Beauty instrument with cold compress effect

Abstract

The utility model provides a beauty instrument with a cold compress effect, which comprises a host, and a radiating module support is mounted at one end of the host in a 30-degree inclined manner; a glass head is arranged at the top end of the inner wall of the heat dissipation module support, the glass head is of an annular structure, the glass head and the heat dissipation module support are installed in a sealed mode, a touch copper wire is fixedly installed at the position, on one side of the glass head, of the heat dissipation module support, and the touch copper wire is used for sensing whether the glass head makes contact with the skin of a user or not; a main control device is arranged between one side of the semiconductor chilling plate and the glass head, and a heat absorption assembly is installed on the other side of the semiconductor chilling plate; the cooling device has the advantages that effective cooling is performed under the action of the semiconductor chilling plate, meanwhile, the heating side of the semiconductor chilling plate is effectively cooled under the action of the heat dissipation module, heat absorption cooling is performed on the refrigerating side, and effective cold compress is performed on the skin of a user under the action of heat absorption cooling.

Description

Technical Field

[0001] One or more embodiments of the present specification relate to the technical field of beauty instruments, and in particular, to a beauty instrument with a cold compress effect. Background Art

[0002] A beauty instrument is a machine that adjusts according to the physiological functions of the human body to improve the body and face. Its functions include whitening, skin rejuvenation, freckle removal, wrinkle removal, hair removal, and weight loss. Its names include ultrasonic introduction, photon rejuvenation, high-frequency electrotherapy, RF radio wave skin tightening, electronic spot and mole removal, E-light permanent hair removal and skin rejuvenation, and Jafani nutrient introduction and export.

[0003] The application number in the prior art is: 2021207351199, the patent name is: A Chinese utility model patent for a beauty instrument with a cold compress function for laser beauty, which describes "by setting up a storage chamber, by setting up a storage chamber in the third shell, and embedding and installing a conduction block at the bottom of the storage chamber, by placing a frozen thermal insulation ice bag in the storage chamber, and the conduction block conducts the low temperature of the thermal insulation ice bag to the skin, thereby lowering the temperature of the skin, achieving the effect of effectively lowering the skin temperature", however, the cold compress method cannot perform continuous cold compress during use, and thus cannot meet the requirements of the prior art. Utility Model Content

[0004] In view of this, the purpose of the present invention is to provide a beauty instrument with a cold compress effect to solve the problem that the prior art cannot provide continuous cold compress.

[0005] Based on the above purpose, the utility model provides a beauty instrument with a cold compress effect, comprising a main unit, one end of which is inclined at thirty degrees to install a heat dissipation module bracket.

[0006] A glass head is arranged at the top of the inner wall of the heat dissipation module bracket. The glass head is in an annular structure and is sealed and installed with the heat dissipation module bracket. A tactile copper wire is fixedly installed at the heat dissipation module bracket on one side of the glass head. The tactile copper wire is used to sense whether the glass head contacts the user's skin.

[0007] A semiconductor cooling sheet is arranged in the heat dissipation module bracket, a main control device is arranged between one side of the semiconductor cooling sheet and the glass head, and a heat absorption component is installed on the other side of the semiconductor cooling sheet.

[0008] Preferably, the heat absorption component includes: a heat dissipation module, and a heat dissipation module is also installed on the heat dissipation module bracket on the other side of the semiconductor refrigeration plate.

[0009] Preferably, the heat dissipation module is fixed on the heat dissipation module bracket by a heat dissipation module locking frame.

[0010] Preferably, a decorative fixing ring is fixedly clamped on the periphery of one end of the heat dissipation module bracket.

[0011] Preferably, the main control device comprises: a PCB assembly, the back side of the PCB assembly is in contact with the semiconductor cooling sheet, and the front side of the PCB assembly is provided with thermal conductive silica gel;

[0012] The front side of the thermal conductive silicone contacts the glass head, and the back side contacts the PCB assembly.

[0013] Preferably, the heat dissipation module comprises: a heat sink, a heat dissipation air duct and a heat dissipation fan, wherein the heat sink is installed in the heat dissipation air duct, and the heat dissipation fan is fixedly installed on the heat dissipation air duct on the back side of the heat sink.

[0014] Preferably, air holes are evenly arranged on the outside of the heat dissipation module bracket, and the hot air extracted by the heat dissipation fan is discharged through the air holes.

[0015] From the above description, it can be seen that the utility model provides a beauty instrument with a cold compress effect, which can effectively cool down the skin through the action of a semiconductor refrigeration plate, and can effectively cool down the heating side of the semiconductor refrigeration plate through the action of a heat dissipation module, and can absorb heat and cool down the cooling side, and can effectively provide a cold compress effect on the user's skin under the action of absorbing heat and cooling. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate one or more embodiments of the present specification or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only one or more embodiments of the present specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 This is a schematic diagram of the explosion structure of the cold compress instrument head of the utility model;

[0018] Figure 2 It is a schematic diagram of the overall structure of the utility model.

[0019] In the figure: 1. Decorative fixing ring; 2. Heat dissipation module bracket; 3. Glass head; 4. Tactile copper wire; 5. Thermal conductive silicone; 6. PCB assembly; 7. Semiconductor cooling sheet; 8. Heat dissipation module; 81. Heat sink; 82. Heat dissipation air duct; 83. Cooling fan; 9. Heat dissipation module locking frame; 10. Host. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0021] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the utility model should be the common meanings understood by people with ordinary skills in the field to which the disclosure belongs. The "first", "second" and similar words used in the present disclosure do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0022] Embodiment 1:

[0023] like Figure 1-2 As shown, a beauty instrument with a cold compress effect is provided, comprising a host 10, wherein one end of the host 10 is inclined at thirty degrees to install a heat dissipation module bracket 2.

[0024] A glass head 3 is arranged at the top of the inner wall of the heat dissipation module bracket 2. The glass head 3 is annular in structure and is sealed and installed with the heat dissipation module bracket 2. A tactile copper wire 4 is fixedly installed at the heat dissipation module bracket 2 on one side of the glass head 3. The tactile copper wire 4 is used to sense whether the glass head 3 contacts the user's skin.

[0025] The touch-sensitive copper wire 4 recognizes whether the user's skin touches the glass head by electromagnetic induction.

[0026] A semiconductor cooling sheet 7 is arranged in the heat dissipation module bracket 2 , a main control device is arranged between one side of the semiconductor cooling sheet 7 and the glass head 3 , and a heat absorption component is installed on the other side of the semiconductor cooling sheet 7 .

[0027] Among them, the main control device is used to be installed with an external power supply and an external control connector of the device.

[0028] The heat absorption component includes: a heat dissipation module 8, and a heat dissipation module 8 is also installed on the heat dissipation module bracket 2 on the other side of the semiconductor refrigeration plate 7;

[0029] Among them, the heat dissipation module bracket 2 serves as the bearing bracket of the entire equipment. When in use, it adopts high-strength and high-temperature resistant material, and corresponding holes are also provided on the heat dissipation module bracket 2 for replacing the internal air to facilitate its cooling effect.

[0030] The heat dissipation module 8 includes: a heat sink 81, a heat dissipation duct 82 and a heat dissipation fan 83. The heat sink 81 is installed in the heat dissipation duct 82, and the heat dissipation fan 83 is fixedly installed on the heat dissipation duct 82 on the back of the heat sink 81.

[0031] The heat dissipation module bracket 2 is evenly provided with air holes, and the hot air drawn by the heat dissipation fan 83 is discharged through the air holes.

[0032] The heat dissipation module 8 is fixed on the heat dissipation module bracket 2 via a heat dissipation module locking frame 9 .

[0033] A decorative fixing ring 1 is fixedly clamped on the periphery of one end of the heat dissipation module bracket 2 .

[0034] Among them, when in use, the decorative fixing ring 1 is used for decoration and at the same time strengthens the installation of one end of the heat dissipation module bracket for more stability.

[0035] Embodiment 2:

[0036] like Figure 1-2 As shown, a beauty instrument with a cold compress effect is provided, comprising a host 10, wherein one end of the host 10 is inclined at thirty degrees to install a heat dissipation module bracket 2.

[0037] A glass head 3 is arranged at the top of the inner wall of the heat dissipation module bracket 2. The glass head 3 is annular in structure and is sealed and installed with the heat dissipation module bracket 2. A tactile copper wire 4 is fixedly installed at the heat dissipation module bracket 2 on one side of the glass head 3. The tactile copper wire 4 is used to sense whether the glass head 3 contacts the user's skin.

[0038] The touch-sensitive copper wire 4 recognizes whether the user's skin touches the glass head by electromagnetic induction.

[0039] A semiconductor cooling sheet 7 is arranged in the heat dissipation module bracket 2 , a main control device is arranged between one side of the semiconductor cooling sheet 7 and the glass head 3 , and a heat absorption component is installed on the other side of the semiconductor cooling sheet 7 .

[0040] Among them, the main control device is used to be installed with an external power supply and an external control connector of the device.

[0041] The heat absorption component includes: a heat dissipation module 8, and a heat dissipation module 8 is also installed on the heat dissipation module bracket 2 on the other side of the semiconductor refrigeration plate 7;

[0042] The heat dissipation module 8 includes: a heat sink 81, a heat dissipation duct 82 and a heat dissipation fan 83. The heat sink 81 is installed in the heat dissipation duct 82, and the heat dissipation fan 83 is fixedly installed on the heat dissipation duct 82 on the back of the heat sink 81.

[0043] The heat dissipation module bracket 2 is evenly provided with air holes, and the hot air drawn by the heat dissipation fan 83 is discharged through the air holes.

[0044] Among them, the heat dissipation module bracket 2 serves as the bearing bracket of the entire equipment. When in use, it adopts high-strength and high-temperature resistant material, and corresponding holes are also provided on the heat dissipation module bracket 2 for replacing the internal air to facilitate its cooling effect.

[0045] The heat dissipation module 8 is fixed on the heat dissipation module bracket 2 via a heat dissipation module locking frame 9 .

[0046] A decorative fixing ring 1 is fixedly clamped on the periphery of one end of the heat dissipation module bracket 2 .

[0047] Among them, when in use, the decorative fixing ring 1 is used for decoration and at the same time strengthens the installation of one end of the heat dissipation module bracket for more stability.

[0048] The main control device comprises: a PCB assembly 6, the back side of the PCB assembly 6 is in contact with a semiconductor cooling sheet 7, and a heat-conducting silica gel 5 is arranged on the front side of the PCB assembly 6;

[0049] The front side of the thermal conductive silicone 5 contacts the glass head 3 , and the back side contacts the PCB assembly 6 .

[0050] Among them, when in use, the setting of the thermal conductive silicone 5 can make the heat absorbed evenly transferred to the glass head 3, and the PCB component can be effectively cooled under the effect of uniform heat absorption, and a corresponding LED light board is set on the side of the PCB component corresponding to the glass head 3.

[0051] Working principle: The device is started and shut down by the host 10, and during operation, the semiconductor refrigeration plate 7 is used to effectively cool down the working state. At the same time, the heat dissipation module 8 is used to effectively cool down the heating side of the semiconductor refrigeration plate 7, and the cooling side is cooled by absorbing heat. At the same time, the user's skin is effectively cooled by the heat absorption and cooling effect.

[0052] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present disclosure (including the claims) is limited to these examples. Under the concept of the present invention, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity.

[0053] The embodiments of the present invention are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A beauty instrument with a cold compress effect, comprising a main unit (10), wherein one end of the main unit (10) is inclined at 30 degrees to mount a heat dissipation module bracket (2), characterized in that: A glass head (3) is arranged at the top of the inner wall of the heat dissipation module support (2); the glass head (3) is in an annular structure, and the glass head (3) is sealed and installed with the heat dissipation module support (2); a touch-sensitive copper wire (4) is fixedly installed at the heat dissipation module support (2) on one side of the glass head (3); the touch-sensitive copper wire (4) is used to sense whether the glass head (3) is in contact with the user's skin; A semiconductor cooling sheet (7) is arranged in the heat dissipation module bracket (2), a main control device is arranged between one side of the semiconductor cooling sheet (7) and the glass head (3), and a heat absorption component is installed on the other side of the semiconductor cooling sheet (7).

2. A beauty instrument with cold compress effect according to claim 1, characterized in that: The heat absorption component comprises: A heat dissipation module (8) is also installed on the heat dissipation module bracket (2) on the other side of the semiconductor refrigeration plate (7).

3. A beauty instrument with cold compress effect according to claim 2, characterized in that: The heat dissipation module (8) is fixed on the heat dissipation module bracket (2) via a heat dissipation module locking frame (9).

4. The beauty instrument with cold compress effect according to claim 1, characterized in that: A decorative fixing ring (1) is fixedly clamped on the periphery of one end of the heat dissipation module bracket (2).

5. The beauty instrument with cold compress effect according to claim 1, characterized in that: The main control device comprises: A PCB component (6), wherein the back side of the PCB component (6) is in contact with the semiconductor cooling sheet (7), and a heat-conducting silica gel (5) is arranged on the front side of the PCB component (6); The front side of the thermal conductive silica gel (5) is in contact with the glass head (3), and the back side is in contact with the PCB assembly (6).

6. The beauty instrument with cold compress effect according to claim 3, characterized in that: The heat dissipation module (8) comprises: A heat sink (81), a heat dissipation duct (82) and a heat dissipation fan (83), wherein the heat sink (81) is installed in the heat dissipation duct (82), and the heat dissipation fan (83) is fixedly installed on the heat dissipation duct (82) on the back side of the heat sink (81).

7. A beauty instrument with cold compress effect according to claim 6, characterized in that: Air holes are evenly arranged on the outside of the heat dissipation module bracket (2), and the hot air extracted by the heat dissipation fan (83) is discharged through the air holes.

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