Wafer placement detection system

Abstract

The utility model provides a wafer placement detection system, comprising a wafer box which comprises a containing cavity with an opening, and the containing cavity is provided with a plurality of clamping grooves used for containing wafers at intervals; and the photoelectric sensor is positioned on one side of the arrangement direction of the plurality of clamping grooves, and the photoelectric sensor is positioned at a position corresponding to the notch of the wafer. According to the utility model, the photoelectric sensor can detect the wafers with wrong placement directions in the wafer box, thereby ensuring that the gaps of the wafers can be correctly matched with the blocking PIN on the machine table so as to load the wafers to the specified positions of the machine table.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer detection, in particular to a wafer placement detection system. Background Art

[0002] Reference Figure 1 The wafer in the machine has a notch on the edge of the wafer, which can be used to determine the direction and orientation of the wafer to ensure the correct implementation of subsequent processes. In addition, the notch can also be used to locate and transfer the wafer so that related equipment can accurately identify and operate the wafer.

[0003] When loading the wafers in the wafer box into the machine, there is a hidden danger of the wafer being placed in the wrong direction in the wafer box. When the reverse wafer enters the machine for loading, the notch of the wafer cannot correctly match the PIN on the machine, resulting in the wafer being unable to be loaded into the specified position, the machine alarming, and even causing severe damage to the wafer.

[0004] In view of this, it is necessary to provide a wafer placement inspection system to solve the above technical problems. Utility Model Content

[0005] In order to achieve the above-mentioned purpose, the utility model provides a wafer placement and inspection system, which includes a wafer box, including a accommodating cavity with an opening, wherein the accommodating cavity is spaced apart and provided with a plurality of slots for accommodating wafers; a photoelectric sensor is located on one side of the arrangement direction of the plurality of slots, and the photoelectric sensor is located at a position corresponding to the notch of the wafer.

[0006] As a further improvement of the present invention, the photoelectric sensor is a reflective photoelectric sensor.

[0007] As a further improvement of the present invention, the photoelectric sensor is installed on the wafer box.

[0008] As a further improvement of the present invention, the photoelectric sensor is located at the opening side of the accommodating cavity.

[0009] As a further improvement of the present invention, the photoelectric sensors are provided in multiple groups.

[0010] As a further improvement of the utility model, it also includes a machine platform, the wafer box is located on the top of the machine platform, and the photoelectric sensor is installed on the machine platform.

[0011] As a further improvement of the present invention, limit blocks for limiting the position of the wafer box are arranged at intervals on the machine platform.

[0012] As a further improvement of the utility model, it also includes a pressure sensor installed on the machine platform.

[0013] As a further improvement of the utility model, an external power supply is used to supply power to the photoelectric sensor and the pressure sensor;

[0014] A PLC controller, the photoelectric sensor and the pressure sensor are connected to the PLC controller;

[0015] An alarm is connected to the PLC controller.

[0016] As a further improvement of the utility model, an intermediate relay is also included, which is connected to the PLC controller and is used to open and close the photoelectric sensor.

[0017] Beneficial effects of the utility model: The utility model can detect the wafer placed in the wrong direction in the wafer box through the photoelectric sensor, thereby ensuring that the notch of the wafer can correctly match the stop PIN on the machine to load the wafer into the specified position of the machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0019] Figure 1 It is a schematic diagram of the structure of a round crystal;

[0020] Figure 2 This is a schematic diagram of the overall structure of the wafer placement and inspection system of the utility model;

[0021] Figure 3 This is a schematic diagram of the exploded structure of the wafer placement inspection system of the utility model;

[0022] Figure 4 This is a schematic diagram of the structure of the utility model in which the wafer is placed in reverse;

[0023] Figure 5 A schematic diagram of the correct structure for placing all wafers of the utility model;

[0024] Figure 6 This is a schematic diagram of the utility model for placing a detection system. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in combination with the specific embodiments of the utility model and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0027] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0028] In the description of the present utility model, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection of two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0029] like Figures 2 to 6 As shown, the wafer placement and inspection device of the present invention comprises a wafer box 200, a photoelectric sensor 300, a PLC controller connected to the photoelectric sensor 300, and an alarm connected to the PLC controller.

[0030] The wafer box 200 has a receiving cavity 201 for receiving the wafer 100. One side of the receiving cavity 201 is open, and the wafer 100 is placed in the receiving cavity 201 through the opening. The wafer 100 also includes a plurality of slots 202 spaced apart on the inner wall of the receiving cavity 201, and the slots 202 are used to place the wafer 100.

[0031] Specifically, the slots 202 are opened on two opposite inner walls adjacent to the opening side, and the wafer 100 is placed in the slots 202 from the opening. A plurality of the slots 202 can be used to place a plurality of the wafers 100 .

[0032] The photoelectric sensor 300 is located on one side of the arrangement direction of the plurality of slots 202, and the photoelectric sensor 300 is located at a position corresponding to the notch 101 of the wafer 100, and is used to emit a light beam to the wafer 100 located in the accommodating cavity 201.

[0033] When the placement direction of the wafer 100 is correct, the photoelectric sensor 300 is facing the notch 101 of the wafer 100, and the light beam emitted from the photoelectric sensor 300 can pass through the notch 101 without being blocked by the wafer 100; when the placement direction of the wafer 100 is wrong, the photoelectric sensor 300 is misaligned with the notch 101, and the light beam emitted from the photoelectric sensor 300 is blocked by the wafer 100.

[0034] In this embodiment, the photoelectric sensor 300 is a transmitting photoelectric sensor, whose transmitter and receiver are integrated in the same device, and the transmitter is used to emit a light beam to the wafer 100. When the light beam is blocked by the wafer 100, the light beam is reflected back by the wafer 100 and then received by the receiver. The photoelectric sensor 300 is powered by an external power supply.

[0035] Of course, in other embodiments, a through-beam photoelectric sensor may also be used, in which the transmitter and the receiver are separately arranged, and the transmitter is used to emit a light beam aimed at the wafer 100. When the light beam is blocked by the wafer 100, the receiver cannot receive the light beam; when the light beam passes through the gap 101, the receiver receives the light beam.

[0036] Furthermore, the photoelectric sensor 300 is located at the opening side of the accommodating cavity 101, so that the working state of the photoelectric sensor 300 can be observed and the photoelectric sensor 300 can be repaired or replaced. The photoelectric sensor 300 is provided in multiple groups, so that it can adapt to the wafer 100 with different positions of the notch 101. In other embodiments, the photoelectric sensor 300 can also be set to be movable, so that the photoelectric sensor 300 is moved according to the position of the notch 101 of the wafer 100 to face the notch 101.

[0037] The PLC controller is connected to the photoelectric sensor 300. When the photoelectric sensor 300 receives the light beam emitted back, it transmits a signal to the PLC controller. The PLC controller then controls the alarm to sound an alarm, reminding the staff that the wafer 100 is misplaced in the placement direction.

[0038] In this embodiment, the photoelectric sensor 300 and the PLC controller, and the PLC controller and the alarm are connected via signal lines to achieve signal transmission, and the alarm can use sound or light alarm.

[0039] In one implementation, the photoelectric sensor 300 is mounted on the wafer box 200 .

[0040] Reference Figure 4 When at least one group of the wafers 100 in the accommodating cavity 101 is not correctly placed (the notch 101 is away from the opening side), the light beam emitted by the transmitter is blocked by the incorrectly placed wafer 100, and the light beam is reflected back by the wafer 100 and then received by the receiver, so that the wafer 100 with the wrong direction can be detected, and the photoelectric sensor 300 generates a signal X1 and transmits it to the PLC controller. After receiving the signal, the PLC controller controls the alarm to sound an alarm;

[0041] Reference Figure 5 When the wafers 100 in the accommodating cavity 101 are all correctly placed (the notches 101 face the opening side), the notches 101 of all the wafers 100 are located on the same axis and face the photoelectric sensor 300, and the light beam emitted by the transmitter is emitted from the notch 101 of each of the wafers 100. The receiver cannot receive the reflected light beam, thereby determining that all the wafers are placed correctly and the alarm does not work.

[0042] It should be particularly noted that the top plate of the wafer box 200 does not block the light beam emitted by the transmitter, and the light beam can be directly emitted from the top of the wafer box 200 .

[0043] In another embodiment, the wafer placement and inspection device further includes a machine platform 400 , the wafer box 200 is placed on the top of the machine platform 400 , and the photoelectric sensor 300 is installed on the machine platform 400 .

[0044] In this embodiment, the photoelectric sensor 300 is installed at the bottom of the machine platform 400. The machine platform 400 is provided with a through hole corresponding to the installation position of the photoelectric sensor 300. The light beam emitted by the transmitter is vertically upward from the through hole.

[0045] Furthermore, the machine platform 400 is provided with spaced apart limit blocks 401 for limiting the placement position of the wafer box 200, the limit blocks 401 are symmetrically arranged on the top of the machine platform 400, and the spacing between the two limit blocks 402 arranged opposite to each other corresponds to the size of the wafer box 200, and the placement area of ​​the wafer box 200 can be limited by the limit blocks 401, so that when the wafer box 200 containing the wafer 100 is placed on the machine platform 400, the notch 101 of the wafer 100 in the wafer box 200 can face the photoelectric sensor 300. Specifically, the limit block 402 can be a bar block or an L-shaped block.

[0046] The wafer placement inspection device also includes a pressure sensor 500 installed on the machine platform 400. The pressure sensor 500 is spaced apart from the photoelectric sensor 300 and is connected to the PLC controller. When the wafer box 200 is placed on the machine platform 400, the pressure sensor 500 receives a pressure signal and transmits the pressure signal to the PLC controller.

[0047] The pressure sensor 500 is powered by an external power supply. It should be noted that the external power supply for the photoelectric sensor 300 and the external power supply for the pressure sensor 500 are two independent external power supplies; or the photoelectric sensor 300 and the pressure sensor 500 are connected in parallel and powered by one external power supply.

[0048] Furthermore, the wafer placement inspection device also includes an intermediate relay, which is connected to the PLC controller and used to open and close the photoelectric sensor 300 , that is, the intermediate relay is connected in series in the power supply circuit of the photoelectric sensor 300 .

[0049] Specifically, in the initial state, the intermediate relay is in the disconnected state, the photoelectric sensor 300 does not work, and the pressure sensor 500 works;

[0050] When the wafer box 200 containing the wafer 100 is placed on the machine platform 400, the pressure sensor 500 detects the pressure signal X2 and transmits it to the PLC controller, and the PLC controller controls the intermediate relay to close, thereby energizing the photoelectric sensor 300;

[0051] The photoelectric sensor 300 emits a light beam. When all the wafers 100 are correctly placed, the light beam passes through the notch 101 of the wafer 100 in turn and is emitted from the top of the wafer box 200. The receiver cannot receive the reflected light beam, thereby determining that all the wafers are placed correctly and the alarm does not work. When at least one group of the wafers 100 in the accommodating cavity 101 is not placed correctly, the light beam emitted by the transmitter is blocked by the incorrectly placed wafer 100, and the light beam is reflected back by the wafer 100 and then received by the receiver, thereby detecting the wafer 100 with the wrong direction placed. The photoelectric sensor 300 generates a signal X1 and transmits it to the PLC controller. After receiving the signal, the PLC controller controls the alarm to sound an alarm. The alarm is reset after 10s of sounding an alarm.

[0052] Furthermore, the closing time of the intermediate relay is 3s, and the photoelectric sensor 300 detects the wafer 100 within 3s. After 3s, the PLC controller controls the intermediate relay to disconnect again, thereby preventing the alarm from being triggered when the wafer 100 in the wafer box 200 is subsequently taken out and loaded onto the machine.

[0053] The wafer box 200 or the machine platform 400 may have a slide groove for installing the photoelectric sensor 300 . The photoelectric sensor 300 may move along the slide groove to align with the notch 101 of the wafer 100 .

[0054] In summary, the present invention can detect the wafer 100 placed in the wrong direction in the wafer box 100 through the photoelectric sensor 300, thereby ensuring that the notch 101 of the wafer 100 can correctly match the stop PIN on the machine to load the wafer 100 to the specified position of the machine.

[0055] It should be understood that although the present specification is described according to embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0056] The series of detailed descriptions listed above are only specific descriptions of feasible embodiments of the utility model and are not intended to limit the protection scope of the utility model. Any equivalent embodiments or changes that do not deviate from the technical spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A wafer placement inspection system, characterized in that: include: A wafer box (200) comprises a receiving cavity (201) having an opening, wherein the receiving cavity (201) is provided with a plurality of slots (202) for receiving wafers (100) at intervals; A photoelectric sensor (300) is located on one side of the arrangement direction of the plurality of slots (202), and the photoelectric sensor (300) is located at a position corresponding to the notch (101) of the wafer (100).

2. The wafer placement inspection system according to claim 1, characterized in that: The photoelectric sensor (300) is a reflective photoelectric sensor.

3. The wafer placement inspection system according to claim 1, characterized in that: The photoelectric sensor (300) is mounted on the wafer box (200).

4. The wafer placement inspection system according to claim 3, characterized in that: The photoelectric sensor (300) is located at the opening side of the accommodating cavity (201).

5. The wafer placement inspection system according to claim 1, characterized in that: The photoelectric sensors (300) are arranged in multiple groups.

6. The wafer placement inspection system according to claim 1, characterized in that: It also includes a machine platform (400), the wafer box (200) is located on the top of the machine platform (400), and the photoelectric sensor (300) is installed on the machine platform (400).

7. The wafer placement inspection system according to claim 6, characterized in that: Limiting blocks (401) for limiting the position of the wafer box (200) are arranged at intervals on the machine platform (400).

8. The wafer placement inspection system according to claim 6, characterized in that: It also includes a pressure sensor (500) installed on the machine platform (400).

9. The wafer placement inspection system according to claim 8, characterized in that: Also includes: An external power source, used to supply power to the photoelectric sensor (300) and the pressure sensor (500); A PLC controller, the photoelectric sensor (300) and the pressure sensor (500) being connected to the PLC controller; An alarm is connected to the PLC controller.

10. The wafer placement inspection system according to claim 9, characterized in that: It also includes an intermediate relay connected to the PLC controller and used to turn on and off the photoelectric sensor (300).

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