Inverted and side-mounted packaging structure of laser light source
Through the flip-up stacking and side-mounted packaging structure, the problems of low efficiency and insufficient power of the existing laser light source packaging structure are solved, and more efficient packaging and more stable chip stress are achieved, reducing costs and improving heat dissipation efficiency.
Patent Information
- Application Number
- CN202420935505.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-30
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-04-30
AI Technical Summary
The existing laser light source packaging structure is low in efficiency, resulting in low power, high packaging cost and low heat dissipation efficiency, and unstable chip stress.
The flip-flop stacked and side-mounted packaging structure is adopted, and the substrate is mounted parallel to the chip to achieve an unblocked laser light source structure at both ends, reducing the packaging thickness and processing complexity.
It improves packaging efficiency and chip stress stability, extends service life, reduces packaging costs, and improves heat dissipation efficiency.
Smart Images
Figure CN222620391U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductor packaging, in particular to a laser light source flip-chip side-mount packaging structure. Background Art
[0002] Laser light sources have been widely used in various fields of industrial and agricultural production and science and technology. Since the characteristic of laser light sources is that light is emitted from the end face, the existing direct-insertion laser light source packaging structure uses a vertical substrate and then a tube shell packaging. This packaging method is inefficient, and there is a shielding on one side of the chip, resulting in low power, high packaging cost, and low heat dissipation efficiency of the packaging structure, and the chip is unstable.
[0003] In view of this, this technical solution proposes a laser light source flip-chip side-mounted packaging structure, which adopts flip-chip stacking and side-mounted packaging structure to improve packaging efficiency. The overall structure is simple, the packaging efficiency is high, the chip is stable in force, the service life is long, and it is easy to mount and process. Utility Model Content
[0004] The technical solution of the utility model aims to solve at least one of the technical problems in the related art to a certain extent. To this end, the main purpose of the utility model is to provide a laser light source flip-chip side-mount packaging structure, aiming to solve the problems of low packaging efficiency and low power of the laser light source packaging structure in the prior art.
[0005] To achieve the above-mentioned purpose, the utility model provides a flip-chip side-mounted packaging structure of a laser light source, comprising a base, and a first pole piece and a second pole piece mounted parallel to the base, the first pole piece and the second pole piece, a chip is mounted parallel to the surface of one end of the first pole piece, the chip and the second pole piece are connected by leads, and the chip is flush with the first pole piece, the second pole piece and one end of the base.
[0006] As a further solution of the utility model, the base is composed of a first substrate at the bottom and a second substrate mounted parallel to the surface of the first substrate, and the first pole piece, the second pole piece and the chip are all mounted parallel to the surface of the first substrate.
[0007] As a further solution of the utility model, a terminal pin for side connection is provided at the bottom of one side of the first substrate.
[0008] As a further solution of the present invention, the chip is a laser light source structure with unobstructed ends.
[0009] As a further solution of the present invention, the base is a laser lens glass substrate structure.
[0010] The beneficial effects of the utility model are as follows:
[0011] The laser light source flip-chip side-mount packaging structure proposed in the utility model has BRIEF DESCRIPTION OF THE DRAWINGS
[0012] In order to more clearly illustrate the embodiments of the utility model technical solution or the utility model technical solution in the prior art, the drawings required for use in the embodiments or the prior art descriptions will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the utility model technical solution. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0013] Figure 1 It is a schematic diagram of the planar structure of the packaging structure of the utility model.
[0014] Figure 2 A schematic three-dimensional perspective diagram of the chip arrangement of the packaging structure of the utility model.
[0015] Figure 3 It is a schematic diagram of the structure of the other side of the packaging structure of the utility model.
[0016] [Main parts / assembly reference numerals]
[0017] Label name Label name 1 Base 21 The first pole 10 First substrate 22 The second pole piece 11 Second substrate 3 chip 20 lead 4 Terminal pins DETAILED DESCRIPTION
[0018] as follows:
[0019] Please refer to the attached Figure 1-3 ,
[0020] The main structure includes a base 1, and a first pole piece 21 and a second pole piece 22 mounted parallel to the base 1. The first pole piece 21 and the second pole piece 22, a chip 3 is mounted parallel to the surface of one end of the first pole piece 21, the chip 3 and the second pole piece 22 are connected by a lead 20, and the chip 3 is flush with the first pole piece 21, the second pole piece 22 and one end of the base 1.
[0021] Here’s how it works:
[0022] Compared with the direct-insertion laser light source packaging structure used in the prior art (the substrate is placed vertically and then packaged in a tube shell), this solution adopts a packaging structure in which the substrate and chip 3 are mounted in parallel, and the chip 3 emits light from one side, so that the overall thickness of the laser light source package is thinner. Since the chip 3 is placed flat on the substrate, many complicated processing processes are omitted. It is only necessary to keep the two ends of the chip 3 unobstructed and the bottom in contact with the substrate.
[0023] A preferred embodiment of the utility model: the base 1 is composed of a first substrate 10 at the bottom, and a second substrate 11 mounted parallel to the surface of the first substrate 1, and the first pole piece 21, the second pole piece 22 and the chip 3 are all mounted parallel to the surface of the first substrate 10. The chip 3 is a laser light source structure with no shielding at both ends. The base 1 is a laser lens glass substrate structure.
[0024] A double-layer or multi-layer substrate is used to raise the chip 3 so that it is higher than the side to reduce shielding and power loss.
[0025] A preferred embodiment of the present invention: a terminal pin 4 for side connection is provided at the bottom of one side of the first substrate 1 .
[0026] The above are only preferred embodiments of the technical solution of the utility model, and do not limit the patent scope of the technical solution of the utility model. All equivalent structural changes made by using the contents of the technical solution description and drawings of the utility model under the conception of the technical solution of the utility model, or direct / indirect application in other related technical fields are included in the patent protection scope of the technical solution of the utility model.
Claims
1. A laser light source flip-chip side-mount packaging structure, characterized in that: include A base, and a first pole piece and a second pole piece on one side mounted parallel to the base, the first pole piece and the second pole piece, a chip is mounted parallel to the surface of one end of the first pole piece, the chip and the second pole piece are connected by leads, and the chip is flush with the first pole piece, the second pole piece and one end of the base.
2. The laser light source flip-chip side-mount packaging structure according to claim 1, characterized in that: The base is composed of a first substrate at the bottom and a second substrate mounted parallel to the surface of the first substrate. The first pole piece, the second pole piece and the chip are all mounted parallel to the surface of the first substrate.
3. The laser light source flip-chip side-mount packaging structure according to claim 2, characterized in that: A terminal pin for side connection is provided at the bottom of one side of the first substrate.
4. The laser light source flip-chip side-mount packaging structure according to claim 1, characterized in that: The chip is a laser light source structure with unobstructed ends.
5. The laser light source flip-chip side-mount packaging structure according to claim 1, characterized in that: The base is a laser lens glass substrate structure.