Electroplating impurity treatment auxiliary cylinder

Abstract

The utility model discloses an electroplating impurity treatment auxiliary cylinder which comprises a cylinder body located outside an electroplating main cylinder and provided with a liquid storage tank, the cylinder body is connected with a liquid inlet pipe and a liquid outlet pipe, and electroplating liquid medicine enters the liquid storage tank from the electroplating main cylinder through the liquid inlet pipe and flows back to the electroplating main cylinder through the liquid outlet pipe; the electrode assembly is arranged in the liquid storage tank and comprises an adsorption plate and two anode groups, and the two anode groups are arranged on the two sides of the adsorption plate respectively; and the electrifying assembly is used for electrifying the electrode assembly so as to drive impurities in the electroplating liquid medicine to be accumulated on the adsorption plate. The continuous circulating auxiliary cylinder is arranged outside the electroplating main cylinder for impurity treatment, parallel operation of the electroplating process and impurity removal is achieved, the electroplating operation of the main cylinder does not need to be interrupted, and the production continuity and the overall efficiency are remarkably improved; and moreover, the electrode assembly and the electrifying assembly are matched to gather and fix metal impurities in the electroplating liquid medicine by utilizing an electrochemical adsorption principle, so that the impurity capturing effect is enhanced.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board electroplating treatment, in particular to an electroplating impurity treatment auxiliary cylinder. Background Art

[0002] In the field of modern electroplating, electroplating technology is one of the key steps to improve the corrosion resistance, wear resistance and aesthetics of metal parts. However, in the electroplating process, due to the incompleteness of the chemical reaction and the tiny impurities in the raw materials, impurities such as metal ions and organic debris often accumulate in the electroplating solution. If these impurities are not removed in time, they will seriously affect the quality of the electroplating layer, leading to surface spots, pinholes, uneven color and other problems, and even cause electroplating failure in severe cases. Therefore, the purification of the electroplating solution is an indispensable part of ensuring the quality of electroplated products.

[0003] Traditional methods of treating impurities in electroplating solutions mainly rely on periodic shutdowns to change solutions or physical filtration using filtration equipment, but both methods have their own limitations. Stopping the machine to change solutions not only interrupts the production process and reduces production efficiency, but also causes resource waste and environmental burdens; and although physical filtration can remove larger particle impurities to a certain extent, it has limited removal capacity for fine ions and organic pollutants, making it difficult to achieve high-standard purification effects. Therefore, it is urgent to propose a device for treating electroplating solutions without stopping the machine. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes an electroplating impurity treatment sub-cylinder, which can significantly improve the cleanliness and efficiency of the electroplating process, reduce the defective product rate caused by impurities, and meet the requirements of the modern electroplating industry for high-efficiency and high-quality production.

[0005] The electroplating impurity treatment sub-cylinder according to the embodiment of the utility model comprises:

[0006] A cylinder body is located outside the electroplating main cylinder, the cylinder body is provided with a liquid storage tank, the cylinder body is connected with a liquid inlet pipe and a liquid outlet pipe, the electroplating liquid enters the liquid storage tank from the electroplating main cylinder through the liquid inlet pipe, and flows back to the electroplating main cylinder through the liquid outlet pipe;

[0007] An electrode assembly is disposed in the liquid storage tank, wherein the electrode assembly includes an adsorption plate and an anode group, wherein the anode group has two anode groups, and the two anode groups are respectively disposed on both sides of the adsorption plate;

[0008] The power supply component is used to supply power to the electrode component to drive the impurities in the electroplating solution to accumulate on the adsorption plate.

[0009] The electroplating impurity treatment sub-cylinder according to the embodiment of the utility model has at least the following beneficial effects: by arranging a continuously circulating sub-cylinder outside the electroplating main cylinder for impurity treatment, the parallel operation of the electroplating process and the impurity removal is realized without interrupting the electroplating operation of the main cylinder, which significantly improves the production continuity and overall efficiency; and the electrode assembly and the power-on assembly cooperate to utilize the principle of electrochemical adsorption to gather and fix the metal impurities in the electroplating solution, thereby enhancing the impurity capture effect.

[0010] According to the electroplating impurity processing sub-cylinder described in the utility model, the anode group includes a plurality of mesh tubes arranged in an array, anode materials are arranged in the mesh tubes, and a first opening is arranged at the upper end of the mesh tubes, and the first opening is suitable for allowing the anode material to pass through.

[0011] According to the electroplating impurity processing sub-cylinder of the utility model, the outer peripheral wall of the mesh tube is wrapped with filter cloth.

[0012] According to the electroplating impurity processing sub-cylinder of the utility model, the end surface of the adsorption plate is wavy.

[0013] According to the electroplating impurity treatment sub-cylinder of the utility model, the cylinder body is provided with a mounting block, the mounting block is provided with a mounting groove, and the two ends of the adsorption plate are installed in the mounting groove.

[0014] According to the electroplating impurity processing sub-cylinder described in the utility model, the mounting block is arranged on the upper wall of the cylinder body, the upper end of the mounting groove is provided with a second opening, and mounting ears are provided at both ends of the adsorption plate, and the mounting ears are plugged into and matched with the mounting groove.

[0015] According to the electroplating impurity treatment sub-cylinder described in the utility model, the power-on component includes a positive pole power-on wire, a negative pole power-on wire and two conductive plates, and the conductive plates are arranged one-to-one with the anode group. One side of the conductive plate is placed in the liquid storage tank and is in contact with the anode group and is conductive, and the other side is located outside the liquid storage tank and is connected to the positive pole power-on wire, and the adsorption plate is connected to the negative pole power-on wire.

[0016] According to the electroplating impurity treatment sub-cylinder of the utility model, the connection between the liquid inlet pipe and the cylinder body is located at the upper part of the liquid storage tank, and the connection between the liquid outlet pipe and the cylinder body is located at the lower part of the liquid storage tank.

[0017] According to the electroplating impurity processing sub-cylinder of the utility model, the liquid outlet pipe is provided with a manual switch valve, and the manual switch valve is used to open or block the liquid outlet pipe.

[0018] According to the electroplating impurity treatment sub-cylinder of the utility model, the cylinder body is installed with an ion sensor, and the ion sensor is used to detect the ion concentration of the electroplating solution located in the liquid storage tank.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0021] Figure 1 It is a top view of the electroplating impurity treatment sub-cylinder according to an embodiment of the utility model;

[0022] Figure 2 This is a front view of the electroplating impurity treatment sub-cylinder according to an embodiment of the utility model.

[0023] Description of Figure Numbers:

[0024] Cylinder body 100; liquid storage tank 101; first wire hole 102; second wire hole 103; liquid inlet pipe 110; liquid outlet pipe 120; manual switch valve 121; mounting block 130; second opening 1301;

[0025] Adsorption plate 210; mounting ear 211; mesh tube 220; first opening 2201; anode material 221;

[0026] Conductive plate 310 . DETAILED DESCRIPTION

[0027] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0028] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0029] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0030] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0031] In the description of the utility model, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0032] In the field of modern electroplating, electroplating technology is one of the key steps to improve the corrosion resistance, wear resistance and aesthetics of metal parts. However, in the electroplating process, due to the incompleteness of the chemical reaction and the tiny impurities in the raw materials, impurities such as metal ions and organic debris often accumulate in the electroplating solution. If these impurities are not removed in time, they will seriously affect the quality of the electroplating layer, leading to surface spots, pinholes, uneven color and other problems, and even cause electroplating failure in severe cases. Therefore, the purification of the electroplating solution is an indispensable part of ensuring the quality of electroplated products.

[0033] Traditional methods of treating impurities in electroplating solutions mainly rely on periodic shutdowns to change solutions or physical filtration using filtration equipment, but both methods have their own limitations. Stopping the machine to change solutions not only interrupts the production process and reduces production efficiency, but also causes resource waste and environmental burdens; and although physical filtration can remove larger particle impurities to a certain extent, it has limited removal capacity for fine ions and organic pollutants, making it difficult to achieve high-standard purification effects. Therefore, it is urgent to propose a device for treating electroplating solutions without stopping the machine.

[0034] For this reason, Figure 1 and Figure 2As shown, the electroplating impurity treatment sub-cylinder proposed by the utility model includes a cylinder body 100, an electrode assembly and an energizing assembly, wherein the cylinder body 100 is located outside the electroplating main cylinder, and circulates the electroplating solution in the electroplating main cylinder. Specifically, the cylinder body 100 is provided with a liquid storage tank 101, and the cylinder body 100 is connected with a liquid inlet pipe 110 and a liquid outlet pipe 120. The electroplating solution enters the liquid storage tank 101 from the electroplating main cylinder through the liquid inlet pipe 110, and flows back to the electroplating main cylinder through the liquid outlet pipe 120. It is easy to understand that the flow of the electroplating solution is driven by a water pump, for example, the liquid inlet pipe 110 is connected to a first water pump, and the liquid outlet pipe 120 is connected to a second water pump, the first water pump pumps the electroplating solution in the electroplating main cylinder to the liquid storage tank 101, and the second water pump pumps the electroplating solution in the liquid storage tank 101 back to the electroplating main cylinder. Furthermore, the electrode assembly is arranged in the liquid storage tank 101, and the electrode assembly includes an adsorption plate 210 and an anode group. There are two anode groups, and the two anode groups are respectively arranged on both sides of the adsorption plate 210, so as to make full use of the two end surfaces of the adsorption plate 210 and accumulate impurities on the two end surfaces of the adsorption plate 210. In addition, the power-on assembly is used to energize the electrode assembly to drive the impurities in the electroplating solution to accumulate on the adsorption plate 210. It should be noted that by arranging a continuously circulating sub-cylinder outside the electroplating main cylinder for impurity treatment, the parallel operation of the electroplating process and impurity removal is realized, without interrupting the electroplating operation of the main cylinder, which significantly improves the production continuity and overall efficiency; and the electrode assembly and the power-on assembly cooperate to utilize the principle of electrochemical adsorption to gather and fix the metal impurities in the electroplating solution, thereby enhancing the impurity capture effect.

[0035] Refer to Figure 1 The anode group includes a plurality of mesh tubes 220 arranged in an array, wherein the mesh tubes 220 are provided with anode materials 221, and the upper end of the mesh tubes 220 is provided with a first opening 2201, which is suitable for the anode material 221 to pass through. Among them, the mesh structure of the mesh tube 220 promotes the uniform flow of the syrup and the effective contact between the impurities and the anode, thereby improving the efficiency and speed of impurity removal. It should be noted that when the anode is made of a nickel-containing alloy to be refined, the anode material 221 itself will gradually be consumed during the electrolysis process, especially the nickel and other soluble metal components therein will dissolve into the electrolyte. In addition, the upper end of the mesh tube 220 is provided with a first opening 2201, which, on the one hand, allows the gas generated by the anode material 221 in the electrochemical reaction to escape, thereby avoiding the accumulation of internal pressure; on the other hand, it is convenient for the operator to replenish the anode material 221. Optionally, the outer wall of the mesh tube 220 is wrapped with a filter cloth (not shown in the figure), which helps to intercept large particles of impurities and prevent them from clogging the mesh holes. It may also help regulate the flow pattern of the solution around the mesh tube 220, promote the uniformity of the solution flow, and make the electrochemical reaction more evenly distributed, which is beneficial to improving the overall efficiency of impurity adsorption and the stability of electroplating solution purification.

[0036] In some embodiments of the present invention, Figure 1 As shown, the end face of the adsorption plate 210 is wavy, which can create more "trough" areas, which naturally promote the aggregation and accumulation of metal impurities under electrochemical action. Compared with the planar structure, the wavy design provides more effective adsorption sites in the same area, which improves the adsorption efficiency of impurities. In addition, the dynamic surface of the wave structure increases the contact interface between the electroplating solution and the electrode, which helps to form a more uniform electric field distribution, thereby optimizing the electrochemical reaction conditions and making the impurity removal process more efficient and thorough. It should be noted that during the electroplating process, the crest part can reduce the scouring of the adsorbed impurities when the solution flows through, while the trough is more likely to accumulate impurities. When accumulated to a certain extent, due to factors such as gravity or vibration, the impurity groups accumulated in the trough may fall off by themselves, which is convenient for subsequent cleaning and reduces the need for manual intervention. By optimizing the structure of the adsorption plate 210 to improve the impurity treatment efficiency, the energy consumption in the electroplating process is indirectly reduced, and the need for frequent maintenance of the system is also reduced. In the long run, it helps to reduce the overall operating cost.

[0037] Refer to Figure 1 and Figure 2 The cylinder body 100 is provided with a mounting block 130, and the mounting block 130 is provided with a mounting groove. Both ends of the adsorption plate 210 are installed in the mounting groove. The design of the mounting block 130 and the mounting groove ensures the stable installation of the adsorption plate 210. Specifically, the mounting block 130 is provided on the upper wall of the cylinder body 100, and the upper end of the mounting groove is provided with a second opening 1301. Both ends of the adsorption plate 210 are provided with mounting ears 211, and the mounting ears 211 are plugged into the mounting groove, so that the replacement or cleaning of the adsorption plate 210 becomes simple and quick, without the need for complex tools, reducing the complexity and time cost of maintenance. In application, the operator can directly take out the old adsorption plate 210 from the top, and then directly insert the new adsorption plate 210 from the top.

[0038] Furthermore, the power supply assembly includes a positive pole power supply wire, a negative pole power supply wire and two conductive plates 310, and the conductive plates 310 are arranged one by one with the anode group. One side of the conductive plate 310 is placed in the liquid storage tank 101 and is in contact with the anode group, and the other side is located outside the liquid storage tank 101 and is connected to the positive pole power supply wire. The adsorption plate 210 is connected to the negative pole power supply wire, which can avoid direct contact between the wire and the liquid and improve safety. Optionally, the cylinder body 100 is made of insulating plastic material, and the upper wall of the cylinder body 100 is provided with a first wire hole 102 and a second wire hole 103. The first wire hole 102 is arranged corresponding to the conductive plate 310, the positive pole power supply wire is passed through the first wire hole 102, the second wire hole 103 is arranged corresponding to the mounting block 130, and the negative pole power supply wire is passed through the second wire hole 103. It is easy to understand that a driving power source is provided outside the cylinder body 100, and the driving power source passes through the positive electrode power line, the conductive plate 310, the anode group, the electroplating solution, the adsorption plate 210 and the negative electrode power line in sequence to form a closed loop.

[0039] In addition, in some embodiments of the present invention, the connection between the liquid inlet pipe 110 and the cylinder body 100 is located at the upper part of the liquid storage tank 101, and the connection between the liquid outlet pipe 120 and the cylinder body 100 is located at the lower part of the liquid storage tank 101, so that the electroplating solution forms a circulation mode of entering from the top and exiting from the bottom in the liquid storage tank 101, which helps to maintain the stability of the flow of the electroplating solution and the effective precipitation of impurities, and reduces the energy consumption of pumping. Figure 1 and Figure 2 , one end of the liquid inlet pipe 110 is connected to the electroplating main cylinder (not shown in the figure), and the other end is installed on the outer side wall of the cylinder body 100 and connected to the upper part of the liquid storage tank 101. Optionally, the liquid inlet pipe 110 converts the layout path through a right-angle joint. One end of the liquid outlet pipe 120 extends from the end face of the liquid storage tank 101 into the bottom of the liquid storage tank 101, and the other end extends out of the cylinder body 100 and is connected to the electroplating main cylinder (not shown in the figure). Similarly, the layout path of the liquid outlet pipe 120 can be converted by a right-angle joint. Further, the liquid outlet pipe 120 is provided with a manual switch valve 121, which is used to conduct or block the liquid outlet pipe 120, so that the operator can flexibly control the discharge of the electroplating solution according to the actual situation, and realize the instant start and stop of the solution circulation. This requires a quick response to abnormal situations in the electroplating process, such as excessive contamination of the solution, equipment maintenance requirements, etc., without interrupting the entire electroplating production line, thereby improving processing flexibility. In some embodiments, the cylinder body 100 is installed with an ion sensor, which is used to detect the ion concentration of the electroplating solution in the liquid storage tank 101. The ion concentration of the electroplating solution can be monitored in real time, the information of the metal ion impurity concentration of the current electroplating solution can be collected in time, and the impurity treatment effect can be fed back.

[0040] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. Electroplating impurity treatment sub-cylinder, characterized in that: include: A cylinder body is located outside the electroplating main cylinder, the cylinder body is provided with a liquid storage tank, the cylinder body is connected with a liquid inlet pipe and a liquid outlet pipe, the electroplating liquid enters the liquid storage tank from the electroplating main cylinder through the liquid inlet pipe, and flows back to the electroplating main cylinder through the liquid outlet pipe; An electrode assembly is disposed in the liquid storage tank, wherein the electrode assembly includes an adsorption plate and an anode group, wherein the anode group has two anode groups, and the two anode groups are respectively disposed on both sides of the adsorption plate; The power supply component is used to supply power to the electrode component to drive the impurities in the electroplating solution to accumulate on the adsorption plate.

2. The electroplating impurity treatment sub-cylinder according to claim 1, characterized in that: The anode group includes a plurality of mesh tubes arranged in an array, anode materials are arranged in the mesh tubes, and a first opening is arranged at the upper end of the mesh tubes, and the first opening is suitable for allowing the anode materials to pass through.

3. The electroplating impurity treatment sub-cylinder according to claim 2, characterized in that: The outer peripheral wall of the mesh tube is wrapped with filter cloth.

4. The electroplating impurity treatment sub-cylinder according to claim 1, characterized in that: The end surface of the adsorption plate is wavy.

5. The electroplating impurity treatment sub-cylinder according to claim 1 or 4, characterized in that: The cylinder body is provided with a mounting block, the mounting block is provided with a mounting groove, and both ends of the adsorption plate are mounted in the mounting groove.

6. The electroplating impurity treatment sub-cylinder according to claim 5, characterized in that: The mounting block is arranged on the upper wall of the cylinder body, a second opening is arranged at the upper end of the mounting groove, mounting ears are arranged at both ends of the adsorption plate, and the mounting ears are plugged and matched with the mounting groove.

7. The electroplating impurity treatment sub-cylinder according to claim 1, characterized in that: The power-on component includes a positive power-on wire, a negative power-on wire and two conductive plates, and the conductive plates are arranged one-to-one with the anode group. One side of the conductive plate is placed in the liquid storage tank and is in contact with the anode group, and the other side is located outside the liquid storage tank and is connected to the positive power-on wire. The adsorption plate is connected to the negative power-on wire.

8. The electroplating impurity treatment sub-cylinder according to claim 1, characterized in that: The connection point between the liquid inlet pipe and the cylinder body is located at the upper part of the liquid storage tank, and the connection point between the liquid outlet pipe and the cylinder body is located at the lower part of the liquid storage tank.

9. The electroplating impurity treatment sub-cylinder according to claim 8, characterized in that: The liquid outlet pipe is provided with a manual switch valve, and the manual switch valve is used to open or block the liquid outlet pipe.

10. The electroplating impurity treatment sub-cylinder according to claim 1, characterized in that: The cylinder body is installed with an ion sensor, and the ion sensor is used to detect the ion concentration of the electroplating solution in the liquid storage tank.

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