Integrated adhesive film

Abstract

The utility model relates to an integrated adhesive film, and relates to the technical field of photovoltaic cells. The integrated adhesive film comprises a substrate film layer, a first adhesive layer and a second adhesive layer, wherein the substrate film layer is an adhesive film; the integrated adhesive film comprises a substrate film layer and a bearing film layer, the bearing film layer is a pre-crosslinking film, and the substrate film layer and the bearing film layer are compounded into the integrated adhesive film. The bearing film layer and the substrate film layer are compounded into a whole, so that the flowing speed of the integrated adhesive film is delayed, and the integrated adhesive film is prevented from flowing into a gap between the welding strip and a battery piece when the welding strip is pressed.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaic cells, in particular to an integrated adhesive film. Background Art

[0002] As battery cells continue to become thinner in order to reduce costs, the thickness of battery cells is currently decreasing from 150μm to 120μm, and may become even thinner in the future.

[0003] Traditional high-temperature welding technology has poor compatibility with thin-film cells, which are prone to warping or cracking, and the process risk is very high. As a result, a new type of soft connection glue-fixed solder ribbon connection method has emerged, which does not require high-temperature welding or flux and is very suitable for thin-film cells.

[0004] The current new connection method only uses adhesive film to fix the two ends of the soldering ribbon on the battery cell. The soldering ribbon is welded and pressed onto the battery cell by a laminator. The traditional adhesive film has good fluidity and is easy to flow into the gap between the soldering ribbon and the battery cell when pressing the soldering ribbon, resulting in poor soldering effect of the soldering ribbon, a large number of EL shadows, and a large number of bubbles on the appearance. Utility Model Content

[0005] The utility model aims to provide an integrated adhesive film and its application, so as to solve the problem that the traditional adhesive film flows into the gap between the welding strip and the battery cell when the welding strip is pressed.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an integrated adhesive film, comprising: a base film layer, the base film layer is an adhesive film; a bearing film layer, the bearing film layer is a pre-cross-linked film, arranged on the lower surface of the base film layer, the base film layer and the bearing film layer are compounded into the integrated adhesive film.

[0007] Preferably, the adhesive film is made of one of EVA, POE, co-extruded POE, PVB, PTFE, and ETFE.

[0008] Preferably, the carrier film is made of one of PE, PO, PET, PVC, PP, EVA, PVB, POE, PTFE, and ETFE.

[0009] Preferably, the thickness of the base film layer is less than 1 mm.

[0010] Preferably, the thickness of the supporting film layer is less than 1 mm.

[0011] Preferably, the base film layer and the support film layer are compounded by co-extrusion.

[0012] Preferably, the base film layer and the carrier film layer are compounded by lamination.

[0013] In addition, in order to achieve the above objectives, the embodiments of the present application also disclose an application of an integrated adhesive film on a photovoltaic cell.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] The utility model composites the carrier film layer and the base film layer into one, slows down the flow speed of the integrated adhesive film, prevents the integrated adhesive film from flowing into the gap between the welding strip and the battery cell when the welding strip is pressed, and arranges a rotating part on the surface of the upper pressing mold when the welding strip is pressed, so that before the upper pressing mold is lowered for lamination, the rotating part cooperates with the linkage part to drive the flattening and de-bubbling part to move horizontally on the surface of the integrated mold, thereby preventing a large number of EL shadows and a large number of bubbles from appearing on the appearance. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the main three-dimensional structure of the utility model;

[0017] Figure 2 It is a partial three-dimensional structural schematic diagram of the utility model;

[0018] Figure 3 for Figure 2 A magnified schematic diagram of the structure at position A;

[0019] Figure 4 It is a three-dimensional structural schematic diagram of the flattening component of the utility model;

[0020] Figure 5 It is a three-dimensional structural schematic diagram of the rotating part of the utility model;

[0021] Figure 6 It is a three-dimensional structural schematic diagram of the rotation limiter of the utility model;

[0022] Figure 7 It is a cross-sectional structural schematic diagram of the flattening assembly of the utility model;

[0023] Figure 8 It is a schematic cross-sectional structure diagram of the rotation limiter of the utility model;

[0024] Fig. 9 Schematic diagram of the structure of the integrated film.

[0025] In the figure: upper pressure mold 1, flattening top plate 2, cleaning brush 3, lower pressure mold 4, integrated adhesive film 5, adhesive film layer 501, bearing film layer 502, flattening roller 6, defoaming scraper 7, connecting rod 8, reset rod 9, rotation limit block 10, fixed block 11, limit rotation groove 12, rotating shaft 13, fixed shaft 14, first rotating fixed plate 15, rotating bottom plate 16, second rotating fixed plate 17, rotating spring 18, flattening top holding rod 19, flattening fixed block 20, defoaming fixed block 21, rotation limit groove 22, rotation limit top holding block 23, flattening sliding limit groove 24, flattening sliding limit block 25, flattening top holding spring 26, flattening top holding groove 27, defoaming top holding groove 28, defoaming top holding spring 29, defoaming sliding limit groove 30, defoaming sliding limit block 31, rotation top holding spring 32, rotation top holding groove 33. DETAILED DESCRIPTION

[0026] In order to make the purpose and technical solution of the utility model clearly and completely described, and the advantages more clearly understood, the embodiments of the utility model are further described in detail in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are part of the embodiments of the utility model, not all of the embodiments, and are only used to explain the embodiments of the utility model, and are not used to limit the embodiments of the utility model. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] In the description of the present utility model, it should be noted that the terms "center", "middle", "upper", "lower", "left", "right", "inner", "outer", "top", "bottom", "side", "vertical", "horizontal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "one", "first", "second", "third", "fourth", "fifth", "sixth" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0028] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] For the purpose of simplicity and illustration, the principles of the embodiments are mainly described by reference to examples. In the following description, many specific details are proposed to provide a thorough understanding of the embodiments. However, it is obvious that for those of ordinary skill in the art, these embodiments may not be limited to these specific details in practice. In some instances, known methods and structures are not described in detail to avoid making these embodiments unnecessarily difficult to understand. In addition, all embodiments can be used in combination with each other. Example

[0030] like Fig. 9 As shown, this embodiment discloses an integrated adhesive film, including a base film layer and a carrier film layer, wherein the carrier film layer is a pre-cross-linked film, which is arranged on the lower surface of the base film layer, and the base film layer and the carrier film layer are composited into the integrated adhesive film.

[0031] Preferably, the adhesive film is made of one of EVA, POE, co-extruded POE, PVB, PTFE, and ETFE.

[0032] Preferably, the carrier film is made of one of PE, PO, PET, PVC, PP, EVA, PVB, POE, PTFE, and ETFE.

[0033] Preferably, the thickness of the base film layer is less than 1 mm.

[0034] Preferably, the thickness of the supporting film layer is less than 1 mm.

[0035] Preferably, the base film layer and the support film layer are compounded by co-extrusion.

[0036] Preferably, the base film layer and the carrier film layer are compounded by lamination. Example

[0037] like Figure 1-8 As shown, this embodiment discloses a method for preparing an integrated adhesive film, comprising the following steps: using a laminating machine to press the base film layer and the carrier film layer together.

[0038] Specifically, the laminating machine includes: an upper pressing mold 1, which is arranged on the surface of the laminating machine; a lower pressing mold 4, which is arranged on the surface of the laminating machine and is located below the upper pressing mold 1; an integrated adhesive film 5, which is arranged on the upper surface of the lower pressing mold 4; a connecting rod 8, which is arranged above the flattening top plate 2 and is located outside the upper pressing mold 1; a rotating part, which is arranged on the surface of the upper pressing mold 1; a connecting part, which is arranged on the surface of the upper pressing mold 1; and a flattening and defoaming part, including a cleaning brush 3, a flattening part and a defoaming part, the cleaning brush 3, the flattening part and the defoaming part are all arranged between the upper pressing mold 1 and the lower pressing mold 4, and the length of the cleaning brush 3 is greater than the length of the integrated adhesive film 5. Example

[0039] On the basis of Embodiment 2, in order to flatten the integrated film 5, the flattening member includes a flattening top holding rod 19, a flattening roller 6 sleeved on the surface of the flattening top holding rod 19, and a flattening limiting top holding member. The flattening top holding rod 19 is arranged below the flattening top plate 2. The flattening top holding rod 19 has a "C" - shaped structure. The flattening roller 6 rotates around the axis line at the lower end of the flattening top holding rod 19, and the length of the flattening roller 6 is equal to the length of the cleaning brush 3. The flattening limiting top holding member includes a flattening fixing block 20, a flattening top holding groove 27 opened on the surface of the flattening fixing block 20, a flattening top holding spring 26 connected to the flattening top holding groove 27, a flattening sliding limiting groove 24, and a flattening sliding limiting block 25 matched with the flattening sliding limiting groove 24. The flattening fixing block 20 is fixed in the middle of the bottom surface of the flattening top plate 2. The flattening top holding groove 27 is opened on the bottom surface of the flattening fixing block 20 and has a cross - section in a "C" - shaped structure. The other end of the flattening top holding spring 26 is connected to the top surface of the flattening top holding rod 19. The flattening sliding limiting blocks 25 are fixed on both sides of the upper end surface of the flattening top holding rod 19. The flattening sliding limiting grooves 24 are opened on both sides of the flattening top holding groove 27, and both the cross - sections of the flattening sliding limiting groove 24 and the flattening sliding limiting block 25 are in a "T" - shaped structure. The flattening sliding limiting groove 24 and the flattening sliding limiting block 25 cooperate to longitudinally limit the flattening top holding rod 19.

[0040] The flattening top holding spring 26 holds the flattening top holding rod 19 to drive the flattening roller 6 to contact the integrated film 5. The flattening roller 6 rolls on the surface of the flattening top holding rod 19, thereby flattening the integrated film 5 after being cleaned by the cleaning brush 3. The flattening sliding limiting groove 24 and the flattening sliding limiting block 25 longitudinally limit the flattening top holding rod 19 to prevent the flattening top holding rod 19 from tilting. Embodiment

[0041] On the basis of Embodiment 2, in order to remove bubbles from the integrated film 5, the bubble - removing member includes a bubble - removing scraper 7 and a bubble - removing limiting top holding member. The bubble - removing scraper 7 is arranged below the flattening top plate 2, and the length of the bubble - removing scraper 7 is equal to the length of the cleaning brush 3. The bubble - removing limiting top holding member includes a bubble - removing fixing block 21, a bubble - removing top holding groove 28 opened on the surface of the bubble - removing fixing block 21, a bubble - removing top holding spring 29 connected to the bubble - removing top holding groove 28, a bubble - removing sliding limiting groove 30, and a bubble - removing sliding limiting block 31 matched with the bubble - removing sliding limiting groove 30. The bubble - removing fixing block 21 is fixed on the bottom surface of the flattening top plate 2. The bubble - removing top holding groove 28 is opened on the bottom surface of the bubble - removing fixing block 21 and has a cross - section in a "C" - shaped structure. The other end of the bubble - removing top holding spring 29 is connected to the top surface of the bubble - removing scraper 7. The bubble - removing sliding limiting blocks 31 are fixed on both sides of the upper end surface of the bubble - removing scraper 7. The bubble - removing sliding limiting grooves 30 are opened on both sides of the bubble - removing top holding groove 28, and both the cross - sections of the bubble - removing sliding limiting groove 30 and the bubble - removing sliding limiting block 31 are in a "T" - shaped structure. The bubble - removing sliding limiting groove 30 and the bubble - removing sliding limiting block 31 cooperate to longitudinally limit the bubble - removing scraper 7.

[0042] The debubble scraper 7 is held in contact with the integrated film 5 by the debubble holding spring 29, thereby debubbling the integrated film 5 after being flattened by the flattening roller 6. The debubble sliding limit groove 30 and the debubble sliding limit block 31 limit the debubble scraper 7 longitudinally to ensure that the debubble scraper 7 is always perpendicular to the integrated film 5. Example

[0043] On the basis of Example 2, in order to realize the movement of the flattening top plate 2 when the upper pressure clamping mold 1 is pressed down, the rotating member includes a rotating shaft 13, a fixed block 11 connected to the rotating shaft 13, a rotating spring 18, a second rotating fixed plate 17 connected to one end of the rotating spring 18, a first rotating fixed plate 15 connected to the other end, a rotating bottom plate 16 connected to the first rotating fixed plate 15, a limiting rotating groove 12 connected to the second rotating fixed plate 17 and a rotating limiting member, the rotating shaft 13 passes through the upper pressure clamping mold 1 and both ends extend out of the upper pressure clamping mold 1, the fixed block 11 is fixed at both ends of the rotating shaft 13, and is coaxially arranged with the rotating shaft 13. The upper end of the connecting rod 8 is sleeved on the surface of the rotating shaft 13, the rotating bottom plate 16 is fixed on the upper end of the connecting rod 8, the limit rotation groove 12 is opened on the two side surfaces of the lower end of the upper pressure clamping mold 1, and the rotating spring 18 is sleeved on the outer surface of the rotating shaft 13; the connecting part includes a flattening top plate 2 and a fixed shaft 14, the fixed shaft 14 passes through the flattening top plate 2 and the two ends extend out of the flattening top plate 2, the fixed shaft 14 is an "I"-shaped structure, and the protruding ends on both sides of the fixed shaft 14 are hinged to the lower end of the connecting rod 8, the flattening top plate 2 is arranged between the upper pressure clamping mold 1 and the lower pressure clamping mold 4, and is located between the two sets of connecting rods 8, and the cleaning brush 3 is fixed on the bottom end surface of the flattening top plate 2.

[0044] The first rotating fixed plate 15 and the second rotating fixed plate 17 connected by the rotating spring 18 make the connecting rod 8 and the rotating shaft 13 rotate simultaneously, and the cleaning brush 3, the flattening roller 6 and the defoaming scraper 7 contact the integrated film 5 by pressing the upper mold 1 downward, so that the rotating shaft 13 rotates, so that the cleaning brush 3, the flattening roller 6 and the defoaming scraper 7 clean, flatten and defoam the integrated film 5 in turn, and make the connecting rod 8 rotate toward both sides of the integrated film 5, thereby driving the flattening top plate 2 to move toward both sides of the integrated film 5. Example

[0045] On the basis of Embodiment 2, in order to prevent the linkage rod 8 from rebounding when the upper pressing die 1 moves downward and then rises, the rotation limiting member includes a rotation limiting block 10, a rotation limiting groove 22 formed on the surface of the rotation limiting block 10, a rotation abutting spring 32, a rotation abutting groove 33 connected to one end of the rotation abutting spring 32, a rotation limiting abutting block 23 connected to the other end, and a reset pull rod 9. The rotation limiting block 10 is fixed on the two side surfaces of the upper pressing die 1. The rotation limiting groove 22 is formed on the bottom surface of the rotation limiting block 10. The rotation abutting groove 33 is formed on the surface of the rotation limiting groove 22. The cross sections of both the rotation limiting groove 22 and the rotation abutting groove 33 are in a "C" - shaped structure. The lower surface of the rotation limiting abutting block 23 is provided with an inclined surface, and the transverse length of the inclined surface is less than the width of the rotation limiting groove 22. One end of the reset pull rod 9 extends out of the rotation limiting block 10, and the other end passes through the rotation limiting block 10 and the rotation abutting groove 33 and is connected to the rotation limiting abutting block 23. The rotation abutting spring 32 is sleeved on the outer surface of the reset pull rod 9. The width of the rotation limiting groove 22 is equal to the thickness of the linkage rod 8. The distance between the top surface of the rotation limiting abutting block 23 and the top surface of the rotation limiting block 10 is equal to the width of the linkage rod 8.

[0046] When the linkage rod 8 contacts the inclined surface formed on the rotation limiting abutting block 23, the rotation limiting abutting block 23 is pressed into the interior of the rotation abutting groove 33. When the linkage rod 8 enters above the rotation limiting abutting block 23, the rotation abutting spring 32 abuts the rotation limiting abutting block 23 to enter the rotation limiting groove 22, thereby limiting and fixing the linkage rod 8 to prevent the linkage rod 8 from rebounding when the upper pressing die 1 rises. And the limit fixation of the linkage rod 8 can be cancelled by pulling the reset pull rod 9.

[0047] Although the above - described illustrative specific embodiments of the present application have been described to enable those skilled in the art to understand the present application, the present application is not limited to the scope of the specific embodiments. For those of ordinary skill in the art, as long as various changes are within the spirit and scope of the present application defined and determined by the appended claims, all the application creations using the concept of the present application are within the scope of protection.

Claims

1. An integrated adhesive film, characterized in that: include: A base film layer, wherein the base film layer is an adhesive film; The bearing film layer is a pre-crosslinked film and is arranged on the lower surface of the base film layer. The base film layer and the bearing film layer are compounded into the integrated adhesive film.

2. The integrated adhesive film according to claim 1, characterized in that: The adhesive film is one of EVA, POE, co-extruded POE, PVB, PTFE and ETFE.

3. The integrated adhesive film according to claim 1, characterized in that: The carrier film is one of PE, PO, PET, PVC, PP, EVA, PVB, POE, PTFE, and ETFE.

4. The integrated adhesive film according to claim 1, characterized in that: The thickness of the base film layer is less than 1 mm.

5. The integrated adhesive film according to claim 1, characterized in that: The thickness of the supporting film layer is less than 1 mm.

6. The integrated adhesive film according to claim 1, characterized in that: The base film layer and the support film layer are compounded by co-extrusion.

7. The integrated adhesive film according to claim 1, characterized in that: The base film layer and the carrier film layer are compounded by lamination.

Images