Assembling and disassembling tool for wafer clamp

Abstract

The utility model provides an assembling and disassembling tool for a wafer clamp, and relates to the technical field of semiconductor testing. According to the utility model, the downward pressing mechanism is connected with the supporting mechanism, the downward pressing mechanism comprises the driving assembly and at least one crimping assembly, and when the driving assembly drives the corresponding crimping assembly to cancel the downward pressing acting force applied to the buckle assembly, the buckle assembly is clamped with the first sealing cover, so that the test plate assembly is connected with the first sealing cover. According to the technical scheme, the driving assembly drives the crimping assembly to cancel the downward pressing acting force applied to the buckle assembly of the wafer clamp, so that the buckle assembly is clamped with the first sealing cover, automatic connection of the wafer clamp is realized, the installation time is saved, and the wafer aging test efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor testing, in particular to a loading and unloading tool for a wafer clamp. Background Art

[0002] In the prior art, when performing an aging test on a wafer, it is necessary to loosen and tighten the screws in sequence to complete the loading and unloading of the wafer fixture. In this process, the screw threads are prone to dropping metal debris and slipping, which can easily damage the wafer. If the wafer fixture is loaded and unloaded by snapping and opening, the problems of debris and slipping can be avoided. However, this method also requires manual operation, which will result in a longer loading and unloading time for the wafer fixture, thereby affecting the efficiency of the wafer aging test. Utility Model Content

[0003] One purpose of the utility model is to provide a loading and unloading tool for a wafer clamp, so as to solve the technical problem in the prior art that the wafer clamp cannot be automatically loaded and unloaded, which affects the efficiency of aging testing.

[0004] A further object of the utility model is to prevent the wafer clamp from being damaged during the assembly and disassembly process.

[0005] In particular, the utility model provides a loading and unloading tool for a wafer fixture, wherein the wafer fixture comprises a test board assembly, a first sealing cover, and at least one buckle assembly for connecting the test board assembly and the first sealing cover, so the loading and unloading tool comprises:

[0006] A supporting mechanism, used for supporting the wafer fixture;

[0007] A pressing mechanism is connected to the supporting mechanism, and the pressing mechanism includes a driving assembly and at least one crimping assembly. When the driving assembly drives the corresponding crimping assembly to cancel the pressing force applied to the buckle assembly, the buckle assembly is engaged with the first sealing cover to connect the test board assembly to the first sealing cover.

[0008] Optionally, when the driving assembly drives the corresponding crimping assembly to move and press against the corresponding snap assembly and applies a downward pressure force to the snap assembly, the snap assembly is separated from the first sealing cover, so that the test board assembly is separated from the first sealing cover.

[0009] Optionally, the driving assembly comprises:

[0010] A first driving member connected to the crimping assembly, the first driving member being configured to controllably drive the crimping assembly to move and tighten against the corresponding buckle assembly;

[0011] The second driving member is connected to the crimping assembly, and the second driving member is configured to controllably drive the crimping assembly to apply a downward pressure force to the corresponding buckle assembly when the crimping assembly and the corresponding buckle assembly are movably pressed against each other.

[0012] Optionally, the driving assembly further includes:

[0013] The first mounting member is connected to the first driving member and the crimping assembly respectively, the second driving member is mounted on the first mounting member, and the first mounting member is configured to move vertically under the drive of the first driving member to drive the crimping assembly and the second driving member to move vertically.

[0014] Optionally, the driving assembly further includes:

[0015] The second mounting member is connected to the second driving member and the crimping assembly. The second mounting member is configured to move vertically under the drive of the second driving member to drive the crimping assembly to apply a downward pressure force to the buckle assembly.

[0016] Optionally, the buckle assembly includes a pressing plate, and the crimping assembly includes:

[0017] Roller parts;

[0018] A connecting rod component is connected to the first mounting member and the second mounting member, and the roller component is connected to the end of the connecting rod component. The connecting rod component is configured to drive the roller component to move and press against the corresponding pressure plate of the buckle assembly under the drive of the first driving member, and drive the roller component to deflect under the drive of the second driving member to apply a downward pressure force to one end of the corresponding pressure plate.

[0019] Optionally, the connecting rod component comprises:

[0020] a first connecting rod, one end of which is rotatably connected to the second mounting member;

[0021] a second connecting rod, one end of which is connected to an end of the first connecting rod away from the second mounting member, and the other end of which is connected to the roller component;

[0022] The third connecting rod has one end rotatably connected to the second connecting rod and the other end connected to the first mounting member.

[0023] Optionally, there are multiple crimping assemblies, which are arranged in a circular shape and spaced apart from each other, and each crimping assembly corresponds to one buckle assembly.

[0024] Optionally, the supporting mechanism comprises:

[0025] A first bracket, located below the wafer clamp;

[0026] A first support plate is installed on the top of the first bracket and is used to abut against the wafer clamp to support the test board assembly.

[0027] Optionally, it also includes:

[0028] A lifting mechanism is located below the wafer clamp, and the lifting mechanism includes a third driving member and a second support plate connected to the third driving member, and the second support plate is configured to move vertically under the drive of the third driving member to receive the first sealing cover that is detached from the test board assembly or lift the first sealing cover to a position abutting the test board assembly.

[0029] Optionally, the supporting mechanism further comprises:

[0030] At least one limiting component is located above the wafer clamp, and the limiting component is configured to press against the top of the test board assembly when the wafer clamp is located on the first supporting plate.

[0031] According to the solution of the utility model, the pressing mechanism is connected to the supporting mechanism, and the pressing mechanism includes a driving component and at least one crimping component. When the driving component drives the corresponding crimping component to cancel the pressing force applied to the buckle component, the buckle component is engaged with the first sealing cover, so that the test board assembly is connected with the first sealing cover. The above technical solution drives the crimping component to cancel the pressing force applied to the buckle component of the wafer fixture through the driving component, so that the buckle component is engaged with the first sealing cover, thereby realizing the automatic connection of the wafer fixture, saving installation time, and improving the efficiency of wafer aging test.

[0032] Furthermore, the loading and unloading tooling in the utility model also includes a lifting mechanism, which is located below the wafer clamp, and includes a third driving member and a second support plate connected to the third driving member, and the second support plate is configured to move vertically under the drive of the third driving member to receive the first sealing cover detached from the test board assembly or lift the first sealing cover to a position abutting against the test board assembly. The above technical solution drives the first sealing cover of the wafer clamp to rise and fall through the lifting mechanism, and supports the first sealing cover, so that the wafer clamp can be fully automatically loaded and unloaded, and the first sealing cover can be prevented from falling during the loading and unloading process, thereby improving the stability of the wafer clamp loading and unloading and preventing the wafer clamp from being damaged during the assembly and disassembly process.

[0033] Based on the detailed description of the specific embodiments of the present invention in combination with the accompanying drawings below, those skilled in the art will become more aware of the above and other purposes, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0035] Figure 1 It is a schematic structural diagram of a loading and unloading tool for a wafer clamp according to an embodiment of the utility model;

[0036] Figure 2 yes Figure 1 A schematic enlarged view of part A;

[0037] Figure 3 is a schematic structural diagram of a wafer clamp in a connected state according to an embodiment of the utility model;

[0038] Figure 4 is a schematic structural diagram of a wafer clamp in an open state according to an embodiment of the utility model;

[0039] Figure 5 yes Figure 1 A schematic structural diagram of the pressing mechanism of the loading and unloading tool shown;

[0040] Figure 6 is a schematic structural diagram of a connecting rod component according to an embodiment of the utility model;

[0041] Figure 7 It is a schematic structural diagram of a jacking mechanism according to an embodiment of the utility model at one angle;

[0042] Figure 8 It is a schematic structural diagram of a jacking mechanism according to an embodiment of the utility model from another angle.

[0043] Reference numerals:

[0044] 100-loading and unloading tooling, 200-wafer fixture, 10-support mechanism, 11-first pillar, 12-mounting plate, 13-limiting component, 20-pressing mechanism, 22-pressing assembly, 24-driving assembly, 241-first driving member, 242-second driving member, 210-buckle assembly, 30-lifting mechanism, 221-first connecting rod, 222-second connecting rod, 223-roller component, 224-third connecting rod, 23-first mounting member, 21-second mounting member, 211-pressing plate, 212-elastic member, 213-third mounting member Mounting part, 214-fourth connecting rod, 215-rotating shaft, 240-probe card, 244-PCB board, 245-outer frame weight reduction plate, 246-decorative panel, 220-second sealing cover, 230-first sealing cover, 250-test board assembly, 215-clamping part, 232-matching part, 231-groove, 243-sliding assembly, 31-second support plate, 32-second pillar, 33-third driving member, 41-first bracket, 42-first support plate, 225-fourth mounting part, 14-second bracket, 15-third bracket. DETAILED DESCRIPTION

[0045] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0046] In the description of the present invention, it is necessary to understand that the terms "upper" and "lower" etc. indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0047] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features, that is, include one or more of the features. In the description of the present utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. When a feature "includes or contains" one or some of the features it covers, unless otherwise specifically described, this indicates that other features are not excluded and may further include other features.

[0048] Unless otherwise clearly specified and limited, the terms "connection", "installation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. A person skilled in the art should be able to understand the specific meanings of the above terms in the present utility model according to the specific circumstances.

[0049] Unless otherwise defined, all terms (including technical terms and scientific terms) used in the description of this embodiment have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0050] Figure 1 is a schematic structural diagram of a loading and unloading tool 100 for a wafer clamp 200 according to an embodiment of the utility model. Figure 2 yes Figure 1 A schematic enlarged view of part A in the figure, Figure 3 is a schematic structural diagram of a wafer clamp 200 in a connected state according to an embodiment of the utility model. Figure 4 is a schematic structural diagram of a wafer clamp 200 in an open state according to an embodiment of the utility model. Figure 5 yes Figure 1 The schematic structural diagram of the pressing mechanism 20 of the loading and unloading tool 100 is shown. Figure 6 Schematic diagram of the structure of a connecting rod component according to an embodiment of the utility model. Figures 1 to 6 As shown, in this embodiment, the wafer clamp 200 includes a test board assembly 250, a first sealing cover 230, and at least one snap assembly 210 for connecting the test board assembly 250 and the first sealing cover 230. The loading and unloading tool 100 includes a supporting mechanism 10 and a pressing mechanism 20. The supporting mechanism 10 is used to support the wafer clamp 200. The pressing mechanism 20 is connected to the supporting mechanism 10, and the pressing mechanism 20 includes a driving assembly 24 and at least one crimping assembly 22. When the driving assembly 24 drives the corresponding crimping assembly 22 to cancel the pressing force applied to the snap assembly 210, the snap assembly 210 is snapped with the first sealing cover 230, so that the test board assembly 250 is connected to the first sealing cover 230.

[0051] This embodiment drives the crimping assembly 22 through the driving assembly 24 to cancel the downward pressure applied to the snap assembly 210 of the wafer clamp 200, so that the snap assembly 210 is snapped into the first sealing cover 230, thereby realizing automatic connection of the wafer clamp 200, saving installation time, and improving the efficiency of wafer aging testing.

[0052] In this embodiment, when the driving component 24 drives the corresponding crimping component 22 to move and press against the corresponding buckle component 210 and applies a downward pressure force to the buckle component 210, the buckle component 210 is separated from the first sealing cover 230, so that the test board component 250 is separated from the first sealing cover 230. This embodiment can not only realize the automatic connection of the wafer clamp 200, but also realize the automatic disassembly of the wafer clamp 200, saving loading and unloading time and further improving the efficiency of the wafer aging test.

[0053] In some embodiments, the buckle assembly 210 includes a pressure plate 211, and the driving assembly 24 applies a downward pressure force to the pressure plate 211. When the pressure plate 211 is not subjected to the downward force of the driving assembly 24, the pressure plate 211 is in a horizontal state. Figure 3 When the pressing plate 211 is subjected to the downward force of the driving assembly 24, the pressing plate 211 is in a state of being tilted toward the wafer clamp 200, see Figure 4The test board assembly 250 includes a second sealing cover 220 and a probe card 240. The buckle assembly 210 also includes a third mounting member 213, an elastic member 212 and a fourth connecting rod 214. The third mounting member 213 is mounted on the top of the second sealing cover 220. The bottom of the fourth connecting rod 214 is provided with a clamping portion 215. The edge of the first sealing cover 230 is provided with an inwardly recessed groove 231. The inner wall of the groove 231 is provided with a protruding matching portion 232. The clamping portion 215 matches with the matching portion 232, thereby connecting the test board assembly 250 with the first sealing cover 230. The third mounting member 213 is provided with a through hole. The fourth connecting rod 214 is inserted into the through hole of the third mounting member 213 and the groove 231 of the first sealing cover 230. The top of the fourth connecting rod 214 is connected to the pressing plate 211. At least part of the rotating shaft 215 is movably inserted into the third mounting member 213. The fourth connecting rod 214 passes through the third mounting member 213, and part of the rotating shaft 215 is disposed in the fourth connecting rod 214, so that the fourth connecting rod 214 rotates around the rotating shaft 215. The elastic member 212 is disposed on the fourth connecting rod 214 and is located between the pressing plate 211 and the third mounting member 213. When the pressing plate 211 is subjected to the downward force of the driving assembly 24, the pressing plate 211 tilts downward to drive the fourth connecting rod 214 to rotate around the rotating shaft 215, so that the clamping portion 215 is disengaged from the matching portion 232, thereby separating the test board assembly 250 from the first sealing cover 230, and at this time, the elastic member 212 is in a compressed state. When the driving assembly 24 cancels the downward pressure on the pressure plate 211, the pressure plate 211 returns to its original state, that is, returns to a horizontal state, and the pressure plate 211 drives the fourth connecting rod 214 to rotate to the position where the clamping portion 215 is clamped with the matching portion 232, thereby realizing the connection between the test board assembly 250 and the first sealing cover 230. At this time, the elastic member 212 is reset. When the test board assembly 250 and the first sealing cover 230 are connected, a test cavity for testing the wafer is formed. Here, the second sealing cover 220 and the probe card 240 are both provided with through holes, and the fourth connecting rod 214 passes through the through hole of the third mounting member 213, the through hole of the second sealing cover 220, the through hole of the probe card 240 and the groove 231 of the first sealing cover 230 in sequence. The through hole of the third mounting member 213, the through hole of the second sealing cover 220, and the through hole of the probe card 240 respectively have redundant space for the fourth connecting rod 214 to rotate.

[0054] In some embodiments, the test board assembly 250 also includes a probe card, and the probe card 240 includes a PCB board 244, an outer frame weight reduction plate 245 and a decorative panel 246. Specifically, the decorative panel 246 is located on the side of the probe card 240 away from the first sealing cover 230, and the PCB board 244 is located on the side of the probe card 240 close to the first sealing cover 230. The outer frame weight reduction plate 245 is connected between the decorative panel 246 and the PCB board 244. The probe board is arranged on the side of the PCB board 244 close to the first sealing cover 230 and is connected to the PCB board 244. When the first sealing cover 230 is connected to the probe card 240 to form a test cavity for testing a wafer, the probe board is located in the test cavity and contacts the wafer.

[0055] In some embodiments, the drive assembly 24 includes a first drive member 241 and a second drive member 242, the first drive member 241 is connected to the crimping assembly 22, and the first drive member 241 is configured to controllably drive the crimping assembly 22 to move and press against the corresponding buckle assembly 210. The second drive member 242 is connected to the crimping assembly 22, and the second drive member 242 is configured to controllably drive the crimping assembly 22 to apply a downward pressure force to the corresponding buckle assembly 210 when the crimping assembly 22 moves and presses against the corresponding buckle assembly 210. It can be understood that the first drive member 241 first drives the crimping assembly 22 to move and press against the corresponding buckle assembly 210, and then the second drive member 242 drives the crimping assembly 22 to apply a downward pressure force to the corresponding buckle assembly 210. When the test board assembly 250 and the first sealing cover 230 need to be connected, the second driving member 242 cancels the downward pressure of the crimping assembly 22 on the corresponding buckle assembly 210, and the pressing plate 211 returns to its original state, that is, to a horizontal state, and the fourth connecting rod 214 rotates to the position where the clamping portion 215 is clamped with the matching portion 232. Then, the first driving member 241 drives the clamping assembly 22 to move upward.

[0056] In some embodiments, the support mechanism 10 includes two first pillars 11 and a mounting plate 12, the two first pillars 11 are arranged vertically, and the mounting plate 12 is connected to the two first pillars 11. The first driving member 241 is mounted on the mounting plate 12.

[0057] In some embodiments, the driving assembly 24 also includes a first mounting member 23, which is respectively connected to the first driving member 241 and the crimping assembly 22, and the second driving member 242 is installed on the first mounting member 23. The first mounting member 23 is configured to move vertically under the drive of the first driving member 241 to drive the crimping assembly 22 and the second driving member 242 to move vertically.

[0058] In some embodiments, the driving assembly 24 further includes a second mounting member 21, the second mounting member 21 is connected to the second driving member 242 and the crimping assembly 22, and the second mounting member 21 is configured to move vertically under the drive of the second driving member 242 to drive the crimping assembly 22 to apply a downward pressure force to the buckle assembly 210. It can be understood that the first mounting member 23 is arranged in parallel with the second mounting member 21, and the second driving member 242 is installed on the first mounting member 23 and is located between the first mounting member 23 and the second mounting member 21. The crimping assembly 22 is connected to the first mounting member 23 and the second mounting member 21 respectively. The first driving member 241 can drive the crimping assembly 22, the first mounting member 23, the second mounting member 21 and the second driving member 242 to move vertically. When the first driving member 241 drives the crimping assembly 22 to move downward until it contacts the pressing plate 211 of the buckle assembly 210, the second driving member 242 drives the second mounting member 21 to move upward, thereby driving the crimping assembly 22 to apply a downward pressure force to one end of the pressing plate 211, so that the pressing plate 211 tilts, driving the fourth connecting rod 214 to rotate, so that the clamping portion 215 is separated from the matching portion 232. When it is necessary to connect the test board assembly 250 to the first sealing cover 230, first the second driving member 242 drives the second mounting member 21 to move downward, driving the crimping assembly 22 to cancel the downward pressure force on the pressing plate 211, so that the pressing plate 211 returns to a horizontal state, and at this time the fourth connecting rod 214 rotates in the opposite direction, so that the clamping portion 215 is clamped with the matching portion 232.

[0059] In some embodiments, the first mounting member 23 and the second mounting member 21 are both plate-shaped and circular. The first driving member 241 is an electric cylinder, and the second driving member 242 is a pneumatic cylinder. In other embodiments, the first driving member 241 and the second driving member 242 can also select other driving components according to actual needs.

[0060] In a preferred embodiment, in order to ensure the stability of the second driving member 242 driving the second mounting member 21 to move up and down, two sliding components 243 extending vertically are provided between the first mounting member 23 and the second mounting member 21. The sliding components 243 are configured so that when the second driving member 242 drives the second mounting member 21 to move upward, the sliding components 243 slide and extend, and when the second driving member 242 drives the second mounting member 21 to move downward and restore to its original state, the sliding components 243 return to their original state.

[0061] In some embodiments, there are multiple crimping assemblies 22, and the multiple crimping assemblies 22 are evenly arranged along the same circumference, and each crimping assembly 22 corresponds to a buckle assembly 210. Specifically, the multiple crimping assemblies 22 are evenly arranged along the circumference of the first mounting member 23. In other words, when the second driving member 242 drives the first mounting member 23 to move upward, it can simultaneously drive the multiple crimping assemblies 22 to apply a downward force to the corresponding pressing plate 211, thereby improving the loading and unloading efficiency of the wafer clamp 200.

[0062] In some embodiments, the buckle assembly 210 includes a pressure plate 211, and the crimping assembly 22 includes a roller component 223 and a connecting rod component. The connecting rod component is connected to the first mounting member 23 and the second mounting member 21, and the roller component 223 is connected to the end of the connecting rod component. The connecting rod component is configured to drive the roller component 223 to move and press against the corresponding pressure plate 211 of the buckle assembly 210 under the drive of the first driving member 241, and drive the roller component 223 to deflect under the drive of the second driving member 242, so as to apply a downward pressure to one end of the corresponding pressure plate 211. Here, rollers are respectively provided at both ends of the roller component 223. This embodiment can reduce the contact area between the crimping assembly 22 and the pressure plate 211 by providing the roller component 223, thereby avoiding scratching the pressure plate 211 when applying a downward pressure to the pressure plate 211.

[0063] In some embodiments, the connecting rod component includes a first connecting rod 221, a second connecting rod 222 and a third connecting rod 224. One end of the first connecting rod 221 is rotatably connected to the second mounting member 21. One end of the second connecting rod 222 is connected to an end of the first connecting rod 221 away from the second mounting member 21, and the other end is connected to the roller component 223. One end of the third connecting rod 224 is rotatably connected to the second connecting rod 222, and the other end is connected to the first mounting member 23. Here, the third connecting rod 224 is connected to the first mounting member 23 by bolts. When the second driving member 242 drives the second mounting member 21 to move upward, the first connecting rod 221 is driven to rotate, and the first connecting rod 221 drives the second connecting rod 222 to rotate, thereby driving the roller component 223 to deflect, so as to apply a downward pressure force to one end of the pressure plate 211. When the second driving member 242 drives the second mounting member 21 to move downward, the first connecting rod 221 is driven to rotate, and the first connecting rod 221 drives the second connecting rod 222 to rotate and reset, thereby driving the roller member 223 to restore to a horizontal state, so as to cancel the downward pressure applied to one end of the pressing plate 211, so that the pressing plate 211 is restored to a horizontal state. Then, the first driving member 241 drives the first mounting member 23, the second mounting member 21, the second driving member 242 and the crimping assembly 22 to move upward and restore to their original state.

[0064] In some embodiments, at least one fourth mounting member 225 is installed on the top of the second mounting member 21, each fourth mounting member 225 corresponds to a first connecting rod 221, and the first connecting rod 221 is connected to the corresponding fourth mounting member 225 through a rotating shaft, thereby achieving a rotational connection with the second mounting member 21.

[0065] Figure 7 1 is a schematic structural diagram of a jacking mechanism 30 according to an embodiment of the utility model at one angle. Figure 8 FIG. 2 is a schematic structural diagram of the lifting mechanism 30 according to another embodiment of the present invention from another angle. Figure 7 and Figure 8 As shown, in this embodiment, the support mechanism 10 includes a first bracket 41 and a first support plate 42, and the first bracket 41 is located below the wafer clamp 200. The first support plate 42 is installed on the top of the first bracket 41, and is used to abut against the wafer clamp 200 to support the test board assembly 250. Here, the first bracket 41 is arranged vertically.

[0066] In some embodiments, the support mechanism 10 further includes at least one limiting component 13, the limiting component 13 is located above the wafer fixture 200, and the limiting component 13 is configured to abut against the top of the test board assembly 250 when the wafer fixture 200 is located on the first support plate 42. Here, the number of limiting components 13 is four, and the four limiting components 13 are respectively located at the four corners of the wafer fixture 200. This embodiment not only supports the test board assembly 250 through the first support plate 42, but also sets the limiting component 13 to abut against the top of the test board assembly 250, so that the test board assembly 250 can be better limited to prevent the test board assembly 250 from moving during the loading and unloading process of the wafer fixture 200.

[0067] In addition, the support mechanism 10 also includes a plurality of second brackets 14 and two third brackets 15. The plurality of second brackets 14 are divided into two groups of second bracket groups. Each group of second bracket groups includes a plurality of second brackets 14. The two groups of second bracket groups are respectively located below the opposite sides of the test board assembly 250 and are arranged vertically. The two third brackets 15 are respectively arranged at the top of the two groups of second bracket groups to support the opposite sides of the test board assembly 250. Here, the first support plate 42 is located between the two third brackets 15. It can be understood that the second bracket 14 and the third bracket 15 support the opposite sides of the test board assembly 250. The first support plate 42 and the first bracket 41 support the middle position of the test board assembly 250. The middle of the first support plate 42 has an avoidance hole for avoiding the first sealing cover 230.

[0068] See also Figure 7 and Figure 8 The loading and unloading tool 100 also includes a lifting mechanism 30, which is located below the wafer clamp 200. The lifting mechanism 30 includes a third driving member 33 and a second support plate 31 connected to the third driving member 33. The second support plate 31 is configured to move vertically under the drive of the third driving member 33 to receive the first sealing cover 230 detached from the test board assembly 250 or lift the first sealing cover 230 to a position abutting against the test board assembly 250.

[0069] In some embodiments, the lifting mechanism 30 further includes a plurality of second pillars 32, the second support plate 31 is mounted on the top of the plurality of second pillars 32, and the second pillars 32 are configured to be retractable. Specifically, when the third driving member 33 drives the second support plate 31 to move upward, the second pillars 32 are in an extended state. When the third driving member 33 drives the second support plate 31 to move downward, the second pillars 32 return to their original state. By providing a plurality of second pillars 32, this embodiment can better support the second support plate 31 and ensure the stability of the second support plate 31 during the lifting process.

[0070] This embodiment drives the first sealing cover 230 of the wafer clamp 200 to rise and fall through the lifting mechanism 30, and supports the first sealing cover 230, so as to realize fully automatic loading and unloading of the wafer clamp 200, and can prevent the first sealing cover 230 from falling during the loading and unloading process, thereby improving the stability of the loading and unloading of the wafer clamp 200 and preventing the wafer clamp 200 from being damaged during the loading and disassembly process.

[0071] This embodiment eliminates the screw connection method and adopts the snap assembly 210 to connect the test board assembly 250 and the first sealing cover 230 of the wafer clamp 200, so there will be no problems of debris and slipping, and the wafer will not be contaminated. In addition, the snap assembly 210 can be fully automatically fastened and opened through the loading and unloading tool 100, thereby improving the loading and unloading efficiency of the wafer clamp 200, thereby improving the testing efficiency of the wafer.

[0072] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived from the contents disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A loading and unloading tool for a wafer fixture, the wafer fixture comprising a test board assembly, a first sealing cover and at least one buckle assembly for connecting the test board assembly and the first sealing cover, characterized in that: The loading and unloading tooling comprises: A supporting mechanism, used for supporting the wafer fixture; A pressing mechanism is connected to the supporting mechanism, and the pressing mechanism includes a driving assembly and at least one crimping assembly. When the driving assembly drives the corresponding crimping assembly to cancel the pressing force applied to the buckle assembly, the buckle assembly is engaged with the first sealing cover to connect the test board assembly to the first sealing cover.

2. The loading and unloading tool according to claim 1, characterized in that: When the driving assembly drives the corresponding crimping assembly to move and press against the corresponding buckle assembly and applies a downward pressure force to the buckle assembly, the buckle assembly is separated from the first sealing cover, so that the test board assembly is separated from the first sealing cover.

3. The loading and unloading tool according to claim 2, characterized in that: The drive assembly comprises: A first driving member connected to the crimping assembly, the first driving member being configured to controllably drive the crimping assembly to move and tighten against the corresponding buckle assembly; The second driving member is connected to the crimping assembly, and the second driving member is configured to controllably drive the crimping assembly to apply a downward pressure force to the corresponding buckle assembly when the crimping assembly and the corresponding buckle assembly are movably pressed against each other.

4. The loading and unloading tool according to claim 3, characterized in that: The drive assembly also includes: The first mounting member is connected to the first driving member and the crimping assembly respectively, the second driving member is mounted on the first mounting member, and the first mounting member is configured to move vertically under the drive of the first driving member to drive the crimping assembly and the second driving member to move vertically.

5. The loading and unloading tool according to claim 4, characterized in that: The drive assembly also includes: The second mounting member is connected to the second driving member and the crimping assembly. The second mounting member is configured to move vertically under the drive of the second driving member to drive the crimping assembly to apply a downward pressure force to the buckle assembly.

6. The loading and unloading tool according to claim 5, characterized in that: The buckle assembly includes a pressing plate, and the crimping assembly includes: Roller parts; A connecting rod component is connected to the first mounting member and the second mounting member, and the roller component is connected to the end of the connecting rod component. The connecting rod component is configured to drive the roller component to move and press against the corresponding pressure plate of the buckle assembly under the drive of the first driving member, and drive the roller component to deflect under the drive of the second driving member to apply a downward pressure force to one end of the corresponding pressure plate.

7. The loading and unloading tool according to claim 6, characterized in that: The connecting rod component comprises: a first connecting rod, one end of which is rotatably connected to the second mounting member; a second connecting rod, one end of which is connected to an end of the first connecting rod away from the second mounting member, and the other end of which is connected to the roller component; The third connecting rod has one end rotatably connected to the second connecting rod and the other end connected to the first mounting member.

8. The loading and unloading tool according to any one of claims 1 to 7, characterized in that: There are multiple crimping assemblies, which are arranged in a circular shape and spaced apart from each other, and each crimping assembly corresponds to one buckle assembly.

9. The loading and unloading tool according to any one of claims 1 to 7, characterized in that: The supporting mechanism comprises: A first bracket, located below the wafer clamp; A first support plate is installed on the top of the first bracket and is used to abut against the wafer clamp to support the test board assembly.

10. The loading and unloading tool according to any one of claims 1 to 7, characterized in that: Also includes: A lifting mechanism is located below the wafer clamp, and the lifting mechanism includes a third driving member and a second support plate connected to the third driving member, and the second support plate is configured to move vertically under the drive of the third driving member to receive the first sealing cover that is detached from the test board assembly or lift the first sealing cover to a position abutting the test board assembly.

11. The loading and unloading tool according to claim 9, characterized in that: The support mechanism also includes: At least one limiting component is located above the wafer clamp, and the limiting component is configured to press against the top of the test board assembly when the wafer clamp is located on the first supporting plate.

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