Chip packaging structure

Abstract

The utility model discloses a wafer packaging structure, which relates to the field of electronic equipment and comprises a substrate, a circuit assembly arranged at the bottom of the substrate, a box dam arranged at the top of the substrate, and an optical lens arranged at the top of the box dam. According to the wafer packaging structure, the box dam and the inner box dam are arranged to form a double-box-dam structure, the outer side of the optical lens is matched with the size of the inner cavity of the box dam, the size of the side wall of the lens cavity is matched with the size of the outer side of the inner box dam, the portion below the top of the lens cavity of the optical lens can be completely bonded to the inner side of the outer dam cavity, and the bonding area of the optical lens is increased; the optical lens can be bonded more stably, the inner box dam can block light emitted by the wafer, damage of ultraviolet light to the bonding glue is reduced, the part, shielded by the inner box dam, of the bonding glue can maintain effective bonding for a longer time, the service life of the bonding glue product is prolonged, meanwhile, the path of water vapor in air entering the inner dam cavity is increased, and the service life of the bonding glue product is prolonged. And the moisture resistance of the device is improved.

Description

Technical Field

[0001] The utility model relates to electronic equipment technology, in particular to a chip packaging structure. Background Art

[0002] A chip, also known as an integrated circuit chip or chip, is a miniaturized component widely used in electronic devices. It is usually made of semiconductor materials (such as silicon) and realizes specific functions by building tiny transistors, capacitors, resistors and other electronic components on a silicon substrate. These components are interconnected to form complex circuits that can perform various computing, storage and control functions in electronic devices.

[0003] Chips are widely used in electronic devices such as computers, mobile phones, tablets, digital cameras, audio equipment, etc., and are key components for these devices to achieve various functions. The development of chip technology has greatly promoted the progress and innovation of electronic technology, making many high-tech products in modern society possible.

[0004] In addition, the chip is also the main material for making LED lights and display screens. Its internal structure is a PN junction with unidirectional conductivity, which is a key component for LED light emission. The quality of the chip will directly determine the performance of the LED.

[0005] In general, chips are indispensable key components in modern electronic devices and the LED industry, and their application areas are constantly expanding, including medical equipment, artificial intelligence, virtual reality, self-driving cars and other fields.

[0006] Wafer packaging refers to the process of externally protecting, fixing and connecting the manufactured wafer (also called integrated circuit chip or chip). The main purpose of packaging is to connect the circuit pins on the wafer to the external connector with wires so as to connect with other devices, while ensuring that the wafer can work stably and reliably during use.

[0007] During the packaging process, the chip will be installed in a specific shell, which not only fixes and protects the chip, but also connects the contacts on the chip to the pins of the package shell through wires. These pins are then connected to other devices through wires on the printed circuit board, thereby realizing the connection between the internal chip and the external circuit. The quality of packaging technology directly affects the performance of the chip itself and the design and manufacture of the PCB (printed circuit board) connected to it.

[0008] There are many technologies for chip packaging, among which wafer-level chip packaging technology (WL-CSP) is an advanced packaging method. Its biggest feature is the small package size and small inductance between IC and PCB, which can shorten the production cycle. At the same time, this packaging technology can also improve the quality and reliability of the chip and reduce the losses that may occur during the packaging process, such as electrical performance fluctuations caused by poor welding.

[0009] In general, chip packaging is a key step to ensure that chips can work normally and stably in electronic devices. The continuous advancement of packaging technology helps to improve the performance and reliability of chips and promote the development of the electronics industry.

[0010] UVC (ultraviolet-C) is a type of ultraviolet radiation that is part of the electromagnetic spectrum. Its wavelength range is usually defined as 200 nanometers (nm) to 280 nanometers (nm). UVC has high energy and can effectively kill bacteria, viruses and other microorganisms, so it is widely used in disinfection and sterilization applications.

[0011] Some important information about UVC includes:

[0012] Sterilization effect: UVC has high energy and short wavelength, which can directly destroy the nucleic acid (DNA and RNA) of microorganisms, thereby killing or inactivating bacteria, viruses and fungi.

[0013] Disinfection Applications: UVC is used in air disinfection, water treatment, food processing, medical facilities, laboratories and other environments to eliminate or control the growth of microorganisms.

[0014] Safety precautions: UVC has high ultraviolet energy and is harmful to human tissue and eyes. Therefore, when using UVC for disinfection, appropriate safety measures must be taken, such as wearing protective glasses and avoiding direct exposure to UVC light.

[0015] Lamps and Equipment: UVC disinfection equipment includes UV lamps and UV-C LED lamps, which are designed for specific disinfection tasks.

[0016] When the existing chip packaging structure is in use, the optical lens is fixed to the bracket by adhesive glue. However, when encapsulating UVC products, the light emitted by the UVC products has high ultraviolet energy. The emitted UVC light can easily destroy the molecular chains of objects, especially adhesives such as glue. Long-term and large-dose UVC light exposure will cause the glue to age and become brittle, causing it to lose its adhesive ability, resulting in the optical lens falling off. In terms of structure, the bonding surface of the optical lens is small, the path for water vapor in the air to enter the cavity is short, and the ability to resist moisture is not strong enough. Utility Model Content

[0017] The purpose of the utility model is to provide a chip packaging structure to solve the above-mentioned deficiencies in the prior art.

[0018] In order to achieve the above-mentioned object, the utility model provides the following technical solution: a chip packaging structure, including a substrate and a circuit component installed at the bottom of the substrate, and also including:

[0019] A dam, which is installed on top of the base plate;

[0020] The optical lens is installed on the top of the dam.

[0021] Furthermore, the bottom of the dam is fixedly installed on the top of the substrate, an inner dam is installed on the inner side of the dam, the bottom of the inner dam is fixedly installed on the top of the substrate, the space formed by the outer side and the inner side of the inner dam is the outer dam cavity, and the space inside the inner dam is the inner dam cavity.

[0022] Furthermore, a chip is fixedly mounted on the top of the substrate, and the chip is also located at the bottom of the inner dam cavity.

[0023] Furthermore, a lens cavity is provided in the middle of the optical lens.

[0024] Furthermore, the size of the lens cavity is adapted to the outer size of the inner dam, the outer size of the optical lens is adapted to the inner size of the dam, the inner depth of the lens cavity is adapted to the height of the inner dam, and the height of the dam is adapted to the height of the inner dam.

[0025] Furthermore, the outer side of the optical lens is adhesively connected to the side wall of the outer dam cavity.

[0026] Compared with the prior art, the utility model provides a chip packaging structure, which forms a double dam structure by setting a dam and an inner dam. The outer side of the optical lens is square, and the side wall of the lens cavity is round. The outer side of the optical lens is adapted to the inner cavity size of the dam, and the side wall size of the lens cavity is adapted to the outer size of the inner dam. The optical lens below the top of the lens cavity can be completely adhered to the inner side of the outer dam cavity, thereby increasing the bonding area of ​​the optical lens and making the optical lens more firmly bonded. The inner dam can block the light emitted by the chip and reduce the damage of ultraviolet light to the adhesive. The adhesive blocked by the inner dam can maintain effective adhesion for a longer time, thereby increasing the product service life of the adhesive. At the same time, the path for water vapor in the air to enter the inner dam cavity is increased, thereby improving the device's resistance to moisture. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present utility model. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0028] Figure 1 The overall structural diagram provided for the embodiment of the utility model;

[0029] Figure 2 A first schematic diagram of a partial structure provided for an embodiment of the utility model;

[0030] Figure 3 A second schematic diagram of a partial structure provided by an embodiment of the utility model;

[0031] Figure 4 The present invention is a schematic cross-sectional view of the overall structure of an embodiment of the present invention.

[0032] Description of reference numerals:

[0033] 1. Substrate; 2. Dam; 3. Optical lens; 4. Wafer; 5. Circuit assembly; 21. Inner dam; 23. Inner dam cavity; 22. Outer dam cavity; 31. Lens cavity. DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0035] Embodiment 1:

[0036] See also Figure 1 - Figure 4 , a chip packaging structure, comprising a substrate 1 and a circuit component 5 mounted on the bottom of the substrate 1, and further comprising:

[0037] A dam 2 is installed on the top of the base plate 1;

[0038] The optical lens 3 is installed on the top of the dam 2.

[0039] The specific implementation is as follows: the optical lens 3 is an optical element made of transparent material (such as glass, crystal, etc.). Convex lens: thick in the middle and thin at the edge, there are three types: biconvex, planoconvex, and concave-convex; concave lens: thin in the middle and thick at the edge, there are three types: biconcave, planoconcave, and convex-concave.

[0040] The bottom of the dam 2 is fixedly installed on the top of the substrate 1, and an inner dam 21 is installed on the inner side of the dam 2. The bottom of the inner dam 21 is fixedly installed on the top of the substrate 1. The space formed by the outer side of the inner dam 21 and the inner side of the dam 2 is the outer dam cavity 22, and the space inside the inner dam 21 is the inner dam cavity 23.

[0041] The specific implementation is as follows: the dam 2 is intended to protect the chip 4 from interference or damage from the external environment or operating conditions. At the physical level, the dam 2 adds a specific protective layer or structure around the chip 4 to prevent external physical damage or interference. In terms of logic circuit design, the dam 2 of the chip 4 includes adding redundant circuits, error detection and correction circuits, and technologies to prevent reverse engineering, thereby improving the stability and security of the chip 4. In terms of software security, the dam 2 of the chip 4 includes encryption technology, access control measures, firmware update mechanisms, etc. to prevent unauthorized access or tampering. In general, the dam 2 of the chip 4 is a measure taken to ensure the stability, security and reliability of the integrated circuit, and is intended to prevent the internal and external environments from affecting the chip 4. The inner dam 21 can block the light emitted by the chip 4 and reduce damage to the adhesive.

[0042] A chip 4 is fixedly mounted on the top of the substrate 1 , and the chip 4 is also located at the bottom of the inner dam cavity 23 .

[0043] A lens cavity 31 is defined in the middle of the optical lens 3 .

[0044] The specific implementation is as follows: the substrate 1 is the physical carrier of the integrated circuit chip 4, also called a chip carrier or chip substrate. It is used as the basic material for supporting, connecting and assembling the chip 4, and is usually made of silicon (Si) or other semiconductor materials.

[0045] The main functions of the substrate include:

[0046] Supporting wafer 4: The substrate 1 provides a solid platform for supporting and fixing the electronic devices on the wafer 4.

[0047] Connection: The substrate 1 usually has metal wires or connectors for connecting the circuit inside the chip 4 with the external circuit to achieve communication and control with other devices.

[0048] Heat dissipation: The substrate 1 can help dissipate heat and transfer the heat generated by the chip 4 to the external environment to keep the operating temperature of the chip 4 within a safe range.

[0049] Electrical insulation: The substrate 1 generally has good electrical insulation properties to prevent interference or short circuits between circuits.

[0050] Protection: The substrate 1 may also provide physical and environmental protection to the wafer 4, such as dust, moisture, corrosion, etc.

[0051] Common types of substrates 1 include silicon substrates, glass substrates, ceramic substrates, etc. The specific selection depends on application requirements and manufacturing processes.

[0052] The size of the lens cavity 31 is adapted to the outer size of the inner dam 21 , the outer size of the optical lens 3 is adapted to the inner size of the dam 2 , the inner depth of the lens cavity 31 is adapted to the height of the inner dam 21 , and the height of the dam 2 is adapted to the height of the inner dam 21 .

[0053] The outer side of the optical lens 3 is glued to the side wall of the outer dam cavity 22 .

[0054] Working principle: When in use, after installing the chip 4 to the middle position of the top of the substrate 1, apply adhesive glue to the side wall of the outer dam cavity 22, install the bottom of the optical lens 3 into the outer dam cavity 22, cool and dry, and the double dam structure formed by the inner dam 21 and the dam 2, the lens cavity 31 of the optical lens 3 below the top can be completely adhered to the inner side of the outer dam cavity 22, thereby increasing the bonding area of ​​the optical lens 3 and making the optical lens 3 more firmly bonded. The inner dam 21 can block the light emitted by the chip 4 and reduce the damage of ultraviolet light to the adhesive. The adhesive blocked by the inner dam 21 can maintain effective adhesion for a longer time, thereby increasing the service life of the adhesive. At the same time, the path for water vapor in the air to enter the inner dam cavity 23 is increased, thereby improving the device's resistance to moisture.

[0055] The above only describes some exemplary embodiments of the present invention by way of illustration. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A chip packaging structure, comprising a substrate (1) and a circuit component (5) mounted on the bottom of the substrate (1), characterized in that: Also includes: A dam (2) mounted on the top of the base plate (1); An optical lens (3) mounted on the top of the dam (2); The bottom of the dam (2) is fixedly mounted on the top of the base plate (1); an inner dam (21) is mounted inside the dam (2); the bottom of the inner dam (21) is fixedly mounted on the top of the base plate (1); the space formed by the outer side of the inner dam (21) and the inner side of the dam (2) is an outer dam cavity (22); and the space inside the inner dam (21) is an inner dam cavity (23); A chip (4) is fixedly mounted on the top of the substrate (1), and the chip (4) is also located at the bottom of the inner dam cavity (23); A lens cavity (31) is provided in the middle of the optical lens (3); The size of the lens cavity (31) is adapted to the outer size of the inner dam (21), the outer size of the optical lens (3) is adapted to the inner size of the dam (2), the inner depth of the lens cavity (31) is adapted to the height of the inner dam (21), and the height of the dam (2) is adapted to the height of the inner dam (21); The outer side of the optical lens (3) is adhesively connected to the side wall of the outer dam cavity (22).

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