Exhaust mechanism of semiconductor plastic package mold

Abstract

The utility model relates to the technical field of exhaust mechanisms, and discloses an exhaust mechanism of a semiconductor plastic package mold, which comprises a base, a pressing plate and a fifth fixing block. A first fixing block is fixedly connected to the middle of the upper portion of the base, second fixing blocks are fixedly connected to the left and right of the front and rear sides of the first fixing block, fixing shafts are fixedly connected to the upper ends of the second fixing blocks, springs are fixedly connected to the upper sides of the second fixing blocks, and third fixing blocks are fixedly connected to the left and right of the front and rear sides of a pressing plate. A fourth fixing block is fixedly connected to the left side of the pressing plate, a filling groove is formed in the position, close to the left side, of the middle of the pressing plate, a second mold clamping groove is formed in the bottom end of the pressing plate, and an exhaust hole is formed in the right side of the second mold clamping groove. And the plastic packaging mold of the device can be freely replaced, so that plastic packaging of various processes can be realized by one machine, and the purchase cost and the maintenance cost are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of exhaust mechanisms, in particular to an exhaust mechanism for a semiconductor plastic packaging mould. Background Art

[0002] Semiconductors play an important role in many fields, such as integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion, etc. For example, diodes are devices made of semiconductors. Circuits in various electrical appliances also use semiconductor devices. Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. There are many kinds of semiconductor materials, the most common ones are silicon, germanium, gallium arsenide, etc. Silicon is the most influential of all semiconductor materials applications. Semiconductors play a very important role in the development of industrial science and technology.

[0003] Most of the existing devices are integrated, which makes it impossible to replace the plastic packaging mold. Usually, a set of molds requires a set of corresponding machinery, which increases the cost and makes it difficult to store the device, making it impossible to use it more effectively and comprehensively. Utility Model Content

[0004] In order to make up for the above shortcomings, the utility model provides an exhaust mechanism for a semiconductor plastic packaging mold, aiming to improve the problem of high cost caused by the inability to replace the plastic packaging mold in the prior art.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A venting mechanism for a semiconductor plastic encapsulation mold comprises a base, a pressing plate and a fifth fixed block, wherein a first fixed block is fixedly connected to the middle part of the upper part of the base, a second fixed block is fixedly connected to the left and right sides of the front and rear sides of the first fixed block, a fixed shaft is fixedly connected to the upper end of the second fixed block, a spring is fixedly connected to the upper side of the second fixed block, a third fixed block is fixedly connected to the left and right sides of the front and rear sides of the pressing plate, a fourth fixed block is fixedly connected to the left side of the pressing plate, a filling groove is provided on the left side of the middle part of the pressing plate, a second mold slot is provided at the bottom end of the pressing plate, an venting hole is provided on the right side of the second mold slot, a heating plate is fixedly connected to the front and rear of the bottom of the pressing plate, a hydraulic pressure is fixedly connected to the upper side of the fifth fixed block, a material pressing block is fixedly connected to the left side of the bottom of the fifth fixed block, and limiting plates are fixedly connected to the front and rear sides of the fifth fixed block;

[0007] As a further description of the above technical solution:

[0008] A first mold slot is provided on the upper side of the first fixing block, and the inner side of the first mold slot is engaged with the outer side of the pressing plate;

[0009] As a further description of the above technical solution:

[0010] The upper end of the base is fixedly connected to second fixing blocks on the front, rear, left and right sides;

[0011] As a further description of the above technical solution:

[0012] A limiting groove is formed in the middle of the third fixing block from top to bottom, and the inner wall of the limiting groove is slidably connected to the outer wall of the fixing shaft;

[0013] As a further description of the above technical solution:

[0014] The inner wall of the spring is slidably connected to the outer wall of the fixed shaft, and the upper end of the spring is fixedly connected to the third fixed block;

[0015] As a further description of the above technical solution:

[0016] A material loading groove is provided in the middle of the fourth fixing block;

[0017] As a further description of the above technical solution:

[0018] The exhaust hole penetrates the pressing plate;

[0019] As a further description of the above technical solution:

[0020] The inner side of the limit plate is slidably connected to the outer side of the pressure plate, and the inner side of the limit plate is slidably connected to the outer side of the first fixing block.

[0021] The utility model has the following beneficial effects:

[0022] 1. In the present invention, by using the first mold slot and the second mold slot in combination, the plastic sealing mold of the device can be freely replaced, thereby realizing plastic sealing of multiple processes by one machine, reducing purchase cost and maintenance cost.

[0023] 2. In the utility model, through the cooperation of the loading trough, the filling trough and the pressing block, the operator can keep an effective distance from the high temperature environment when filling the plastic sealing material, which speeds up the replacement efficiency, reduces the possibility of accidents and enhances the safety of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the overall structure of an exhaust mechanism of a semiconductor plastic packaging mold proposed by the utility model;

[0025] Figure 2 A top view of a pressure plate structure of an exhaust mechanism of a semiconductor plastic packaging mold proposed by the utility model;

[0026] Figure 3This is a bottom view of a pressure plate structure of an exhaust mechanism of a semiconductor plastic packaging mold proposed by the utility model;

[0027] Figure 4 The utility model is a schematic diagram of the hydraulic structure of an exhaust mechanism of a semiconductor plastic packaging mold.

[0028] Legend:

[0029] 1. Base; 2. First fixed block; 3. First mold slot; 4. Second fixed block; 5. Spring; 6. Fixed shaft; 7. Third fixed block; 8. Pressing plate; 9. Fourth fixed block; 10. Filling slot; 11. Loading slot; 12. Second mold slot; 13. Exhaust hole; 14. Heating plate; 15. Limiting plate; 16. Fifth fixed block; 17. Hydraulic press; 18. Pressing block; 19. Limiting slot. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] Reference Figure 1-Figure 4 , including a base 1, a pressing plate 8 and a fifth fixed block 16, a first fixed block 2 is fixedly connected to the middle part of the upper part of the base 1, a second fixed block 4 is fixedly connected to the left and right sides of the front and rear sides of the first fixed block 2, a fixed shaft 6 is fixedly connected to the upper end of the second fixed block 4, a spring 5 is fixedly connected to the upper side of the second fixed block 4, a third fixed block 7 is fixedly connected to the left and right sides of the front and rear sides of the pressing plate 8, a fourth fixed block 9 is fixedly connected to the left side of the pressing plate 8, a packing groove 10 is opened on the left side of the middle part of the pressing plate 8, a second mold slot 12 is opened at the bottom end of the pressing plate 8, an exhaust hole 13 is opened on the right side of the second mold slot 12, a heating plate 14 is fixedly connected to the front and rear of the bottom of the pressing plate 8, a hydraulic press 17 is fixedly connected to the upper side of the fifth fixed block 16, a press block 18 is fixedly connected to the left side of the bottom of the fifth fixed block 16, and a limiting plate 15 is fixedly connected to the front and rear sides of the fifth fixed block 16.

[0032] The first mold slot 3 and the second mold slot 12 can freely replace the template of the plastic packaging mold. The operator adds the plastic packaging material into the loading slot 11 and slides it into the filling slot 10. During the pressing process, the pressing block 18 presses the heated and melted plastic packaging material into the second mold slot 12. During the whole process, the operator always maintains an effective distance from the heating plate 14 to prevent scalding accidents during the operation.

[0033] A first mold slot 3 is provided on the upper side of the first fixed block 2, and the inner side of the first mold slot 3 is engaged with the outer side of the pressing plate 8. The second fixed block 4 is fixedly connected to the front, back, left and right sides of the upper end of the base 1. A limiting slot 19 is provided through the middle of the third fixed block 7 from top to bottom, and the inner wall of the limiting slot 19 is slidably connected to the outer wall of the fixed shaft 6. The inner wall of the spring 5 is slidably connected to the outer wall of the fixed shaft 6, and the upper end of the spring 5 is fixedly connected to the third fixed block 7. A loading slot 11 is provided in the middle of the fourth fixed block 9. The exhaust hole 13 runs through the pressing plate 8. The inner side of the limiting plate 15 is slidably connected to the outer side of the pressing plate 8, and the inner side of the limiting plate 15 is slidably connected to the outer side of the first fixed block 2.

[0034] The fixed shaft 6 performs limit control on the pressing process of the device to ensure that the device will not deviate during the pressing process. When pressing down, the pressing plate 8 and the first mold slot 3 create a closed environment. During the pressing and heating process, the plastic sealing material melts through the filling groove 10 and flows into the mold under the action of the heating plate 14. As the volume of the closed space gradually decreases, excess air and plastic sealing material will enter the exhaust hole 13. After the heating is completed, the plastic sealing material solidifies, preventing air from entering, thereby ensuring a vacuum environment.

[0035] Working principle: The operator places the required plastic sealing mold in the first mold slot 3 and the second mold slot 12, adds the plastic sealing material into the loading slot 11, and slides it into the filling slot 10. During the pressing process, the pressing block 18 presses the heated and melted plastic sealing material into the second mold slot 12, and controls the hydraulic press 17 to start pressing down. During the pressing process, the pressing plate 8 and the first mold slot 3 create a closed environment. The fixed shaft 6 performs limit control on the pressing process of the device to ensure that the device will not deviate during the pressing process. During the pressing and heating process, the plastic sealing material melts through the filling slot 10 under the action of the heating plate 14 and flows into the mold. As the volume of the closed space gradually decreases, excess air and plastic sealing material will enter the exhaust hole 13. After the heating is completed, the plastic sealing material solidifies, preventing air from entering, ensuring the vacuum environment, and controlling the hydraulic press 17. Under the action of the spring 5, the device opens and the plastic sealing product can be taken out.

[0036] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An exhaust mechanism for a semiconductor plastic packaging mold, comprising a base (1), a pressing plate (8) and a fifth fixing block (16), characterized in that: A first fixed block (2) is fixedly connected to the middle part of the upper part of the base (1); a second fixed block (4) is fixedly connected to the left and right sides of the front and rear sides of the first fixed block (2); a fixed shaft (6) is fixedly connected to the upper end of the second fixed block (4); a spring (5) is fixedly connected to the upper side of the second fixed block (4); a third fixed block (7) is fixedly connected to the left and right sides of the front and rear sides of the pressing plate (8); a fourth fixed block (9) is fixedly connected to the left side of the pressing plate (8); a filling groove (10) is provided at the left side of the middle part of the pressing plate (8); a second mold slot (12) is provided at the bottom end of the pressing plate (8); an exhaust hole (13) is provided on the right side of the second mold slot (12); a heating plate (14) is fixedly connected to the front and rear of the bottom of the pressing plate (8); a hydraulic press (17) is fixedly connected to the upper side of the fifth fixed block (16); a material pressing block (18) is fixedly connected to the left side of the bottom of the fifth fixed block (16); and limiting plates (15) are fixedly connected to the front and rear sides of the fifth fixed block (16).

2. The exhaust mechanism of a semiconductor plastic packaging mold according to claim 1, characterized in that: A first mold slot (3) is provided on the upper side of the first fixed block (2), and the inner side of the first mold slot (3) is engaged with the outer side of the pressing plate (8).

3. The exhaust mechanism of a semiconductor plastic packaging mold according to claim 1, characterized in that: The upper end of the base (1) is fixedly connected to second fixing blocks (4) on the front, rear, left and right sides.

4. The exhaust mechanism of a semiconductor plastic packaging mold according to claim 1, characterized in that: A limiting groove (19) is provided through the middle of the third fixed block (7) from top to bottom, and the inner wall of the limiting groove (19) is slidably connected to the outer wall of the fixed shaft (6).

5. The exhaust mechanism of a semiconductor plastic packaging mold according to claim 1, characterized in that: The inner wall of the spring (5) is slidably connected to the outer wall of the fixed shaft (6), and the upper end of the spring (5) is fixedly connected to the third fixed block (7).

6. The exhaust mechanism of a semiconductor plastic packaging mold according to claim 1, characterized in that: A material loading groove (11) is provided in the middle of the fourth fixing block (9).

7. The exhaust mechanism of a semiconductor plastic packaging mold according to claim 1, characterized in that: The exhaust hole (13) passes through the pressing plate (8).

8. The exhaust mechanism of a semiconductor plastic packaging mold according to claim 1, characterized in that: The inner side of the limit plate (15) is slidably connected to the outer side of the pressure plate (8), and the inner side of the limit plate (15) is slidably connected to the outer side of the first fixed block (2).

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