Stacked tag integrating radio frequency and detection

Abstract

The utility model relates to a stacked tag integrating radio frequency and detection. The stacked tag comprises a bearing substrate, a radio frequency chip, a main wire, a first detection wire, a second detection wire and a third detection wire, wherein the radio frequency chip and the main wire are arranged on the same surface of the bearing substrate, one end of the main wire is in butt joint with a high-frequency radio frequency transmitting end of the radio frequency chip, the other end of the main wire is in butt joint with a high-frequency radio frequency receiving end of the radio frequency chip, and a high-frequency radiation antenna in butt joint with the radio frequency chip is formed by the main wire arranged in a closed loop mode.

Description

Technical Field

[0001] The utility model relates to a stacking label integrating radio frequency and detection, belonging to the technical field of radio frequency labels. Background Art

[0002] Ultra-high frequency RFID (Radio Frequency Identification) technology is an automatic identification technology that allows items with RFID tags to be identified and tracked through radio waves. High-frequency RFID tags are widely used in transportation, access control, asset management and other fields due to their advantages such as non-contact, security and low cost.

[0003] High-frequency chips usually have encryption algorithms and a certain amount of memory. They can be used with corresponding high-frequency antennas to achieve short-distance information security interaction with reading and writing devices (such as mobile phones with NFC functions). Some special high-frequency chips have detection ports, and there is a continuous wire between the detection ports. When the wire is disconnected, the data inside the chip changes, so that it can be identified whether the product is damaged.

[0004] The detection line of the prior art is a section of wire outside the high-frequency tag. Therefore, the size of the existing high-frequency tag with a detection line is much larger than that of an ordinary high-frequency tag, and it is difficult to apply it to some usage scenarios with size restrictions, which limits the usage scenarios of this type of high-frequency tag. Utility Model Content

[0005] The technical problem to be solved by the utility model is to provide a stacked label integrating radio frequency and detection, integrating the detection structure and the label structure, realizing the detection of the breakage of the detection line, and effectively ensuring the continuity of the high-frequency label operation.

[0006] In order to solve the above technical problems, the utility model adopts the following technical solutions: the utility model designs a stacked tag integrating radio frequency and detection, including a carrier substrate, a radio frequency chip, a main trace, a first detection trace, a second detection trace, and a third detection trace; wherein the radio frequency chip and the main trace are arranged on the same surface of the carrier substrate, one end of the main trace is connected to the high-frequency radio frequency transmitting end of the radio frequency chip, and the other end of the main trace is connected to the high-frequency radio frequency receiving end of the radio frequency chip, and the main trace arranged in a closed loop constitutes a high-frequency radiation antenna connected to the radio frequency chip;

[0007] The first detection trace and the third detection trace are arranged on the surface of the carrier substrate where the RF chip is arranged, the second detection trace is arranged on the other surface of the carrier substrate facing away from the surface where the RF chip is arranged, one end of the first detection trace is connected to one detection end of the RF chip, the other end of the first detection trace is connected to the same side end of the first conductive detection component that runs through both sides of the carrier substrate, the two ends of the second detection trace are respectively connected to the same side end of the first conductive detection component and the same side end of the second conductive detection component that runs through both sides of the carrier substrate, one end of the third detection trace is connected to the same side end of the second conductive detection component, the other end of the third detection trace is connected to the other detection end of the RF chip, and the first detection trace and the third detection trace are not in contact with the main trace;

[0008] Along the projection direction perpendicular to the surface of the carrier substrate, the projection of the second detection trace is located within the overall projection of the RF chip, the main trace, the first detection trace, and the third detection trace.

[0009] As an optimal technical solution of the utility model: it also includes a high-frequency bridge and a secondary routing, the high-frequency bridge is arranged on the surface of the carrier substrate where the second detection routing is arranged, and the two ends of the high-frequency bridge are respectively connected to the same side end of the first high-frequency component and the same side end of the second high-frequency component that penetrates the two sides of the carrier substrate; one end of the main routing is connected to the high-frequency RF transmitting end of the RF chip, and the other end of the main routing is connected to the same side end of the first high-frequency component, the secondary routing is arranged on the surface of the carrier substrate where the main routing is arranged, and one end of the secondary routing is connected to the same side end of the second high-frequency component, and the secondary routing The other end is connected to the high-frequency RF receiving end of the RF chip, and the high-frequency radiation antenna connected to the RF chip is composed of a main route, a high-frequency bridge, and a secondary route arranged in a closed loop in series. In the projection direction perpendicular to the surface of the carrier substrate, there is a main route projection section or a secondary route projection section that intersects with the projection of the high-frequency bridge, and the first detection route and the third detection route do not contact the secondary route; along the projection direction perpendicular to the surface of the carrier substrate, the projection of the high-frequency bridge is located within the overall projection of the RF chip, the main route, the secondary route, the first detection route, and the third detection route.

[0010] As a preferred technical solution of the utility model: it also includes a protective film, and the protective film is covered on the high-frequency bridge.

[0011] As a preferred technical solution of the utility model: it also includes an insulating member in a straight line shape, wherein both ends of the insulating member are arranged on the surface where the RF chip is arranged on the carrier substrate, the main routing line passes through the bottom between the two ends of the insulating member and is arranged on the surface where the RF chip is arranged on the carrier substrate, and the main routing line is arranged from one end to the other end of the upper surface of the insulating member, and at the position where the insulating member is arranged, the main routing line is arranged to achieve spatial intersection.

[0012] As a preferred technical solution of the present utility model: the radio frequency chip, the first detection trace, and the third detection trace are located in the minimum enclosing area corresponding to the high-frequency radiation antenna.

[0013] As a preferred technical solution of the utility model: the shape and size of the minimum enclosed area corresponding to the high-frequency radiation antenna is adapted to the shape and size of the surface of the supporting substrate.

[0014] The stacking tag integrating radio frequency and detection described in the utility model adopts the above technical solution and has the following technical effects compared with the prior art:

[0015] The utility model designs a stacked label integrating radio frequency and detection, with the radio frequency label structure and the detection wiring structure respectively mounted on the two sides of the carrier substrate, and constructing an overlapping relationship between each other along the direction perpendicular to the surface of the carrier substrate, effectively reducing the volume of the overall design and reducing the manufacturing cost, and further through the bridge structure, the radio frequency label structure and the detection wiring structure are designed to span the two sides of the carrier substrate respectively, thereby improving the efficiency of wiring layout. In actual applications, the overall designed stacked label can efficiently realize the detection function of the detection line break while retaining the high-frequency label performance, thereby effectively improving the actual work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the second detection wiring on the carrier substrate in the stacked label integrating radio frequency and detection of the utility model;

[0017] Figure 2 This is a schematic diagram of the main wiring arrangement on the carrier substrate in the stacked tag integrating radio frequency and detection of the utility model;

[0018] Figure 3 It is a side view schematic diagram of the stacked tag integrating radio frequency and detection of the utility model;

[0019] Figure 4 It is an overall schematic diagram of a stacked tag integrating radio frequency and detection designed by the utility model.

[0020] Among them, 1. carrier substrate, 2. RF chip, 3. main trace, 4. first detection trace, 5. second detection trace, 6. third detection trace, 7. first conductive detection component, 8. second conductive detection component, 9. high-frequency bridge, 10. secondary trace, 11. first high-frequency component, 12. second high-frequency component, 13. protective film. DETAILED DESCRIPTION

[0021] The specific implementation of the utility model is further described in detail below in conjunction with the accompanying drawings.

[0022] The utility model is designed to design a stacking tag that integrates radio frequency and detection. In practical applications, such as Figures 1 to 4 As shown, the specific design includes a carrier substrate 1, an RF chip 2, a main trace 3, a first detection trace 4, a second detection trace 5, and a third detection trace 6; wherein the RF chip 2 and the main trace 3 are arranged on the same surface of the carrier substrate 1, one end of the main trace 3 is connected to the high-frequency RF transmitting end of the RF chip 2, and the other end of the main trace 3 is connected to the high-frequency RF receiving end of the RF chip 2, and the main trace 3 arranged in a closed loop constitutes a high-frequency radiation antenna connected to the RF chip 2.

[0023] The first detection trace 4 and the third detection trace 6 are arranged on the surface of the carrier substrate 1 where the RF chip 2 is arranged, and the second detection trace 5 is arranged on the other surface of the carrier substrate 1 facing away from the surface where the RF chip 2 is arranged. One end of the first detection trace 4 is connected to one detection end of the RF chip 2, and the other end of the first detection trace 4 is connected to the same side end of the first conductive detection component 7 that runs through both sides of the carrier substrate 1. The two ends of the second detection trace 5 are respectively connected to the same side end of the first conductive detection component 7 and the same side end of the second conductive detection component 8 that runs through both sides of the carrier substrate 1. One end of the third detection trace 6 is connected to the same side end of the second conductive detection component 8, and the other end of the third detection trace 6 is connected to the other detection end of the RF chip 2. The first detection trace 4 and the third detection trace 6 are not in contact with the main trace 3.

[0024] Along the projection direction perpendicular to the surface of the carrier substrate 1 , the projection of the second detection trace 5 is located within the overall projection of the RF chip 2 , the main trace 3 , the first detection trace 4 , and the third detection trace 6 .

[0025] The above-mentioned stacked tag that integrates radio frequency and detection is designed. In order to improve the efficiency of routing under the radio frequency tag, regarding the possible spatial intersection in the routing structure, two embodiment structures are designed in actual application, such as Figures 1 to 4As shown, the structure of embodiment 1 is further designed to add a high-frequency bridge 9 and a secondary routing line 10. The high-frequency bridge 9 is arranged on the surface of the carrier substrate 1 where the second detection routing line 5 is arranged, and the two ends of the high-frequency bridge 9 are respectively connected to the same side end of the first high-frequency component 11 and the same side end of the second high-frequency component 12 that penetrate through the two sides of the carrier substrate 1; one end of the main routing line 3 is connected to the high-frequency RF transmitting end of the RF chip 2, and the other end of the main routing line 3 is connected to the same side end of the first high-frequency component 11. The secondary routing line 10 is arranged on the surface of the carrier substrate 1 where the main routing line 3 is arranged, and one end of the secondary routing line 10 is connected to the same side end of the second high-frequency component 12. The secondary routing line 10 The other end is connected to the high-frequency RF receiving end of the RF chip 2, and the high-frequency radiation antenna connected to the RF chip 2 is composed of a main routing line 3, a high-frequency bridge 9, and a secondary routing line 10 arranged in a closed loop in series, and along the projection direction perpendicular to the surface of the carrier substrate 1, there is a projection section of the main routing line 3 or a projection section of the secondary routing line 10 that intersects with the projection of the high-frequency bridge 9, and the first detection routing line 4 and the third detection routing line 6 are not in contact with the secondary routing line 10; along the projection direction perpendicular to the surface of the carrier substrate 1, the projection of the high-frequency bridge 9 is located within the overall projection of the RF chip 2, the main routing line 3, the secondary routing 10, the first detection routing line 4, and the third detection routing line 6.

[0026] In order to cooperate with the design of penetrating the carrier substrate 1 under the above-mentioned radio frequency tag structure, in actual application, a protective film 13 is further designed to be added. The protective film 13 is covered on the high-frequency bridge 9. The design of the protective film 13 is that all structures on the surface of the carrier substrate 1 are fragile. In order to protect the high-frequency bridge 9 on the surface of the carrier substrate 1, a non-fragile protective film 13 is covered on the high-frequency bridge 9. When the surface of the high-frequency bridge 9 on the carrier substrate 1 is attached to an object and then torn off, the second detection trace 5 on the surface of the high-frequency bridge 9 on the carrier substrate 1 will be damaged, and the high-frequency bridge 9 will be damaged due to the protective film. The existence of 13 is not affected, that is, the function of detecting the breakage of the detection line is realized, and the original performance of the high-frequency label is retained; and in practical applications, the adhesive force between the protective film 13 and the supporting substrate 1 is designed to be greater than the adhesive force between the protective film 13 and the attached object, so as to ensure that when the label designed by the utility model is torn off from the attached object, the high-frequency bridge 9 can be protected; and the adhesive force between the second detection wiring 5 and the supporting substrate 1 must be designed to be less than the adhesive force between the second detection wiring 5 and the attached object, so as to ensure that when the label is torn off, partial or complete peeling-type breakage will occur between the attached objects.

[0027] In addition, as for the first conductive detection component 7 , the second conductive detection component 8 , the first high-frequency component 11 , and the second high-frequency component 12 penetrating through the two surfaces of the carrier substrate 1 , each wiring is connected thereto respectively, and riveting can be used for connection.

[0028] Regarding the spatial intersection that may occur in the routing structure, the structural design of Example 2 also includes a straight-line insulating member, wherein both ends of the insulating member are arranged on the surface where the RF chip 2 is arranged on the carrier substrate 1, and the main routing line 3 passes below between the two ends of the insulating member and is arranged on the surface where the RF chip 2 is arranged on the carrier substrate 1, and the main routing line 3 is arranged from one end to the other end of the upper surface of the insulating member. At the position where the insulating member is arranged, the main routing line 3 is arranged to achieve a spatial intersection.

[0029] The stacked label integrating radio frequency and detection designed by the utility model is applied in practice, and the radio frequency chip 2, the first detection trace 4, and the third detection trace 6 are designed to be located within the minimum enclosing area corresponding to the high-frequency radiation antenna, and the shape and size of the minimum enclosing area corresponding to the high-frequency radiation antenna are further designed to be compatible with the shape and size of the surface of the carrier substrate 1. That is, the utility model design makes the radio frequency tag structure and the detection trace structure in the same space through reasonable layout, thereby minimizing the overall volume of the designed label and reducing the cost.

[0030] In actual applications, the carrier substrate 1 and the protective film 13 are designed to use insulators. The carrier substrate 1 is made of materials such as PET, paper, etc. The material of the protective film 13 is non-fragile and can be PET, PP, PI, etc. All small structures contained in the two-sided structures of the carrier substrate 1 are conductors, which can be metals such as copper and aluminum, or conductive inks.

[0031] The stacked label integrating radio frequency and detection designed by the above technical scheme is equipped with a radio frequency tag structure and a detection wiring structure on both sides of the supporting substrate 1, and constructs an overlapping relationship with each other in the direction perpendicular to the surface of the supporting substrate 1, which effectively reduces the volume of the overall design and reduces the manufacturing cost. Furthermore, through the bridge structure, the radio frequency tag structure and the detection wiring structure are designed to span the two sides of the supporting substrate 1 respectively, thereby improving the efficiency of wiring layout. In actual applications, the overall designed stacked label can efficiently realize the detection function of the detection line break while retaining the high-frequency tag performance, thereby effectively improving the actual work efficiency.

[0032] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in this field without departing from the purpose of the present invention.

Claims

1. A stacking tag integrating radio frequency and detection, characterized in that: The invention comprises a carrier substrate (1), a radio frequency chip (2), a main trace (3), a first detection trace (4), a second detection trace (5), and a third detection trace (6); wherein the radio frequency chip (2) and the main trace (3) are arranged on the same surface of the carrier substrate (1); one end of the main trace (3) is connected to a high-frequency radio frequency transmitting end of the radio frequency chip (2); and the other end of the main trace (3) is connected to a high-frequency radio frequency receiving end of the radio frequency chip (2); and the main trace (3) arranged in a closed loop constitutes a high-frequency radiation antenna connected to the radio frequency chip (2); The first detection trace (4) and the third detection trace (6) are arranged on the surface of the carrier substrate (1) on which the radio frequency chip (2) is arranged, and the second detection trace (5) is arranged on the other surface of the carrier substrate (1) which faces away from the surface on which the radio frequency chip (2) is arranged, one end of the first detection trace (4) is connected to one detection end of the radio frequency chip (2), the other end of the first detection trace (4) is connected to the same side end of a first conductive detection component (7) penetrating through two surfaces of the carrier substrate (1), two ends of the second detection trace (5) are respectively connected to the same side end of the first conductive detection component (7) and the same side end of a second conductive detection component (8) penetrating through two surfaces of the carrier substrate (1), one end of the third detection trace (6) is connected to the same side end of the second conductive detection component (8), and the other end of the third detection trace (6) is connected to the other detection end of the radio frequency chip (2), and the first detection trace (4) and the third detection trace (6) are not in contact with the main trace (3); Along a projection direction perpendicular to the surface of the carrier substrate (1), the projection of the second detection trace (5) is located within the overall projection of the radio frequency chip (2), the main trace (3), the first detection trace (4), and the third detection trace (6).

2. The stacking tag integrating radio frequency and detection according to claim 1, characterized in that: The invention also includes a high-frequency bridge (9) and a secondary routing (10). The high-frequency bridge (9) is arranged on the surface of the carrier substrate (1) where the second detection routing (5) is arranged, and the two ends of the high-frequency bridge (9) are respectively connected to the same side end of the first high-frequency component (11) and the same side end of the second high-frequency component (12) that penetrate through the two sides of the carrier substrate (1); one end of the main routing (3) is connected to the high-frequency RF transmitting end of the RF chip (2), and the other end of the main routing (3) is connected to the same side end of the first high-frequency component (11); the secondary routing (10) is arranged on the surface of the carrier substrate (1) where the main routing (3) is arranged, one end of the secondary routing (10) is connected to the same side end of the second high-frequency component (12), and the other end of the secondary routing (10) is connected to the high-frequency RF transmitting end of the RF chip (2). The high-frequency radio frequency receiving end of the radio frequency chip (2) is composed of a main line (3), a high-frequency bridge (9), and a secondary line (10) arranged in a closed loop and connected in series to form a high-frequency radiation antenna connected to the radio frequency chip (2); and along a projection direction perpendicular to the surface of the carrier substrate (1), there is a projection section of the main line (3) or a projection section of the secondary line (10) intersecting with the projection of the high-frequency bridge (9), and the first detection line (4) and the third detection line (6) are not in contact with the secondary line (10); along a projection direction perpendicular to the surface of the carrier substrate (1), the projection of the high-frequency bridge (9) is located within the overall projection of the radio frequency chip (2), the main line (3), the secondary line (10), the first detection line (4), and the third detection line (6).

3. The stacking tag integrating radio frequency and detection according to claim 2, characterized in that: It also includes a protective film (13), which is covered on the high-frequency bridge (9).

4. The stacking tag integrating radio frequency and detection according to claim 1, characterized in that: It also includes a straight-line insulating member, wherein the two ends of the insulating member are arranged on the surface of the carrier substrate (1) on which the radio frequency chip (2) is arranged, the main wiring (3) passes through the bottom between the two ends of the insulating member and is arranged on the surface of the carrier substrate (1) on which the radio frequency chip (2) is arranged, and the main wiring (3) is arranged from one end to the other end of the upper surface of the insulating member, and at the position where the insulating member is arranged, the arrangement of the main wiring (3) realizes spatial intersection.

5. A stacking tag integrating radio frequency and detection according to any one of claims 1 to 4, characterized in that: The radio frequency chip (2), the first detection trace (4), and the third detection trace (6) are located within the minimum enclosing area corresponding to the high-frequency radiation antenna.

6. The stacking tag integrating radio frequency and detection according to claim 5, characterized in that: The shape and size of the minimum enclosed area corresponding to the high-frequency radiation antenna are compatible with the shape and size of the surface of the supporting substrate (1).

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