Circuit board via hole welding auxiliary structure

Abstract

The utility model discloses a circuit board via hole welding auxiliary structure, and belongs to the technical field of circuit boards. Comprising a circuit board provided with a via hole, bonding pads are arranged at the two ends of the via hole, and sinking grooves matched with the bonding pads in outer diameter are formed in the side, meeting wave soldering, of the circuit board; the bonding pad is arranged in the sinking groove and protrudes outwards; a plurality of strip-shaped grooves penetrating through the inside and the outside are formed in the bonding pad in a surrounding mode. According to the utility model, the strip-shaped groove is arranged around the bonding pad to communicate the inside and the outside, thereby enhancing the diversion of liquid tin, enabling more liquid tin to enter the via hole, and enhancing the welding quality; and meanwhile, the contact surface between the soldering tin and the bonding pad is increased, so that the temperature can be increased more quickly, the soldering tin and the bonding pad are connected more firmly, and the welding effect is further enhanced.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board through-hole welding auxiliary structure. Background Art

[0002] Wave soldering is mainly for plug-in soldering. The soldering surface is in contact with high-temperature liquid tin, which maintains an inclined surface and forms a wave-like phenomenon. During the wave soldering process, the pins of the components are inserted into the vias; due to the small gap of the vias after insertion, it is not easy for the tin to surge up, which will cause cold soldering and affect the soldering effect of the circuit.

[0003] To solve the above problems, the patent with application number "CN202320858046.1" discloses "a circuit board via welding auxiliary structure"; it is arranged on a circuit board, the circuit board is provided with a through via, the circuit board includes pads at both ends of the through hole, and the circuit board is provided with at least one through hole outside the pad. During the welding process, the through hole is placed close to the direction of the liquid tin. Since the liquid tin is in a high temperature state, when the pad is about to contact the liquid tin, the hot air will first preheat the area near the pad from the through hole. When the pad contacts the liquid tin, due to the increase in temperature, the tin will be more likely to flow to the other side of the circuit board, and when the welding is completed, the circuit board needs to be cooled, and the through hole is more conducive to the heat dissipation of the circuit board.

[0004] In the above technical solution, hot air passes through the through hole to preheat the circuit board, thereby improving the soldering effect of the pins. However, in actual production, it is not suitable or impossible to open through holes on some circuit boards. Therefore, the applicant has made targeted improvements to enhance the through-hole soldering effect without opening holes. Utility Model Content

[0005] The utility model aims to solve the above problems in the prior art and proposes a circuit board through-hole welding auxiliary structure.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A circuit board through-hole soldering auxiliary structure comprises a circuit board provided with a through-hole, soldering pads are provided at both ends of the through-hole, and a sink groove matching the outer diameter of the soldering pad is provided on the side of the circuit board facing the wave soldering;

[0008] The pad is arranged in the sink and protrudes outwards;

[0009] The pad is surrounded by a plurality of strip grooves that penetrate inside and outside.

[0010] In some embodiments, the depth of the strip groove is less than the thickness of the pad.

[0011] In some embodiments, it further includes: a ring groove arranged around the pad;

[0012] The inner diameter of the annular groove is adapted to the outer diameter of the welding pad;

[0013] The strip groove communicates with the interior of the pad and the annular groove.

[0014] In some embodiments, the bottom surface of the annular groove is flush with the bottom surface of the strip groove.

[0015] In some embodiments, it also includes: a through hole arranged on the outside of the pad.

[0016] In some embodiments, the through hole is provided at one, or a plurality of through holes are provided around.

[0017] In some embodiments, it also includes: an extension groove connecting the through hole and the strip groove.

[0018] In some embodiments, a copper rod is inserted through the through hole.

[0019] In some embodiments, a copper rod is inserted through the through hole.

[0020] In some embodiments, the copper rod is connected to the soldering pad at a side away from the wave soldering.

[0021] Compared with the prior art, the utility model provides a circuit board via welding auxiliary structure, which has the following beneficial effects.

[0022] 1. In the utility model, a strip groove is arranged around the pad to connect the inside and the outside, so as to strengthen the flow of liquid tin, allow more liquid tin to enter the via hole, and improve the welding quality; at the same time, the contact surface between the solder and the pad is increased, so that it can heat up faster, and make the connection between the solder and the pad more firmly, further enhancing the welding effect.

[0023] 2. The utility model provides a sink groove so that the bottom surface of the strip groove is not higher than the surface of the circuit board, which is more conducive to drainage; a ring groove is arranged around the pad to further enhance the conduction of liquid tin and further enhance the welding effect; hot air passes through the through hole to accelerate the preheating of the circuit board; a copper rod is inserted into the through hole to accelerate the preheating of the circuit board by utilizing the thermal conductivity of the copper rod; an extension groove is provided to cooperate with the copper rod to form a spare circuit.

[0024] Other advantages, objectives and features of the present invention will be described in the following description to some extent; and will be apparent to those skilled in the art based on the following examination and study to some extent; or, may be taught from the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural diagram of embodiment 1.

[0026] Figure 2 This is a schematic diagram of the structure of the sedimentation tank.

[0027] Figure 3 It is a structural diagram of embodiment 2.

[0028] Figure 4 This is a schematic diagram of the structure of the third embodiment.

[0029] Figure 5 It is a structural diagram of embodiment 4.

[0030] Figure 6 It is a structural diagram of embodiment 4.

[0031] In the figure:

[0032] 1. Via hole; 2. Pad; 3. Sink; 4. Strip groove; 5. Ring groove; 6. Through hole; 7. Extension groove;

[0033] 100. Circuit board. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0035] Embodiment 1.

[0036] Reference Figure 1-2 A circuit board via soldering auxiliary structure includes a circuit board 100 provided with a via 1, and pads 2 are provided at both ends of the via 1.

[0037] A plurality of strip grooves 4 are arranged around the soldering pad 2 on the side of the circuit board 100 facing the wave soldering.

[0038] During welding, the provision of the strip groove 4 strengthens the conduction of liquid tin, allowing more liquid tin to enter the via hole, significantly improving the welding quality; at the same time, the provision of the strip groove 4 increases the contact surface between the solder and the pad 2, allowing it to heat up faster; in addition, the increase in the contact surface also makes the connection between the solder and the pad 2 more firmly, further enhancing the welding effect.

[0039] It should be noted that the depth of the strip groove 4 is less than the thickness of the pad 2 so as not to destroy the integrity of the pad 2 and to maintain appropriate strength.

[0040] In some embodiments, a side of the circuit board 100 that faces wave soldering is provided with a sinking groove 3 that matches the outer diameter of the pad 2 ; the pad 2 is disposed in the sinking groove 3 and protrudes outward.

[0041] like Figure 2 As shown, the sinking groove 3 is opened on the circuit board 100, and the pad is partially buried in the sinking groove 3; at the same time, the bottom surface of the strip groove 4 is not higher than the surface of the circuit board 100, which is more conducive to drainage.

[0042] Embodiment 2.

[0043] Reference Figure 3 Different from the above, it also includes: a ring groove 5 arranged around the pad 2.

[0044] The inner diameter of the annular groove 5 matches the outer diameter of the pad 2 ; the strip groove 4 connects the inside of the pad 2 with the annular groove 5 .

[0045] Furthermore, the bottom surface of the annular groove 5 is flush with the bottom surface of the strip groove 4 .

[0046] The additional annular groove 5 further enhances the flow conduction of the liquid tin and the welding effect.

[0047] Embodiment three.

[0048] Reference Figure 4 Different from the above, it also includes: a through hole 6 arranged on the outside of the pad 2.

[0049] It should be noted that the through holes 6 need to be arranged according to the actual routing of the circuit board 100 , and the routing should not be staggered and should not have adverse effects on the circuit.

[0050] The through hole 6 has the same function as the patent "A circuit board through-hole welding auxiliary structure" with application number "CN202320858046.1", which is used to accelerate the preheating of the circuit board 100 through hot air.

[0051] It can be understood that the diameter of the through hole 6 is smaller than the inner diameter of the via hole 1; accordingly, according to the actual circuit, one through hole 6 is provided, or a plurality of through holes 6 are provided around.

[0052] Furthermore, a copper rod is inserted through the through hole 6 .

[0053] It should be noted that, at this time, the through hole 6 is closed and hot air cannot pass through; at this time, the excellent thermal conductivity of the copper rod is used to accelerate the preheating of the circuit board.

[0054] Embodiment 4.

[0055] Reference Figure 5-6 Different from the above, it also includes: an extension groove 7 connecting the through hole 6 and the strip groove 4.

[0056] The extended groove 7 can further enhance the drainage; at the same time, part of the liquid tin can enter the through hole 6 to block it; in addition, after the liquid tin enters the extended groove 7, the welding area is increased.

[0057] Furthermore, a copper rod is inserted through the through hole 6; at the same time, the copper rod is connected to the soldering pad 2 at the side away from the wave soldering.

[0058] It should be noted that at this time, the through hole 6 is closed and hot air cannot pass through; at this time, the excellent thermal conductivity of the copper rod is used to accelerate the preheating of the circuit board; in addition, the copper rod is connected to the pad 2 on the other side to form a backup circuit.

[0059] As for the connection form between the copper rod and the pad 2 on the other side, a printed circuit connection can be used.

[0060] In the utility model, a strip groove 4 is arranged around the pad 2 to connect the inside and the outside, thereby strengthening the flow conduction of liquid tin, allowing more liquid tin to enter the via hole, and improving the welding quality; at the same time, the contact surface between the solder and the pad 2 is increased, so that it can heat up faster, and the connection between the solder and the pad 2 is made more firm, further enhancing the welding effect; a sink groove 3 is provided so that the bottom surface of the strip groove 4 is not higher than the surface of the circuit board 100, which is more conducive to drainage; an annular groove 5 is arranged around the pad 2 to further strengthen the flow conduction of liquid tin and further enhance the welding effect; the through hole 6 passes hot air to accelerate the preheating of the circuit board 100; a copper rod is inserted into the through hole 6, and the thermal conductivity of the copper rod is used to accelerate the preheating of the circuit board; an extension groove 7 is provided to cooperate with the copper rod to form a spare circuit.

[0061] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

[0062] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0063] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A circuit board via-hole soldering auxiliary structure, comprising a circuit board (100) provided with a via (1), wherein solder pads (2) are provided at both ends of the via (1), characterized in that: A sink groove (3) adapted to the outer diameter of the soldering pad (2) is provided on the side of the circuit board (100) that is to be subjected to wave soldering; The welding pad (2) is arranged in the sink (3) and protrudes outwards; The pad (2) is surrounded by a plurality of strip-shaped grooves (4) that penetrate inside and outside.

2. A circuit board through-hole soldering auxiliary structure according to claim 1, characterized in that: The depth of the strip-shaped groove (4) is less than the thickness of the pad (2).

3. A circuit board through-hole soldering auxiliary structure according to claim 1, characterized in that: Also includes: An annular groove (5) arranged around the welding pad (2); The inner diameter of the annular groove (5) is adapted to the outer diameter of the welding pad (2); The strip-shaped groove (4) communicates with the interior of the welding pad (2) and the annular groove (5).

4. A circuit board through-hole soldering auxiliary structure according to claim 3, characterized in that: The bottom surface of the annular groove (5) is flush with the bottom surface of the strip groove (4).

5. A circuit board through-hole soldering auxiliary structure according to claim 1 or 3, characterized in that: Also includes: A through hole (6) is arranged outside the soldering pad (2).

6. A circuit board through-hole soldering auxiliary structure according to claim 5, characterized in that: The through hole (6) is provided with one, or a plurality of through holes (6) are arranged around.

7. The circuit board through-hole soldering auxiliary structure according to claim 5, characterized in that: Also includes: An extension groove (7) communicating with the through hole (6) and the strip groove (4).

8. The circuit board through-hole soldering auxiliary structure according to claim 5, characterized in that: A copper rod is inserted through the through hole (6).

9. The circuit board through-hole soldering auxiliary structure according to claim 7, characterized in that: A copper rod is inserted through the through hole (6).

10. A circuit board through-hole soldering auxiliary structure according to claim 9, characterized in that: The copper rod is connected to a soldering pad (2) at a side away from the wave soldering.

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