Wafer processing cutting device capable of removing dust

Abstract

The utility model discloses a dedusting cutting device for wafer processing, and relates to the field of wafer processing, both sides of the top end of a processing box are fixedly connected with longitudinal electric slide rail groups, the top ends of the longitudinal electric slide rail groups are connected with transverse electric slide rail groups in a sliding manner, and one end of each transverse electric slide rail group is connected with a pneumatic telescopic rod in a sliding manner. According to the cutting device capable of removing dust for wafer processing, during cutting, due to the fact that the output end of a pneumatic telescopic rod moves downwards, a connecting plate and a connecting rod can be driven to move downwards, meanwhile, the connecting rod pushes a movable block downwards, and meanwhile, the connecting rod is in sliding connection with the movable block, so that when the connecting plate and the connecting rod move towards one end, the movable block is pushed downwards; the connecting rod can slide above the movable block, so that the movable block is pressed downwards, gas in the fixed rod is extruded out and discharged through the gas spraying pipe, and the gas spraying pipe can spray gas to the wafer which is being cut above the workbench for dust removal.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer processing cutting device capable of removing dust. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. Its raw material is silicon. The finished product produced after the wafer is ground, polished and sliced ​​is called a wafer. During the wafer processing process, a cutting device is required to cut the wafer to better ensure the subsequent processing operations of the wafer.

[0003] In the prior art, a Chinese patent with authorization announcement number CN216299745U discloses a large-sheet cutting device for wafer processing, comprising a base, a support seat is symmetrically installed on the top of the base, a lifting groove is arranged on the inner side of the support seat on the left side, a transverse support column is installed on the lifting groove through a sliding member, a sliding block is movably installed on the bottom of the transverse support column, a linear motor is arranged between the sliding block and the transverse support column, a laser locator and a cutting machine are installed at the bottom of the sliding block, a support plate is arranged on the support seat on the right side, a cutting groove is arranged on the support plate, a cutting seat is arranged between the support seats, a cutting platform is installed on the top of the cutting seat, a support leg is arranged at the bottom of the base, a buffer member is installed on the support leg, the structure is simple, the design is reasonable, the wafer can be conveniently positioned and stabilized, the wafer cutting is convenient, and the quality of the wafer cutting is guaranteed.

[0004] The above-mentioned mechanism achieves cool cutting by utilizing a laser locator, a cutting machine and spraying water on the cutting part. However, in actual use, a large amount of debris is generated when the wafer is cut. When only cool cutting is achieved, the debris in this part cannot be cleaned stably, resulting in a large amount of debris remaining on the workbench, affecting the subsequent cutting of other wafers and causing a decrease in work efficiency. Utility Model Content

[0005] The utility model aims to provide a wafer processing cutting device capable of removing dust, so as to solve the problem in the above-mentioned background technology that a lot of debris will remain on the workbench, and excessive debris will cause the subsequent cutting efficiency to decrease.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer processing cutting device capable of dust removal, both sides of the top of the processing box are fixedly connected with longitudinal electric slide rail groups, the top of the longitudinal electric slide rail group is slidably connected with a transverse electric slide rail group, and one end of the transverse electric slide rail group is slidably connected with a pneumatic telescopic rod, the output end of the pneumatic telescopic rod is fixedly connected with a mounting box, and a driving motor is fixedly connected at the middle position of the lower end of one side of the mounting box, the output end of the driving motor extends to the inside of the mounting box and is fixedly connected with a cutting knife, the bottom end of the inside of the processing box is fixedly connected with a workbench, and a screen is fixedly connected below the workbench;

[0007] A collection box is fixedly connected below the workbench, and dust removal mechanisms are fixedly connected to the upper ends of both sides of the processing box. The dust removal mechanisms are used to clean up the debris generated by the cutting knife during cutting to prevent excessive debris from affecting subsequent cutting processing;

[0008] Fixed frames are arranged on both sides of the top of the collection box, and a clamping mechanism is arranged on the inner side of the fixed frame. The clamping mechanism is used to clamp the wafer to facilitate cutting and avoid positional deviation during cutting.

[0009] Furthermore, the dust removal mechanism includes a fixed rod, and the fixed rod is fixedly connected to the upper ends of both sides of the interior of the processing box, the interior of the fixed rod is slidably connected to a movable block, and the top of the movable block is slidably connected to a connecting rod, one side of the connecting rod is fixedly connected to a connecting plate, and the connecting plate is sleeved on the outside of the output end of the pneumatic telescopic rod, and an air jet pipe is fixedly connected to the middle position of one side of the fixed rod.

[0010] Furthermore, the air jet pipes are arranged above both sides of the workbench, and the air jet pipes are distributed at equal intervals on one side of the fixing rod.

[0011] Furthermore, a second one-way valve is fixedly connected to the middle position of one side of the top end of the fixed rod, and the bottom end of the second one-way valve extends to the inside of the fixed rod. A first one-way valve is fixedly connected to one side of the jet pipe, and the first one-way valve extends to the inside of the fixed rod.

[0012] Furthermore, the clamping mechanism includes a support plate, and the support plate is slidably connected to the inner side of the fixed frame, both ends of the bottom end of the support plate are fixedly connected with buffer springs, and an airbag is arranged under the support plate on one side of the buffer spring, both ends of the top end of the fixed frame are fixedly connected with air storage pipes, and the inside of the air storage pipe is slidably connected with a piston rod, the bottom end of the piston rod is fixedly connected with a clamping plate, and the clamping plate and the fixed frame are slidably connected, one side of the air storage pipe is fixedly connected with a hose, and one side of the hose is connected to the airbag.

[0013] Furthermore, the cross section of the fixing frame is in an inverted "L" shape, and the fixing frame is symmetrical about the central axis of the processing box in the vertical direction.

[0014] Furthermore, the top end of the buffer spring is connected to the support plate, and the bottom end of the buffer spring is connected to the top end of the collection box.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] 1. Place the wafer on the top of the workbench, and use the clamping mechanism to clamp and fix the wafer. The position of the pneumatic telescopic rod can be controlled by the mutual cooperation of the longitudinal electric slide rail group and the transverse electric slide rail group, so as to adjust the position of the cutting knife according to different cutting requirements. Use the pneumatic telescopic rod to move the cutting knife downward until it moves to the height required for cutting, and at the same time, the output end of the driving motor drives the cutting knife to rotate, so as to realize the cutting of the wafer. During the cutting, due to the downward movement of the output end of the pneumatic telescopic rod, the connecting plate and the connecting rod will be driven to move downward, and the connecting rod will push the movable block downward. At the same time, the connecting rod and the movable block are slidably connected, so that when the connecting plate and the connecting rod move to one end, the connecting rod can slide above the movable block, so as to realize pressing the movable block downward, so that the gas inside the fixed rod is squeezed out and discharged through the air jet pipe, so that the air jet pipe can perform air jet dust removal on the wafer being cut above the workbench, and the impurities blown away will fall through the screen into the inside of the collection box for collection, so as to avoid the splashing of debris and inconvenience in cleaning;

[0017] Furthermore, the second one-way valve can be opened when the movable block moves upward to inflate the interior of the fixed rod, so as to facilitate the next dust blowing operation. At the same time, the one-way air intake can effectively prevent impurities from entering the interior of the fixed rod. At the same time, the first one-way valve can also effectively prevent impurities from entering the interior of the fixed rod through the air injection pipe, and also prevent the problem of impurities blocking the air injection pipe due to reverse air intake.

[0018] Furthermore, the workbench can make the lower end of the wafer contact with it and support the wafer, so that the wafer can be supported during the clamping process, effectively avoiding the splashing of debris due to suspension during the cutting process, thereby facilitating dust removal;

[0019] 2. Place the wafers on the support plate, and use the weight of multiple wafers to press the support plate downward, so that the buffer spring under the support plate is stressed and shortened, and at the same time, the gas inside the airbag is squeezed out through the hose and transported to the inside of the gas storage tube, and at the same time, the piston rod inside the gas storage tube is pushed and pushes the clamping plate downward, so that the wafers can be clamped and fixed by the support plate and the clamping plate, avoiding the positional deviation of the wafers during the processing, making it easier to cut the wafers;

[0020] Furthermore, the cooperation between the support plate and the clamping plate can effectively clamp and fix the wafer, and the distance between the support plate and the clamping plate can also be used to clamp and fix multiple wafers, thereby increasing the overall work efficiency during cutting, and the elastic force of the buffer spring can stably drive the support plate and the clamping plate to reset their positions, facilitating subsequent clamping operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model from a side view;

[0022] Figure 2 This is a schematic diagram of the three-dimensional structure of the utility model;

[0023] Figure 3 This is a schematic diagram of the front view and cross-section of the three-dimensional structure of the utility model;

[0024] Figure 4 This is a schematic diagram of the side-view stereoscopic cross-sectional structure of the utility model;

[0025] Figure 5 It is a partial enlarged structural schematic diagram of the dust removal mechanism of the utility model;

[0026] Figure 6 It is a partial enlarged structural schematic diagram of the clamping mechanism of the utility model.

[0027] In the figure: 1. processing box; 2. longitudinal electric slide rail group; 3. transverse electric slide rail group; 4. pneumatic telescopic rod; 5. installation box; 6. cutting knife; 7. driving motor; 8. workbench; 9. collecting box; 10. connecting plate; 11. connecting rod; 12. movable block; 13. fixing rod; 14. jet pipe; 15. first one-way valve; 16. second one-way valve; 17. fixing frame; 18. supporting plate; 19. buffer spring; 20. air bag; 21. clamping plate; 22. hose; 23. air storage pipe; 24. piston rod; 25. screen. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] Embodiment 1:

[0030] like Figure 1-Figure 5 The technical solution shown is to solve the problem of too many impurities remaining on the surface of the workbench 8: the dust-removable wafer processing cutting device discloses a dust removal mechanism, both sides of the top of the processing box 1 are fixedly connected with a longitudinal electric slide rail group 2, the top of the longitudinal electric slide rail group 2 is slidably connected with a transverse electric slide rail group 3, and one end of the transverse electric slide rail group 3 is slidably connected with a pneumatic telescopic rod 4, the output end of the pneumatic telescopic rod 4 is fixedly connected with a mounting box 5, and a driving motor 7 is fixedly connected at the middle position of the lower end of one side of the mounting box 5, the output end of the driving motor 7 extends to the inside of the mounting box 5 and is fixedly connected with a cutting knife 6, the bottom end of the inside of the processing box 1 is fixedly connected with the workbench 8, and a screen 25 is fixedly connected below the workbench 8;

[0031] A collecting box 9 is fixedly connected to the bottom of the workbench 8, and dust removal mechanisms are fixedly connected to the upper ends of both sides of the processing box 1. The dust removal mechanisms are used to clean up the debris generated by the cutting knife 6 during cutting to avoid excessive debris affecting subsequent cutting processing;

[0032] A fixing frame 17 is provided on both sides of the top of the collecting box 9, and a clamping mechanism is provided on the inner side of the fixing frame 17. The clamping mechanism is used to clamp the wafer to facilitate cutting and avoid positional deviation during cutting.

[0033] The dust removal mechanism includes a fixed rod 13, and the fixed rod 13 is fixedly connected to the upper ends of both sides inside the processing box 1, the fixed rod 13 is slidably connected to the inside of the fixed rod 13, and the top of the movable block 12 is slidably connected to the connecting rod 11, one side of the connecting rod 11 is fixedly connected to a connecting plate 10, and the connecting plate 10 is sleeved on the outside of the output end of the pneumatic telescopic rod 4, and an air jet pipe 14 is fixedly connected to the middle position of one side of the fixed rod 13.

[0034] The air injection pipes 14 are disposed above both sides of the workbench 8 , and the air injection pipes 14 are evenly spaced and distributed on one side of the fixing rod 13 .

[0035] In this example, a wafer is placed on top of a workbench 8, and a clamping mechanism is used to clamp and fix the wafer. The position of the pneumatic telescopic rod 4 can be controlled by the cooperation between the longitudinal electric slide rail group 2 and the transverse electric slide rail group 3, so that the position of the cutting knife 6 can be adjusted according to different cutting requirements. The cutting knife 6 is moved downward by the pneumatic telescopic rod 4 until it reaches the height required for cutting. At the same time, the output end of the driving motor 7 drives the cutting knife 6 to rotate, thereby realizing the cutting of the wafer. During the cutting process, the downward movement of the output end of the pneumatic telescopic rod 4 drives the connecting plate 10 and the connecting rod 11 downward. The connecting rod 11 moves, and at the same time, the movable block 12 is pushed downward by the connecting rod 11. At the same time, the connecting rod 11 and the movable block 12 are slidably connected, so that when the connecting plate 10 and the connecting rod 11 move to one end, the connecting rod 11 can slide above the movable block 12, thereby pressing the movable block 12 downward, so that the gas inside the fixed rod 13 is squeezed out and discharged through the jet pipe 14, so that the jet pipe 14 can perform jet dust removal on the wafer being cut above the workbench 8, and the impurities blown away will fall through the screen 25 into the collection box 9 for collection, so as to avoid splashing of debris and inconvenience in cleaning.

[0036] Embodiment 2:

[0037] like Figure 1-Figure 5 The technical solution shown is to solve the problem of impurities entering the interior due to the long-term air jet intake of the fixed rod 13 during the dust removal process: the cutting device for wafer processing with dust removal discloses a one-way air intake mechanism, a second one-way valve 16 is fixedly connected to the middle position of the top side of the fixed rod 13, and the bottom end of the second one-way valve 16 extends to the interior of the fixed rod 13, and a first one-way valve 15 is fixedly connected to one side of the air jet pipe 14, and the first one-way valve 15 extends to the interior of the fixed rod 13.

[0038] In this example, the second one-way valve 16 can be opened when the movable block 12 moves upward and inflate the interior of the fixed rod 13, which is convenient for the next dust blowing operation. At the same time, the one-way air intake can effectively prevent impurities from entering the interior of the fixed rod 13. At the same time, the first one-way valve 15 can also effectively prevent impurities from entering the interior of the fixed rod 13 through the air jet pipe 14, and also prevent impurities from clogging the air jet pipe 14 due to reverse air intake.

[0039] Embodiment three:

[0040] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 6The technical solution shown is to solve the problem of position displacement of the wafer during cutting: the dust-removable wafer processing cutting device discloses a clamping mechanism, which includes a support plate 18, and the support plate 18 is slidably connected to the inner side of the fixed frame 17, and the two ends of the bottom end of the support plate 18 are fixedly connected with buffer springs 19, and an airbag 20 is arranged under the support plate 18 on one side of the buffer spring 19, and the two ends of the top end of the fixed frame 17 are fixedly connected with an air storage pipe 23, and the inside of the air storage pipe 23 is slidably connected with a piston rod 24, the bottom end of the piston rod 24 is fixedly connected with a clamping plate 21, and the clamping plate 21 and the fixed frame 17 are slidably connected, one side of the air storage pipe 23 is fixedly connected with a hose 22, and one side of the hose 22 is connected to the airbag 20.

[0041] The cross section of the fixing frame 17 is in an inverted “L” shape, and the fixing frame 17 is symmetrical about the central axis of the processing box 1 in the vertical direction.

[0042] The top end of the buffer spring 19 is connected to the support plate 18 , and the bottom end of the buffer spring 19 is connected to the top end of the collection box 9 .

[0043] In this example, the wafer is placed on the support plate 18, and the support plate 18 is pressed downward by the weight of multiple wafers, so that the buffer spring 19 under the support plate 18 is stressed and shortened, and at the same time, the gas inside the airbag 20 is squeezed out through the hose 22 and transported to the inside of the gas storage tube 23, and at the same time, the piston rod 24 inside the gas storage tube 23 is pushed and pushes the clamping plate 21 downward, so that the wafer can be clamped and fixed by the support plate 18 and the clamping plate 21 to avoid the position deviation of the wafer during the processing. At the same time, when the wafer is taken out, the weight pressure on the buffer spring 19 disappears, so that the support plate 18 is reset, thereby driving the airbag 20 to return to its initial state. At the same time, the clamping plate 21 is also pushed upward by the support plate 18 from the pressed state, so that the piston rod 24 can push the gas storage tube 23 upward, so that the gas inside the gas storage tube 23 is squeezed and transported back to the inside of the airbag 20 through the hose 22, so that the inside of the airbag 20 is restored to the inflated state, which is convenient for the subsequent clamping operation.

[0044] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A dust-removable wafer processing cutting device, wherein both sides of the top of a processing box (1) are fixedly connected with a longitudinal electric slide rail group (2), the top of the longitudinal electric slide rail group (2) is slidably connected with a transverse electric slide rail group (3), and one end of the transverse electric slide rail group (3) is slidably connected with a pneumatic telescopic rod (4), the output end of the pneumatic telescopic rod (4) is fixedly connected with a mounting box (5), and a driving motor (7) is fixedly connected at the middle position of the lower end of one side of the mounting box (5), the output end of the driving motor (7) extends to the inside of the mounting box (5) and is fixedly connected with a cutting knife (6), the bottom end of the inside of the processing box (1) is fixedly connected with a workbench (8), and a screen (25) is fixedly connected below the workbench (8); Features: A collecting box (9) is fixedly connected below the workbench (8), and dust removal mechanisms are fixedly connected to the upper ends of both sides of the processing box (1), and the dust removal mechanisms are used to clean up the debris generated by the cutting knife (6) during cutting, so as to avoid excessive debris affecting subsequent cutting processing; Both sides of the top of the collection box (9) are provided with fixing frames (17), and a clamping mechanism is provided inside the fixing frames (17), and the clamping mechanism is used to clamp the wafer to facilitate cutting and avoid positional deviation during cutting.

2. A wafer processing cutting device capable of removing dust according to claim 1, characterized in that: The dust removal mechanism comprises a fixed rod (13), and the fixed rod (13) is fixedly connected to the upper ends of both sides inside the processing box (1), the fixed rod (13) is slidably connected to a movable block (12) inside, and the top of the movable block (12) is slidably connected to a connecting rod (11), one side of the connecting rod (11) is fixedly connected to a connecting plate (10), and the connecting plate (10) is sleeved on the outside of the output end of the pneumatic telescopic rod (4), and an air injection pipe (14) is fixedly connected to the middle position of one side of the fixed rod (13).

3. The wafer processing cutting device capable of removing dust according to claim 2, characterized in that: The air injection pipes (14) are arranged above both sides of the workbench (8), and the air injection pipes (14) are evenly spaced and distributed on one side of the fixing rod (13).

4. The wafer processing cutting device capable of removing dust according to claim 3, characterized in that: A second one-way valve (16) is fixedly connected to a middle position on one side of the top end of the fixed rod (13), and the bottom end of the second one-way valve (16) extends to the inside of the fixed rod (13); a first one-way valve (15) is fixedly connected to one side of the jet pipe (14), and the first one-way valve (15) extends to the inside of the fixed rod (13).

5. The wafer processing cutting device capable of removing dust according to claim 4, characterized in that: The clamping mechanism comprises a support plate (18), and the support plate (18) is slidably connected to the inner side of the fixing frame (17), the two ends of the bottom end of the support plate (18) are fixedly connected with a buffer spring (19), and an air bag (20) is arranged below the support plate (18) on one side of the buffer spring (19), the two ends of the top end of the inside of the fixing frame (17) are fixedly connected with an air storage pipe (23), and the inside of the air storage pipe (23) is slidably connected with a piston rod (24), the bottom end of the piston rod (24) is fixedly connected with a clamping plate (21), and the clamping plate (21) and the fixing frame (17) are slidably connected, one side of the air storage pipe (23) is fixedly connected with a hose (22), and one side of the hose (22) is connected to the air bag (20).

6. The wafer processing cutting device capable of removing dust according to claim 5, characterized in that: The cross section of the fixing frame (17) is in an inverted "L" shape, and the fixing frame (17) is symmetrical about the central axis of the processing box (1) in the vertical direction.

7. The wafer processing cutting device capable of removing dust according to claim 6, characterized in that: The top end of the buffer spring (19) is connected to the support plate (18), and the bottom end of the buffer spring (19) is connected to the top end of the collection box (9).

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