Wafer conveying mechanism
By designing a wafer chip transfer mechanism for inverting the wafer carrier, the problem of inconvenient wafer flip in the prior art is solved, and the 180° flip and surface flatness of the wafer are improved.
Patent Information
- Application Number
- CN202420357876.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-26
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-02-26
AI Technical Summary
Existing wafer flip fixtures cannot flip the wafer during the chip transfer process, resulting in inconvenient process operation on the back of the wafer and low flatness of the wafer surface.
A wafer chip transfer mechanism is designed, including a carrier board, a limiting module and a plurality of positioning modules, and the 180° flip of the wafer is realized by inverting the wafer carrier between the first positioning region and the second positioning region.
The wafer flip is realized, so that subsequent processes can work on the back of the wafer, improve the warping of the wafer surface and improve the flatness of the wafer surface.
Smart Images
Figure CN222637247U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of optimization and improvement of wafer production, in particular to a wafer conveying mechanism. Background Art
[0002] With the continuous development of semiconductor technology, the process of integrated circuits has become increasingly complex. During the manufacturing process of integrated circuits, the wafer will have a warping problem, especially the warping problem of 6-inch gallium arsenide wafers, which often leads to the breakage of gallium arsenide wafers during the production process, greatly affecting the yield of semiconductor devices. The method of back-depositing metal film layers can effectively improve the warping of the wafer and make the warping of the wafer within the specification range. When performing the process of back-depositing metal film layers, the fixture needs to flip the wafer 180°, and then put the flipped wafer into the equipment port for back-deposition operation.
[0003] However, there are still some problems with the current wafer flipping fixture. Utility Model Content
[0004] The technical problem solved by the utility model is to provide a wafer conveying mechanism, so that the wafer to be conveyed can be turned over during the conveying process, thereby facilitating operations on the back side of the wafer, improving the warping of the wafer surface, and improving the flatness of the wafer surface.
[0005] In order to solve the above problems, the technical solution of the utility model proposes a wafer conveying mechanism, including: a carrying plate, including a first positioning area and a second positioning area arranged along a first direction, the first positioning area is used to position the first surface of the wafer carrier, and the second positioning area is used to position the second surface of the wafer carrier opposite to the first surface; a limiting module, located on the side of the first positioning area away from the second positioning area along the first direction, the central axis of the limiting module is parallel to the central axis of the carrying plate along the first direction; a plurality of first positioning modules, located between the first positioning area and the second positioning area, the plurality of first positioning modules are arranged along the second direction and are symmetrically distributed about the central axis of the limiting module, the second direction is perpendicular to the first direction, and the limiting module and the plurality of first positioning modules define the first positioning area.
[0006] Optionally, the projection of each of the first positioning modules on the surface of the supporting plate has a first part, a second part and a third part, the first part, the second part and the third part are arranged sequentially along the second direction, and the first part is closer to the central axis of the limiting module in the second direction than the second part and the third part.
[0007] Optionally, it also includes: a plurality of first raised switches located on the surface of the first positioning area, the first raised switches are arranged along the second direction; and a plurality of second raised switches located on the surface of the second positioning area, the second raised switches are arranged along the second direction.
[0008] Optionally, it also includes: a plurality of second positioning modules located on the second positioning area; the second positioning modules are arranged along the second direction, each of the second positioning modules includes two positioning ridges and a limit groove located between the two positioning ridges, and each of the limit grooves is located on the central axis of the second raised switch along the second direction.
[0009] Optionally, it further includes: a plurality of third positioning modules located in the second positioning area, each of the third positioning modules being closer to an edge of the carrier plate than each of the second positioning modules in the second direction; and the third positioning modules being distributed along the second direction.
[0010] Optionally, it also includes: a fourth positioning module located in the first positioning area; the fourth positioning modules are symmetrically distributed about the central axis of the limiting module, and the first positioning module, the fourth positioning module and the limiting module form the first positioning area.
[0011] Optionally, it further includes: a sheet pushing mechanism that can move along the first direction, the sheet pushing mechanism includes: a push plate, a push rod, and a connecting rod connected in sequence, and the push plate is located above the supporting plate.
[0012] Optionally, it also includes: a driving mechanism fixed under the supporting plate, the connecting rod is connected to the driving mechanism, the driving mechanism is used to drive the pushing mechanism to move along the first direction, and the driving mechanism includes a hand push rod, and the hand push rod is connected to the first raised switch and the second raised switch from the back side of the supporting plate.
[0013] Compared with the prior art, the technical solution of the embodiment of the utility model has the following beneficial effects:
[0014] The technical solution of the utility model provides a wafer transfer mechanism, wherein the first positioning area is used to position the first side of the wafer carrier, and the second positioning area is used to position the second side of the wafer carrier opposite to the first side. The wafer carriers on the first positioning area and the second positioning area are placed upside down, the wafer carrier on the second positioning area is loaded with wafers and the first side of the wafer carrier faces upward, the front side of the wafer faces the first side, and the first side of the wafer carrier on the first positioning area faces downward, the wafers in the wafer carrier in the second positioning area are transferred to the wafer carrier in the first positioning area, the back side of the wafer in the wafer carrier in the first positioning area faces the first side, thereby realizing wafer flipping, so that subsequent processes can be performed on the back side of the wafer, thereby improving the warping of the wafer surface and improving the flatness of the wafer surface. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a top view of the wafer transfer mechanism (excluding the wafer carrier) in the embodiment of the utility model;
[0016] Figure 2 It is a front view of the wafer transfer mechanism (excluding the wafer carrier) in the embodiment of the utility model;
[0017] Figure 3 It is a top view of the wafer transfer mechanism (including the wafer carrier) in the embodiment of the utility model;
[0018] Figure 4 It is a front view of the wafer transfer mechanism (including the wafer carrier) in the embodiment of the utility model. DETAILED DESCRIPTION
[0019] As described in the background art, the surface of the wafer is prone to warping. The current wafer feeder cannot flip the wafer during the feeding process, making it inconvenient to perform processing operations on the back of the wafer, and the flatness of the wafer surface is not high.
[0020] To solve the above technical problems, an embodiment of the utility model provides a wafer transfer mechanism, wherein the first positioning area is used to position the first surface of the wafer carrier, and the second positioning area is used to position the second surface of the wafer carrier opposite to the first surface, the wafer carriers on the first positioning area and the second positioning area are placed upside down, the wafer carrier on the second positioning area is loaded with wafers and the first surface (U-shaped surface) of the wafer carrier is facing upward, and the front side of the wafer is placed facing the first surface (U-shaped surface), and the first surface (U-shaped surface) of the wafer carrier on the first positioning area is facing downward, the wafer in the wafer carrier in the second positioning area is transferred to the wafer carrier in the first positioning area, and the back side of the wafer in the wafer carrier in the first positioning area is facing the first surface (U-shaped surface), thereby realizing wafer flipping, so that subsequent processes can be performed on the back side of the wafer, thereby improving the warping of the wafer surface and improving the flatness of the wafer surface.
[0021] In order to make the above-mentioned objects, features and beneficial effects of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.
[0022] Figure 1 and Figure 2 Schematic diagram of a wafer transfer mechanism (excluding wafer carrier) according to an embodiment of the utility model. Figure 1 yes Figure 2 A top view of Figure 2 yes Figure 1 A front view along a first direction X, Figure 3 and Figure 4 Schematic diagram of a wafer transfer mechanism (including a wafer carrier) according to an embodiment of the utility model. Figure 3 yes Figure 4 A top view of Figure 4 yes Figure 3The front view along the first direction X includes: the carrier plate 101 includes a first positioning area I and a second positioning area II arranged along the first direction X, the first positioning area I is used to position the wafer carrier 109 (such as Figure 4 The first surface of the wafer carrier 109 is provided with a first positioning area I and a second positioning area II, wherein the second positioning area II is used for positioning the second surface of the wafer carrier 109; a limiting module 103 is located on the side of the first positioning area I away from the second positioning area II along the first direction X, and the central axis of the limiting module 103 is parallel to the central axis of the carrier plate 101 along the first direction X; a plurality of first positioning modules 105 are located between the first positioning area I and the second positioning area II, a plurality of the first positioning modules 105 are arranged along the second direction Y and are symmetrically distributed about the central axis of the limiting module, the second direction Y is perpendicular to the first direction X, and the limiting module 103 and the plurality of the first positioning modules 105 define the first positioning area I.
[0023] The first positioning area I and the second positioning area II provide working positions for the wafer carrier 109. The wafer carrier 109 has a first surface and a second surface relative to each other. The wafer carrier 109 on the first positioning area I is empty and the first surface is placed downward. The wafer carrier 109 on the second positioning area II is loaded with wafers and the first surface is placed upward. The wafer carrier 109 on the first positioning area I is used to receive wafers transferred from the wafer carrier 109 on the second positioning area II.
[0024] The wafer carrier 109 has a plurality of slots, and the slots of the wafer carrier 109 are used to accommodate wafers.
[0025] The size range of the first positioning area I along the first direction X is: 16 cm to 17 cm.
[0026] The size range of the first positioning area I along the second direction Y is: 19.5 cm to 20.5 cm.
[0027] Please continue to refer to Figure 1 and Figure 2 The wafer transfer mechanism includes: a plurality of first positioning modules 105, located between the first positioning area I and the second positioning area II, and the plurality of first positioning modules 105 are arranged along a second direction Y, and the second direction Y is perpendicular to the first direction X.
[0028] The first positioning module 105 is used to limit the wafer carrier 109 located in the first positioning area I and the wafer carrier 109 located in the second positioning area II.
[0029] The projection of each first positioning module 105 on the surface of the supporting plate 101 has a first part, a second part and a third part, and the first part, the second part and the third part are arranged in sequence along the second direction Y, and the first part is closer to the central axis of the limiting module 103 in the second direction Y than the second part and the third part.
[0030] Specifically, in this embodiment, the two first positioning modules 105 are symmetrically distributed about the first direction X, the size of the first part in the first direction X is 4 cm; the size of the first part in the second direction Y is 1.4 cm; the first part is in contact with the second part, and the distance between the second part and the third part in the second direction Y is 0.8 cm. The edge of the wafer carrier 109 has a protrusion, and the gap between the second part and the third part is used to accommodate the protrusion of the edge of the wafer carrier 109 to limit the edge of the wafer carrier 109.
[0031] Specifically, in this embodiment, the height of the first positioning module 105 in a direction perpendicular to the surface of the carrying plate 101 is 1 cm.
[0032] The size range of the second positioning area II along the first direction X is: 16 cm to 17 cm.
[0033] The size range of the second positioning area II along the second direction Y is: 19.5 cm to 20.5 cm.
[0034] Please continue to refer to Figure 1 and Figure 2 The wafer conveying mechanism includes: a limiting module 103, located at a side of the first positioning area I away from the second positioning area II along the first direction X, the central axis of the limiting module 103 is parallel to the central axis of the carrier plate 101 along the first direction X, and the limiting module 103 and a plurality of the first positioning modules 105 define the first positioning area I. The plurality of the first positioning modules are symmetrically distributed about the central axis of the limiting module.
[0035] In this embodiment, the wafer carrier 109 has a first surface and a second surface opposite to each other, the first surface is a U-shaped surface, and the second surface is an H-shaped surface. The surface of the wafer carrier 109 on the first positioning area I facing the carrier plate 101 is a U-shaped surface, and the limiting module 103 is used to limit the U-shaped surface of the wafer carrier 109.
[0036] Specifically, in this embodiment, a surface of the wafer carrier 109 located on the second positioning area II facing the carrier plate 101 is an H-shaped surface.
[0037] Specifically, in this embodiment, the projection of the limiting module 103 on the surface of the carrying plate 101 has a fourth part and a fifth part, and the fourth part and the fifth part are arranged in sequence along the first direction X, and the fifth part is closer to the second positioning area II than the fourth part in the first direction X, and the size of the fourth part in the first direction X is 1.9 cm; the size of the fourth part in the second direction Y is 11 cm; the size of the fifth part in the first direction X is 1 cm; the size of the fifth part in the second direction Y is 8.8 cm.
[0038] Specifically, in this embodiment, the height of the limiting module 103 in a direction perpendicular to the surface of the carrying plate 101 is 2.5 centimeters.
[0039] Please continue to refer to Figure 1 and Figure 2 The wafer transmission mechanism also includes: a fourth positioning module 104 located on the first positioning area I; the fourth positioning module 104 is symmetrically distributed about the central axis of the limiting module 103, and the first positioning module 105, the fourth positioning module 104 and the limiting module 103 form the first positioning area I.
[0040] The limiting module 103, the first positioning module 105 and the fourth positioning module 104 are used to limit the U-shaped surface of the wafer carrier 109. When the wafer carrier 109 on the first positioning area I receives the wafer from the wafer carrier 109 on the second positioning area II, the wafer carrier 109 on the first positioning area I does not move in the first direction X and the second direction Y to affect the reception of the wafer.
[0041] Please continue to refer to Figure 1 and Figure 2 The wafer transmission mechanism also includes: a plurality of first raised switches 102 located on the surface of the first positioning area I, and the first raised switches 102 are arranged along the second direction Y; and a plurality of second raised switches 106 located on the surface of the second positioning area II, and the second raised switches 106 are arranged along the second direction Y.
[0042] The wafer carrier 109 on the first positioning area I is located on the first raised switch 102, and the wafer carrier 109 on the second positioning area II is located on the second raised switch 106. When the wafer carrier 109 on the second positioning area II presses the second raised switch 106 and the wafer carrier 109 on the first positioning area I presses the first raised switch 102, the wafer to be transferred in the wafer carrier 109 on the second positioning area II is transferred to the wafer carrier 109 on the first positioning area I; when the wafer carrier 109 on the first positioning area I does not press the first raised switch 102 or the wafer carrier 109 on the second positioning area II does not press the second raised switch 106, the wafer in the wafer carrier 109 on the second positioning area II cannot be transferred to the wafer carrier 109 on the first positioning area I. The first raised switch 102 and the second raised switch 106 prevent the wafer carrier 109 from being transferred when the wafer carrier 109 is not placed, which may cause erroneous operation.
[0043] Please continue to refer to Figure 1 and Figure 2 The wafer transmission mechanism also includes: a plurality of second positioning modules 107 located on the second positioning area II; the second positioning modules 107 are arranged along the second direction Y, each of the second positioning modules 107 includes two positioning ridges and a limiting groove located between the two positioning ridges, the central axis of each of the second positioning modules 107 along the second direction Y coincides with the central axis of the second raised switch 106 along the second direction Y parallel to the second direction Y, and each of the limiting grooves is located on the central axis of the second raised switch 106 along the second direction.
[0044] Specifically, in this embodiment, the two positioning ridges of each second positioning module 107 are symmetrically distributed. The distance between the two positioning ridges of each second positioning module 107 in the first direction X is 0.7 cm; the size of the two positioning ridges of each second positioning module 107 in the first direction X is 1 cm; the size of each second positioning module 107 in the first direction X is 6 cm.
[0045] Specifically, in this embodiment, the height of each of the second positioning modules 107 in a direction perpendicular to the surface of the carrying plate 101 is 1 centimeter.
[0046] The wafer transfer mechanism further includes: a plurality of third positioning modules 108 located in the second positioning area II, each of the third positioning modules 108 being closer to the edge of the carrier plate 101 than each of the second positioning modules 107 in the second direction Y; and the third positioning modules 108 are distributed along the second direction.
[0047] Specifically, in the present embodiment, the side of the wafer carrier 109 located in the second positioning area II facing the carrier plate 101 is an H-shaped surface, and the side of the wafer carrier 109 located in the first positioning area I facing the carrier plate 101 is a U-shaped surface, the H-shaped surface and the U-shaped surface are different in shape and are two opposite surfaces, the H-shaped surface is a beam structure, the second positioning module 107 and the third positioning module 108 are used to limit the H-shaped surface, and the H-shaped surface is placed in the limiting groove of the second positioning module 107, when the wafer to be transferred in the wafer carrier 109 on the second positioning area II is transferred to the wafer carrier 109 on the first positioning area I, the wafer carrier 109 on the second positioning area II does not displace in the first direction X and the second direction Y to affect the transfer of the wafer.
[0048] Please refer to Figure 3 and Figure 4 The wafer transport mechanism includes: a wafer pushing mechanism that can move along a first direction X, and the wafer pushing mechanism includes: a push plate 110, a push rod 111, and a connecting rod 112 connected in sequence, and the push plate 110 is located above the carrier plate 101.
[0049] The wafer pushing mechanism is used to push the wafer in the wafer carrier 109 to move along the first direction X, so as to complete the transfer of the wafer in the wafer carrier 109 on the second positioning area II to the wafer carrier 109 on the first positioning area I.
[0050] The contact area between the push plate 110 and the wafer in the wafer carrier 109 is relatively large, so that the force on the wafer to be transferred is uniform, thereby improving the accuracy of transferring the wafer.
[0051] Please continue to refer to Figure 3 and Figure 4 The wafer transport mechanism includes: a driving mechanism fixed under the carrier plate 101, the connecting rod 112 is connected to the driving mechanism, the driving mechanism is used to drive the wafer pushing mechanism to move along the first direction X, the driving mechanism includes a hand push rod 113, and the hand push rod 113 is connected to the first protrusion switch 102 and the second protrusion switch 106 from the back of the carrier plate 101.
[0052] The connecting rod 112 is located below the supporting plate 101, and the connecting rod 112 has a first end and a second end opposite to each other, and the pushing rod 111 has a third end and a fourth end opposite to each other, and the first end of the connecting rod 112 is connected to the driving mechanism, and the second end of the connecting rod 112 is connected to the third end of the pushing rod 111, and the fourth end of the pushing rod 111 is connected to the pushing plate 110, and the pushing plate 110 is used to push the wafer to be transferred in the wafer carrier 109 to move along the first direction X.
[0053] The wafer carrier 109 on the second positioning area II is located on the second raised switch 106, and the wafer carrier 109 on the first positioning area I is located on the first raised switch 102. The second raised switch 106 and the first raised switch 102 are connected to a hand push rod 113 for controlling the transfer of the wafer to be transferred. When the wafer carrier 109 on the first positioning area I presses the first raised switch 102 and the wafer carrier 109 on the second positioning area II presses the second raised switch 106, the operation The hand push rod 113 moves along the first direction X toward the first positioning area I, so that the wafer to be transferred in the wafer carrier 109 on the second positioning area II is transferred to the wafer carrier 109 on the first positioning area I; when the wafer carrier 109 on the first positioning area I does not press the first protruding switch 102 or the wafer carrier 109 on the second positioning area II does not press the second protruding switch 106, the hand push rod 113 cannot be pushed, and the wafer to be transferred in the second positioning area II to the first positioning area I cannot be completed.
[0054] Specifically, the wafer carrier 109 loaded with wafers is placed with its H-shaped surface facing downward in the second positioning area II, and the front side of the wafer faces the U-shaped surface of the wafer carrier 109; the U-shaped surface of the empty wafer carrier 109 is placed with its U-shaped surface facing downward in the first positioning area II; the operating hand push rod 113 moves along the first direction X toward the first positioning area I, and pushes the wafer in the wafer carrier 109 on the second positioning area II into the wafer carrier 109 on the first positioning area I. After the transfer is completed, the front side of the wafer on the first positioning area I faces the H-shaped surface of the wafer carrier 109, and the back side of the wafer faces the U-shaped surface of the wafer carrier 109. The wafer is flipped 180° in the wafer carrier 109 relative to before the transfer, so that the subsequent process can be performed on the back side of the wafer, thereby improving the warping of the wafer surface and improving the flatness of the wafer surface.
[0055] Although the utility model is disclosed as above, the utility model is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the utility model. Therefore, the protection scope of the utility model shall be subject to the scope defined by the claims.
Claims
1. A wafer conveying mechanism, characterized in that: include: A carrier plate, comprising a first positioning area and a second positioning area arranged along a first direction, wherein the first positioning area is used to position a first surface of a wafer carrier, and the second positioning area is used to position a second surface of the wafer carrier opposite to the first surface; A limiting module is located at a side of the first positioning area away from the second positioning area along the first direction, and the central axis of the limiting module is parallel to the central axis of the carrying plate along the first direction; A plurality of first positioning modules are located between the first positioning area and the second positioning area. The plurality of first positioning modules are arranged along a second direction and are symmetrically distributed about the central axis of the limiting module. The second direction is perpendicular to the first direction. The limiting module and the plurality of first positioning modules define the first positioning area.
2. The wafer transfer mechanism according to claim 1, wherein: The projection of each first positioning module on the surface of the supporting plate has a first part, a second part and a third part, the first part, the second part and the third part are arranged in sequence along the second direction, and the first part is closer to the central axis of the limiting module in the second direction than the second part and the third part.
3. The wafer transfer mechanism according to claim 1, wherein: Also includes: A plurality of first protruding switches located on the surface of the first positioning area, wherein the first protruding switches are arranged along the second direction; A plurality of second protruding switches are located on the surface of the second positioning area, and the second protruding switches are arranged along a second direction.
4. The wafer transfer mechanism according to claim 3, wherein: Also includes: A plurality of second positioning modules are located on the second positioning area; the second positioning modules are arranged along the second direction, each of the second positioning modules includes two positioning ridges and a limiting groove between the two positioning ridges, and each of the limiting grooves is located on the central axis of the second raised switch along the second direction.
5. The wafer transfer mechanism according to claim 4, characterized in that: Also includes: A plurality of third positioning modules located in the second positioning area, each of the third positioning modules being closer to an edge of the carrier plate than each of the second positioning modules in the second direction; The third positioning modules are distributed along the second direction.
6. The wafer transfer mechanism according to claim 1, wherein: Also includes: A fourth positioning module is located in the first positioning area; the fourth positioning modules are symmetrically distributed about the central axis of the limiting module, and the first positioning module, the fourth positioning module and the limiting module form the first positioning area.
7. The wafer transfer mechanism as claimed in claim 3, characterized in that: Also includes: A sheet pushing mechanism is movable along a first direction, the sheet pushing mechanism comprising: a push plate, a push rod, and a connecting rod connected in sequence, the push plate being located above the carrying plate.
8. The wafer transfer mechanism according to claim 7, wherein: Also includes: A driving mechanism is fixed under the supporting plate, the connecting rod is connected to the driving mechanism, the driving mechanism is used to drive the pushing mechanism to move along a first direction, and the driving mechanism includes a hand push rod, and the hand push rod is connected to the first raised switch and the second raised switch from the back side of the supporting plate.