranged on the circuit board and is connected with a pin in the golden finger; the receiving signal input end of the DSP chip is connected with the light receiving part so as to convert the initial receiving electric signal into two paths of receiving electric signals, and the two paths of receiving electric signals are sent to an upper computer through pins in the golden fingers; the DSP chip is provided with a second control port, the DSP chip comprises DEMUX, and the first control port is used for receiving a control signal; the MCU is arranged on the circuit board, and a first control port is arranged on the MCU; and the first control port is connected with the second control port, so that the MCU is in control connection with the DSP chip through the first control port. An upper computer adapted to low-rate configuration receives a relatively high-rate optical signal.

Description

Technical Field

[0001] The present disclosure relates to the technical field of optical fiber communication, and in particular to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, video, and artificial intelligence, the development and progress of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting photoelectric signals to each other. They are one of the key components in optical communication equipment and are at the core of optical communication. Utility Model Content

[0003] The embodiment of the present disclosure provides an optical module that can adapt to a host computer with a low-rate configuration to receive relatively high-rate optical signals.

[0004] In a first aspect, the present disclosure provides an optical module, comprising:

[0005] A circuit board, a surface of which one end is provided with a gold finger;

[0006] A light receiving component, electrically connected to the circuit board, for receiving the light signal and converting it into an initial receiving electrical signal;

[0007] A DSP chip is arranged on the circuit board and connected to the pins in the gold finger; a receiving signal input end of the DSP chip is connected to the optical receiving component to convert an initial receiving electrical signal into two receiving electrical signals, and the two receiving electrical signals are sent to the host computer through the pins in the gold finger; a second control port is arranged on the DSP chip, the DSP chip includes a DEMUX, and the second control port is used to receive a control signal, and the control signal is used to reset the DEMUX;

[0008] An MCU is arranged on the circuit board, and a first control port is arranged on the MCU; the first control port is connected to the second control port, so that the MCU controls the connection to the DSP chip through the first control port, so as to send a control signal through the first control port when the DSP chip outputs a received electrical signal that does not follow a preset rule.

[0009] In a second aspect, the present disclosure provides an optical module, comprising:

[0010] A circuit board, a surface of which one end is provided with a gold finger;

[0011] A light receiving component, electrically connected to the circuit board, for receiving the light signal and converting it into an initial receiving electrical signal;

[0012] A DSP chip is arranged on the circuit board and connected to the pins in the gold finger; a receiving signal input end of the DSP chip is connected to the optical receiving component to convert an initial receiving electrical signal into two receiving electrical signals, and the two receiving electrical signals are sent to the host computer through the pins in the gold finger; a second control port is arranged on the DSP chip, and the second control port is used to receive a control signal, and the control signal is used to reset the DSP chip;

[0013] An MCU is arranged on the circuit board, and a first control port is arranged on the MCU; the first control port is connected to the second control port, so that the MCU controls the connection to the DSP chip through the first control port, so as to send a control signal through the first control port when the DSP chip outputs a received electrical signal that does not follow a preset rule.

[0014] In the optical module provided by the present disclosure, an initial received electrical signal is outputted through the optical receiving component, transmitted to the DSP chip and processed by the DSP chip to output two received electrical signals, and the DSP chip reduces the rate of the initial received electrical signal by half and converts it into two received electrical signals. The DSP chip decomposes a received data into two data and transmits them to the host computer, so that the host computer configured for low rate can receive relatively high rate optical signals through the optical module provided by the embodiment of the present disclosure.

[0015] In addition, when the two-way receiving electrical signals sent by the DSP chip do not follow the preset rules, the MCU controls the DSP chip reset or the DEMUX reset of the DSP chip, so as to quickly implement the two-way receiving electrical signals sent by the DSP chip to follow the preset rules and enable the optical module to go online quickly. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the products involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0017] Figure 1 A partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0018] Figure 2 A partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0019] Figure 3A structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0020] Figure 4 An exploded view of an optical module provided according to some embodiments of the present disclosure;

[0021] Figure 5 The internal structure of an optical module provided according to some embodiments of the present disclosure is shown in FIG. Figure 1 ;

[0022] Figure 6 The internal structure of an optical module provided according to some embodiments of the present disclosure is shown in FIG. Figure 2 ;

[0023] Figure 7 A schematic diagram of the internal structure circuit connection of an optical module provided according to some embodiments of the present disclosure;

[0024] Figure 8 A diagram showing a use state of a support member provided according to some embodiments of the present disclosure;

[0025] Fig. 9 A usage state diagram of a DSP chip provided according to some embodiments of the present disclosure;

[0026] Fig.10 A schematic diagram of the internal structure circuit connection of an optical module provided according to some embodiments of the present disclosure;

[0027] Fig.11 This is a usage status diagram of another DSP chip provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0028] The following will be combined with the accompanying drawings to clearly and in detail describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0029] In optical communication technology, in order to establish information transmission between information processing devices, it is necessary to load information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When optical signals are transmitted in information transmission equipment, the loss of optical power can be reduced, so high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment usually includes optical network terminals (Optical Network Unit, ONU), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment usually includes optical fibers and optical waveguides.

[0030] The optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the upper computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0031] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0032] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0033] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the working state of the optical module 200.

[0034] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0035] The host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200, and the optical module 200 converts the first optical signal into a first electrical signal, and the optical module 200 transmits the first electrical signal to the host computer 100, and the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between the optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0036] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0037] Figure 2 FIG. 1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2As shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0038] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101.

[0039] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, Figure 4 FIG. 1 is an exploded view of an optical module provided according to some embodiments of the present disclosure. Figure 3 and 4 As shown, the optical module 200 includes a shell, a circuit board 300, a light emitting component 400 and a light receiving component 500 disposed in the shell. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0040] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 203 and 204 . The outer contour of the housing is generally a square body.

[0041] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0042] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates 2012 located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates 2012 are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0043] The direction of the line connecting the two openings 203 and 204 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 203 is located at the end of the optical module 200 ( Figure 3 The opening 204 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 203 is located at the end of the optical module 200, and the opening 204 is located at the side of the optical module 200. The opening 203 is an electrical port, and the gold finger of the circuit board 300 extends from the electrical port and is inserted into the host computer (for example, the optical network terminal 100); the opening 204 is an optical port, which is configured to access the optical fiber 101 so that the optical fiber 101 is connected to the optical module 200.

[0044] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted to facilitate the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the shell, and the upper shell 201 and the lower shell 202 form a package protection for these components. In addition, when assembling components such as the circuit board 300, the light emitting component 400, the light receiving component 500, etc., it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these components, which is conducive to the automated implementation of production.

[0045] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0046] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing, and the unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0047] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0048] The circuit board 300 includes circuit traces, electronic components and chips, and the electronic components and chips are connected together according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission and grounding. Electronic components include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFET). Chips include, for example, lasers, photodetectors, microcontroller units (MCU), laser driver chips, transimpedance amplifiers (TIA), limiting amplifiers (LA), clock and data recovery (CDR) chips, power management chips, digital signal processing (DSP) chips, etc.

[0049] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0050] The circuit board 300 further includes a gold finger 310 formed on the end surface thereof. The gold finger 310 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 310 is connected to the electrical connector in the cage 106. The gold finger 310 can be provided on only one side of the circuit board 300 (e.g. Figure 4 The upper surface shown in FIG. 300 may also be arranged on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger 310 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0051] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger 301 .

[0052] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 may be directly disposed on the circuit board 300. For example, at least one of the light emitting component 400 or the light receiving component 500 may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0053] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0054] In some embodiments, the light emitting component 400 and the light receiving component 500 are both arranged on the round square tube body. The light emitting component 400 is used to generate and output signal light, and the light receiving component 500 is used to receive signal light from outside the optical module. A fiber optic adapter is arranged on the round square tube body, and the fiber optic adapter is used to achieve the connection between the optical module and the external optical fiber. A lens assembly is usually arranged in the round square tube body, and the lens assembly is used to change the propagation direction of the signal light output by the light emitting component 400 or the signal light input by the external optical fiber. In the embodiments of the present disclosure, the assembly structure of the light emitting component 400 and the light receiving component 500 is not limited to Figure 3 and Figure 4 The structure shown may also be other assembled combined structures, such as the light emitting component 400 and the light receiving component 500 are arranged on different tubes.

[0055] In some embodiments, the light emitting component 400 is electrically connected to the circuit board 300 through the first flexible circuit board 410 , and the light receiving component 500 is electrically connected to the circuit board 300 through the second flexible circuit board 510 .

[0056] Figure 5 The internal structure of an optical module provided according to some embodiments of the present disclosure is shown in FIG. Figure 1 , Figure 6 The internal structure of an optical module provided according to some embodiments of the present disclosure is shown in FIG. Figure 2 .like Figure 5 and 6 As shown, an MCU 320 and a DSP chip 330 are disposed on the front side of the circuit board 300 , and a laser driver 340 is disposed on the back side of the circuit board 300 .

[0057] The MCU 320 is electrically connected to the DSP chip 330, so that the MCU 320 is in communication connection with the DSP chip 330, so that the MCU 320 can transmit information, control signals, etc. to the DSP chip 330. The DSP chip 330 is electrically connected to the optical receiving component 500, and the DSP chip 330 is used to process the electrical signal output by the optical receiving component 500, such as limiting and amplifying the electrical signal output by the optical receiving component 500. The laser driver 340 is electrically connected to the optical emitting component 400, and the laser driver 340 drives the laser in the optical emitting component 400 to generate an optical signal.

[0058] In some embodiments, the DSP chip 330 is close to an edge of an end of the circuit board 300 , and the laser driver 340 is close to an edge of an end of the circuit board 300 .

[0059] In some embodiments, a first pad group 350 is disposed on the front side of the end of the circuit board 300. The first pad group 350 is located at the edge of the end of the circuit board 300 and close to the DSP chip 330. The first pad group 350 is soldered and connected to the second flexible circuit board 510. The first pad group 350 is disposed between the edge of the end of the circuit board 300 and the DSP chip 330, so as to control the transmission distance of the electrical signal from the optical receiving component 500 to the DSP chip 330, so as to ensure the transmission quality of the electrical signal output by the optical receiving component 500.

[0060] In some embodiments, a second pad group 360 is disposed on the back of the end of the circuit board 300, the second pad group 360 is located at the edge of the end of the circuit board 300 and close to the laser driver 340, and the second pad group 360 is welded and connected to the first flexible circuit board 410. The second pad group 360 is disposed between the edge of the end of the circuit board 300 and the laser driver 340, so as to control the transmission distance of the driving signal from the laser driver 340 to the light emitting component 400, so as to ensure the transmission quality of the driving signal output by the laser driver 340.

[0061] Figure 7 The figure is a schematic diagram of the internal structure circuit connection of an optical module according to some embodiments of the present disclosure. Figure 7 As shown, MCU320 is connected to the pins in the gold finger 310 to connect to the host computer through the pins in the gold finger 310 to achieve communication connection with the host computer, and has received information sent by the host computer or sent messages to the host computer.

[0062] In some embodiments, the MCU 320 is electrically connected to a plurality of pins in the gold finger 310 , so as to establish corresponding communication between the MCU 320 and the host computer through corresponding pins, and then receive information from the host computer through the corresponding pins.

[0063] The receiving signal input end of the DSP chip 330 is electrically connected to the optical receiving component 500, and the receiving signal output end of the DSP chip 330 is connected to the pin in the gold finger 310, and the receiving signal output after the photoelectric conversion of the optical receiving component 500 is transmitted to the DSP chip 330. The receiving signal output end of the DSP chip 330 is electrically connected to the host computer through the pin in the gold finger 310, so that the electrical signal output by the DSP chip 330 is transmitted to the host computer through the pin.

[0064] The signal input end of the laser driver 340 is connected to the pin in the gold finger 310, so as to be electrically connected to the host computer through the pin, so that the transmitting electrical signal output by the host computer is transmitted to the laser driver 340 through the pin. The signal output end of the laser driver 340 is connected to the light emitting component 400 to drive the light emitting component 400 to emit an optical signal.

[0065] In some embodiments, at the receiving signal output side of the DSP chip 330, a plurality of transmission lines are respectively arranged on the circuit board 300 to form a first transmission channel 301 and a second transmission channel 302. One end of the first transmission channel 301 and one end of the second transmission channel 302 are respectively connected to the DSP chip 330, and the other end of the first transmission channel 301 and the other end of the second transmission channel 302 are respectively connected to the gold finger 310, and the DSP chip 330 transmits electrical signals to the upper computer through the first transmission channel 301 and the second transmission channel 302.

[0066] In some embodiments, the optical receiving component 500 outputs one initial received electrical signal, which is transmitted to the DSP chip 330 and processed by the DSP chip 330 to output two received electrical signals. The DSP chip 330 reduces the rate of the initial received electrical signal by half and converts it into two received electrical signals; wherein, one received electrical signal is sent to the host computer through the first transmission channel 301, and the other received electrical signal is sent to the host computer through the second transmission channel 302. The DSP chip 330 decomposes a received data into two data and transmits them to the host computer, so that the host computer configured for low rate can receive relatively high rate optical signals through the optical module provided in the embodiment of the present disclosure.

[0067] In the embodiment of the present disclosure, the optical receiving component 500 is not limited to receiving one optical signal, but can also be used to receive two equal optical signals, and then output two equal initial received electrical signals. Exemplarily, when the optical receiving component 500 can be used to receive two optical signals, the optical receiving component 500 outputs two initial electrical signals, which are processed by the DSP chip 330 to output four output electrical signals.

[0068] In some embodiments, the initial received signal output by the optical receiving component 500 is a 50G NRZ type electrical signal, and the DSP chip 330 converts the 50G NRZ type initial received electrical signal into two 25G NRZ type received electrical signals, so that the optical module provided by the present disclosure can convert one 50G NRZ type optical signal into two 25G NRZ type electrical signals and transmit them to the host computer. Of course, in the embodiments of the present disclosure, the model and rate of the initial signal output by the optical receiving component 500 are not limited to this.

[0069] Figure 8 FIG. 1 is a usage state diagram of a DSP chip provided according to some embodiments of the present disclosure, wherein x is the transmission direction of the received electrical signal. Figure 8 As shown, the DSP chip 330 may include a demultiplexer (DEMUX) 331, and an initial received electrical signal is transmitted to the DEMUX 331, and is decomposed into two received electrical signals by the DEMUX 331. The DSP chip 330 includes a first output terminal 332 and a second output terminal 333, and the first output terminal 332 and the second output terminal 333 are used to output the received electrical signals decomposed by the DEMUX 331.

[0070] In some embodiments, the first output terminal 332 is connected to the first transmission channel 301, and the second output terminal 333 is connected to the second transmission channel 302, so that the two received electrical signals are sent to the host computer through the corresponding output terminals and transmission channels. Exemplarily, DEMUX331 outputs the first received electrical signal through the first output terminal 332 and outputs the second received electrical signal through the second output terminal 333. The first received electrical signal is sent to the host computer through the first transmission channel 301, and the second received electrical signal is sent to the host computer through the second transmission channel 302.

[0071] In some embodiments, in order to enable the host computer to correctly process the two-way receiving electrical signals sent by the DSP chip 330, the host computer will preset the rules for the two-way receiving electrical signals so that the host computer receives and processes the two-way receiving electrical signals input in accordance with the preset rules. When the processing of the two-way receiving electrical signals sent by the DSP chip 330 does not follow the preset rules, the host computer does not process the two-way electrical signals and will determine that the optical module has failed to go online. Exemplarily, the preset rule can be that the first bite of the first receiving electrical signal is 1. When the host computer detects that the first bite of the first receiving electrical signal is not 1, it is considered that the optical module has failed to go online.

[0072] In some embodiments, by plugging and unplugging the optical fiber 101 or the optical module 200, the optical module 200 is restarted, the DSP chip 330 resends the two-way receiving electrical signal, and the host computer determines again whether the two-way output signals follow the preset rules until the host computer receives the two-way receiving electrical signals sent by the DSP chip 330 that follow the preset rules.

[0073] Fig. 9 FIG. 1 is a schematic diagram of another optical module internal structure circuit connection according to some embodiments of the present disclosure. Fig. 9 As shown, the MCU 320 includes a first control port 321, and the DSP chip 330 includes a second control port 334, and the first control port 321 is connected to the second control port 334. The first control port 321 is used to output a control signal, and the second control port 334 is used to receive a control signal, and the control signal includes a signal for resetting the DSP chip 330 or a signal for resetting the DEMUX 331. When the DSP chip 330 receives a signal for resetting the DSP chip 330, the DSP chip 330 is reset; when the DSP chip 330 receives a signal for resetting the DEMUX 331, the DSP chip 330 controls the DEMUX 331 to reset, that is, to implement the optical port side of the DSP chip 330. In this way, the optical module 200 provided in this embodiment can solve the problem of the DSP chip 330 outputting the received electrical signal by resetting the DSP chip 330 or the DEMUX 331 when the optical module 200 fails to go online.

[0074] In some embodiments, MCU320 generates a control signal. For example, when MCU320 receives a control instruction issued by the host computer through communication with the host computer, the control instruction is used to indicate that the single board is not online, reset the signal of the DSP chip 330 or the signal of DEMUX331, etc., MCU320 generates a control signal. Exemplarily, when the host computer receives two output signals sent by the DSP chip 330 that do not follow the preset rules, the host computer sends a control instruction to MCU320 through the communication established between the host computer and MCU320.

[0075] In some embodiments, the host computer sends low-frequency information to MCU320 through a communication connection with MCU320. The low-frequency information carries control instructions. MCU320 receives the low-frequency information and parses the low-frequency information into control instructions.

[0076] In some embodiments, the gold finger 310 includes a first pin 311, the MCU 320 is connected to the first pin 311, and the host computer sends a control instruction to the MCU 320 through the first pin 311. Exemplarily, the control instruction is a level instruction, including a high level instruction or a low level instruction.

[0077] In some embodiments, when the host computer receives two output signals sent by the DSP chip 330 that do not follow the preset rules, the host computer sets the first pin 311 to a high level state; when the MCU 320 reads that the first pin 311 is in a high level state, a control signal is generated. Of course, in some embodiments, the low level state of the first pin 311 can also be used to generate a control signal.

[0078] In some embodiments, the reset address of the DSP chip 330 is stored in the register of MCU320. When MCU320 receives a control instruction, MCU320 sends 1 through the first control port 321 according to the reset address of the DSP chip 330. When the DSP chip 330 receives 1 through the second control port 334, the DSP chip 330 automatically resets or controls DEMUX331 to reset.

[0079] Fig.10 The figure is a schematic diagram of the internal structure circuit connection of an optical module according to some embodiments of the present disclosure. Fig.10 As shown, the signal input end of the laser driver 340 is the DSP chip 330. The transmitting electrical signal output by the host computer is first transmitted to the DSP chip 330, and then transmitted to the laser driver 340 after being processed by the DSP chip 330.

[0080] In some embodiments, on the transmission signal input side of the DSP chip 330, a plurality of transmission lines are respectively arranged on the circuit board 300 to form a third transmission channel 303 and a fourth transmission channel 304. One end of the third transmission channel 303 and one end of the fourth transmission channel 304 are respectively connected to the DSP chip 330, and the other end of the third transmission channel 303 and the other end of the fourth transmission channel 304 are respectively connected to the gold finger 310, and the DSP chip 330 receives the initial transmission electrical signal sent by the host computer through the third transmission channel 303 and the fourth transmission channel 304.

[0081] In some embodiments, the host computer sends down two initial transmission electrical signals, and transmits them to the DSP chip 330 via the third transmission channel 303 and the fourth transmission channel 304. The DSP chip 330 converts the two initial transmission electrical signals into one transmission electrical signal by doubling their rates and sends it to the laser driver 340, so as to drive the optical transmission component 400 to transmit one optical signal through the laser driver 340.

[0082] In the embodiment of the present disclosure, the optical transmission component 400 is not limited to transmitting one optical signal, but can also be used to transmit two equal optical signals, so the host computer can send down four equal initial transmission electrical signals. Exemplarily, when the optical transmission component 400 can be used to transmit two optical signals, the host computer can send down four initial transmission electrical signals, which are processed by the DSP chip 330 and output to the laser driver 340. The laser driver 340 drives the optical transmission component 400 to transmit two optical signals according to the two transmission electrical signals. In this way, the two transmission electrical signals are synthesized into one signal by the DSP chip 330 and sent to the laser driver 340, so that the host computer configured for low rate can transmit relatively high rate optical signals through the optical module provided in the embodiment of the present disclosure.

[0083] In some embodiments, the host computer sends down two 25G NRZ type initial transmission electrical signals, and the DSP chip 330 converts the two 25G NRZ type initial transmission electrical signals into 50G NRZ type transmission electrical signals, so that the laser driver 340 drives the optical transmission component 400 based on one 50G NRZ type transmission electrical signal.

[0084] Fig.11 FIG. 1 is a usage state diagram of another DSP chip provided according to some embodiments of the present disclosure, wherein y is the transmission direction of the transmitted electrical signal. Fig.11 As shown, the DSP chip 330 may include a combiner (MUX) 335, and the two initial transmission electrical signals are transmitted to the MUX 335 and combined into one transmission electrical signal by the MUX 335. The DSP chip 330 includes a first input terminal 336 and a second input terminal 337, and the first input terminal 336 and the second input terminal 337 are used to transmit the initial transmission electrical signal to the MUX 335.

[0085] In some embodiments, the first input terminal 336 is connected to the third transmission channel 303, and the second input terminal 337 is connected to the fourth transmission channel 304, so as to transmit the two initial transmission electrical signals through the corresponding transmission channels and input terminals to the MUX 335. Exemplarily, the first initial transmission electrical signal is transmitted to the MUX 335 through the third transmission channel 303, and the second initial transmission electrical signal is transmitted to the MUX 335 through the fourth transmission channel 304.

[0086] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, characterized in that: include: A circuit board, a surface of which one end is provided with a gold finger; A light receiving component, electrically connected to the circuit board, for receiving the light signal and converting it into an initial receiving electrical signal; A DSP chip is arranged on the circuit board and connected to the pins in the gold finger; a receiving signal input end of the DSP chip is connected to the optical receiving component to convert an initial receiving electrical signal into two receiving electrical signals, and the two receiving electrical signals are sent to the host computer through the pins in the gold finger; a second control port is arranged on the DSP chip, the DSP chip includes a DEMUX, and the second control port is used to receive a control signal, and the control signal is used to reset the DEMUX; An MCU is arranged on the circuit board, and a first control port is arranged on the MCU; The first control port is connected to the second control port, so that the MCU controls the connection to the DSP chip through the first control port, so as to send a control signal through the first control port when the DSP chip outputs a received electrical signal that does not follow a preset rule.

2. The optical module according to claim 1, characterized in that: The circuit board is provided with a first transmission channel and a second transmission channel, and the DSP chip includes a first output terminal and a second output terminal; One end of the first transmission channel is connected to the first output end, the other end of the first transmission channel is connected to the gold finger, and the DEMUX sends a first received optical signal to the upper computer through the first transmission channel; One end of the second transmission channel is connected to the second output end, the other end of the second transmission channel is connected to the gold finger, and the DEMUX sends a second received optical signal to the upper computer through the second transmission channel; The DEMUX decomposes the initial received electrical signal into the first received optical signal and the second received optical signal.

3. The optical module according to claim 1, characterized in that: The gold finger includes a first pin, the MCU is connected to the first pin, and the MCU determines whether to send a control signal to the DSP chip according to the level state of the first pin.

4. The optical module according to claim 1, characterized in that: The optical module further includes: A light emitting component, electrically connected to the circuit board, for emitting a light signal; A laser driver, arranged on the circuit board and electrically connected to the light emitting component, wherein the laser driver drives the light emitting component to emit a light signal according to an emission electrical signal; The DSP chip is connected to the laser driver. The DSP chip includes a MUX. The MUX converts two initial transmission electrical signals received from the host computer into one transmission electrical signal and transmits the transmission electrical signal to the laser driver.

5. The optical module according to claim 4, characterized in that: The circuit board is provided with a third transmission channel and a fourth transmission channel, and the DSP chip includes a first input terminal and a second input terminal; One end of the third transmission channel is connected to the first input end, the other end of the third transmission channel is connected to the gold finger, and the MUX inputs the first initial transmission electrical signal through the third transmission channel; One end of the fourth transmission channel is connected to the second input end, the other end of the fourth transmission channel is connected to the gold finger, and the MUX inputs the second initial transmission electrical signal through the fourth transmission channel; The MUX combines the first initial transmit electrical signal and the second initial transmit electrical signal into the transmit electrical signal.

6. The optical module according to claim 4, characterized in that: The light receiving component and the light emitting component are respectively located outside the other end of the circuit board, the light receiving component is electrically connected to the circuit board through a flexible circuit board, and the light emitting component is electrically connected to the circuit board through a flexible circuit board.

7. The optical module according to claim 6, characterized in that: A first pad group is arranged on the front side of the circuit board away from the gold finger, and the first pad group is electrically connected to the light receiving component through a second flexible circuit board; A second pad group is arranged on the back side of one end of the circuit board away from the gold finger, and the second pad group is electrically connected to the light emitting component through the first flexible circuit board.

8. The optical module according to claim 4, characterized in that: The MCU and the DSP chip are located on the front side of the circuit board, and the laser driver is arranged on the back side of the circuit board.

9. An optical module, characterized in that: include: A circuit board, a surface of which one end is provided with a gold finger; A light receiving component, electrically connected to the circuit board, for receiving the light signal and converting it into an initial receiving electrical signal; A DSP chip is arranged on the circuit board and connected to the pins in the gold finger; a receiving signal input end of the DSP chip is connected to the optical receiving component to convert an initial receiving electrical signal into two receiving electrical signals, and the two receiving electrical signals are sent to the host computer through the pins in the gold finger; a second control port is arranged on the DSP chip, and the second control port is used to receive a control signal, and the control signal is used to reset the DSP chip; An MCU is arranged on the circuit board, and a first control port is arranged on the MCU; the first control port is connected to the second control port, so that the MCU controls the connection to the DSP chip through the first control port, so as to send a control signal through the first control port when the DSP chip outputs a received electrical signal that does not follow a preset rule.

10. The optical module according to claim 9, characterized in that: The gold finger includes a first pin, and the first pin is connected to the MCU; when the first pin is in a high level state, the MCU sends a control signal to the DSP chip.

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