Semiconductor laser

Abstract

The utility model relates to the technical field of lasers, in particular to a semiconductor laser which comprises a shell with an inner cavity, an optical device and a laser chip, the optical device and the laser chip are arranged in the inner cavity, the shell is further provided with a first jack, a mounting groove and a second jack which are sequentially arranged, and the first jack is communicated with the inner cavity. Laser output by the laser chip is emitted to the first jack after passing through the optical device; the semiconductor laser further comprises an optical fiber pigtail, and the optical fiber pigtail comprises an insertion core, a fixing sleeve and an optical fiber. The insertion core is arranged in the first insertion hole and is provided with a first through hole. The fixing sleeve is arranged on the shell and located outside the inner cavity, and the fixing sleeve is provided with a second through hole right opposite to the second insertion hole. The optical fiber passes through the first through hole and the second through hole and is located in the first jack, the first through hole, the installation groove, the second through hole and the second jack. By arranging the first jack, the mounting groove and the second jack, the distance between the optical fiber and the optical device can be shortened, so that the power stability can be maintained.

Description

Technical Field

[0001] The present application relates to the field of laser technology, and in particular to a semiconductor laser. Background Art

[0002] Semiconductor lasers usually output laser light from a laser chip and then use optical devices to adjust, steer, and combine the laser light before it enters an optical fiber. In related technologies, the end of the optical fiber is usually adjacent to the side wall of the semiconductor laser shell, which causes the optical path inside the semiconductor laser to be too long, thereby affecting the power of the semiconductor laser. Utility Model Content

[0003] In view of the above, it is necessary to provide a semiconductor laser that can shorten the optical path inside the semiconductor laser.

[0004] The present application provides a semiconductor laser, comprising a housing provided with an inner cavity, an optical device and a laser chip provided in the inner cavity, the housing further comprising a first jack, a mounting groove and a second jack arranged in sequence, the first jack being connected to the inner cavity, and the laser output by the laser chip being emitted to the first jack after passing through the optical device; the semiconductor laser further comprises an optical fiber pigtail, the optical fiber pigtail comprising a core insert, a fixing sleeve and an optical fiber. The core insert is provided in the first jack and is provided with a first through hole. The fixing sleeve is provided in the housing and is located outside the inner cavity, and the fixing sleeve is provided with a second through hole directly opposite to the second jack. The optical fiber is passed through the first through hole and the second through hole, and is located in the first jack, the first through hole, the mounting groove, the second through hole and the second jack.

[0005] In the semiconductor laser of the above embodiment, the laser light after passing through the optical device is emitted to the optical fiber at the first jack, the first through hole of the ferrule and the second through hole of the fixing sleeve are used to fix the optical fiber, and a mounting groove is provided to facilitate the installation of the ferrule in the first jack. By arranging the first jack, the mounting groove and the second jack, the distance between the optical fiber and the optical device can be shortened, thereby shortening the optical path, so as to maintain power stability and reduce the situation where the laser power is affected by the excessively long optical path in the housing.

[0006] In a possible implementation manner, the diameter of the first plug hole matches the diameter of the ferrule, and the diameter of the second plug hole is larger than the diameter of the ferrule.

[0007] In a possible implementation, the first socket has a light-transmitting portion and a positioning portion, the light-transmitting portion is located on a side of the positioning portion away from the mounting groove, the diameter of the light-transmitting portion is smaller than the diameter of the positioning portion, the diameter of the positioning portion matches the diameter of the ferrule, and the ferrule is supported against a side wall where the positioning portion and the light-transmitting portion are connected.

[0008] In a possible implementation, the core is partially located in the first plug hole, and the other part is located in the installation groove.

[0009] In a possible implementation, the laser chip includes a plurality of first chips, and the plurality of first chips are arranged along a first direction. The optical device includes a plurality of first fast-axis collimators, a plurality of first slow-axis collimators, a plurality of first reflectors, a first light path steering element, a second light path steering element and a focusing module. The plurality of first chips correspond one-to-one to the plurality of first fast-axis collimators, the plurality of first slow-axis collimators and the plurality of first reflectors, respectively. The first light path steering element and the second light path steering element are arranged along a second direction, the second light path steering element and the focusing module are arranged in a direction opposite to the first direction, and the first direction intersects with the second direction.

[0010] The laser light outputted by each of the first chips passes through the first fast-axis collimator, the first slow-axis collimator, the first reflector, the first light path steering element, the second light path steering element and the focusing module in sequence and then enters the optical fiber.

[0011] The laser light reflected by the first reflector is emitted along a first direction, and the laser light reflected by the second light path redirecting element is emitted along a direction opposite to the first direction.

[0012] In a possible implementation, the laser chip further includes a plurality of second chips, the plurality of second chips are arranged along the first direction, the optical device further includes a plurality of second fast-axis collimators, a plurality of second slow-axis collimators, a plurality of second reflectors and a polarization beam combining module, and the plurality of second chips correspond one-to-one to the plurality of second fast-axis collimators, the plurality of second slow-axis collimators and the plurality of second reflectors respectively;

[0013] The laser output by the second chip passes through the second fast-axis collimator, the second slow-axis collimator, the second reflector, the polarization beam combining module, the second optical path steering element and the focusing module in sequence.

[0014] In a possible implementation manner, the optical fiber pigtail is located on a side of the second chip away from the first chip.

[0015] In a possible implementation, the inner cavity is provided with a light baffle, and the light baffle is located between the laser chip and the focusing module.

[0016] In a possible implementation, the shell includes a main body, a cover plate and a sealing plate, the inner cavity is located in the main body, the cover plate is arranged on the main body to seal the inner cavity, and the sealing plate is arranged on a side of the main body away from the cover plate to seal the installation groove.

[0017] In a possible implementation manner, the shell is substantially rectangular in shape.

[0018] In the semiconductor laser described above, the optical path of the semiconductor laser is shortened by providing the first plug hole, the mounting groove and the second plug hole, and the situation that the optical path is too long and affects the laser power is reduced. The laser directed to the optical fiber is propagated in the opposite direction of the first direction by providing the first optical path steering element and the second optical path steering element, which is conducive to shortening the size of the housing, and the first plug hole, the mounting groove and the second plug hole are matched to keep the optical path short when reducing the size of the housing, and the housing is roughly rectangular and has better strength. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is an exploded view of a semiconductor laser in one embodiment of the present application.

[0020] Figure 2 yes Figure 1 An exploded view of a semiconductor laser from another angle.

[0021] Figure 3 yes Figure 1 A partial cross-sectional stereogram of a semiconductor laser.

[0022] Figure 4 yes Figure 1 Side cross-sectional view of a semiconductor laser.

[0023] Figure 5 It is a schematic diagram of the optical path of a semiconductor laser in one embodiment of the present application.

[0024] Figure 6 It is a schematic diagram of the optical path of a semiconductor laser in another embodiment of the present application.

[0025] Figure 7 It is a schematic diagram of the optical path of a semiconductor laser in yet another embodiment of the present application.

[0026] Description of main component symbols:

[0027] 100. Semiconductor laser;

[0028] 10. Shell; 11. Main body; 111. Inner cavity; 112. First plug hole; 1121. Light-transmitting portion; 1122. Positioning portion; 113. Mounting groove; 114. Second plug hole; 12. Cover plate; 13. Closing plate; 14. Light shielding plate;

[0029] 20. Optical device; 211. First fast axis collimator; 212. Second fast axis collimator; 221. First slow axis collimator; 222. Second slow axis collimator; 231. First reflector; 232. Second reflector; 241. First light path steering element; 242. Second light path steering element; 25. Focusing module; 251. Fast axis focusing lens; 252. Slow axis focusing lens; 26. Polarization beam combining module;

[0030] 30. laser chip; 31. first chip; 32. second chip;

[0031] 40. Optical fiber pigtail; 41. Ferrule; 42. Fixing sleeve; 43. Optical fiber;

[0032] X, first direction; Y, second direction; Z, third direction. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0034] It should be understood that, considering the actual tolerance factor, the term "perpendicular" in the technical solution of this application is used to describe the ideal state between two components. In actual production or use, the two components may be in a state that is approximately perpendicular to each other. The two components described as "perpendicular" may not be absolutely straight lines or planes, but may be roughly straight lines or planes. From a macroscopic point of view, the components can be considered "straight lines" or "planes" if the overall extension direction is a straight line or a plane.

[0035] See also Figure 1 , Figure 1 A three-dimensional diagram of a semiconductor laser provided for some embodiments of the present application. The semiconductor laser is approximately rectangular. On this basis, in order to facilitate the description of each embodiment below, an XYZ coordinate system is established, and the first direction is defined as the X-axis direction, the length direction of the semiconductor laser is parallel to the first direction, the second direction is the Y-axis direction, the length direction of the semiconductor laser is parallel to the second direction, and the third direction is the Z-axis direction, and the thickness of the semiconductor laser is parallel to the Z-axis direction. It can be understood that the coordinate system setting of the semiconductor laser can be flexibly set according to actual needs, and no specific limitation is made here. The three axes X, Y, and Z are not necessarily mutually perpendicular, and there may be a certain angle deviation, for example, the angle between the X-axis and the Y-axis is 80°.

[0036] See also Figure 1 The semiconductor laser 100 includes a housing 10, an optical device 20 and a laser chip 30. The housing 10 is provided with an inner cavity 111, the optical device 20 and the laser chip 30 are located in the inner cavity 111, and the laser output by the laser chip 30 is output to the outside of the housing 10 through the optical device 20.

[0037] See also Figure 1 , Figure 2 and Figure 3 The housing 10 is also provided with a first jack 112, a mounting groove 113 and a second jack 114 arranged in sequence along the first direction X. The first jack 112 is connected to the inner cavity 111, and the laser output by the laser chip 30 is emitted to the first jack 112 after passing through the optical device 20. The semiconductor laser 100 also includes an optical fiber pigtail 40, which includes a core ferrule 41, a fixing sleeve 42 and an optical fiber 43. The core ferrule 41 is arranged in the first jack 112 and is provided with a first through hole. The fixing sleeve 42 is arranged in the housing 10 and is located outside the inner cavity 111. The fixing sleeve 42 is provided with a second through hole directly opposite to the second jack 114. The optical fiber 43 is passed through the first through hole and the second through hole, and is located in the first jack 112, the first through hole, the mounting groove 113, the second through hole and the second jack 114.

[0038] The laser after passing through the optical device 20 is emitted to the optical fiber 43 at the first socket 112. The first through hole of the ferrule 41 and the second through hole of the fixing sleeve 42 are used to fix the optical fiber 43. The mounting groove 113 is provided to facilitate the installation of the ferrule 41 in the first socket 112. By arranging the first socket 112, the mounting groove 113 and the second socket 114, the distance between the optical fiber 43 and the optical device 20 can be shortened, thereby shortening the optical path, so as to maintain power stability and reduce the situation where the laser power is affected by the excessively long optical path in the housing 10.

[0039] In some embodiments, the diameter of the first plug hole 112 matches the diameter of the ferrule 41, so that the ferrule 41 can be stably inserted into the first plug hole 112, and the diameter of the second plug hole 114 is larger than the diameter of the ferrule 41. During installation, the ferrule 41 is first fixed to the optical fiber 43, and the ferrule 41 is moved from the second plug hole 114 to the installation groove 113 manually or mechanically, and then the ferrule 41 in the installation groove 113 is inserted into the first plug hole 112.

[0040] By setting the diameter of the second plug hole 114 to be larger than the diameter of the first plug hole 112 , the ferrule 41 can be inserted into the first plug hole 112 , and the method of installing the ferrule 41 in the first plug hole 112 is simple and quick.

[0041] In some embodiments, the dimensions of the mounting groove 113 in the second direction Y and the third direction Z are both larger than the dimensions of the first socket 112 and the second socket 114 in the second direction Y and the third direction Z, so that when installing the ferrule 41, the ferrule 41 can be located in the mounting groove 113 after passing through the second socket 114. The mounting groove 113 with a larger space can facilitate manual or mechanical insertion of the ferrule 41 located in the mounting groove 113 into the first socket 112.

[0042] See also Figure 4 In some embodiments, the first plug hole 112 has a light-transmitting portion 1121 and a positioning portion 1122. The light-transmitting portion 1121 and the positioning portion 1122 are both circular hole-shaped and coaxially arranged. The light-transmitting portion 1121 is located on the side of the positioning portion 1122 away from the mounting groove 113. The diameter of the light-transmitting portion 1121 is smaller than the diameter of the positioning portion 1122. The diameter of the positioning portion 1122 matches the diameter of the ferrule 41. The ferrule 41 is supported on the side wall where the positioning portion 1122 and the light-transmitting portion 1121 are connected.

[0043] After passing through the optical device 20, the laser enters the light-transmitting portion 1121 and then enters the optical fiber 43. By setting the diameter of the light-transmitting portion 1121 smaller than the diameter of the positioning portion 1122, the diameter of the positioning portion 1122 matches the diameter of the ferrule 41, so that the ferrule 41 can enter the positioning portion 1122, and the ferrule 41 abuts against the side wall where the positioning portion 1122 and the light-transmitting portion 1121 meet to achieve the position positioning of the optical fiber 43, so as to ensure that the laser after passing through the optical device 20 can accurately enter the optical fiber 43.

[0044] It is understandable that the method of positioning the optical fiber 43 is not limited to setting the light-transmitting portion 1121 and the positioning portion 1122 of different diameters. For example, the diameter of the light-transmitting portion 1121 and the positioning portion 1122 may be the same. By making a mark in the ferrule 41, the ferrule 41 is inserted into the positioning portion 1122. When the mark of the ferrule 41 is flush with the opening of the positioning portion 1122, it indicates that the optical fiber 43 is in a suitable position. For another example, a card block is set on the outside of the ferrule 41. When the card block abuts against the side wall of the opening of the positioning portion 1122, it indicates that the optical fiber 43 is in a suitable position, thereby positioning the optical fiber 43.

[0045] In some embodiments, part of the ferrule 41 is located in the positioning portion 1122, and the other part is located in the mounting groove 113, so that when maintenance is required, the ferrule 41 located in the mounting groove 113 is held by hand or a mechanical structure to pull the ferrule 41 out of the positioning portion 1122. Maintenance is more convenient and quick.

[0046] The shape of the shell 10 is roughly rectangular, which can be easily machined, and the shell 10 has high overall strength and stability. In addition, by providing the first hole 112, the mounting groove 113 and the second hole 114 to shorten the optical path, the situation where the optical path length is too long due to the shape of the shell 10 can be reduced.

[0047] The housing 10 includes a main body 11, a cover plate 12 and a sealing plate 13. The inner cavity 111, the first plug hole 112, the mounting groove 113 and the second plug hole 114 are all arranged in the main body 11. The opening of the inner cavity 111 is located in the third direction Z, that is, located at the top. The opening of the mounting groove 113 is located in the opposite direction of the third direction Z, that is, located at the bottom.

[0048] The cover plate 12 is arranged at the opening of the inner cavity 111 of the main body 11, and is used to seal the inner cavity 111. The sealing plate 13 is arranged on the side of the main body 11 away from the cover plate 12, and is used to seal the installation groove 113 to protect the optical fiber 43 and the ferrule 41. The cover plate 12 and the main body 11 are connected by welding, and the sealing plate 13 and the main body 11 are connected by bolts. It should be noted that the connection method between the cover plate 12 and the main body 11 and the sealing plate 13 and the main body 11 is not limited, for example, it can also be a clamping, riveting and other methods. The opening position of the installation groove 113 is also not limited, for example, it can also be located in the third direction Z, the second direction Y or the opposite direction of the second direction Y.

[0049] See also Figure 5 In some embodiments, the laser chip 30 includes a plurality of first chips 31, and the plurality of first chips 31 are arranged on the bottom wall of the inner cavity 111 along the first direction X. The optical device 20 includes a first fast axis collimator 211, a plurality of first slow axis collimators 221, a plurality of first reflectors 231, a first optical path steering element 241, a second optical path steering element 242, and a focusing module 25. The plurality of first chips 31 correspond to the plurality of first fast axis collimators 211, the plurality of first slow axis collimators 221, and the plurality of first reflectors 231 one by one, and are arranged in sequence along the second direction Y. The first optical path steering element 241 and the second optical path steering element 242 are arranged along the second direction Y. The second optical path steering element 242 and the focusing module 25 are arranged in the opposite direction of the first direction X.

[0050] Each first chip 31 outputs laser light along the second direction Y. The laser light is collimated in the fast axis direction by the first fast axis collimator 211, and then collimated in the slow axis direction by the first slow axis collimator 221, and then reflected by the first reflector 231 and emitted along the first direction X. Therefore, the laser light output by several first chips 31 is combined after passing through the corresponding first reflector 231. The combined laser light propagates in the second direction Y after passing through the first optical path steering element 241, propagates in the opposite direction of the first direction X after passing through the second optical path steering element 242, and enters the optical fiber 43 after being focused by the focusing module 25.

[0051] By providing the first light path redirecting element 241 and the second light path redirecting element 242, the laser beam propagating in the first direction X is transformed into the laser beam propagating in the opposite direction of the first direction X, so that the second redirecting element and the focusing module 25 can be arranged in the opposite direction of the first direction X, and the focusing module 25 does not need to be arranged in the same row as the first reflectors 231, which can effectively reduce the length of the semiconductor laser 100 in the first direction X. Furthermore, by providing the first insertion hole 112, the mounting groove 113 and the second insertion hole 114, the optical path is shortened while keeping the shape of the main body 11 substantially rectangular, thereby reducing the occurrence of the situation where the optical path in the inner cavity 111 is too long and affects the power.

[0052] See also Figure 6 In some embodiments, the laser chip 30 further includes a plurality of second chips 32, and the plurality of second chips 32 are arranged along the first direction X. The optical device 20 further includes a plurality of second fast-axis collimators 212, a plurality of second slow-axis collimators 222, a plurality of second reflectors 232, and a polarization beam combining module 26. The plurality of second chips 32 correspond one-to-one to the plurality of second fast-axis collimators 212, the plurality of second slow-axis collimators 222, and the plurality of second reflectors 232, respectively. The second chips 32, the second fast-axis collimators 212, the second slow-axis collimators 222, and the second reflectors 232 are arranged in the opposite direction of the second direction Y.

[0053] The second chip 32 outputs laser light in the opposite direction of the second direction Y. The laser light is collimated in the fast axis direction by the second fast axis collimator 212, and then collimated in the slow axis direction by the second slow axis collimator 222. Then, the laser light is reflected by the second reflector 232 and propagates in the first direction X. Thus, the laser lights output by the second chips 32 are combined and emitted to the polarization beam combining module 26. After passing through the polarization beam combining module 26, the laser light output by the first chip 31 is combined with the laser light output by the second chip 32, and are emitted to the second optical path steering element 242 together.

[0054] The overall power of the semiconductor laser 100 can be increased by providing a plurality of second chips 32. The polarization beam combining module 26 can combine the laser beams output by the first chip 31 and the second chip 32.

[0055] In some embodiments, each first chip 31 is aligned with a second chip 32 in the second direction Y, and along the second direction Y, the first chip 31, the first fast axis collimator 211, the first slow axis collimator 221, the first reflector 231, the second reflector 232, the second slow axis collimator 222, the second fast axis collimator 212 and the second chip 32 are arranged along the second direction Y.

[0056] In other embodiments, the first chip 31, the first fast-axis collimator 211, the first slow-axis collimator 221 and the first reflector 231 are used as a combination, and the second chip 32, the second fast-axis collimator 212, the second slow-axis collimator 222 and the second reflector 232 are used as another combination, and the two combinations are alternately arranged so that the size of the semiconductor laser 100 can be shortened in the second direction Y.

[0057] The focusing module 25 includes a fast-axis focusing lens 251 and a slow-axis focusing lens 252 . After passing through the fast-axis focusing lens 251 and the slow-axis focusing lens 252 , the laser light is focused in the fast-axis direction and the slow-axis direction respectively and enters the optical fiber 43 .

[0058] In some embodiments, the optical fiber pigtail 40 is located on a side of the second chip 32 away from the first chip 31 .

[0059] See also Figure 7 In other embodiments, the optical fiber pigtail 40 is located between the first chip 31 and the second chip 32 , and the first light path steering element 241 , the polarization beam combining module 26 and the second light path steering element 242 are arranged along the second direction Y. Each first chip 31 is directly opposite to a second chip 32 .

[0060] See also Figure 3 and Figure 4 In some embodiments, the inner cavity 111 is provided with a light shielding plate 14, and the light shielding plate 14 is located between the laser chip 30 and the focusing module 25 to reduce the occurrence of laser being emitted to the focusing module 25 from other directions.

[0061] In summary, in the semiconductor laser 100 of the embodiment of the present application, the optical path inside the semiconductor laser 100 is shortened by providing the first insertion hole 112, the mounting groove 113 and the second insertion hole 114, which is conducive to maintaining power stability. By providing the first optical path deflection element 241 and the second optical path deflection element 242, the length of the optical path in the first direction X can be shortened.

[0062] Obviously, the embodiments described above are only part of the embodiments of the present application, rather than all of the embodiments. The present application is not limited to the details of the above embodiments, and any appropriate changes or modifications made by ordinary technicians in the relevant technical field are deemed to be within the patent scope of the present application.

Claims

1. A semiconductor laser, comprising a housing having an inner cavity, an optical device disposed in the inner cavity, and a laser chip, wherein: The housing is further provided with a first jack, a mounting groove and a second jack arranged in sequence, the first jack is communicated with the inner cavity, and the laser output by the laser chip is emitted to the first jack after passing through the optical device; the semiconductor laser further includes an optical fiber pigtail, and the optical fiber pigtail includes: An ferrule, the ferrule is arranged in the first jack and is provided with a first through hole; A fixing sleeve, the fixing sleeve is arranged on the housing and is located outside the inner cavity, and the fixing sleeve is provided with a second through hole directly facing the second plug hole; An optical fiber is passed through the first through hole and the second through hole, and is located at the first plugging hole, the first through hole, the mounting groove, the second through hole, and the second plugging hole.

2. The semiconductor laser according to claim 1, characterized in that The diameter of the first plug hole matches the diameter of the ferrule, and the diameter of the second plug hole is larger than the diameter of the ferrule.

3. The semiconductor laser according to claim 1, characterized in that The first plug hole has a light-transmitting portion and a positioning portion, wherein the light-transmitting portion is located on a side of the positioning portion away from the mounting groove, the diameter of the light-transmitting portion is smaller than the diameter of the positioning portion, the diameter of the positioning portion matches the diameter of the ferrule, and the ferrule is supported against a side wall where the positioning portion and the light-transmitting portion are connected.

4. The semiconductor laser according to claim 1, characterized in that The insert core is partially located in the first insert hole, and the other part is located in the installation groove.

5. The semiconductor laser according to claim 1, characterized in that The laser chip includes a plurality of first chips, and the plurality of first chips are arranged along a first direction. The optical device includes a plurality of first fast-axis collimators, a plurality of first slow-axis collimators, a plurality of first reflectors, a first light path steering element, a second light path steering element, and a focusing module. The plurality of first chips correspond to the plurality of first fast-axis collimators, the plurality of first slow-axis collimators, and the plurality of first reflectors one by one. The first light path steering element and the second light path steering element are arranged along a second direction, and the second light path steering element and the focusing module are arranged in a direction opposite to the first direction, and the first direction intersects with the second direction. The laser light outputted by each of the first chips sequentially passes through the first fast-axis collimator, the first slow-axis collimator, the first reflector, the first light path steering element, the second light path steering element and the focusing module, and then enters the optical fiber; The laser light reflected by the first reflector is emitted along a first direction, and the laser light reflected by the second light path redirecting element is emitted along a direction opposite to the first direction.

6. The semiconductor laser according to claim 5, characterized in that The laser chip further includes a plurality of second chips, which are arranged along the first direction, and the optical device further includes a plurality of second fast-axis collimators, a plurality of second slow-axis collimators, a plurality of second reflectors and a polarization beam combining module, and the plurality of second chips correspond to the plurality of second fast-axis collimators, the plurality of second slow-axis collimators and the plurality of second reflectors one by one respectively; The laser output by the second chip passes through the second fast-axis collimator, the second slow-axis collimator, the second reflector, the polarization beam combining module, the second optical path steering element and the focusing module in sequence.

7. The semiconductor laser according to claim 6, characterized in that The optical fiber pigtail is located at a side of the second chip away from the first chip.

8. The semiconductor laser according to claim 5, characterized in that The inner cavity is provided with a light blocking plate, and the light blocking plate is located between the laser chip and the focusing module.

9. The semiconductor laser according to claim 1, characterized in that The shell includes a main body, a cover plate and a sealing plate. The inner cavity is located in the main body. The cover plate is arranged on the main body to seal the inner cavity. The sealing plate is arranged on a side of the main body away from the cover plate to seal the installation groove.

10. The semiconductor laser according to claim 1, characterized in that The shell is roughly rectangular in shape.

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