Heat dissipation assembly and air conditioner

Abstract

The utility model relates to the technical field of air conditioners, in particular to a heat dissipation assembly and an air conditioner, the heat dissipation assembly comprises a heat conduction mechanism and a refrigerant pipe, the heat conduction mechanism is provided with a heat absorption end and a heat dissipation end which can conduct heat exchange, the heat absorption end is used for absorbing heat dissipated by components, and the refrigerant pipe is attached to the heat dissipation end of the heat conduction mechanism; according to the heat dissipation assembly, the heat of the heat dissipation end can be taken away when the refrigerant in the refrigerant pipe passes through the heat dissipation end of the heat conduction mechanism, the heat dissipation assembly can efficiently dissipate heat of the controller in a high-temperature environment, and damage to an electric appliance caused by condensation can be avoided.

Description

Technical Field

[0001] The present application relates to the technical field of air conditioning, and in particular to a heat dissipation component and an air conditioner. Background Art

[0002] In a high temperature environment, the air conditioner has poor heat dissipation in the controller, which causes the compressor to limit / reduce frequency, resulting in insufficient air conditioning cooling capacity. At present, the heat dissipation of the controller mainly includes traditional air cooling technology and industry liquid cooling technology. Traditional air cooling technology: 3P external unit high temperature cooling IGBT 96.7℃ has reached the reliability limit requirements. In order to increase the heat dissipation of air cooling in a high temperature environment, it is necessary to increase the heat dissipation area of ​​the aluminum plate, which has low heat dissipation efficiency and increased costs. Industry liquid cooling technology: The low-temperature refrigerant substrate is in direct contact with the control device, and the control device is prone to condensation and short-circuit damage. Therefore, there is an urgent need for a heat dissipation component that can effectively improve the heat dissipation effect of the controller and avoid condensation on the controller. Utility Model Content

[0003] The purpose of the present application is to provide a heat dissipation component and an air conditioner, wherein the heat dissipation component can efficiently dissipate heat from a controller in a high temperature environment and can prevent condensation from causing damage to the electrical appliance.

[0004] To this end, on the first aspect, an embodiment of the present application provides a heat dissipation component, including: a heat conducting mechanism, the heat conducting mechanism having a heat absorbing end and a heat dissipating end for heat exchange, the heat absorbing end being used to absorb heat dissipated by components; and a refrigerant pipe, the refrigerant pipe being fitted to the heat dissipating end of the heat conducting mechanism so that the refrigerant in the refrigerant pipe takes away the heat from the heat dissipating end when passing through the heat dissipating end of the heat conducting mechanism.

[0005] In a possible implementation, the heat conduction mechanism includes a substrate and a heat conduction pipe disposed on the substrate, the substrate includes a heat dissipation module and a heat absorption module, and the heat dissipation module and the heat absorption module exchange heat through the heat conduction pipe.

[0006] In a possible implementation, a gap is left between the heat absorption module and the heat dissipation module.

[0007] In a possible implementation, a heat insulation module is provided between the heat absorption module and the heat dissipation module, and the heat insulation module is a heat insulation material provided in the gap between the heat absorption module and the heat dissipation module.

[0008] In a possible implementation, the substrate is an integral structure, or the heat absorption module and the heat dissipation module of the substrate are separate structures.

[0009] In one possible implementation, the heat pipe has a first end that is attached to the heat absorption module and a second end that is attached to the heat dissipation module; the heat absorption module and / or the first end form the heat absorption end of the heat conduction mechanism; the heat dissipation module and / or the second end form the heat dissipation end of the heat conduction mechanism.

[0010] In a possible implementation, the heat pipe is filled with cooling liquid, the cooling liquid is vaporized into a gas phase at the first end and flows to the second end, and the gas phase is condensed into a liquid phase at the second end and flows to the first end.

[0011] In a possible implementation manner, a height of the first end is lower than a height of the second end.

[0012] In a possible implementation, the refrigerant in the refrigerant pipe is cooling water, air or refrigerant.

[0013] In a possible implementation, the refrigerant pipe is a suction pipe of a compressor or an output pipe of a condenser.

[0014] In one possible implementation, a first receiving groove is provided on the heat absorption module, and a second receiving groove and a third receiving groove are provided on the heat dissipation module. A portion of the heat conduction pipe is located in the first receiving groove, and the other portion is located in the second receiving groove. The refrigerant pipe is arranged in the third receiving groove and abuts against the heat dissipation end of the heat conduction mechanism.

[0015] In a possible implementation, the heat dissipation assembly further includes a cover plate disposed on the substrate, and the cover plate is used to compress the heat conduction pipe and the refrigerant pipe.

[0016] In a second aspect, an embodiment of the present application provides an air conditioner, comprising: a compressor, a condenser and an evaporator connected in sequence; and the above-mentioned heat dissipation component, wherein the refrigerant pipe of the heat dissipation component is selected from the intake pipe of the compressor or the output pipe of the condenser.

[0017] According to the heat dissipation component and air conditioner provided in the embodiments of the present application, the heat dissipation component exchanges heat with the components through the heat absorption end of the heat conduction mechanism, takes away the heat emitted by the components, transfers the heat to the heat dissipation end and takes away the heat from the heat dissipation end through the refrigerant pipe, thereby achieving heat dissipation of the components. Compared with traditional air-cooled heat dissipation, it can efficiently dissipate the heat of the components in a high temperature environment. Compared with the existing refrigerant pipe that directly exchanges heat with the components and is prone to condensation problems and damages the components, the refrigerant pipe in the present application dissipates heat from the components through the heat conduction mechanism, which can avoid condensation from causing damage to the electrical appliances. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0020] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0021] Figure 1 A schematic diagram of the three-dimensional structure of a heat dissipation assembly provided in an embodiment of the present application is shown;

[0022] Figure 2 A schematic diagram of an exploded structure of a heat dissipation assembly provided in an embodiment of the present application is shown;

[0023] Figure 3 A schematic diagram showing the structure of a heat dissipation assembly and components provided in an embodiment of the present application is shown;

[0024] Figure 4 A schematic diagram of an exploded structure of a heat dissipation assembly and components provided in an embodiment of the present application is shown;

[0025] Figure 5 A schematic diagram of the planar structure of a heat dissipation assembly and components provided in an embodiment of the present application is shown;

[0026] Figure 6 A structural block diagram of a heat dissipation component, an evaporator, a condenser, and a compressor provided in an embodiment of the present application is shown;

[0027] Figure 7 A structural block diagram of another heat dissipation component, evaporator, condenser and compressor provided in an embodiment of the present application is shown.

[0028] Description of reference numerals:

[0029] 1. heat conduction mechanism; 11. heat absorption end; 12. heat dissipation end; 13. substrate; 131. heat dissipation module; 1311. second receiving groove; 1312. third receiving groove; 132. heat absorption module; 1321. first receiving groove; 133. heat insulation module; 14. heat conduction pipe; 141. first end; 142. second end;

[0030] 2. Refrigerant pipe;

[0031] 3. Compressor;

[0032] 4. Condenser;

[0033] 5. Evaporator;

[0034] 6. Cover plate;

[0035] 7. Components;

[0036] 8. Electrical box. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0038] The disclosure below provides many different embodiments or examples to realize the different structures of the embodiments of the present application. In order to simplify the disclosure of the embodiments of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the embodiments of the present application. In addition, the embodiments of the present application can repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0039] For ease of description, spatial relative terms may be used herein to describe the relative positional relationship or movement of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", "front", "back", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure undergoes a position flip or a posture change or a motion state change, then these directional indications also change accordingly, for example: an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative descriptors used herein are interpreted accordingly.

[0040] In order to solve the problems in the prior art, the present application provides a heat dissipation component and an air conditioner, wherein the heat dissipation component can efficiently dissipate heat from a controller in a high temperature environment and can prevent condensation from causing damage to the electrical appliance.

[0041] like Figure 1-7As shown, an embodiment of the present application provides a heat dissipation component, including: a heat conducting mechanism 1, the heat conducting mechanism 1 having a heat absorbing end 11 and a heat dissipating end 12 for heat exchange, the heat absorbing end 11 being used to absorb the heat dissipated by the components 7; and a refrigerant tube 2, the refrigerant tube 2 being attached to the heat dissipating end 12 of the heat conducting mechanism 1, so that the refrigerant in the refrigerant tube 2 takes away the heat of the heat dissipating end 12 when passing through the heat dissipating end 12 of the heat conducting mechanism 1.

[0042] In the present application, heat is exchanged between the heat absorbing end 11 of the heat conducting mechanism 1 and the component 7, and the heat emitted by the component 7 is taken away. The heat is transferred to the heat dissipating end 12 and the heat of the heat dissipating end 12 is taken away through the refrigerant pipe 2, thereby realizing the heat dissipation of the component 7. Compared with the traditional air cooling, the component 7 can be efficiently cooled in a high temperature environment. Compared with the existing refrigerant pipe 2 that directly exchanges heat with the component 7 and is prone to condensation problems and damage to the component 7, the refrigerant pipe 2 in the present application cools the component 7 through the heat conducting mechanism 1, which can avoid condensation from causing damage to the electrical appliance.

[0043] Specifically, the components 7 are IPM, diode, IGBT, rectifier bridge and the like.

[0044] With traditional air cooling technology, the 3P external unit high temperature cooling IGBT is 96.7℃, which has reached the reliability limit requirement. In order to increase the heat dissipation of air cooling in high temperature environment, the heat dissipation area of ​​the aluminum plate needs to be increased, but the heat dissipation efficiency is low and the cost is increased.

[0045] Liquid cooling technology in the industry, a refrigerant ring solution is commonly used in household air conditioners. The low-temperature refrigerant substrate is in direct contact with the control device, which is prone to condensation and short-circuit damage. To solve the condensation problem, two sets of electronic expansion valve devices are often added before and after the substrate of the refrigerant ring, which is very costly. Because of the risk of condensation, the refrigerant heat dissipation method cannot use the system's lowest temperature compressor suction refrigerant pipe, and a throttle valve is used to control the temperature. The system tests that the temperature is 10°C or higher than the suction pipe.

[0046] In the embodiment of the present application, heat is transferred between the electrical component and the refrigerant pipe 2 through the heat conducting mechanism 1. Compared with the traditional air cooling technology, not only the heat dissipation efficiency can be improved, but also the cost can be reduced. Compared with air cooling, the temperature can be reduced by 13.76°C to 44.76°C; compared with liquid cooling technology, there is no need to set up a costly electronic expansion valve device, which reduces the cost, and the refrigerant pipe 2 with the lowest temperature in the system can be used for heat dissipation. Compared with the refrigerant heat dissipation method, the heat pipe heat dissipation solution can reduce the temperature by 3.88°C to 12.17°C, improve the heat dissipation efficiency, and condensation occurs at the heat conducting mechanism 1 instead of on the component 7, thereby protecting the component 7.

[0047] In actual use, the temperature at the refrigerant pipe 2 is relatively low, and condensation is likely to occur. The condensed water is likely to flow to the component 7 through the heat conduction mechanism 1, thereby causing damage to the component 7. In order to avoid the above problems, the present application provides the following embodiments.

[0048] In some embodiments, the heat conduction mechanism 1 includes a substrate 13 and a heat conduction pipe 14 disposed on the substrate 13 . The substrate 13 includes a heat dissipation module 131 and a heat absorption module 132 . The heat dissipation module 131 and the heat absorption module 132 exchange heat through the heat conduction pipe 14 .

[0049] In the present application, the heat absorption module 132 and the heat dissipation module 131 of the substrate 13 exchange heat through the heat pipe 14, the heat absorption module 132 exchanges heat with the component 7, and the heat dissipation module 131 exchanges heat with the refrigerant pipe 2, thereby realizing the heat dissipation of the component 7. By separating the heat absorption module 132 and the heat dissipation module 131, condensed water can be prevented from flowing onto the component 7, and the component 7 is further protected to ensure that the temperature at the heat absorption module 132 is not too low to cause condensation on the component 7.

[0050] In some embodiments, the heat absorption module 132 and the heat dissipation module 131 are arranged at intervals.

[0051] Specifically, the heat absorption module 132 and the heat dissipation module 131 are arranged at intervals, and the heat absorption module 132 and the heat dissipation module 131 will not exchange heat directly, but can only exchange heat through the heat pipe 14. This allows a large temperature difference between the heat absorption module 132 and the heat dissipation module 131 to avoid condensation due to the low temperature of the heat absorption module 132, while satisfying the heat dissipation effect on the components 7.

[0052] In some embodiments, the substrate 13 is an integral structure, and an insulation module 133 is provided between the heat absorption module 132 and the heat dissipation module 131; alternatively, the heat absorption module 132 and the heat dissipation module 131 are separate structures, and a gap is left between the heat absorption module 132 and the heat dissipation module 131.

[0053] In one embodiment, the substrate 13 adopts an integral structure, and the heat absorption module 132 and the heat dissipation module 131 are separated by the insulation module 133, so that there can be a temperature difference between the heat absorption module 132 and the heat dissipation module 131, thereby preventing the temperature of the heat absorption module 132 from being too low and condensation from occurring.

[0054] In another embodiment, the heat absorption module 132 and the heat dissipation module 131 are provided separately so as to achieve that there is no direct heat exchange between the heat absorption module 132 and the heat exchange module, thereby ensuring that there is a temperature difference between the heat absorption module 132 and the heat dissipation module 131, thereby avoiding the phenomenon of condensation due to the temperature of the heat absorption module 132 being too low.

[0055] In a specific embodiment, the heat insulation module 133 is a heat insulation material disposed between the heat absorption module 132 and the heat dissipation module 131 .

[0056] In the present application, a heat insulating material can be provided between the heat absorbing module 132 and the heat dissipating module 131 to prevent the heat absorbing module 132 and the heat dissipating module 131 from directly exchanging heat, and heat exchange can only be performed through the heat conducting pipe 14; a certain gap can also be left between the heat absorbing module 132 and the heat dissipating module 131 to prevent direct heat exchange between the heat absorbing module 132 and the heat exchanging module.

[0057] Preferably, the substrate 13 in the present application adopts an integral structure, and the heat absorbing module 132 and the heat dissipating module 131 are separated by a gap to achieve the effect that the heat absorbing module 132 and the heat dissipating module 131 cannot directly exchange heat. This not only satisfies the problem that the heat absorbing module 132 and the heat dissipating module 131 cannot directly exchange heat, but also facilitates processing and molding.

[0058] In some embodiments, the heat pipe 14 has a first end 141 that is attached to the heat absorption module 132 and a second end 142 that is attached to the heat dissipation module 131; the heat absorption module 132 and / or the first end 141 form the heat absorption end 11 of the heat conduction mechanism 1; the heat dissipation module 131 and / or the second end 142 form the heat dissipation end 12 of the heat conduction mechanism 1.

[0059] In the present application, the first end 141 of the heat pipe 14 is attached to the heat absorption module 132 to exchange heat with the heat absorption module 132 , and the second end 142 of the heat pipe 14 is attached to the heat dissipation module 131 to exchange heat with the heat dissipation module 131 .

[0060] In one embodiment, the heat absorption module 132 of the substrate 13 is attached to the component 7 and serves as the heat absorption end 11 to absorb the heat emitted by the component 7. The temperature of the heat absorption module 132 of the substrate 13 is not too low, so that condensation will not occur on the component 7. In another embodiment, the first end 141 of the heat pipe 14 is attached to the component 7 and serves as the heat absorption end 11 to absorb the heat emitted by the component 7, so that the heat dissipation of the component 7 can be more directly performed. In yet another embodiment, the heat absorption module 132 of the substrate 13 and the first end 141 of the heat pipe 14 together serve as the heat absorption end 11 to absorb the heat emitted by the component 7.

[0061] In one embodiment, the heat dissipation module 131 of the substrate 13 is attached to the refrigerant tube 2 and serves as a heat dissipation end 12 for transferring heat to the refrigerant tube 2; in another embodiment, the second end 142 of the heat pipe 14 is attached to the refrigerant tube 2 and serves as a heat dissipation end 12 for transferring heat to the refrigerant tube 2. The temperature of the second end 142 of the heat pipe 14 is higher than that of the heat dissipation module 131. The heat dissipation effect can be ensured by directly attaching the second end 142 of the heat pipe 14 to the refrigerant tube 2. In another embodiment, the second end 142 of the heat pipe 14 and the heat dissipation module 131 together serve as the heat dissipation end 12, which is attached to the refrigerant tube 2 for transferring heat to the refrigerant tube 2, which can further improve the heat dissipation effect.

[0062] Preferably, the present application selects the heat absorption module 132 of the substrate 13 as the heat absorption end 11. The heat absorption module 132 is bonded to the component 7 to absorb the heat generated by the component 7, which can avoid the overcooled heat pipe 14 directly contacting the component 7 and causing condensation on the component 7, thereby protecting the component 7; the heat dissipation module 131 of the substrate 13 and the second end 142 of the heat pipe 14 jointly serve as the heat dissipation end 12 in contact with the refrigerant pipe 2, thereby ensuring the heat exchange efficiency between the heat dissipation end 12 and the refrigerant pipe 2.

[0063] In some embodiments, the heat pipe 14 is filled with cooling liquid, which is vaporized into gas phase at the first end 141 and flows to the second end 142 , and condensed into liquid phase at the second end 142 and flows to the first end 141 .

[0064] In the present application, the interior of the heat pipe 14 is filled with a coolant, and the coolant is in a two-phase form. The coolant is in a liquid state at the first end 141, and becomes a gas after absorbing heat and flows to the second end 142, thereby carrying the heat to the second end 142. After dissipating heat at the second end 142, it becomes a liquid state and returns to the first end 141 again. The heat conduction through the two-phase coolant has a better heat conduction effect than the direct heat conduction through the conductor, and a certain temperature difference can be made between the first end 141 and the second end 142 of the heat pipe 14. The temperature of the first end 141 is higher than the temperature of the second end 142, and the heat absorption module 132 and the component 7 can also be protected.

[0065] Optionally, the heat pipe 14 may also be made of a material with good thermal conductivity, such as copper, aluminum, etc.

[0066] In some embodiments, a height of the first end 141 is lower than a height of the second end 142 .

[0067] In the present application, by making the height of the first end 141 of the heat pipe 14 lower than the height of the second end 142, because the second end 142 is in direct contact with the refrigerant pipe 2 and has a lower temperature, it is used for condensing the coolant in the heat pipe 14, and it is more convenient for the cooling water condensed at the second end 142 to return to the first end 141, and the gas generated by the heat at the first end 141 flows upward and naturally flows to the second end 142. In the vertical direction, the heat pipe 14 has the gas above the working fluid inside the heat pipe 14 being cooled and turned into liquid and flowing downward, and the liquid below being evaporated by the heat source and turned into gas and floats up, so that the coolant forms a circulation in the heat pipe 14, further improving the heat exchange effect and heat exchange efficiency of the heat pipe 14.

[0068] In some embodiments, the refrigerant in the refrigerant pipe 2 is cooling water, air or refrigerant.

[0069] In the present application, the refrigerant pipe 2 can be connected to cooling water, external cold air or the refrigerant in the cooling system, as long as the temperature inside the refrigerant pipe 2 is low enough to take away the heat from the heat dissipation end 12 .

[0070] In the related art, there is an upper limit for the use of air cooling, and water cooling cannot continuously provide a water source. In view of factors such as high cooling costs, the refrigerant selected in the cooling system in the embodiment of the present application is the preferred method, which can provide a sufficiently low temperature without the need for external equipment.

[0071] In a specific embodiment, the refrigerant pipe 2 is a suction pipe of the compressor 3 or an output pipe of the condenser 4 .

[0072] In the present application, the refrigerant in the suction pipe of the compressor 3 has a relatively low temperature, and when the heat is exchanged with the heat conducting pipe 14, a better effect can be achieved than when the refrigerant directly dissipates heat. Because in the prior art, if the refrigerant directly dissipates heat for the components 7, the low temperature of the refrigerant easily causes condensation in the components 7, causing damage to the components 7, so it is impossible to directly dissipate heat for the components 7 through the refrigerant. The refrigerant in the output pipe of the condenser 4 also has a relatively low temperature, and the effect of dissipating heat for the components 7 is achieved by heat exchange with the heat conducting pipe 14, and the refrigerant pipe 2 uses the output pipe of the condenser 4, so there is no problem of vibration of the suction pipe.

[0073] Optionally, the refrigerant pipe 2 may also be a pipeline at other locations in the cooling system.

[0074] In some embodiments, a first receiving groove 1321 is provided on the heat absorption module 132, and a second receiving groove 1311 and a third receiving groove 1312 are provided on the heat dissipation module 131. A portion of the heat pipe 14 is located in the first receiving groove 1321, and the other portion is located in the second receiving groove 1311. The refrigerant pipe 2 is arranged in the third receiving groove 1312 and abuts against the heat dissipation end 12 of the heat conducting mechanism 1.

[0075] In the present application, the heat pipe 14 is positioned and fixed by the first receiving groove 1321 on the heat absorption module 132 and the second receiving groove 1311 on the heat dissipation module 131, which can not only fix the heat pipe 14 well, but also increase the contact area between the heat pipe 14 and the substrate 13, and further improve the heat exchange effect between the substrate 13 and the heat pipe 14. Specifically, the first receiving groove 1321 and the second receiving groove 1311 are coated with heat dissipation grease, and the heat dissipation grease between the heat pipe 14 and the substrate 13 can fully fill the gap between the substrate 13 and the heat pipe 14, thereby improving the heat exchange efficiency between the substrate 13 and the heat pipe 14.

[0076] The third receiving groove 1312 on the heat dissipation module 131 is used to position and fix the refrigerant tube 2, which can not only ensure the fixing effect of the refrigerant tube 2, but also increase the contact area between the refrigerant tube 2 and the substrate 13, thereby improving the heat exchange efficiency between the refrigerant tube 2 and the substrate 13. Specifically, the third receiving groove 1312 is coated with heat dissipation paste, and the gap between the refrigerant tube 2 and the substrate 13 is filled with the heat dissipation paste, thereby improving the heat exchange effect between the refrigerant tube 2 and the substrate 13.

[0077] In some embodiments, the heat dissipation assembly further includes a cover plate 6 disposed on the substrate 13 , and the cover plate 6 is used to compress the heat pipe 14 and the refrigerant pipe 2 .

[0078] In the present application, the cover plate 6 of the substrate 13 presses the heat pipe 14 and the refrigerant pipe 2, so that the heat pipe 14, the substrate 13 and the refrigerant pipe 2 can be more closely attached, and the heat conduction effect can be further improved with the heat dissipation paste. In addition, the cover plate 6 has the effect of fixing the heat pipe 14 and the refrigerant pipe 2, preventing the heat pipe 14 and the refrigerant pipe 2 from loosening, and ensuring the reliability of later use.

[0079] The heat dissipation component exchanges heat with the component 7 through the heat absorption end 11 of the heat conduction mechanism 1, takes away the heat emitted by the component 7, transfers the heat to the heat dissipation end 12 and takes away the heat from the heat dissipation end 12 through the refrigerant pipe 2, thereby achieving heat dissipation of the component 7. Compared with traditional air cooling, it can efficiently dissipate the heat of the component 7 in a high temperature environment. Compared with the existing refrigerant pipe 2 that directly exchanges heat with the component 7 and is prone to condensation problems and damage to the component 7, the refrigerant pipe 2 in the present application dissipates heat for the component 7 through the heat conduction mechanism 1, which can avoid condensation from causing damage to the electrical appliance.

[0080] An embodiment of the present application provides an air conditioner, comprising: a compressor 3, a condenser 4 and an evaporator 5 connected in sequence; and the above-mentioned heat dissipation component, wherein the refrigerant pipe 2 of the heat dissipation component is the air inlet pipe of the compressor 3 or the output pipe of the condenser 4.

[0081] Specifically, the heat dissipation assembly is used to dissipate heat from the components 7 in the air conditioner outdoor unit, and heat dissipation paste is applied between the components 7 and the substrate 13 to ensure the heat dissipation effect between the components 7 and the substrate 13. The compressor 3, the condenser 4 and the evaporator 5 form a cooling system of the air conditioner, and the refrigerant pipe 2 of the heat dissipation assembly directly uses a section of the cooling system, without the need for an external branch, and without the need to add throttling devices, which can effectively reduce costs.

[0082] In the present application, the substrate 13 of the heat dissipation assembly is disposed on the electrical box 8 of the component 7, and an opening is disposed on the electrical box 8 at a position corresponding to the component 7, so that the component 7 can directly fit with the substrate 13 through the opening for heat dissipation.

[0083] Optionally, the heat dissipation assembly in the present application can also be applied to an indoor unit of an air conditioner to dissipate heat and cool down components 7 of the indoor unit of the air conditioner.

[0084] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0085] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0086] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A heat dissipation component, characterized in that: include: A heat conduction mechanism (1), the heat conduction mechanism (1) having a heat absorption end (11) and a heat dissipation end (12) capable of performing heat exchange, the heat absorption end (11) being used to absorb heat dissipated by the component (7); and A refrigerant tube (2), wherein the refrigerant tube (2) is in contact with the heat dissipation end (12) of the heat conducting mechanism (1), so that the refrigerant in the refrigerant tube (2) takes away the heat of the heat dissipation end (12) when passing through the heat dissipation end (12) of the heat conducting mechanism (1).

2. The heat dissipation assembly according to claim 1, characterized in that: The heat conduction mechanism (1) comprises a substrate (13) and a heat conduction pipe (14) arranged on the substrate (13); the substrate (13) comprises a heat dissipation module (131) and a heat absorption module (132); the heat dissipation module (131) and the heat absorption module (132) exchange heat via the heat conduction pipe (14).

3. The heat dissipation assembly according to claim 2, characterized in that: A gap is left between the heat absorption module (132) and the heat dissipation module (131).

4. The heat dissipation assembly according to claim 3, characterized in that: A heat insulation module (133) is arranged between the heat absorption module (132) and the heat dissipation module (131); the heat insulation module (133) is a heat insulation material arranged in the gap between the heat absorption module (132) and the heat dissipation module (131).

5. The heat dissipation assembly according to claim 3, characterized in that: The substrate (13) is an integral structure, or the heat absorption module (132) and the heat dissipation module (131) of the substrate are separate structures.

6. The heat dissipation assembly according to claim 2, characterized in that: The heat conducting pipe (14) has a first end (141) affixed to the heat absorbing module (132) and a second end (142) affixed to the heat dissipating module (131); The heat absorption module (132) and / or the first end (141) form a heat absorption end (11) of the heat conduction mechanism (1); The heat dissipation module (131) and / or the second end (142) form a heat dissipation end (12) of the heat conduction mechanism (1).

7. The heat dissipation assembly according to claim 6, characterized in that: The heat conducting pipe (14) is filled with a cooling liquid, the cooling liquid is vaporized into a gas phase at the first end (141) and flows to the second end (142), the gas phase is condensed into a liquid phase at the second end (142) and flows to the first end (141).

8. The heat dissipation assembly according to claim 7, characterized in that: The height of the first end (141) is lower than the height of the second end (142).

9. The heat dissipation assembly according to claim 1, characterized in that: The refrigerant in the refrigerant pipe (2) is cooling water, air or refrigerant.

10. The heat dissipation assembly according to claim 9, characterized in that: The refrigerant pipe (2) is selected from the suction pipe of the compressor (3) or the output pipe of the condenser (4).

11. The heat dissipation assembly according to claim 2, characterized in that: The heat absorption module (132) is provided with a first receiving groove (1321), and the heat dissipation module (131) is provided with a second receiving groove (1311) and a third receiving groove (1312); a portion of the heat conduction pipe (14) is located in the first receiving groove (1321), and another portion is located in the second receiving groove (1311); the refrigerant pipe (2) is arranged in the third receiving groove (1312) and abuts against the heat dissipation end (12) of the heat conduction mechanism (1).

12. An air conditioner, characterized in that: include: A compressor (3), a condenser (4) and an evaporator (5) connected in sequence; as well as According to any one of claims 1 to 11, the refrigerant pipe (2) of the heat dissipation component is an intake pipe of the compressor (3) or an output pipe of the condenser (4).

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