Semiconductor laser with sealed cavity
By adopting an in-cavity sealing design in semiconductor lasers and using the cooperation of multi-layer silicone rubber sealing ring pressing plates, the problem of poor sealing of existing lasers is solved, and higher sealing and longer service life are achieved.
Patent Information
- Application Number
- CN202421465751.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-25
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-06-25
AI Technical Summary
Existing semiconductor lasers are prone to water leakage after use, resulting in poor sealing and difficult to apply on a large scale.
The design of in-cavity sealing is adopted, by setting a first sealing ring in the positioning groove of the front cover and extruding it with multiple first screws to achieve sealing; a second sealing ring is provided in the counterhole of the water channel, and a plurality of second screws are used to squeeze it to lock the water channel and the heat sink module; a third sealing ring is provided on the power supply line, and a plurality of third screws are used to extrude it to seal the wire hole.
It significantly improves the sealing properties of semiconductor lasers, prevents water leakage, extends the service life of the product, and reduces production costs.
Smart Images
Figure CN222620388U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor lasers, in particular to a semiconductor laser with a cavity sealed therein. Background Art
[0002] There are many designs for the structure of semiconductor lasers. They are usually assembled with materials of various structures. There will be multiple matching gaps in their water channels, circuits and assembly. These gaps are actually not sealed. However, the working requirements of the laser are to work in a temperature and humidity controlled environment to prevent static electricity from affecting the service life of the laser. Since the use environment cannot meet strict requirements, it is basically used in a humid environment. In addition, the water flow impact is relatively large every time the equipment is turned on and off, and the water hammer effect cannot be controlled, resulting in an increased risk of water seepage and leakage. Therefore, it is necessary to solve these problems on the laser, so it is necessary to develop a fully sealed method that is universally applicable to products with this requirement to improve the performance quality of the product.
[0003] At present, for the sealing of lasers, the wire-controlled sealing is done by applying glue, and the glue is easy to age and the sealing effect is poor; for the sealing of the waterway, the sealing method between the waterway and the front cover is a sealing gasket, which is difficult to assemble and easy to move; for the sealing of the waterway, the waterway is sealed by external positioning of the sealing ring, which is easily affected by the water hammer effect and leaks under high water pressure; specifically, the wire-controlled sealing is done by applying silicone rubber, and it takes 24 hours for the glue to fully cure, which affects production efficiency, and the performance of the glue is relatively weak, and it is easy to crack after curing, and the sealing is poor; the waterway and the front cover use sealing gaskets, because the sealing gaskets are large and the product design does not have a large space for positioning, so it is difficult to install and easy to move after squeezing, resulting in sealing failure, and the sealing gaskets are customized by mold opening, so the cost is relatively high; the waterway seal uses an external positioning sealing ring, and the inner diameter of the sealing ring is in direct contact with the water flow. When encountering high water pressure, the sealing ring has a relatively weak pressure resistance and is easy to deform, resulting in leakage and burning the entire laser.
[0004] Therefore, the methods currently used in line hole sealing, water channel sealing and waterway sealing may lead to water leakage after use, so the sealing performance is poor and it is difficult to be used in the manufacture of semiconductor lasers on a large scale. Utility Model Content
[0005] The utility model provides a semiconductor laser with a cavity seal, which can solve the problem in the prior art that the current methods used in line control sealing, water channel sealing and waterway sealing may cause water leakage after use, thus resulting in poor sealing.
[0006] The utility model provides a semiconductor laser sealed in a cavity, comprising a heat sink module, a front cover is arranged on one side of the heat sink module; a water channel is arranged on the other side of the heat sink module, a back plate is arranged on the other side of the water channel, and a power line is passed through the back plate and connected to the heat sink module;
[0007] A first sealing ring is arranged in the positioning groove of the front cover, and a plurality of first screws are inserted through the water channel and connected to the front cover to squeeze the first sealing ring for sealing;
[0008] A plurality of second sealing rings are arranged in the sink hole of the water channel, and a plurality of second screws are passed through the inner diameters of the plurality of second sealing rings to connect with the heat sink module, so as to lock the water channel and the heat sink module, and squeeze the second sealing rings to achieve sealing of the screw holes;
[0009] A third sealing ring is sleeved on the power cord, and the third sealing ring is in the countersunk hole of the water channel. A plurality of third screws are passed through the back plate to connect with the water channel, so that the back plate squeezes the third sealing ring to seal the wire hole.
[0010] Preferably, the number of the second sealing rings is 4, which are distributed on the inner side of the water channel and correspond to the second screws.
[0011] Preferably, a window piece is provided on the other side of the front cover, and the window piece is bonded to a positioning position of the front cover to achieve sealing of the housing.
[0012] Preferably, a fourth sealing ring is arranged in the annular countersunk hole of the water channel, and a plurality of second screws lock the water channel and the heat sink module to squeeze the fourth sealing ring to seal the water channel.
[0013] Preferably, the number of the first screws is 4 and they are distributed at the four corners of the water channel.
[0014] Preferably, the number of the second screws is 4 and they are distributed on the inner side of the water channel.
[0015] Preferably, the number of the third screws is 2 and they are distributed at the diagonals of the back plate.
[0016] Preferably, the positions of the front cover and the window piece are the light outlet positions of the laser.
[0017] Preferably, a protrusion is provided on the first sealing ring so that the first sealing ring will not completely sink into the positioning groove of the front cover;
[0018] The second sealing ring is provided with a protrusion so that the second sealing ring will not completely sink into the sink hole of the water channel.
[0019] The present invention provides a semiconductor laser with a sealed cavity. Compared with the prior art, the invention has the following beneficial effects:
[0020] The utility model arranges a first sealing ring in a positioning groove of a front cover, and uses a plurality of first screws to squeeze it to seal the shell, arranges a second sealing ring in a countersunk hole of a water channel, and uses a plurality of second screws to squeeze it to seal the screw hole, and sets a third sealing ring on a power line, and uses a plurality of third screws to squeeze it to seal the line hole; as a whole, the sealing ring is adopted and the sealing ring is squeezed by screws to realize the overall sealing in the semiconductor laser cavity, so the sealing performance is greatly improved, water leakage is not easy to occur after use, and the utility model can be widely used in the manufacture of semiconductor lasers.
[0021] In addition, a sealing ring is arranged on the water channel hole inside the water channel to offset the water hammer effect caused by the direct impact of the water flow on the water channel hole. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 A schematic diagram of the overall structure of a cavity-sealed semiconductor laser provided by an embodiment of the utility model;
[0023] Figure 2 A schematic diagram of the structure of the cavity seal of a semiconductor laser with an intracavity seal provided in an embodiment of the utility model;
[0024] Figure 3 A schematic cross-sectional view of a housing, a screw hole seal and a wire hole seal of a cavity-sealed semiconductor laser provided by an embodiment of the utility model;
[0025] Figure 4 A schematic structural diagram of a water channel seal of a cavity-sealed semiconductor laser provided in an embodiment of the utility model.
[0026] Among them: 101, front cover, 102, first sealing ring, 103, heat sink module, 104, fourth sealing ring, 105, second sealing ring, 106, water channel, 107, first screw, 108, second screw, 109, back plate, 110, third screw, 111, power cord, 112, window piece, 113, third sealing ring. DETAILED DESCRIPTION
[0027] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.
[0028] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0029] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0030] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0031] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0032] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.
[0033] See also Figure 1 The embodiment of the utility model provides a cavity-sealed semiconductor laser, including a front cover 101, a first sealing ring 102, a heat sink module 103, a fourth sealing ring 104, a second sealing ring 105, a water channel 106, a first screw 107, a second screw 108, a back plate 109, a third screw 110, a power line 111, a window sheet 112 and a third sealing ring 113.
[0034] The utility model has a targeted sealing structure, which adopts the cooperation of multiple layers of silicone rubber sealing rings and pressure plates to physically seal the inside of the product cavity. In addition, an annular sealing method is adopted on the water path, which reduces the risk of direct impact of the water hammer effect on the sealing ring and extends the service life of the product.
[0035] like Figure 2 As shown, the sealing method of the semiconductor laser is mainly reflected in the external sealing structure, which prevents the tube of the outer handle from bursting and water from directly impacting the inside of the laser. It can also play a role in dust and moisture prevention, which is specifically reflected in the shell sealing, screw hole sealing, wire hole sealing and water channel sealing.
[0036] Shell sealing aspects, such as Figure 2 and Figure 3As shown, a first silicone rubber sealing ring 102 is positioned and laid flat in the positioning groove of the front cover 101, and the first sealing ring 102 has a protruding portion and is not completely sunk into the positioning groove of the front cover 101. Then, four first screws 107 are used to lock the water channel 106 and the front cover 101 to squeeze the first sealing ring 102 to form a seal. Because the laser needs to emit light when working, the light outlet part at the front end of the front cover 101 and the window piece 112 are bonded to the positioning position of the front cover 101 using silicone rubber to achieve the overall shell sealing.
[0037] Screw hole sealing, such as Figure 2 and Figure 3 As shown, because the water channel 106 and the heat sink module 103 need to be locked during assembly, four second sealing rings 105 are used to be positioned in the countersunk hole of the water channel 106 for sealing. Similarly, the second sealing ring 105 has a protruding part and is not completely sunk into the countersunk hole of the water channel 106. Then, four second screws 108 are used to pass through the inner diameter of the second sealing ring 105 to lock the water channel 106 and the heat sink module 103, and the second sealing ring 105 is squeezed to achieve the sealing of the screw hole.
[0038] In terms of wire hole sealing, such as Figure 2 and Figure 3 As shown, the third sealing ring 113 is sleeved on the power cord 111 and then positioned in the countersunk hole of the waterway 106, and then the back plate 109 is locked using the third screw 110, and then the back plate 109 over-presses the third sealing ring 113 to form a sealing structure for the wire hole.
[0039] Waterway sealing, such as Figure 2 and Figure 4 As shown, the water circulation works, and the closed waterway needs to work for a long time without leakage. Therefore, an annular structure is designed on the waterway 106 at the positioning position of the fourth sealing ring 104, and the water hammer effect caused by the large water pressure is offset by the direct impact of the water flow on the waterway hole. The water flow will not directly impact the fourth sealing ring 104, thereby protecting the fourth sealing ring 104 from deformation due to the large water pressure. Structurally, the fourth sealing ring 104 is positioned in the annular countersunk hole of the waterway 106, and then the second screw 108 is used to lock the waterway 106 and the heat sink module 103, so as to squeeze the fourth sealing ring 104 in the annular countersunk hole, thereby sealing the waterway.
[0040] The utility model can prevent the water hammer effect of high water pressure from directly impacting the sealing ring, causing water leakage inside the product; the utility model can prevent the external water from entering the inside of the laser after the product is soaked in water, causing the product to burn; the sealing method of the utility model is universal, and the sealing rings are designed according to standard products, without customization, which can reduce costs and can meet the needs of all products with this need.
[0041] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A semiconductor laser with a sealed cavity, characterized in that: include: A heat sink module (103), wherein a front cover (101) is provided on one side of the heat sink module (103); a water channel (106) is provided on the other side of the heat sink module (103); a back plate (109) is provided on the other side of the water channel (106); and a power line (111) is passed through the back plate (109) and is connected to the heat sink module (103); A first sealing ring (102) is arranged in the positioning groove of the front cover (101), and a plurality of first screws (107) are inserted through the water channel (106) to connect the front cover (101), so as to squeeze the first sealing ring (102) to achieve sealing; A plurality of second sealing rings (105) are arranged in the countersunk hole of the water channel (106); a plurality of second screws (108) are passed through the inner diameter of the plurality of second sealing rings (105) and connected to the heat sink module (103) to lock the water channel (106) and the heat sink module (103), and to squeeze the second sealing rings (105) to achieve sealing of the screw holes; A third sealing ring (113) is sleeved on the power line (111), and the third sealing ring (113) is located in the countersunk hole of the water channel (106). A plurality of third screws (110) are passed through the back plate (109) and connected to the water channel, so that the back plate (109) squeezes the third sealing ring (113) to seal the wire hole.
2. The cavity-sealed semiconductor laser according to claim 1, characterized in that: The number of the second sealing rings (105) is four and they are distributed on the inner side of the water channel (106) and correspond to the second screws (108).
3. The cavity-sealed semiconductor laser according to claim 1, characterized in that: A window piece (112) is provided on the other side of the front cover (101), and the window piece (112) is bonded to a positioning position of the front cover (101) to achieve sealing of the housing.
4. The cavity-sealed semiconductor laser according to claim 1, characterized in that: A fourth sealing ring (104) is arranged in the annular countersunk hole of the water channel (106), and a plurality of second screws (108) lock the water channel (106) and the heat sink module (103) to squeeze the fourth sealing ring (104) to seal the water channel.
5. The cavity-sealed semiconductor laser according to claim 1, characterized in that: The number of the first screws (107) is four and they are distributed at the four corners of the water channel (106).
6. The cavity-sealed semiconductor laser according to claim 1, characterized in that: The number of the second screws (108) is four and they are distributed on the inner side of the water channel (106).
7. The cavity-sealed semiconductor laser according to claim 1, characterized in that: The number of the third screws (110) is two and they are distributed at the diagonal positions of the back plate (109).
8. The cavity-sealed semiconductor laser according to claim 3, characterized in that: The positions of the front cover (101) and the window sheet (112) are the light outlet positions of the laser.
9. The cavity-sealed semiconductor laser according to claim 1, characterized in that: The first sealing ring (102) is provided with a protrusion so that the first sealing ring (102) will not completely sink into the positioning groove of the front cover (101); The second sealing ring (105) is provided with a protrusion so that the second sealing ring (105) will not completely sink into the sink hole of the water channel (106).