Wine cabinet

Abstract

The utility model relates to the technical field of household appliances, and discloses a wine cabinet. The wine cabinet comprises a wine cabinet body, and the wine cabinet body comprises a refrigeration space and a semiconductor refrigeration assembly; the semiconductor refrigeration assembly is used for refrigerating the refrigeration space; the semiconductor refrigeration assembly comprises a semiconductor refrigeration sheet and a fan; the fan is used for cooling the heat exchange end of the semiconductor chilling plate; the wine cabinet further comprises a heat dissipation air channel formed in the foaming layer of the wine cabinet body. The heat dissipation air channel comprises a first air inlet and a first air outlet; the first air inlet is formed in the side wall of the wine cabinet body; an air outlet of the heat dissipation fan is communicated with the heat dissipation air duct; the electric control box is arranged on the top wall of the wine cabinet body; and a first air outlet of the heat dissipation air duct is communicated with the electric control box. Heat dissipation of the electric control box is achieved through the heat dissipation fan of the semiconductor refrigeration assembly, and redundant energy consumption and cost caused by the fact that a fan is independently arranged on the electric control box are reduced.

Description

Technical Field

[0001] The present application relates to the technical field of household electrical appliances, for example, to a wine cabinet. Background Art

[0002] At present, during the operation of the semiconductor refrigeration plate in the semiconductor refrigeration wine cabinet, the computer board of the wine cabinet is in a working state, and the temperature in the electrical control box where the computer board is located continues to rise, affecting the electrical performance of the computer board, thereby causing the working efficiency of the computer board to become low.

[0003] In order to reduce the temperature of the computer board, the relevant technology adopts the method of using a fan to supply air to the electronic control box of the wine cabinet to drive the air flow through the space inside the electronic control box, thereby reducing the temperature inside the electronic control box, improving the heat dissipation efficiency of the computer board, improving the electrical performance of the computer board, and improving the working efficiency of the computer board.

[0004] In the process of implementing the embodiments of the present disclosure, it is found that there are at least the following problems in the related art:

[0005] Although the related technology can reduce the temperature inside the electric control box, setting up a fan alone will cause unnecessary energy consumption.

[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0007] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical components or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0008] The disclosed embodiment provides a wine cabinet, which can dissipate heat for an electric control box through a heat dissipation fan provided by a semiconductor refrigeration component, thereby reducing the unnecessary energy consumption and cost caused by separately providing a fan for the electric control box.

[0009] In some embodiments, a wine cabinet is provided, which includes a wine cabinet body, the wine cabinet body includes a refrigeration space and a semiconductor refrigeration component; the semiconductor refrigeration component is used to cool the refrigeration space; the semiconductor refrigeration component includes a semiconductor refrigeration plate and a heat dissipation fan; the heat dissipation fan is used to dissipate heat from the heating end of the semiconductor refrigeration plate; the wine cabinet also includes: a heat dissipation air duct, arranged in the side wall of the wine cabinet body; the heat dissipation air duct includes a first air inlet and a first air outlet; the first air inlet is opened on the side wall of the wine cabinet body; the air outlet of the heat dissipation fan is connected to the heat dissipation air duct; an electric control box is arranged on the wine cabinet body; the first air outlet of the heat dissipation air duct is connected to the installation cavity of the electric control box.

[0010] Optionally, the electric control box includes: a shell, including an installation cavity, the interior of which is used to install the electric control board; the installation cavity is connected to the first air outlet of the heat dissipation duct; and an air guide portion is arranged on the shell wall of the shell to form an outlet for the airflow in the electric control box.

[0011] Optionally, the air guide part includes: a through hole, which is opened in the shell wall of the shell; an air guide cover, which is covered in the through hole and has an opening; the opening of the air guide cover faces the front space and / or the upper space of the wine cabinet, so that the air in the heat dissipation duct flows through the electronic control box and then is blown out to the external space of the wine cabinet.

[0012] Optionally, the electrical control box also includes: an air inlet duct, which is opened in the shell; the air inlet of the air inlet duct is opened in the side wall of the shell; the first air outlet of the heat dissipation duct is connected with the air inlet of the air inlet duct; an air collecting duct, which is opened in the shell, the air inlet of the air collecting duct is connected with the air outlet of the air inlet duct, and the air outlet of the air collecting duct is opened in the cavity wall of the installation cavity.

[0013] Optionally, the air collecting duct is composed of a first side wall, a second side wall, a third side wall and a fourth side wall connected in sequence; wherein the first side wall and the third side wall are arranged opposite to each other, and the second side wall and the fourth side wall are arranged opposite to each other; wherein, along the direction from the outer side wall of the shell to the inner side wall of the shell, the distance between the first side wall and the third side wall decreases, and the distance between the second side wall and the fourth side wall increases.

[0014] Optionally, the distance A between the first side wall and the third side wall and the distance B between the second side wall and the fourth side wall satisfy the following relationship: <B。

[0015] Optionally, the wine cabinet further includes: a first air door, which is arranged at the first air outlet of the heat dissipation air duct; the first air door can be controlled to open or close the first air outlet of the heat dissipation air duct.

[0016] Optionally, the heat dissipation air duct also includes: a main air duct, the main air duct includes a second air inlet and a first air outlet; a secondary air duct, the secondary air duct includes a first air inlet, a second air outlet and a third air outlet; the first air inlet and the second air outlet are opened on the side wall of the wine cabinet body, and the third air outlet is connected to the second air inlet; wherein, when the refrigeration space includes multiple temperature zones, the heat dissipation air duct includes multiple secondary air ducts, and the multiple secondary air ducts are arranged in a one-to-one correspondence with the multiple temperature zones.

[0017] Optionally, the wine cabinet further includes: a second damper, disposed at the third air outlet; the second damper can be controlled to open or close the third air outlet.

[0018] Optionally, the first air outlet comprises: a plurality of branch air outlets, each of which is connected to the heat dissipation air duct, and the plurality of branch air outlets are arranged at intervals on the side wall of the electric control box along the width direction of the electric control box.

[0019] The wine cabinet provided by the embodiment of the present disclosure can achieve the following technical effects:

[0020] The wine cabinet provided by the embodiment of the present disclosure has a lower temperature than the temperature in the electric control box because the temperature of the heat dissipation airflow in the heat dissipation air duct is lower than the temperature in the electric control box. The first air outlet of the heat dissipation air duct is connected to the electric control box, and the airflow in the heat dissipation air duct is used to dissipate the heat of the electric control box. The heat dissipation fan provided by the semiconductor refrigeration component is used to dissipate the heat of the electric control box, thereby reducing the unnecessary energy consumption and cost caused by setting up a fan separately for the electric control box. Specifically, the air outlet of the heat dissipation fan is connected to the heat dissipation air duct so that the airflow generated by the heat dissipation fan can enter the heat dissipation air duct, and then enter the electric control box through the first air outlet of the heat dissipation air duct, and then use the airflow to dissipate the heat of the electric control box, thereby reducing the unnecessary energy consumption and cost caused by setting up a fan separately for the electric control box.

[0021] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements, and the drawings do not constitute a scale limitation, and wherein:

[0023] Figure 1 is a rear view of the wine cabinet provided by the embodiment of the present disclosure;

[0024] Figure 2 is a front view of a back plate of a wine cabinet provided by an embodiment of the present disclosure;

[0025] Figure 3 yes Figure 1 A cross-sectional view of the back panel of the wine cabinet along the airflow direction in the main air duct in the illustrated embodiment;

[0026] Figure 4 yes Figure 3 An enlarged schematic diagram of M in the embodiment shown;

[0027] Figure 5 yes Figure 3 An enlarged schematic diagram of location N in the illustrated embodiment;

[0028] Figure 6 is a schematic diagram of the structure of the electric control box provided by an embodiment of the present disclosure;

[0029] Figure 7 is a schematic structural diagram of a top wall of a housing provided by an embodiment of the present disclosure;

[0030] Figure 8 yes Figure 7 a cross-sectional view of the illustrated embodiment;

[0031] Fig. 9 yes Figure 8 An enlarged schematic diagram of the position P in the embodiment shown;

[0032] Fig.10 It is a cross-sectional view of the electric control box provided in the embodiment of the present disclosure.

[0033] Reference numerals:

[0034] 10. Wine cabinet body;

[0035] 20, cooling air duct; 201, main air duct; 2011, second air inlet; 2012, first air outlet; 2013, branch air outlet; 202, secondary air duct; 2021, first air inlet; 2022, second air outlet; 2023, third air outlet;

[0036] 30, electric control box; 301, housing; 3011, air inlet; 3012, air collecting duct; 3013, first side wall; 3014, second side wall; 3015, third side wall; 3016, fourth side wall; 302, air guide portion; 3021, through hole; 3022, air guide cover; 3023, first air guide plate; 3024, second air guide plate;

[0037] 40. First air gate;

[0038] 50. Second air door;

[0039] 60. Semiconductor refrigeration components. DETAILED DESCRIPTION

[0040] In order to be able to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0041] The terms "first", "second", etc. in the specification and claims of the embodiments of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate, so that the embodiments of the embodiments of the present disclosure described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0042] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0043] In addition, the terms "disposed", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0044] Unless otherwise stated, the term "plurality" means two or more.

[0045] In the embodiment of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship. For example, A / B indicates: A or B.

[0046] The term "and / or" is a description of the association relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B.

[0047] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

[0048] Combination Figures 1 to 10As shown, an embodiment of the present disclosure provides a wine cabinet, which includes a wine cabinet body 10, and the wine cabinet body 10 includes a refrigeration space and a semiconductor refrigeration component 60. The semiconductor refrigeration component 60 is used to cool the refrigeration space. The semiconductor refrigeration component 60 includes a semiconductor refrigeration plate and a heat dissipation fan. The heat dissipation fan is used to dissipate heat from the heat exchange end of the semiconductor refrigeration plate. The wine cabinet also includes: a heat dissipation duct 20 and an electric control box 30. The heat dissipation duct 20 is opened in the side wall of the wine cabinet body 10. The heat dissipation duct 20 includes a first air inlet 2021 and a first air outlet 2012. The first air inlet 2021 is opened on the side wall of the wine cabinet body 10. The air outlet of the heat dissipation fan is connected to the heat dissipation duct 20. The electric control box 30 is arranged on the top wall of the wine cabinet body 10. The first air outlet 2012 of the heat dissipation duct 20 is connected to the electric control box 30.

[0049] In the wine cabinet provided by the embodiment of the present disclosure, the temperature of the heat dissipation airflow in the heat dissipation air duct 20 is lower than the temperature in the electric control box 30, so that the first air outlet 2012 of the heat dissipation air duct 20 is connected to the electric control box 30, and the airflow of the heat dissipation air duct 20 is used to dissipate the heat of the electric control box 30, so that the heat dissipation fan of the semiconductor refrigeration component 60 is used to dissipate the heat of the electric control box 30, thereby reducing the unnecessary energy consumption and cost caused by setting up a fan separately for the electric control box 30. Specifically, by setting the air outlet of the heat dissipation fan to be connected to the heat dissipation air duct 20, so that the airflow generated by the heat dissipation fan can enter the heat dissipation air duct 20, and then enter the electric control box 30 through the first air outlet 2012 of the heat dissipation air duct 20, and then use the airflow to dissipate the heat of the electric control box 30, thereby reducing the unnecessary energy consumption and cost caused by setting up a fan separately for the electric control box 30.

[0050] For example, during the operation of the wine cabinet, the air flow temperature generated by the heat dissipation fan to the heat exchange end of the semiconductor refrigeration plate is 40°C to 50°C, and the temperature inside the electrical control box 30 is 90°C to 100°C. Therefore, the air flow in the heat dissipation duct 20 can be used to cool down and dissipate heat inside the electrical control box 30.

[0051] Specifically, when the semiconductor refrigeration plate is powered on, the first heat exchange end and the second heat exchange end generate heat or cold respectively. When the wine cabinet is in a cooling state, a heat exchange end located close to the refrigeration space generates cold, and a heat exchange end located far from the refrigeration space generates heat, thereby realizing the cooling of the refrigeration space. At the same time, the fan is working, and the fan drives the air flow at the heat exchange end far from the refrigeration space, so that after the air is used to exchange heat with the heat exchange end, it is transported to other positions along the heat dissipation duct 20 to realize the heat dissipation of the semiconductor refrigeration plate.

[0052] When the wine cabinet is in the defrosting state, the electrodes of the semiconductor refrigeration plate are reversed, and a heat exchange end located near the refrigeration space generates heat, and a heat exchange end located far from the refrigeration space generates cold energy, thereby achieving defrosting of the refrigeration space. At the same time, the fan works, and the fan drives the air flow at the heat exchange end located far from the refrigeration space. Since the heat exchange end generates cold energy at this time, the temperature of the air flow flowing in the heat dissipation duct 20 is relatively low. After the air flow is transported to the inside of the electric control box 30, the temperature inside the electric control box 30 can be further reduced, and the cooling speed of the space inside the electric control box 30 can be increased.

[0053] Exemplarily, the semiconductor refrigeration plate includes a first heat exchange end and a second heat exchange end. The first heat exchange end is a heat exchange end close to the refrigeration space, and the second heat dissipation end is a heat exchange end far from the refrigeration space. When the wine cabinet is in the refrigeration state, the second heat exchange end generates heat, and the airflow in the heat dissipation duct 20 driven by the fan exchanges heat with the second heat exchange end and flows through the first air outlet 2012 of the heat dissipation duct 20, and then enters the electric control box 30, and then uses the airflow to dissipate heat from the electric control box 30, thereby reducing the unnecessary energy consumption and cost caused by setting up a fan for the electric control box 30 separately. When the wine cabinet is in the defrosting state, the airflow driven by the fan exchanges heat with the cold energy generated by the second heat exchange end, and then flows through the first air outlet 2012 of the heat dissipation duct 20, and then enters the electric control box 30, thereby further reducing the temperature in the electric control box 30 and increasing the cooling speed of the space in the electric control box 30.

[0054] It is understandable that the heat dissipation duct 20 provided in the embodiment of the present disclosure can be disposed in the side wall of the wine cabinet body 10, without limiting the specific side wall (for example: the rear side wall, the left side wall or the right side wall) where the heat dissipation duct 20 is located.

[0055] Specifically, when the wine cabinet is an embedded wine cabinet, that is, when the wine cabinet needs to be embedded in the installation space, the electric control box 30 is arranged on the top wall of the wine cabinet body, so that the installation cavity of the electric control box 30 can exchange heat with the upper space and the front space of the wine cabinet, thereby improving the heat dissipation efficiency of the electric control box 30.

[0056] Optionally, combined Figure 6 , Figure 7 and Figure 8 As shown, the electric control box 30 includes: a shell 301 and an air guide 302. The shell 301 includes an installation cavity, and the interior of the shell 301 is used to install the electric control board. The installation cavity is connected to the first air outlet 2012 of the heat dissipation air duct 20. The air guide 302 is arranged on the shell wall of the shell 301 to form an outlet for the air flow in the electric control box 30.

[0057] In this embodiment, an air guide portion 302 is provided to discharge the air inside the installation cavity, so that the airflow in the heat dissipation duct 20 can be discharged by the air guide portion 302 after entering the installation cavity, thereby achieving heat dissipation of the electrical control board in the installation cavity and reducing the excess energy consumption and cost caused by separately providing a fan for the electrical control box 30.

[0058] Specifically, the air guide 302 is arranged on the top shell wall and / or the front shell wall of the housing 301, so that the installation cavity of the electric control box 30 can exchange heat with the upper space and the front space of the wine cabinet, thereby improving the heat dissipation efficiency of the electric control box 30. Optionally, the connection between the installation cavity and the heat dissipation air duct 20 is arranged opposite to the air guide 302. In this way, after the airflow flows out of the heat dissipation air duct 20 and enters the installation cavity, it can flow through the electric control board in the installation cavity with the largest area, thereby improving the heat dissipation uniformity of the electric control board, and further improving the heat dissipation efficiency of the electric control board.

[0059] Optionally, combined Fig. 9 and Fig.10 As shown, the air guide portion 302 includes: a through hole 3021 and an air guide cover 3022. The through hole 3021 is opened in the shell wall of the shell 301. The air guide cover 3022 is arranged to cover the through hole 3021, and the air guide cover 3022 is configured with an opening. The opening of the air guide cover 3022 faces the front space and / or the upper space of the wine cabinet, so that the air in the heat dissipation duct 20 flows through the electric control box 30 and then blows out to the external space of the wine cabinet.

[0060] Specifically, the through hole 3021 is opened on the upper shell wall or the front shell wall of the shell 301 .

[0061] Specifically, combined Fig. 9 and Fig.10 As shown, the air guide cover 3022 includes: a first air guide piece 3023 and a second air guide piece 3024. One end of the first air guide piece 3023 is connected to the first side of the through hole 3021, and the first air guide piece 3023 extends obliquely away from the housing 301 and toward the other side of the through hole 3021. One end of the second air guide piece 3024 is connected to the other end of the first air guide piece 3023, and the second air guide piece 3024 extends parallel to the shell wall of the housing 301 or away from the shell wall of the housing 301. Folding edges are formed on both sides of the extension direction of the first air guide piece 3023 and the second air guide piece 3024, and the folding edges are connected to the side edges of the corresponding through hole to form a cover body, and the opening of the cover body is the opening of the air guide cover 3022.

[0062] In this embodiment, the first air guide piece 3023 and the second air guide piece 3024 are provided to form an air guide cover 3022, and then the air guide cover 3022 is used to guide the airflow out of the housing 301. At the same time, the opening of the air guide cover 3022 is limited to be connected with the front space and / or the upper space of the wine cabinet, so that the hot air flowing out of the housing 301 is away from the first air inlet 2021 of the heat dissipation duct 20, and the exhaust hot air is reduced from re-entering the heat dissipation duct 20 through the first air inlet 2021, and the temperature of the air entering the first air inlet 2021 is reduced, and then the temperature of the airflow entering the electric control box 30 is reduced, thereby improving the heat dissipation efficiency of the semiconductor cooling sheet and the heat dissipation efficiency of the computer board in the electric control box 30. In addition, by forming a cover body, foreign matter such as dust entering the electric control box 30 can be reduced.

[0063] Specifically, when the through hole 3021 is opened in the upper shell wall of the housing 301, the opening of the air guide cover 3022 is connected to the front space of the wine cabinet. When the through hole 3021 is opened in the front shell wall of the housing 301, the opening of the air guide cover 3022 is connected to the upper space of the wine cabinet.

[0064] Optionally, combined Fig. 9 and Fig.10 As shown, there is a preset angle α between the first air guide piece 3023 and the top wall of the housing 301. The preset angle is greater than 90° and less than 180°.

[0065] Optionally, the first air inlet 2021 is disposed on the back plate of the wine cabinet body 10. In this way, the possibility of the hot air discharged from the air guide portion 302 re-entering the heat dissipation air duct 20 can be further reduced.

[0066] Optionally, the second air guide piece 3024 is parallel to the upper top wall of the shell 301 .

[0067] Optionally, combined Figure 6 As shown, the electric control box 30 further includes: an air inlet duct 3011 and an air collecting duct 3012. The air inlet duct 3011 is provided in the housing 301. The air inlet of the air inlet duct 3011 is provided in the side wall of the housing 301. The first air outlet 2012 of the heat dissipation air duct 20 is connected with the air inlet of the air inlet duct 3011. The air collecting duct 3012 is provided in the housing 301, the air inlet of the air collecting duct 3012 is connected with the air outlet of the air inlet duct 3011, and the air outlet of the air collecting duct 3012 is provided in the cavity wall of the installation cavity.

[0068] In this embodiment, the air inlet duct 3011 is provided to collect the airflow in the heat dissipation duct 20, and then the airflow in the heat dissipation duct 20 enters the installation cavity to achieve heat dissipation in the space of the electric control box 30. At the same time, the air collecting duct 3012 is provided to increase the lateral air outlet width of the airflow at the air outlet of the air collecting duct 3012, so as to maximize the area of ​​the airflow passing through the electric control board, thereby improving the heat dissipation uniformity and speed of the electric control board.

[0069] Optionally, the cross-sectional area perpendicular to the airflow direction from the air inlet of the air inlet 3011 to the air outlet of the air collecting duct 3012 is the same or decreases. In this way, by setting the same area, the width of the airflow lateral outlet of the air collecting duct 3012 is increased. By setting the area from large to small, the width of the airflow lateral outlet of the air collecting duct 3012 and the speed of the airflow flowing out of the air collecting duct 3012 outlet are increased.

[0070] Optionally, combined Figure 6 and Fig.10 As shown, the air collecting duct 3012 is surrounded by a first side wall 3013, a second side wall 3014, a third side wall 3015 and a fourth side wall 3016 connected in sequence; wherein the first side wall 3013 is arranged opposite to the third side wall 3015, and the second side wall 3014 is arranged opposite to the fourth side wall 3016. In the direction from the outer side wall of the shell 301 to the inner side wall of the shell 301, the distance between the first side wall 3013 and the third side wall 3015 decreases, and the distance between the second side wall 3014 and the fourth side wall 3016 increases.

[0071] In this embodiment, the relative widths among the first side wall 3013, the second side wall 3014, the third side wall 3015 and the fourth side wall 3016 are set so that the airflow in the air collecting duct 3012 is gradually flattened, thereby increasing the lateral width of the airflow at the air outlet of the air collecting duct 3012.

[0072] Optionally, combined Figure 6 and Fig.10 As shown, the distance A between the first side wall 3013 and the third side wall 3015 and the distance B between the second side wall 3014 and the fourth side wall 3016 satisfy the following relationship: <B。

[0073] In this embodiment, by setting the distance between the first side wall 3013 and the third side wall 3015 and the distance between the second side wall 3014 and the fourth side wall 3016, the airflow is gradually flattened in the width direction of the electric control box 30, and the lateral width of the airflow at the air outlet of the air collecting duct 3012 is increased, thereby increasing the air flow passing through the electric control board.

[0074] Optionally, combined Figure 4 and Fig.10As shown, the wine cabinet further includes: a first air door 40 disposed at a first air outlet 2012 of the heat dissipation air duct 20. The first air door 40 can be controlled to open or close the first air outlet 2012 of the heat dissipation air duct 20.

[0075] In this embodiment, a first damper 40 is provided to control the damper to open when heat dissipation of the electric control box 30 is required, so as to open the first air outlet 2012 of the heat dissipation duct 20, allowing air flow to enter the electric control box 30, thereby achieving heat dissipation in the space inside the electric control box 30 and reducing the excess energy consumption and cost caused by separately providing a fan for the electric control box 30.

[0076] Optionally, combined Figure 3 As shown, the heat dissipation air duct 20 also includes: a main air duct 201 and a secondary air duct 202. The main air duct 201 includes a second air inlet 2011 and a first air outlet 2012. The secondary air duct 202 includes a first air inlet 2021, a second air outlet 2022 and a third air outlet 2023. The first air inlet 2021 and the second air outlet 2022 are opened on the side wall of the wine cabinet body 10, and the third air outlet 2023 is connected to the second air inlet 2011. In the case where the refrigeration space includes multiple temperature zones, the heat dissipation air duct 20 includes multiple secondary air ducts 202, and the multiple secondary air ducts 202 are arranged in a one-to-one correspondence with the multiple temperature zones.

[0077] In this embodiment, a secondary air duct 202 including a first air inlet 2021 (i.e., the first air inlet of the heat dissipation air duct) and a second air outlet 2022 is provided to achieve heat dissipation of the hot end of the semiconductor refrigeration component 60 using the secondary air duct 202 when heat dissipation of the space inside the electric control box 30 is not required. At the same time, a third air outlet 2023 is provided in the secondary air duct 202 to achieve communication between the secondary air duct 202 and the main air duct 201. Then, when heat dissipation of the space inside the electric control box 30 is required, the third air outlet 2023 is opened to deliver the airflow to the main air duct 201, and then enter the electric control box 30 through the first air outlet 2012 (i.e., the first air outlet of the heat dissipation air duct) of the main air duct 201, so as to achieve heat dissipation of the space inside the electric control box 30 and reduce the redundant energy consumption and cost caused by separately providing a fan for the electric control box 30.

[0078] Specifically, the first air outlet 2012 of the main air duct 201 is the first air outlet of the heat dissipation air duct. The first air inlet 2021 of the secondary air duct 202 is the first air inlet of the heat dissipation air duct.

[0079] Specifically, when the refrigeration space includes multiple temperature zones, the wine cabinet includes multiple semiconductor refrigeration components 60 , one or more semiconductor refrigeration components 60 are arranged in each temperature zone, and each semiconductor refrigeration component 60 is correspondingly provided with a secondary air duct 202 .

[0080] It is understandable that the number of semiconductor refrigeration components 60 provided in each temperature zone depends on the refrigeration demand of the temperature zone, and the embodiments of the present disclosure do not impose any limitation on this.

[0081] Optionally, combined Figure 3 and Figure 5 As shown, the wine cabinet further includes: a second damper 50. The second damper 50 is disposed at the third air outlet 2023. The second damper 50 can be controlled to open or close the third air outlet 2023.

[0082] In this embodiment, the second damper 50 is provided, so that when the internal space of the electric control box 30 needs to be cooled, the second damper 50 is controlled to be opened, so that the third air outlet 2023 is opened. Thus, the airflow in the secondary air duct 202 is transported to the main air duct 201, and then enters the electric control box 30 through the first air outlet 2012 of the main air duct 201, so as to cool the space in the electric control box 30 and reduce the unnecessary energy consumption and cost caused by separately providing a fan for the electric control box 30.

[0083] Specifically, when it is necessary to dissipate heat for the internal space of the electric control box 30, the second damper 50 is controlled to be opened so that the third air outlet 2023 is opened. Then, the airflow in the secondary air duct 202 is transported to the main air duct 201, and enters the electric control box 30 through the first air outlet 2012 of the main air duct 201, so as to dissipate heat for the space in the electric control box 30. When it is not necessary to dissipate heat for the internal space of the electric control box 30, the second damper 50 is controlled to be closed so that the third air outlet 2023 is closed. At this time, driven by the fan, the airflow enters the secondary air duct 202 from the first air inlet 2021 of the secondary air duct 202, flows through the heat exchange end of the semiconductor cooling plate and exchanges heat with it, and then flows out of the secondary air duct 202 from the second air outlet 2022 of the secondary air duct 202, so as to dissipate heat for the semiconductor cooling plate.

[0084] Optionally, the wine cabinet further includes: a third damper. The third damper is disposed at the second air outlet 2022. The third damper can be controlled to open or close the second air outlet 2022. In this way, when it is necessary to dissipate heat in the internal space of the electric control box 30, the third damper is controlled to be closed, so as to reduce the airflow flowing out of the heat dissipation air duct 20 from the second air outlet 2022, increase the airflow entering the main air duct 201, and improve the heat dissipation speed of the space in the electric control box 30.

[0085] Optionally, combined Figure 2 As shown, the first air outlet 2012 includes: a plurality of branch air outlets 2013. Each branch air outlet 2013 is connected to the heat dissipation air duct 20, and the plurality of branch air outlets 2013 are arranged at intervals on the side wall of the electric control box 30 along the width direction of the electric control box 30.

[0086] In this embodiment, multiple branch air outlets 2013 are arranged at intervals along the width direction of the electric control box 30 to increase the uniformity of the airflow flowing into the electric control box 30, increase the width of the airflow flowing through the space in the electric control box 30, and improve the heat dissipation speed of the space in the electric control box 30.

[0087] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A wine cabinet, comprising a wine cabinet body, the wine cabinet body comprising a refrigeration space and a semiconductor refrigeration component; the semiconductor refrigeration component is used to refrigerate the refrigeration space; The semiconductor refrigeration component includes a semiconductor refrigeration sheet and a heat dissipation fan; The heat dissipation fan is used to dissipate heat from the heating end of the semiconductor refrigeration plate; it is characterized by also comprising: The heat dissipation duct is arranged in the side wall of the wine cabinet body; the heat dissipation duct includes a first air inlet and a first air outlet; the first air inlet is arranged in the side wall of the wine cabinet body; the air outlet of the heat dissipation fan is connected to the heat dissipation duct; The electric control box is arranged on the wine cabinet body; the first air outlet of the heat dissipation air duct is connected with the installation cavity of the electric control box.

2. The wine cabinet according to claim 1, characterized in that: The electric control box includes: The housing comprises a mounting cavity, the interior of which is used to mount the electric control board; the mounting cavity is connected to the first air outlet of the heat dissipation air duct; The air guide part is arranged on the shell wall of the shell to form an outlet for the air flow in the electric control box.

3. The wine cabinet according to claim 2, characterized in that: The air guide part includes: A through hole is provided in the shell wall of the shell; The air guide cover is arranged on the through hole and is structured with an opening; the opening of the air guide cover faces the front space and / or the upper space of the wine cabinet, so that the air in the heat dissipation duct flows through the electric control box and then blows out to the external space of the wine cabinet.

4. The wine cabinet according to claim 2, characterized in that: The electric control box also includes: An air inlet duct is provided in the shell; an air inlet of the air inlet duct is provided in a side wall of the shell; a first air outlet of the heat dissipation air duct is connected to the air inlet of the air inlet duct; The air collecting duct is opened in the shell, the air inlet of the air collecting duct is connected with the air outlet of the air inlet duct, and the air outlet of the air collecting duct is opened in the cavity wall of the installation cavity.

5. The wine cabinet according to claim 4, characterized in that: The air collecting duct is composed of a first side wall, a second side wall, a third side wall and a fourth side wall connected in sequence; wherein the first side wall is arranged opposite to the third side wall, and the second side wall is arranged opposite to the fourth side wall; In the direction from the outer side wall of the shell to the inner side wall of the shell, the distance between the first side wall and the third side wall decreases, and the distance between the second side wall and the fourth side wall increases.

6. The wine cabinet according to claim 5, characterized in that: The distance A between the first side wall and the third side wall and the distance B between the second side wall and the fourth side wall satisfy the following relationship: <B。 7. The wine cabinet according to any one of claims 1 to 6, characterized in that: Also includes: A first air door, arranged at a first air outlet of the heat dissipation air duct; The first air door can be controlled to open or close the first air outlet of the heat dissipation air duct.

8. The wine cabinet according to any one of claims 1 to 6, characterized in that: The heat dissipation duct also includes: A main air duct, the main air duct includes a second air inlet and a first air outlet; The secondary air duct includes a first air inlet, a second air outlet and a third air outlet; the first air inlet and the second air outlet are arranged on the side wall of the wine cabinet body, and the third air outlet is connected to the second air inlet; In the case where the refrigeration space includes a plurality of temperature zones, the heat dissipation air duct includes a plurality of sub-air ducts, and the plurality of sub-air ducts are arranged in a one-to-one correspondence with the plurality of temperature zones.

9. The wine cabinet according to claim 8, characterized in that: Also includes: The second air door is arranged at the third air outlet; the second air door can be controlled to open or close the third air outlet.

10. The wine cabinet according to any one of claims 1 to 6, characterized in that: The first air outlet includes: Multiple branch air outlets; each branch air outlet is connected to the heat dissipation duct, and the multiple branch air outlets are arranged on the side wall of the electric control box at intervals along the width direction of the electric control box.

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