Board feeding mechanism for circuit board

Abstract

The utility model relates to a board feeding mechanism for a circuit board, and relates to the field of circuit board welding technology, the board feeding mechanism mainly comprises a carrier, the carrier is detachably installed on a conveying mesh belt of the board feeding mechanism, and a first placing groove matched with the circuit board is formed in the carrier; a through hole for avoiding a pin of an electronic component on the circuit board is formed in the groove bottom of the first placing groove; the carrier is fixedly connected with a plurality of springs, one ends, far away from the carrier, of the plurality of springs are fixedly connected with a supporting plate, and the supporting plate is located below the FPC; the carrier is detachably provided with a positioning mechanism, and the FPC is clamped between the supporting plate and the positioning mechanism. According to the invention, the situation that the FPC welding quality is influenced due to the position offset of the FPC on the conveying mesh belt in the process of welding the FPC by the reflow soldering furnace can be reduced, and effective guarantee is provided for FPC welding processing.

Description

Technical Field

[0001] The present application relates to the field of circuit board welding technology, and in particular to a circuit board feeding mechanism. Background Art

[0002] Reflow soldering technology is not unfamiliar in the field of electronic manufacturing. The components on various boards used in our computers are soldered to the circuit board through this process. The reflow soldering process is to re-melt the paste solder pre-distributed to the printed circuit board pads to achieve the mechanical and electrical connection between the solder ends or pins of the surface mounted components and the printed circuit board pads.

[0003] In the prior art, a common reflow oven is divided into two sealed boxes, one above the other, with hot air heating mechanisms installed in the two sealed boxes, a furnace formed between the two hot air heating mechanisms, and a board delivery mechanism in the furnace. The hot air heating mechanisms each have a motor driving an impeller to rotate at high speed, generating a blowing force of air or nitrogen. After the gas is heated by a heating wire or other materials, it is blown from a porous plate to the circuit board, and the components on the circuit board are soldered to the board body.

[0004] The board feeding mechanism mainly includes a driving device and a conveyor belt. The conveyor belt is transported through the furnace at a uniform speed by the driving device. When the circuit board is reflow soldered, the operator places the circuit board to be soldered on the conveyor belt in advance. The circuit board is driven by the conveyor belt to enter the furnace through the feed port of the furnace. During the process of passing through the furnace, the circuit board is heated by hot air to complete the welding between the FPC and the circuit board, and finally sent out through the discharge port of the furnace. The operator closes the reflow soldering furnace to stop the board feeding mechanism and the hot air heating mechanism. After the circuit board is completely cooled, the operator removes the circuit board.

[0005] However, in the actual production and processing process, when welding the FPC and the circuit board, if the circuit board and the FPC are directly placed on the conveyor belt, due to the thin and soft texture of the FPC itself, the solder joints on the FPC board and the circuit board cannot be stably fixed to accurately control the required welding positions, which can easily cause solder joint misalignment during the welding process, affecting the welding quality. There is room for improvement. Utility Model Content

[0006] In order to reduce the occurrence of FPC dislocation during the process of soldering FPC in a reflow oven and ensure the soldering quality of FPC in the reflow oven, the present application provides a circuit board feeding mechanism for a circuit board.

[0007] The present application provides a circuit board feeding mechanism using the following technical solution:

[0008] A board feeding mechanism for a circuit board, comprising a carrier, the carrier being detachably mounted on a conveyor belt of the board feeding mechanism, the carrier being provided with a first placement groove adapted to the circuit board, the bottom of the first placement groove being provided with a through hole for avoiding pins of electronic components on the circuit board;

[0009] A plurality of springs are fixedly connected to the carrier, and one end of the plurality of springs away from the carrier is fixedly connected to a support plate, and the support plate is located below the FPC;

[0010] A positioning mechanism is detachably mounted on the carrier, and the FPC is clamped between the support plate and the positioning mechanism.

[0011] By adopting the above technical solution, when the operator uses the reflow oven to solder the FPC and the circuit board, the operator can place the PCB in the first placement slot, then the operator places the FPC on the pallet, and fixes the FPC on the pallet through the positioning mechanism, then the operator installs the carrier on the conveyor belt, starts the reflow oven, and the conveyor belt can drive the carrier together with the circuit board and FPC on the carrier to the furnace for welding. Since a spring is provided between the carrier and the bottom of the tray, the spring can form an upward elastic force on the pallet, so that the FPC is clamped between the pallet and the positioning mechanism, improving the stability of the FPC clamping, and at the same time can reduce the vibration and deviation of the FPC during the transportation process, which can effectively improve the stability and accuracy of the welding between the circuit board and the FPC.

[0012] Preferably, a plurality of insertion rods are fixedly connected to the bottom of the carrier, and the plurality of insertion rods are inserted into holes on the conveyor belt.

[0013] By adopting the above technical solution, the jig can be inserted into the hole on the conveyor belt through the insertion rod, which can reduce the occurrence of position deviation of the jig during the conveying process.

[0014] Preferably, a second placement slot is provided on the carrier, the support plate is mounted above the second placement slot, and the support plate is adapted to the second placement slot, and the bottoms of a plurality of the springs are fixedly connected to the bottom of the second placement slot.

[0015] By adopting the above technical solution, the support plate is raised and lowered in the second placement groove, which can ensure that the support plate rises or falls vertically along the groove wall of the second placement groove, reduce the occurrence of irreversible deformation of the spring, and form a good protection effect on the spring.

[0016] Preferably, the positioning mechanism includes a plurality of positioning members located on both sides of the FPC, and the plurality of positioning members include a connecting portion and a positioning portion;

[0017] A slot is provided at the bottom of the carrier, an insert block is fixedly connected to the bottom of the connecting portion, and the insert block is inserted and fixed in the slot;

[0018] The positioning parts are all tightly arranged on the top of the FPC.

[0019] By adopting the above technical solution, when the operator clamps the FPC, the positioning piece can be fixed through the slot, and the positioning part of the positioning piece is clamped on the top of the FPC. The spring forms an upward elastic force on the support plate, which can clamp the FPC on the support plate, thereby achieving the technical effect of fixing the FPC.

[0020] Preferably, the bottom corners of the positioning portion are rounded.

[0021] By adopting the above technical solution, when the operator installs the positioning plate and pushes the positioning part to clamp on the top of the FPC, the rounded corner setting at the bottom of the positioning part can reduce the occurrence of scratches on the FPC by the positioning part.

[0022] Preferably, it also includes:

[0023] The infrared beam sensor is fixedly installed on the frame of the reflow oven, located at the outlet of the furnace, and is used to sense the soldered circuit boards and output sensing signals;

[0024] A single chip microcomputer, whose signal input terminal is signal-connected to the signal output terminal of the infrared radiation sensor, and is used to receive the sensing signal and output a control signal;

[0025] The signal input ends of the hot air heating mechanism and the plate sending mechanism are connected to the signal output ends of the single chip microcomputer, and the hot air heating mechanism and the plate sending mechanism receive the control signal and stop running.

[0026] By adopting the above technical solution, when the circuit board and the FPC are welded and sent out through the discharge port, the infrared counter-radiation sensor senses the circuit board sent out through the discharge port and outputs a sensing signal. After receiving and identifying the sensing signal, the single-chip microcomputer determines that the circuit board and the FPC are welded, and controls the hot air heating mechanism and the board feeding mechanism to stop running, thereby achieving the technical effect of automatically sensing the welded circuit board and automatically shutting down the hot air heating mechanism and the board feeding mechanism, thereby improving the convenience of operators in using the reflow soldering furnace.

[0027] Preferably, it also includes:

[0028] The temperature sensor is fixedly mounted on the frame of the reflow oven and is mounted above the board feeding mechanism, and its signal input terminal is connected to the signal output terminal of the single chip microcomputer, and is used to receive the control signal, detect the surface temperature of the circuit board, and output a temperature signal;

[0029] A comparator chip, whose signal input terminal is signal-connected to the signal output terminal of the temperature sensor, is used to receive and compare the temperature signal, and output a prompt signal when the surface temperature of the circuit board is less than a set value;

[0030] The buzzer is fixedly mounted on the frame of the reflow oven, and the signal input end is connected to the signal output end of the comparator chip for receiving the prompt signal and issuing a prompt sound.

[0031] By adopting the above technical solution, when the hot air heating mechanism and the board feeding mechanism stop running, the temperature sensor is started under the control of the single-chip microcomputer to detect the surface temperature of the circuit board in real time. The comparator chip receives the temperature signal output by the temperature sensor and compares it. When the surface temperature of the circuit board is lower than the set temperature value, the comparator chip controls the buzzer to sound a prompt to remind the on-site operator that the circuit board has completely cooled down, which can further improve the convenience of the operator in using the reflow oven.

[0032] In summary, the circuit board feeding mechanism of the present application includes at least one of the following beneficial technical effects:

[0033] 1. Through the coordination and use of the support plate, spring and positioning parts on the carrier, the circuit board and FPC can be positioned, reducing the displacement of the FPC position during the conveyor belt conveying the circuit board and FPC, which may lead to welding dislocation, and can provide guarantee for the welding quality between the FPC and the circuit board;

[0034] 2. Through the setting of infrared counter-radiation sensor and single-chip microcomputer, the circuit board can be automatically sensed after the circuit board and FPC are welded and sent out through the discharge port of the furnace, and the hot air heating mechanism and the board feeding mechanism can be automatically controlled to stop running, which can improve the automation degree of the reflow oven and improve the convenience of operators to use the reflow oven;

[0035] 3. Through the combination and use of temperature sensors, comparator chips and buzzers, the surface temperature of the circuit board can be monitored after the circuit board is sent out through the discharge port. When the surface temperature of the circuit board is lower than the set temperature value, it can be determined that the circuit board is completely cooled, and the buzzer can be controlled to sound a warning, prompting the on-site operator to remove the circuit board and the carrier, further improving the convenience of the operator in using the reflow oven. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a schematic diagram of an embodiment of the present application for illustrating the overall structure of a reflow oven.

[0037] Figure 2 yes Figure 1 The enlarged view of point A in the middle is mainly used to show the installation structure of the positioning part.

[0038] Figure 3 It is a schematic diagram of an embodiment of the present application for illustrating the overall structure of the carrier.

[0039] Figure 4 It is a schematic diagram of an embodiment of the present application for displaying the internal structure of a carrier.

[0040] Figure 5 It is a schematic diagram of an embodiment of the present application for demonstrating signal transmission inside a reflow oven.

[0041] Explanation of the reference numerals: 1. carrier; 11. first placement slot; 12. through hole; 13. spring; 14. support plate; 15. insertion rod; 16. second placement slot; 17. slot; 2. conveyor belt; 3. circuit board; 4. FPC; 5. positioning mechanism; 51. positioning piece; 511. connecting part; 512. positioning part; 513. plug-in block; 6. infrared counter-radiation sensor; 61. transmitting end; 62. receiving end; 7. rack; 8. temperature sensor. DETAILED DESCRIPTION

[0042] The following is combined with Figure 1-5 This application is described in further detail.

[0043] Example

[0044] The present application embodiment discloses a circuit board feeding mechanism. Figure 1 and Figure 3 The board delivery mechanism mainly includes a carrier 1, which can be detachably mounted on a conveyor belt 2 of the board delivery mechanism. A first placement groove 11 adapted to the circuit board 3 is provided on the carrier 1, and a through hole 12 for avoiding the pins of electronic components on the circuit board 3 is provided at the bottom of the first placement groove 11.

[0045] A plurality of springs 13 are fixedly connected to the carrier 1 , and a support plate 14 is fixedly connected to one end of the springs 13 away from the carrier 1 . The support plate 14 is located below the FPC 4 . A positioning mechanism 5 is detachably mounted on the carrier 1 , and the FPC 4 is clamped between the support plate 14 and the positioning mechanism 5 .

[0046] When the operator uses the reflow oven to solder the FPC4 and the circuit board 3, the operator can place the PCB in the first placement slot 11, and then the operator places the FPC4 on the pallet 14, and fixes the FPC4 on the pallet 14 through the positioning mechanism 5, and then the operator installs the carrier 1 on the conveyor belt 2, starts the reflow oven, and the conveyor belt 2 can drive the carrier 1 together with the circuit board 3 and FPC4 on the carrier 1 to be transported to the furnace for welding.

[0047] Since a spring 13 is provided between the carrier 1 and the bottom of the tray, the spring 13 can form an upward elastic force on the support plate 14, so that the FPC4 is clamped between the support plate 14 and the positioning mechanism 5, thereby improving the stability of the FPC4 clamping and reducing the vibration and deviation of the FPC4 during the transportation process, thereby effectively improving the stability and accuracy of the welding between the circuit board 3 and the FPC4.

[0048] Reference Figure 1 and Figure 3 The bottom of the carrier 1 is fixedly connected with a plurality of insertion rods 15. The plurality of insertion rods 15 are inserted into the holes on the conveyor mesh belt 2. The fixture can be inserted into the holes on the conveyor mesh belt 2 through the insertion rods 15, which can reduce the occurrence of position deviation of the fixture during the conveying process.

[0049] Reference Figure 3 A second placement groove 16 is opened on the carrier 1, and the support plate 14 is mounted above the second placement groove 16, and the support plate 14 is adapted to the second placement groove 16, and the bottom of the plurality of springs 13 is fixedly connected to the bottom of the second placement groove 16.

[0050] The lifting of the support plate 14 in the second placement groove 16 can ensure that the support plate 14 rises or falls vertically along the groove wall of the second placement groove 16, which can reduce the occurrence of irreversible deformation of the spring 13 and form a good protection effect on the spring 13.

[0051] Reference Figure 1 and Figure 2 The positioning mechanism 5 includes a plurality of positioning members 51 located on both sides of the FPC 4, and the plurality of positioning members 51 include a connecting portion 511 and a positioning portion 512; a slot 17 is provided at the bottom of the carrier 1, and an insert block 513 is fixedly connected to the bottom of the connecting portion 511, and the insert block 513 is inserted and fixed in the slot 17; the positioning portions 512 are all tightly arranged on the top of the FPC 4.

[0052] When the operator clamps FPC4, the positioning member 51 can be fixed through the slot 17, and the positioning portion 512 of the positioning member 51 is clamped on the top of FPC4. The spring 13 forms an upward elastic force on the support plate 14, which can clamp FPC4 on the support plate 14, thereby achieving the technical effect of fixing FPC4.

[0053] Reference Figure 1 and Figure 2 The bottom corners of the positioning portion 512 are rounded. When the operator installs the positioning plate and pushes the positioning portion 512 to clamp the top of the FPC 4, the rounded bottom corners of the positioning portion 512 can reduce the possibility of scratching the FPC 4 caused by the positioning portion 512.

[0054] Reference Figure 4 and Figure 5The board feeding mechanism also includes: an infrared counter-radiation sensor 6, which is fixedly installed on the frame 7 of the reflow soldering furnace and is located at the discharge port of the furnace, and is used to sense the soldered circuit board 3 and output a sensing signal; a single-chip microcomputer, whose signal input end is connected to the signal output end of the infrared counter-radiation sensor 6, and is used to receive the sensing signal and output a control signal; the signal input end of the hot air heating mechanism and the board feeding mechanism is connected to the signal output end of the single-chip microcomputer, and the hot air heating mechanism and the board feeding mechanism receive the control signal and stop running.

[0055] The infrared radiation sensor 6 includes a transmitting end 61 and a receiving end 62. When the circuit board 3 is not blocked between the transmitting end 61 and the receiving end 62, the infrared rays emitted by the transmitting end 61 are received by the receiving end 62, and the transmitting end 61 outputs a low-level signal. When the circuit board 3 (or the carrier 1) is blocked between the transmitting end 61 and the receiving end 62, the infrared rays emitted by the transmitting end 61 cannot be received by the receiving end 62, and the receiving end 62 outputs a high-level signal (sensing signal).

[0056] After receiving and identifying the high-level signal, the single-chip microcomputer determines that the welding of circuit board 3 and FPC4 is completed, and controls the hot air heating mechanism and the board feeding mechanism to stop running, thereby achieving the technical effect of automatically sensing the circuit board 3 that has been welded, and automatically shutting down the hot air heating mechanism and the board feeding mechanism, thereby improving the convenience of operators in using the reflow oven.

[0057] Reference Figure 4 and Figure 5 The board delivery mechanism proposed in the embodiment of the present application also includes: a temperature sensor 8, which is fixedly installed on the frame 7 of the reflow soldering furnace, mounted above the board delivery mechanism, and the signal input end is signal-connected with the signal output end of the single-chip microcomputer, for receiving the control signal and detecting the surface temperature of the circuit board 3, and outputting the temperature signal; a comparator chip, whose signal input end is signal-connected with the signal output end of the temperature sensor 8, for receiving the temperature signal and comparing it, and outputting a prompt signal when the surface temperature of the circuit board 3 is less than the set value; a comparator chip, whose signal input end is signal-connected with the signal output end of the temperature sensor 8, for receiving the temperature signal and comparing it, and outputting a prompt signal when the surface temperature of the circuit board 3 is less than the set value; fixedly installed on the frame 7 of the reflow soldering furnace, whose signal input end is signal-connected with the signal output end of the comparator chip, for receiving the prompt signal and issuing a prompt sound.

[0058] When the hot air heating mechanism and the board feeding mechanism stop running, the temperature sensor 8 is started under the control of the single-chip microcomputer to detect the surface temperature of the circuit board 3 in real time. The comparator chip receives the temperature signal output by the temperature sensor 8 and compares it. When the surface temperature of the circuit board 3 is lower than the set temperature value, the comparator chip controls the buzzer to sound a prompt, reminding the on-site operator that the circuit board 3 has completely cooled down, which can further improve the convenience of the operator in using the reflow oven.

[0059] The implementation principle of a board feeding mechanism for a circuit board in an embodiment of the present application is: by matching and using the support plate 14, the spring 13 and the positioning member 51 on the carrier 1, the circuit board 3 and the FPC 4 can be positioned, thereby reducing the position deviation of the FPC 4 during the process of the conveyor belt 2 conveying the circuit board 3 and the FPC 4, which may lead to welding misalignment, and providing a guarantee for the welding quality between the FPC 4 and the circuit board 3.

[0060] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A circuit board feeding mechanism, characterized in that: The invention comprises a carrier (1), wherein the carrier (1) is detachably mounted on a conveyor belt (2) of a board delivery mechanism, wherein a first placement groove (11) adapted to a circuit board (3) is provided on the carrier (1), and a through hole (12) for avoiding pins of electronic components on the circuit board (3) is provided at the bottom of the first placement groove (11); A plurality of springs (13) are fixedly connected to the carrier (1), and one end of the plurality of springs (13) away from the carrier (1) is fixedly connected to a support plate (14), and the support plate (14) is located below the FPC (4); The carrier (1) is detachably provided with a positioning mechanism (5), and the FPC (4) is clamped between the support plate (14) and the positioning mechanism (5).

2. A circuit board feeding mechanism according to claim 1, characterized in that: A plurality of insertion rods (15) are fixedly connected to the bottom of the carrier (1), and the plurality of insertion rods (15) are inserted into holes on the conveyor mesh belt (2).

3. A circuit board feeding mechanism according to claim 2, characterized in that: The carrier (1) is provided with a second placement groove (16), the support plate (14) is mounted above the second placement groove (16), and the support plate (14) is adapted to the second placement groove (16), and the bottoms of the plurality of springs (13) are fixedly connected to the bottom of the second placement groove (16).

4. A circuit board feeding mechanism according to claim 3, characterized in that: The positioning mechanism (5) comprises a plurality of positioning members (51) located on both sides of the FPC (4), and the plurality of positioning members (51) comprises a connecting portion (511) and a positioning portion (512); The bottom of the carrier (1) is provided with a slot (17), the bottom of the connecting portion (511) is fixedly connected with an insert block (513), and the insert block (513) is inserted and fixed in the slot (17); The positioning parts (512) are all tightly arranged on the top of the FPC (4).

5. A circuit board feeding mechanism according to claim 4, characterized in that: The bottom corners of the positioning portion (512) are rounded.

6. A circuit board feeding mechanism according to claim 1, characterized in that: Also includes: An infrared counter-radiation sensor (6) is fixedly mounted on a frame (7) of the reflow soldering furnace and is located at a discharge port of the furnace chamber, and is used to sense the soldered circuit board (3) and output a sensing signal; A single chip microcomputer, whose signal input end is signal-connected to the signal output end of the infrared radiation sensor (6), and is used to receive the sensing signal and output a control signal; The signal input ends of the hot air heating mechanism and the plate sending mechanism are connected to the signal output ends of the single chip microcomputer, and the hot air heating mechanism and the plate sending mechanism receive the control signal and stop running.

7. A circuit board feeding mechanism according to claim 6, characterized in that: Also includes: A temperature sensor (8) is fixedly mounted on a frame (7) of the reflow oven and is mounted above the board feeding mechanism, with a signal input end connected to a signal output end of the single chip computer, and is used to receive the control signal and detect the surface temperature of the circuit board (3), and output a temperature signal; A comparator chip, the signal input end of which is signal-connected to the signal output end of the temperature sensor (8), for receiving and comparing the temperature signal, and outputting a prompt signal when the surface temperature of the circuit board (3) is less than a set value; The buzzer is fixedly mounted on a frame (7) of the reflow oven, and has a signal input end connected to a signal output end of the comparator chip, and is used to receive the prompt signal and emit a prompt sound.

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