Clamping mechanism and electroplating equipment with same

Abstract

The utility model discloses a clamping mechanism and electroplating equipment with the same, the clamping mechanism comprises a plurality of clamping bodies, each clamping body comprises an upper clamping surface and a lower clamping surface, the upper clamping surface is attached to the first surface of a film, and the lower clamping surface is attached to the second surface of the film, so that the film is clamped through the upper clamping surface and the lower clamping surface; wherein the upper clamping surface of at least one clamping body is an upper conductive surface electrically connected with the first surface, and the upper clamping surface of at least one clamping body is an upper buffer surface attached to the first surface; the lower clamping face of at least one clamping body is a lower conductive face electrically connected with the second surface, and the lower clamping face of at least one clamping body is a lower buffering face attached to the second surface. The conductive clamp solves the problem that a conductive clamp in the prior art is easy to cause damage to a thin film in the process of clamping the thin film.

Description

Technical Field

[0001] The present application relates to the technical field of thin film electroplating, and in particular to a clamping mechanism and an electroplating device having the same. Background Art

[0002] At present, an edge conductive electroplating equipment has appeared in the composite copper foil electroplating production line. Its characteristic is that a large number of conductive clips are clamped on the edges of both sides of the copper foil respectively, and the conductive clips are connected, moved and opened and closed through steel belt transmission and opening and closing mechanism, so as to realize the continuous production of composite copper foil.

[0003] Among them, during the clamping process, the conductive clamp is electrically connected to the upper and lower surfaces of the copper foil through two clamping surfaces and maintains the clamping of the copper foil. However, due to the existence of machining errors, the clamping surface of the conductive clamp cannot be completely fitted with the surface of the film. The clamping surface and the film are in partial contact, and the contact between the clamping surface and the edge or corner of the film can easily cause damage to the film, resulting in stress concentration during the film production process, which makes the film easily damaged. Utility Model Content

[0004] The main purpose of the present application is to provide a clamping mechanism and an electroplating device having the same, so as to solve the problem in the prior art that the conductive clamps easily cause damage to the film during the process of clamping the film.

[0005] According to one aspect of the present application, a clamping mechanism is provided, comprising: a plurality of clamping bodies, each clamping body comprising an upper clamping surface and a lower clamping surface, the upper clamping surface being in contact with the first surface of the film, and the lower clamping surface being in contact with the second surface of the film, so as to clamp the film by the upper clamping surface and the lower clamping surface; wherein, the upper clamping surface of at least one clamping body is an upper conductive surface electrically connected to the first surface, and the upper clamping surface of at least one clamping body is an upper buffer surface in contact with the first surface; the lower clamping surface of at least one clamping body is a lower conductive surface electrically connected to the second surface, and the lower clamping surface of at least one clamping body is a lower buffer surface in contact with the second surface.

[0006] Furthermore, the clamping mechanism also includes: a first buffer component, which is arranged on the upper buffer surface, at least a portion of the first buffer component is in contact with the first surface, and the first buffer component can be elastically arranged; and / or, a second buffer component, which is arranged on the lower buffer surface, at least a portion of the second buffer component is in contact with the second surface, and the second buffer component can be elastically arranged.

[0007] Furthermore, the first buffer component and / or the second buffer component is an insulating member.

[0008] Further, the first buffer component protrudes relative to the upper buffer surface toward the direction close to the first surface; and / or the second buffer component protrudes relative to the lower buffer surface toward the direction close to the second surface.

[0009] Furthermore, the multiple clamping bodies include a first clamping body and a second clamping body adjacent to each other along the transmission direction of the film; the upper clamping surface of the first clamping body is an upper conductive surface, and the lower clamping surface of the first clamping body is a lower buffer surface; the upper clamping surface of the second clamping body is an upper buffer surface, and the lower clamping surface of the second clamping body is a lower conductive surface; wherein, the upper conductive surface and the upper buffer surface are respectively bonded to the first surface, and the lower buffer surface and the lower conductive surface are respectively bonded to the second surface.

[0010] Furthermore, the first clamping body includes: a first fixed clamping arm, on which the lower buffer surface is arranged; a first movable clamping arm, which is arranged on the first fixed clamping arm, the first movable clamping arm is movably arranged relative to the first fixed clamping arm, and the upper conductive surface is arranged on the first movable clamping arm.

[0011] Furthermore, the second clamping body includes: a second fixed clamping arm, on which the lower conductive surface is arranged; a second movable clamping arm, which is arranged on the second fixed clamping arm, the second movable clamping arm is movably arranged relative to the second fixed clamping arm, and the upper buffer surface is arranged on the second movable clamping arm.

[0012] Furthermore, there are a plurality of first clamping bodies and a plurality of second clamping bodies, and the plurality of first clamping bodies and the plurality of second clamping bodies are alternately arranged in sequence along the transmission direction of the film.

[0013] Furthermore, the clamping mechanism also includes: a first conductive layer, which is arranged on the upper conductive surface, and at least a portion of the first conductive layer is in contact with the first surface to be electrically connected to the film; and / or a second conductive layer, which is arranged on the lower conductive surface, and at least a portion of the second conductive layer is in contact with the second surface to be electrically connected to the film.

[0014] On the other hand, the utility model also provides an electroplating device, including a clamping mechanism, and the clamping mechanism is the above-mentioned clamping mechanism.

[0015] Compared with the prior art, the technical solution of this application has at least the following technical effects:

[0016] According to the clamping mechanism provided by the utility model, it includes multiple clamping bodies, each of which includes multiple upper clamping surfaces and multiple lower clamping surfaces. The multiple clamping bodies are used to clamp the film together to ensure smooth transmission of the film during the electroplating process, wherein the upper clamping surface of at least one clamping body is an upper conductive surface electrically connected to the first surface, and the upper clamping surface of at least one clamping body is an upper buffer surface fitted with the first surface; the upper conductive surface is electrically connected to the first surface of the film, and the upper buffer surface is used to protect the first surface of the film, the lower clamping surface of at least one clamping body is a lower conductive surface electrically connected to the second surface, and the lower clamping surface of at least one clamping body is a lower buffer surface fitted with the second surface, the lower conductive surface is electrically connected to the second surface of the film, and the lower buffer surface is used to protect the second surface of the film, thereby ensuring electrical connection with the film, and the upper buffer surface and the lower buffer surface can be used to protect the film, thereby reducing stress concentration at the edge of the film due to breakage, reducing the breakage rate of the film and the risk of film breakage. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0018] Figure 1 It is a structural schematic diagram of a first clamping body of the clamping mechanism disclosed in the utility model;

[0019] Figure 2 It is a partial enlarged view of the first clamping body of the clamping mechanism disclosed in the utility model;

[0020] Figure 3 It is a structural schematic diagram of the second clamping body of the clamping mechanism disclosed in the utility model;

[0021] Figure 4 It is a partial enlarged view of the second clamping body of the clamping mechanism disclosed in the utility model.

[0022] The above drawings include the following reference numerals:

[0023] 1. Upper clamping surface; 2. Lower clamping surface; 10. Upper conductive surface; 11. Upper buffer surface; 20. Lower conductive surface; 21. Lower buffer surface; 3. First buffer component; 4. Second buffer component; 5. First clamping body; 6. Second clamping body; 50. First fixed clamping arm; 51. First movable clamping arm; 60. Second fixed clamping arm; 61. Second movable clamping arm; 7. First conductive layer; 8. Second conductive layer. DETAILED DESCRIPTION

[0024] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0025] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0026] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0027] As mentioned in the background technology, in the process of producing composite current collectors, it is necessary to electroplate the film. In the prior art, the edges of both sides of the film are clamped by multiple conductive clips to achieve conductivity of the film, so that the film is electroplated in the plating tank. In this process, due to the existence of mechanical processing errors and movement accuracy problems, the conductive clips are often in point contact during the contact process of the film, which will cause damage to the film during the clamping process, and stress concentration will occur during the subsequent processing of the film, which may easily cause problems such as tearing and damage to the film or even film breakage. Therefore, in response to the above technical problems, the utility model provides a clamping mechanism, including multiple clamping bodies, each clamping body includes an upper clamping surface 1 and a lower clamping surface 2, the upper clamping surface 1 is bonded to the first surface of the film, and the lower clamping surface 2 is bonded to the second surface of the film. In actual During the production process, multiple clamping bodies jointly clamp the film to maintain the stability of the film during the electroplating process, wherein the upper clamping surface 1 of at least one clamping body is an upper conductive surface 10 electrically connected to the first surface, and the upper clamping surface 1 of at least one clamping body is an upper buffer surface 11 bonded to the first surface; the lower clamping surface 2 of at least one clamping body is a lower conductive surface 20 electrically connected to the second surface, and the lower clamping surface 2 of at least one clamping body is a lower buffer surface 21 bonded to the second surface; in this way, the upper buffer surface 11 and the lower buffer surface 21 are respectively bonded to the first surface and the second surface of the film to protect the film, and at the same time, the upper conductive surface 10 and the lower conductive surface 20 are used to achieve electrical connection with the film, so as to avoid damage to the position where the film is clamped, reduce the risk of film breakage, and improve the production quality of the current collector.

[0028] See also Figures 1 to 4 As shown, the present application provides a clamping mechanism, comprising: a plurality of clamping bodies, each clamping body comprising an upper clamping surface 1 and a lower clamping surface 2, the upper clamping surface 1 being in contact with the first surface of the film, and the lower clamping surface 2 being in contact with the second surface of the film, so as to clamp the film by the upper clamping surface 1 and the lower clamping surface 2; wherein, the upper clamping surface 1 of at least one clamping body is an upper conductive surface 10 electrically connected to the first surface, and the upper clamping surface 1 of at least one clamping body is an upper buffer surface 11 in contact with the first surface; the lower clamping surface 2 of at least one clamping body is a lower conductive surface 20 electrically connected to the second surface, and the lower clamping surface 2 of at least one clamping body is a lower buffer surface 21 in contact with the second surface.

[0029] According to the clamping mechanism provided by the utility model, it includes multiple clamping bodies, each of which includes an upper clamping surface 1 and a lower clamping surface 2. The multiple clamping bodies are used to clamp the film together to ensure smooth transmission of the film during the electroplating process, wherein the upper clamping surface 1 of at least one clamping body is an upper conductive surface 10 electrically connected to the first surface, and the upper clamping surface 1 of at least one clamping body is an upper buffer surface 11 fitted with the first surface; the upper conductive surface 10 is electrically connected to the first surface of the film, and the first surface of the film is protected by the upper buffer surface 11, the lower clamping surface 2 of at least one clamping body is a lower conductive surface 20 electrically connected to the second surface, and the lower clamping surface 2 of at least one clamping body is a lower buffer surface 21 fitted with the second surface, the lower conductive surface 20 is electrically connected to the second surface of the film, and the second surface of the film is protected by the lower buffer surface 21, and the joint action of the above-mentioned surfaces can reduce stress concentration at the edge of the film, and reduce the breakage rate of the film and the risk of film breakage.

[0030] Furthermore, the clamping mechanism further includes: a first buffer component 3, which is arranged on the upper buffer surface 11, at least a portion of the first buffer component 3 is in contact with the first surface, and the first buffer component 3 can be elastically arranged; and / or a second buffer component 4, which is arranged on the lower buffer surface 21, at least a portion of the second buffer component 4 is in contact with the second surface, and the second buffer component 4 can be elastically arranged. Among them, the first buffer component 3 and the second buffer component 4 can use elastic force to protect the surface of the film when they are in contact with the surface of the film, so as to avoid rigid collision with the surface of the film at the moment of clamping, or friction with the surface of the film during the movement of the clamping assembly, which may cause damage to the surface of the film.

[0031] Specifically, the first buffer component 3 and / or the second buffer component 4 are insulating components. Preferably, the first buffer component 3 and the second buffer component 4 are made of rubber material to avoid damage to the surface of the film during the clamping process.

[0032] In the specific implementation process, the first buffer component 3 protrudes in the direction close to the first surface relative to the upper buffer surface 11; and / or the second buffer component 4 protrudes in the direction close to the second surface relative to the lower buffer surface 21. In this way, in the process of clamping the film, the first buffer component 3 is bonded to the film before the upper buffer surface 11, and the second buffer component 4 is bonded to the film before the lower buffer surface 21, thereby protecting the film, and using the first buffer component 3 and the second buffer component 4 to disperse the interaction force between the film and the film when clamping the film.

[0033] In the embodiment provided by the utility model, the plurality of clamping bodies include a first clamping body 5 and a second clamping body 6 which are adjacently arranged along the transmission direction of the film; the upper clamping surface 1 of the first clamping body 5 is an upper conductive surface 10, and the lower clamping surface 2 of the first clamping body 5 is a lower buffer surface 21; the upper clamping surface 1 of the second clamping body 6 is an upper buffer surface 11, and the lower clamping surface 2 of the second clamping body 6 is a lower conductive surface 20; wherein the upper conductive surface 10 and the upper buffer surface 11 are respectively bonded to the first surface, and the lower buffer surface 21 and the lower conductive surface 20 are respectively bonded to the second surface. In this way, the upper conductive surface 10 is matched with the lower buffer surface 21, and the upper buffer surface 11 is matched with the lower conductive surface 20, and the upper conductive surface 10 and the lower conductive surface 20 are electrically connected to the film. At the same time, during the clamping process of the upper conductive surface 10 and the lower buffer surface 21, the lower buffer surface 21 is used to protect the film. Similarly, during the clamping process of the upper buffer surface 11 and the lower conductive surface 20, the upper buffer surface 11 is used to protect the film, which can not only ensure the electroplating quality, but also protect the surface of the film. Preferably, a first buffer component is provided on the upper buffer surface 11, and a second buffer component is provided on the lower buffer surface 21.

[0034] Specifically, the first clamping body 5 includes: a first fixed clamping arm 50, on which the lower buffer surface 21 is arranged; a first movable clamping arm 51, which is arranged on the first fixed clamping arm 50, the first movable clamping arm 51 is movably arranged relative to the first fixed clamping arm 50, and the upper conductive surface 10 is arranged on the first movable clamping arm 51. The second clamping body 6 includes: a second fixed clamping arm 60, on which the lower conductive surface 20 is arranged; a second movable clamping arm 61, which is arranged on the second fixed clamping arm 60, the second movable clamping arm 61 is movably arranged relative to the second fixed clamping arm 60, and the upper buffer surface 11 is arranged on the second movable clamping arm 61. The first clamping body 5 and the second clamping body 6 are combined as a group, which not only ensures electrical connection with the film, but also can play a buffering role on the film in the process of clamping the film by the first clamping body 5 or the second clamping body 6, so as to avoid damage to the film.

[0035] Preferably, there are multiple first clamping bodies 5 and multiple second clamping bodies 6, and the multiple first clamping bodies 5 and multiple second clamping bodies 6 are alternately arranged in sequence along the transmission direction of the film. This arrangement can ensure the stability of the film clamping, and after adding the upper buffer surface and the lower buffer surface for protecting the film, it avoids affecting the electrical connection between the clamping assembly and the film.

[0036] The clamping mechanism further includes: a first conductive layer 7, which is disposed on the upper conductive surface 10, at least a portion of which is in contact with the first surface to be electrically connected to the film; and / or a second conductive layer 8, which is disposed on the lower conductive surface 20, at least a portion of which is in contact with the second surface to be electrically connected to the film. Preferably, the first conductive layer 7 and / or the second conductive layer 8 are metal layers.

[0037] The utility model also provides an electroplating device, comprising a clamping mechanism, and the clamping mechanism is the clamping mechanism of the above embodiment.

[0038] From the above description, it can be seen that the above embodiments of the present application achieve the following technical effects:

[0039] According to the clamping mechanism provided by the utility model, it includes a plurality of clamping bodies, each of which includes an upper clamping surface 1 and a lower clamping surface 2. The film is clamped together by the plurality of clamping bodies to ensure the smooth transmission of the film during the electroplating process, wherein the upper clamping surface 1 of at least one clamping body is an upper conductive surface 10 electrically connected to the first surface, and the upper clamping surface 1 of at least one clamping body is an upper buffer surface 11 in contact with the first surface; the upper conductive surface 10 is electrically connected to the first surface of the film, and the upper buffer surface 11 is used to protect the first surface of the film, and the lower clamping surface 2 of at least one clamping body is an upper conductive surface 10 electrically connected to the second surface. The lower conductive surface 20 is electrically connected to the surface, and the lower clamping surface 2 of at least one clamping body is a lower buffer surface 21 that fits with the second surface. The lower conductive surface 20 is electrically connected to the second surface of the film, and the second surface of the film is protected by the lower buffer surface 21. Through the joint action of the above-mentioned surfaces, the force on the first clamping surface and the second clamping surface is more uniform, the stress concentration at the edge of the film is reduced, the breakage rate of the film and the risk of film breakage are reduced, thereby improving the qualified rate of product production. At present, the qualified rate loss caused by film breakage in the industry is about 10%. The utility model can reduce this loss from 10% to less than 3%.

[0040] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0041] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0042] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A clamping mechanism, characterized in that: include: A plurality of clamping bodies, each of the clamping bodies comprising an upper clamping surface (1) and a lower clamping surface (2), the upper clamping surface (1) being in contact with a first surface of the film, and the lower clamping surface (2) being in contact with a second surface of the film, so as to clamp the film through the upper clamping surface (1) and the lower clamping surface (2); Wherein, at least one upper clamping surface (1) of the clamping body is an upper conductive surface (10) electrically connected to the first surface, and at least one upper clamping surface (1) of the clamping body is an upper buffer surface (11) in contact with the first surface; At least one lower clamping surface (2) of the clamping body is a lower conductive surface (20) electrically connected to the second surface, and at least one lower clamping surface (2) of the clamping body is a lower buffer surface (21) in contact with the second surface.

2. The clamping mechanism according to claim 1, characterized in that: The clamping mechanism also includes: A first buffer component (3) is arranged on the upper buffer surface (11), at least a portion of the first buffer component (3) is in contact with the first surface, and the first buffer component (3) can be elastically arranged; and / or, The second buffer component (4) is arranged on the lower buffer surface (21), at least a part of the second buffer component (4) is in contact with the second surface, and the second buffer component (4) can be elastically arranged.

3. The clamping mechanism according to claim 2, characterized in that: The first buffer component (3) and / or the second buffer component (4) is an insulating member.

4. The clamping mechanism according to claim 2, characterized in that: The first buffer component (3) protrudes relative to the upper buffer surface (11) in a direction close to the first surface; and / or, The second buffer component (4) protrudes relative to the lower buffer surface (21) in a direction close to the second surface.

5. The clamping mechanism according to claim 1, characterized in that: The plurality of clamping bodies include a first clamping body (5) and a second clamping body (6) which are adjacently arranged along the transmission direction of the film; The upper clamping surface (1) of the first clamping body (5) is an upper conductive surface (10), and the lower clamping surface (2) of the first clamping body (5) is a lower buffer surface (21); The upper clamping surface (1) of the second clamping body (6) is an upper buffer surface (11), and the lower clamping surface (2) of the second clamping body (6) is a lower conductive surface (20); The upper conductive surface (10) and the upper buffer surface (11) are respectively bonded to the first surface, and the lower buffer surface (21) and the lower conductive surface (20) are respectively bonded to the second surface.

6. The clamping mechanism according to claim 5, characterized in that: The first clamping body (5) comprises: A first fixed clamping arm (50), the lower buffer surface (21) being arranged on the first fixed clamping arm (50); The first movable clamping arm (51) is arranged on the first fixed clamping arm (50); the first movable clamping arm (51) is movably arranged relative to the first fixed clamping arm (50); and the upper conductive surface (10) is arranged on the first movable clamping arm (51).

7. The clamping mechanism according to claim 5, characterized in that: The second clamping body (6) comprises: A second fixed clamping arm (60), the lower conductive surface (20) being arranged on the second fixed clamping arm (60); The second movable clamping arm (61) is arranged on the second fixed clamping arm (60); the second movable clamping arm (61) is movably arranged relative to the second fixed clamping arm (60); and the upper buffer surface (11) is arranged on the second movable clamping arm (61).

8. The clamping mechanism according to claim 5, characterized in that: There are a plurality of the first clamping bodies (5), and a plurality of the second clamping bodies (6). The plurality of the first clamping bodies (5) and the plurality of the second clamping bodies (6) are alternately arranged in sequence along the transmission direction of the film.

9. The clamping mechanism according to claim 1, characterized in that: The clamping mechanism also includes: A first conductive layer (7) is arranged on the upper conductive surface (10), at least a portion of the first conductive layer (7) is in contact with the first surface so as to be electrically connected to the film; and / or A second conductive layer (8) is arranged on the lower conductive surface (20), and at least a portion of the second conductive layer (8) is in contact with the second surface so as to be electrically connected to the film.

10. An electroplating device, comprising a clamping mechanism, characterized in that: The clamping mechanism is the clamping mechanism according to any one of claims 1 to 9.

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