Optical ultrathin fingerprint module

Abstract

The utility model discloses an optical ultrathin fingerprint module group. The optical ultrathin fingerprint module group comprises an FPC main body and an FPC circuit connected with the FPC main body. The front surface of the FPC main body is provided with an optical fingerprint identification chip installation port used for installing an optical fingerprint identification chip and an MCU installation port used for installing an MCU. The front surface of the FPC main body is also provided with shading foam rubber, the surface of the shading foam rubber is attached with a transparent protective film, the back surface of the FPC main body is provided with a reinforcing steel sheet IV, the surface of the reinforcing steel sheet IV is attached with a conductive double-faced adhesive tape, and the surface of the conductive double-faced adhesive tape is attached with a release film I; the design is more compact, the industrial research and development cost can be effectively reduced, the yield is improved, the loss is reduced, physical keys or virtual keys are not needed, 360-degree touch recognition in any direction is achieved, meanwhile, the high screen proportion, the full-screen space requirement and the safety requirement of mobile payment are met, and more convenient and comfortable experience is provided for a user.

Description

Technical Field

[0001] The utility model relates to the technical field of fingerprint modules, in particular to an optical ultra-thin fingerprint module. Background Art

[0002] Fingerprint recognition is to classify and compare the fingerprints of the identified object to make a judgment. As one of the biological feature recognition technologies, fingerprint recognition technology has gradually matured in the new century and entered the field of human production and life.

[0003] The development of fingerprint recognition can be roughly divided into three types: capacitive fingerprint recognition, optical fingerprint recognition and ultrasonic fingerprint recognition. At the same time, optical fingerprints are divided into lens-type and ultra-thin optical fingerprints. Each fingerprint recognition module has its own independent appearance structure and production process and manufacturing method. The existing fingerprint recognition module has a structure that is not compact enough, and it is easy to have problems such as reduced yield and increased loss during production. Utility Model Content

[0004] The utility model aims to overcome the above-mentioned shortcomings and provide a technical solution that can solve the above-mentioned problems.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an optical ultra-thin fingerprint module, comprising an FPC body and an FPC circuit connected to the FPC body; the front of the FPC body is provided with an optical fingerprint recognition chip installation port for installing an optical fingerprint recognition chip and an MCU installation port for installing an MCU; the front of the FPC body is also provided with a light-shielding foam glue, and the surface of the light-shielding foam glue is adhered to a transparent protective film, and the back of the FPC body is provided with a reinforcing steel sheet four, and the surface of the reinforcing steel sheet four is adhered with a conductive double-sided tape, and the surface of the conductive double-sided tape is adhered to a release film one; EMI layers are provided on both sections of the FPC circuit, and a plurality of bending areas are provided on the body of the FPC circuit.

[0006] As a further solution of the utility model: the left and right sides of the FPC body are provided with incisions, the inner wall of the incision is fixed with connecting ribs, the width of the connecting ribs is smaller than the depth of the incision, and a plurality of connecting ribs are also installed on the side of the FPC line.

[0007] As a further solution of the utility model: a first reinforcing steel sheet is further provided on the inner wall of the optical fingerprint recognition chip installation port, and a second reinforcing steel sheet is further provided on the inner wall of the MCU installation port.

[0008] As a further solution of the utility model: a double-sided tape 1 is adhered to the back side of the FPC circuit close to one end of the FPC body, a release film 2 is adhered to the surface of the double-sided tape 1, the area of ​​the double-sided tape 1 is smaller than the area of ​​the corresponding FPC circuit connection, the area of ​​the release film 2 is the same as the area of ​​the double-sided tape 1, and a tear handle is connected to the release film 2.

[0009] As a further solution of the utility model: a device and IC sealing area is arranged on the front of the FPC circuit, an insulating film is arranged on the surface of the device and IC sealing area, and the area of ​​the insulating film is larger than the area of ​​the device and IC sealing area.

[0010] As a further solution of the utility model: a second double-sided tape is bonded to the back of the FPC circuit and close to the device and IC sealing area, and a third release film is bonded to the surface of the second double-sided tape.

[0011] As a further solution of the utility model: the area of ​​the double-sided tape 2 is smaller than the area of ​​the corresponding FPC circuit connection, the area of ​​the release film 3 is the same as the area of ​​the double-sided tape 2, and a hand-tear handle is connected to the release film 3.

[0012] As a further solution of the utility model: a double-sided tape three is bonded to the back side of the FPC circuit and near the middle, and a release film four is bonded to the surface of the double-sided tape three.

[0013] As a further solution of the utility model: the area of ​​the double-sided tape three is smaller than the area of ​​the corresponding FPC circuit connection, the area of ​​the release film four is the same as the area of ​​the double-sided tape three, and a hand-tear handle is connected to the release film four.

[0014] As a further solution of the utility model: a reinforcing steel sheet three is fixed to the front side of the FPC circuit away from the FPC main body, and a connector is arranged on the back side of the FPC circuit away from the FPC main body.

[0015] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0016] In this application, the design is more compact, which can effectively reduce industry R&D costs, improve yields and reduce losses. The optical fingerprint recognition chip collects fingerprint information and the control chip is responsible for power management, timing control, signal acquisition and communication with the main control. Users can realize fingerprint recognition by lightly touching the fingerprint recognition area of ​​the mobile phone screen. No physical or virtual buttons are required, and 360-degree touch recognition in any direction can be achieved. At the same time, it meets the space requirements of high screen-to-body ratio and full-screen and the security requirements of mobile payment, providing users with a more convenient and comfortable experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1It is a front cross-sectional structural schematic diagram of the utility model as a whole;

[0018] Figure 2 It is a schematic diagram of the back cross-sectional structure of the utility model as a whole;

[0019] Figure 3 It is a three-dimensional top view structural schematic diagram of the utility model as a whole;

[0020] Figure 4 It is a three-dimensional structural schematic diagram of the utility model light-shielding foam adhesive;

[0021] Figure 5 It is a schematic diagram of the overall three-dimensional structure of the utility model when viewed from above;

[0022] Figure 6 It is a three-dimensional structural schematic diagram of the reinforcing steel sheet of the utility model when viewed from above;

[0023] Figure 7 It is a front cross-sectional structural schematic diagram of the FPC main body of the utility model;

[0024] Figure 8 It is a schematic diagram of the manufacturing process of the optical ultra-thin fingerprint module of the utility model.

[0025] The reference numerals and names in the figures are as follows:

[0026] 1. FPC body; 101. Optical fingerprint recognition chip installation port; 102. MCU installation port; 103. Reinforcement steel sheet one; 104. Reinforcement steel sheet two; 2. FPC circuit; 3. Light-shielding foam glue; 4. Inner notch; 5. Connecting ribs; 6. EMI layer; 7. Device and IC sealing area; 8. Insulation film; 9. Bending area; 10. Reinforcement steel sheet three; 11. Transparent protective film; 12. Release film one; 13. Release film two; 1301. Double-sided tape one; 14. Release film three; 1401. Double-sided tape two; 15. Release film four; 1501. Double-sided tape three; 16. Connector; 17. Reinforcement steel sheet four; 18. Conductive double-sided tape. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] See also Figure 1-8, an optical ultra-thin fingerprint module, comprising an FPC body 1 and an FPC line 2 connected to the FPC body 1; the front of the FPC body 1 is provided with an optical fingerprint recognition chip installation port 101 for installing an optical fingerprint recognition chip and an MCU installation port 102 for installing an MCU; the front of the FPC body 1 is also provided with a light-shielding foam glue 3, the light-shielding foam glue 3 is Nitto SCF406TT foam glue, and the outer edge of the light-shielding foam glue 3 does not exceed the edge of the FPC body 1, the surface of the light-shielding foam glue 3 is adhered with a transparent protective film 11, and the transparent protective film 11 is connected with a hand-tear handle, and the back of the FPC body 1 is provided with a reinforcing steel sheet 17, the reinforcing steel sheet 17 Grounding, T=0.1mm, the edge of the reinforcing steel sheet 17 does not exceed the edge of the FPC body 1 when attached, the surface of the reinforcing steel sheet 17 is adhered with a conductive double-sided adhesive 18, the material of the conductive double-sided adhesive 18 is BYH-W030, T=0.03mm, the conductive double-sided adhesive 18 does not exceed the edge of the FPC body 1 when attached, the surface of the conductive double-sided adhesive 18 is adhered with a release film 12, and a hand-tear handle is connected to the release film 12, and the release film 12 does not exceed the edge of the FPC body 1 when attached; EMI layers 6 are provided on both sections of the FPC circuit 2, and a plurality of bending areas 9 are provided on the body of the FPC circuit 2, and the bending areas 9 are softened to facilitate the later bending of the FPC circuit 2.

[0029] See also Figure 1 In this embodiment, an incision notch 4 is provided on both sides of the FPC body 1, and a connecting rib 5 is fixed on the inner wall of the incision notch 4. The width of the connecting rib 5 is smaller than the depth of the incision notch 4, and a plurality of connecting ribs 5 are also installed on the side of the FPC circuit 2.

[0030] Specifically, the connecting ribs 5 on the FPC body 1 are used to improve the stability of the FPC body 1, and the five connecting ribs 5 on the FPC circuit 2 are used to improve the stability of the FPC circuit 2, and the five connecting ribs 5 on the FPC circuit 2 all protrude from the outer shape of the FPC circuit 2 by -0.1 to 0.2 mm.

[0031] See also Figure 1 and Figure 7 In this embodiment, a reinforcing steel sheet 103 is further provided on the inner wall of the optical fingerprint recognition chip installation port 101, and a reinforcing steel sheet 2 104 is further provided on the inner wall of the MCU installation port 102.

[0032] Specifically, the reinforcing steel sheet 103 is used to enhance the stability of the optical fingerprint recognition chip mounting port 101, thereby increasing the stability of the subsequent installation of the optical fingerprint recognition chip, and the reinforcing steel sheet 2 104 is used to enhance the stability of the MCU mounting port 102, thereby increasing the stability of the subsequent installation of the MCU.

[0033] See also Figure 2-3In the present embodiment, a double-sided adhesive tape 1301 is adhered to the back side of the FPC circuit 2 near one end of the FPC body 1, and a release film 13 is adhered to the surface of the double-sided adhesive tape 1301. The area of ​​the double-sided adhesive tape 1301 is smaller than the area of ​​the corresponding connection of the FPC circuit 2. The area of ​​the release film 13 is the same as the area of ​​the double-sided adhesive tape 1301, and a hand-tear handle is connected to the release film 13.

[0034] Specifically, the double-sided adhesive tape 1301 is made of Tesa51972, T=0.05mm. When the double-sided adhesive tape 1301 is attached to the release film 13, the silk screen mark will not be leaked and it will not exceed the shape of the FPC circuit 2. A tear handle is connected to the release film 13 to facilitate the subsequent tearing of the release film 13 to leak out the double-sided adhesive tape 1301.

[0035] See also Figure 1 and Figure 3 In this embodiment, a device and IC sealing area 7 is provided on the front of the FPC circuit 2, and an insulating film 8 is provided on the surface of the device and IC sealing area 7, and the area of ​​the insulating film 8 is larger than the area of ​​the device and IC sealing area 7.

[0036] Specifically, the width of the sealing glue relative to the device edge is required to cover the device pad. The insulating film 8 contains glue, the model is Liansen LS-PI-003, and the thickness is 0.05mm. When attached, it needs to completely cover the device, not exceed the edge of the FPC line 2, and not cover the circular bare copper pad.

[0037] See also Figure 1 , Figure 2 and Figure 5 In this embodiment, a double-sided tape 1401 is bonded to the back of the FPC circuit 2 and close to the device and IC sealing area 7, and a release film 14 is bonded to the surface of the double-sided tape 1401; the area of ​​the double-sided tape 1401 is smaller than the area of ​​the corresponding FPC circuit 2 connection, the area of ​​the release film 14 is the same as the area of ​​the double-sided tape 1401, and a hand-tear handle is connected to the release film 14.

[0038] Specifically, a steel sheet can be set on the double-sided tape 1401 for reinforcement and grounding, T=0.15mm+0.04mm, the grounding impedance ≤3 ohms, the double-sided tape 1401 is made of Tesa61305, T=0.05mm, and the release film 14 and the double-sided tape 1401 are attached without exceeding the edge of the steel sheet and the edge of the FPC circuit 2.

[0039] See also Figure 1 , Figure 2 and Figure 6In this embodiment, a double-sided tape 3 1501 is bonded to the back of the FPC circuit 2 near the middle, and a release film 4 15 is bonded to the surface of the double-sided tape 3 1501; the area of ​​the double-sided tape 3 1501 is smaller than the area of ​​the corresponding FPC circuit 2 connection, the area of ​​the release film 4 15 is the same as the area of ​​the double-sided tape 3 1501, and a hand-tear handle is connected to the release film 4 15.

[0040] Specifically, the material of the double-sided adhesive tape 1501 is Tesa51972, T=0.05mm, and the attachment does not cover the silk screen mark and does not exceed the FPC shape. A tear handle is connected to the release film 15 to facilitate the subsequent tearing of the release film 15 to leak out the double-sided adhesive tape 1501.

[0041] See also Figure 4-5 In this embodiment, a reinforcing steel sheet 10 is fixed to the front side of the FPC line 2 away from the FPC body 1, and a connector 16 is provided to the back side of the FPC line 2 away from the FPC body 1.

[0042] Specifically, the reinforcing steel sheet is 10, T=0.15mm+0.04mm, the grounding impedance is ≤3 ohms, and the connector 16 model is: BTB-JAE-WP26DK-P010VA3-10P-PLUG.

[0043] It should be noted that in order to further promote the improvement of optical fingerprint manufacturing technology, we also provide the production process of optical ultra-thin fingerprint module, please refer to Figure 8 , in order to form norms, reduce industry R&D costs, improve yield and reduce losses.

[0044] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. An optical ultra-thin fingerprint module, characterized in that: It comprises an FPC body (1) and an FPC circuit (2) connected to the FPC body (1); The front side of the FPC body (1) is provided with an optical fingerprint recognition chip installation port (101) for installing an optical fingerprint recognition chip and an MCU installation port (102) for installing an MCU; The front side of the FPC body (1) is also provided with a light-shielding foam adhesive (3), the surface of which is bonded with a transparent protective film (11); the back side of the FPC body (1) is provided with a reinforcing steel sheet four (17), the surface of which is bonded with a conductive double-sided adhesive (18), and the surface of which is bonded with a release film one (12); EMI layers (6) are provided on both sections of the FPC circuit (2), and a plurality of bending areas (9) are provided on the body of the FPC circuit (2).

2. The optical ultra-thin fingerprint module according to claim 1, characterized in that: The left and right sides of the FPC body (1) are both provided with incision notches (4), the inner walls of the incision notches (4) are fixed with connection ribs (5), the width of the connection ribs (5) is smaller than the depth of the incision notches (4), and a plurality of connection ribs (5) are also installed on the side surfaces of the FPC circuit (2).

3. The optical ultra-thin fingerprint module according to claim 1, characterized in that: A first reinforcing steel sheet (103) is also provided on the inner wall of the optical fingerprint recognition chip installation opening (101), and a second reinforcing steel sheet (104) is also provided on the inner wall of the MCU installation opening (102).

4. The optical ultra-thin fingerprint module according to claim 1, characterized in that: The back side of the FPC circuit (2) close to one end of the FPC body (1) is adhered with a double-sided adhesive tape (1301), and the surface of the double-sided adhesive tape (1301) is adhered with a release film (13), the area of ​​the double-sided adhesive tape (1301) is smaller than the area of ​​the corresponding FPC circuit (2) connection, the area of ​​the release film (13) is the same as the area of ​​the double-sided adhesive tape (1301), and a tear handle is connected to the release film (13).

5. The optical ultra-thin fingerprint module according to claim 1, characterized in that: A device and IC sealing area (7) is arranged on the front of the FPC circuit (2), an insulating film (8) is arranged on the surface of the device and IC sealing area (7), and the area of ​​the insulating film (8) is larger than the area of ​​the device and IC sealing area (7).

6. The optical ultra-thin fingerprint module according to claim 1, characterized in that: A second double-sided adhesive tape (1401) is bonded to the back of the FPC circuit (2) and close to the device and IC sealing area (7), and a third release film (14) is bonded to the surface of the second double-sided adhesive tape (1401).

7. The optical ultra-thin fingerprint module according to claim 6, characterized in that: The area of ​​the second double-sided adhesive tape (1401) is smaller than the area of ​​the corresponding FPC circuit (2) connection, the area of ​​the third release film (14) is the same as the area of ​​the second double-sided adhesive tape (1401), and a hand-tear handle is connected to the third release film (14).

8. The optical ultra-thin fingerprint module according to claim 1, characterized in that: A double-sided adhesive tape 3 (1501) is also bonded to the back side of the FPC circuit (2) near the middle, and a release film 4 (15) is bonded to the surface of the double-sided adhesive tape 3 (1501).

9. The optical ultra-thin fingerprint module according to claim 8, characterized in that: The area of ​​the double-sided adhesive tape three (1501) is smaller than the area of ​​the corresponding FPC circuit (2) connection, the area of ​​the release film four (15) is the same as the area of ​​the double-sided adhesive tape three (1501), and a hand-tear handle is connected to the release film four (15).

10. The optical ultra-thin fingerprint module according to claim 1, characterized in that: A reinforcing steel sheet three (10) is fixed to the front side of the FPC circuit (2) away from the FPC main body (1), and a connector (16) is arranged on the back side of the FPC circuit (2) away from the FPC main body (1).

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