Smart phone rear cover with antenna

Abstract

The utility model relates to the technical field of electronic product shells, in particular to an intelligent mobile phone rear cover with an antenna, which comprises a plate layer, an antenna layer and an adhesive layer, the plate layer comprises a transparent base plate, a hardened layer is arranged on the transparent base plate, and a texture layer, an electroplated layer and an ink layer are sequentially arranged below the transparent base plate. The antenna layer comprises a copper-plated antenna, the lower surface of the ink layer of the plate layer is connected with the upper surface of the photosensitive adhesive layer of the antenna layer in an attached manner through an adhesive layer, through a multi-layer stacked structure, the bottom surface of a transparent base plate is sequentially subjected to UV texture transfer printing, electroplating, ink printing and solidification to form the plate layer, and then the copper-plated antenna layer is adhered to the bottom surface through an adhesive. The mobile phone rear cover with the antenna receiving function is formed, the intelligent mobile phone rear cover with the structure is attractive and fashionable in appearance and high in physical texture, and the wireless signal receiving strength of a mobile phone is greatly improved after the copper-plated antenna is matched with the mobile phone.

Description

Technical Field

[0001] The utility model relates to the technical field of decorative covers, in particular to a smart phone back cover with an antenna. Background Art

[0002] With the development of the times, smartphones are becoming more and more important in people's lives, and there are more and more types of mobile phones. The appearance of a mobile phone is particularly important when purchasing it. The material, craftsmanship and color of the mobile phone shell affect people's choices.

[0003] In the production and processing of the back covers of some smart phones, in order to achieve a better appearance, a lot of effort has been put into the production process. Through injection molding and glass high-pressure forming with anti-exposure film and plate high-pressure forming, although single-color and multi-color combinations can be achieved in patterns and colors to increase the texture of the appearance, the complex process superposition affects the reception of mobile phone signals. In addition, in remote areas, the mobile phone itself has a weak signal. It only has a beautiful appearance, but cannot guarantee the original call and Internet functions, and thus loses the original usage characteristics of the mobile phone.

[0004] How to make the back cover of a smartphone have a high-quality appearance and at the same time have a signal enhancement function is a problem that needs to be solved at present. Utility Model Content

[0005] The purpose of the utility model is to provide a smart phone back cover with an antenna in view of the deficiencies in the prior art. The structure is simple. Through a multi-layer stacked structure, UV transfer texture, electroplating, and printing ink are sequentially performed on the bottom surface of a transparent base plate, and then the upper surface is solidified to form a plate layer. Then, a copper-plated antenna layer is adhered to the bottom surface by adhesive to form a mobile phone back cover with an antenna receiving function. The smart phone back cover with this structure not only has a beautiful and fashionable appearance and a strong physical texture, but also greatly increases the wireless signal reception strength of the mobile phone after the copper-plated antenna cooperates with the mobile phone.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A back cover of a smart phone with an antenna comprises a plate layer, an antenna layer, and an adhesive layer. The plate layer comprises a transparent base plate, a hardening layer is arranged on the transparent base plate, a texture layer, an electroplating layer, and an ink layer are arranged in sequence on the bottom of the transparent base plate, a local printing layer is also arranged on the transparent base plate between the transparent base plate and the texture layer, the antenna layer comprises a film substrate, a copper-plated antenna is arranged on the film substrate, a photosensitive adhesive layer is arranged on the copper-plated antenna, the bottom of the ink layer of the plate layer and the top of the photosensitive adhesive layer of the antenna layer are bonded and connected via an adhesive layer, and a contact penetrating the film substrate is arranged on the bottom of the copper-plated antenna.

[0008] The transparent base plate is any one of a PC plate, a PMMA plate, a PET plate, an ABS plate, a PVC plate, a glass fiber plate, or any combination thereof, and the thickness of the transparent base plate is 0.25 mm to 0.8 mm.

[0009] The texture layer is any one of UV liquid ultraviolet curing glue and PU thermal curing glue.

[0010] The electroplating layer is any one of resistive evaporation plating, magnetron sputtering plating, and electron gun evaporation plating, using elements of indium, tin, zirconium, chromium, silicon, titanium, and oxides of the aforementioned elements for coating, and the thickness of the electroplating layer is 50nm-500nm.

[0011] The ink layer and the partial printing layer are any one of solvent-based ink, UV-based ink, water-based ink and resin-based ink, and have a thickness of 0.01 mm to 0.1 mm.

[0012] The film substrate is any one of PET, COP and LCP, and the thickness of the film substrate is 0.05mm-0.5mm.

[0013] The copper-plated antenna is any one of evaporation coating, magnetron coating, and electron gun coating. The copper-plated antenna is any graphic structure formed by etching. The thickness of the copper-plated antenna is 0.0002mm-0.002mm. The photosensitive adhesive layer is any one of coating, offset printing, gravure printing, screen printing, and inkjet printing.

[0014] The adhesive layer is any one of UV liquid adhesive, hot melt adhesive, pressure sensitive adhesive, epoxy resin adhesive, anaerobic adhesive, and latex.

[0015] First, the LOGO and character patterns are partially printed on the lower surface of the transparent base plate. After the LOGO and character patterns are printed on the lower surface, UV transfer texture, electroplating, and printing ink are performed in sequence. Then, the upper surface of the transparent base plate is hardened to form a plate layer. Then, a copper film is plated on the back of the film material. Then, a photosensitive adhesive layer is coated on the copper film. The photosensitive adhesive is exposed to ultraviolet light according to different design circuit diagrams. The unexposed part is removed by washing. The copper film outside the circuit is removed in the etching solution to obtain a thin film with only copper circuits to form an antenna layer. Finally, the plate layer and the antenna layer are bonded by an adhesive layer to form a smartphone back cover with an antenna function.

[0016] The utility model has the following beneficial effects: a smart phone back cover with an antenna comprises a plate layer, an antenna layer, and an adhesive layer, the plate layer comprises a transparent base plate, a hardening layer is arranged on the transparent base plate, a texture layer, an electroplating layer, and an ink layer are arranged in sequence on the bottom of the transparent base plate, a local printing layer is also arranged on the transparent base plate between the transparent base plate and the texture layer, the antenna layer comprises a film substrate, a copper-plated antenna is arranged on the film substrate, a photosensitive adhesive layer is arranged on the copper-plated antenna, the bottom of the ink layer of the transparent base plate and the top of the photosensitive adhesive layer of the antenna layer are bonded and connected by the adhesive layer, a contact penetrating the film substrate is arranged under the copper-plated antenna, UV transfer texture, electroplating, and printing ink are sequentially performed on the bottom surface of the transparent base plate through a multi-layer stacked structure, and then the upper surface is solidified to form a plate layer, and then the copper-plated antenna layer is glued to the bottom surface by adhesive to form a mobile phone back cover with an antenna receiving function. The smart phone back cover with this structure is not only beautiful and fashionable in appearance and strong in physical texture, but also greatly increases the wireless signal receiving strength of the mobile phone after the copper-plated antenna is matched with the mobile phone. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of the utility model;

[0018] Figure 2 It is a structural schematic diagram of the copper-plated antenna in the utility model;

[0019] Figure 3 It is a process flow chart of the utility model. DETAILED DESCRIPTION

[0020] See Figure 1 , Figure 2 As shown: The utility model is a back cover of a smart phone with an antenna, comprising a plate layer 1, an antenna layer 2, and an adhesive layer 3. The plate layer 1 comprises a transparent base plate 10, a hardening layer 14 is arranged on the transparent base plate 10, a texture layer 11, an electroplating layer 12, and an ink layer 13 are arranged in sequence on the bottom of the transparent base plate 10, and a local printing layer 15 is also arranged on the transparent base plate 10 between the transparent base plate 10 and the texture layer 11. The antenna layer 2 comprises a film substrate 20, a copper-plated antenna 21 is arranged on the film substrate 20, a photosensitive adhesive layer 22 is arranged on the copper-plated antenna 21, the bottom of the ink layer 13 of the plate layer 1 is bonded and connected to the top of the photosensitive adhesive layer 22 of the antenna layer 2 through the adhesive layer 3, and a contact 210 penetrating the film substrate 20 is arranged on the bottom of the copper-plated antenna 21.

[0021] The transparent base plate 10 is any one of a PC plate, a PMMA plate, a PET plate, an ABS plate, a PVC plate, and a glass fiber plate, or any combination thereof, and the thickness of the transparent base plate 10 is 0.25 mm-0.8 mm.

[0022] The texture layer 11 is any one of UV liquid ultraviolet curing adhesive and PU thermal curing adhesive.

[0023] The electroplating layer 12 is formed by resistive evaporation plating, magnetron sputtering plating, or electron gun evaporation plating, using elements such as indium, tin, zirconium, chromium, silicon, titanium, and oxides of the aforementioned elements. The thickness of the electroplating layer 12 is 50nm-500nm.

[0024] The ink layer 13 and the partial printing layer 15 are any one of solvent-based ink, UV-based ink, water-based ink, and resin-based ink, and have a thickness of 0.01 mm to 0.1 mm.

[0025] The film substrate 20 is any one of PET, COP and LCP, and the thickness of the film substrate 20 is 0.05 mm-0.5 mm.

[0026] The copper-plated antenna is any one of evaporation coating, magnetron coating, and electron gun coating. The copper-plated antenna is any graphic structure formed by etching. The thickness of the copper-plated antenna is 0.0002mm-0.002mm. The photosensitive adhesive layer 22 is any one of coating, offset printing, gravure printing, screen printing, and inkjet printing.

[0027] The adhesive layer 3 is any one of UV liquid adhesive, hot melt adhesive, pressure sensitive adhesive, epoxy resin adhesive, anaerobic adhesive, and latex.

[0028] See Figure 3 Shown: Process flow chart for manufacturing a decorative back cover of a mobile phone with antenna receiving function.

[0029] In the first step, a transparent base plate 10 is used, and the material is any one of PC plate, PMMA plate, PET plate, ABS plate, PVC plate, glass fiber plate, or a composite or combined material of the above materials. The LOGO and character patterns are printed on the local printing layer 15 on the lower surface of the transparent base plate 10.

[0030] In the second step, after partially printing the LOGO and character patterns on the lower surface of the transparent base plate 10, UV liquid ultraviolet curing glue and PU heat curing glue are used to transfer the UV texture layer 11;

[0031] The third step is to apply a resistive evaporation plating, magnetron sputtering plating, or electron gun evaporation plating to the surface after UV transfer, using indium, tin, zirconium, chromium, silicon, titanium, and oxides of the aforementioned elements to increase a plating layer 12 with a thickness of 50nm-500nm;

[0032] Step 4: After adding the electroplating layer 12, a bottom ink layer 13 with a thickness of 0.01 mm to 0.10 mm is printed. The bottom ink can be any one of solvent-based ink, UV-based ink, water-based ink, and resin-based ink. After adding the bottom ink layer 13, the board layer 1 is obtained;

[0033] Step 5: On the 0.05mm-0.5mm film substrate, a 0.0002mm-0.002mm copper film is plated by any one of evaporation coating, magnetron coating, and electron gun coating. After the copper film is plated, a photosensitive adhesive layer 22 is added on the surface of the copper film by any one of coating, offset printing, gravure printing, screen printing, and inkjet printing;

[0034] Step 6: Use ultraviolet light to expose the photosensitive resin according to different design circuit diagrams, remove the unexposed part by washing, and remove the copper film outside the circuit in the etching solution to obtain the copper-plated antenna 21 with only copper circuits. The copper-plated antenna 21 can be etched into any pattern, and then the antenna layer 2 is obtained;

[0035] Step 7: The board layer 1 and the antenna layer 2 are bonded together by the adhesive layer 3;

[0036] In the eighth step, a hardening layer 14 is then sprayed on the upper surface of the plate layer 1, and then cut to form a 2D structured mobile phone back cover;

[0037] or:

[0038] Step 8: Forming the 3D structure sheet by high pressure forming 3D structure molding (mold temperature 100-150°C, pressure 100-200KG, baking temperature 250-400°C, holding time 10-60S), spraying the hardening layer 14 on the upper surface of the high pressure formed 3D structure sheet;

[0039] Finally, the smartphone back cover is formed into a 3D structure through CNC cutting, laser cutting or die punching.

[0040] The utility model discloses a smart phone back cover with an antenna. The utility model prints a logo and character patterns partially on the lower surface of a transparent base plate 10, and then sequentially performs UV transfer texture, electroplating, and printing ink after the logo and character patterns are printed on the lower surface. Then, the upper surface of the transparent base plate 10 is hardened to form a plate layer 15. Then, a copper film is plated on the back of a film material 20. Then, a photosensitive adhesive layer 22 is coated on the copper film. The photosensitive adhesive is exposed to light according to different circuit diagrams by ultraviolet light. The unexposed part is removed by washing. The copper film outside the circuit is removed in an etching solution to obtain a film with only the copper circuit, thereby forming an antenna layer 2 with a copper-plated antenna 21. Finally, the plate layer 1 and the antenna layer 2 are bonded by an adhesive layer 3 to form a smart phone back cover with an antenna function.

[0041] The back cover of the smart phone with this structure not only has a beautiful and fashionable appearance and a strong physical texture, but also can greatly increase the wireless signal reception strength of the mobile phone after being connected with the mobile phone through the contact 210 on the copper-plated antenna 21.

[0042] The above description is only a preferred embodiment of the present utility model, so all equivalent changes or modifications made according to the structure, features and principles described in the scope of the present utility model patent application are included in the scope of the present utility model patent application.

Claims

1. A smartphone back cover with an antenna, comprising a plate layer (1), an antenna layer (2), and an adhesive layer (3), wherein the plate layer (1) comprises a transparent base plate (10), and is characterized in that: A hardening layer (14) is arranged on the top of the transparent base plate (10), and a texture layer (11), an electroplating layer (12), and an ink layer (13) are arranged in sequence on the bottom of the transparent base plate (10). A local printing layer (15) is also arranged on the transparent base plate (10) between the transparent base plate (10) and the texture layer (11). The antenna layer (2) comprises a film substrate (20), a copper-plated antenna (21) is arranged on the film substrate (20), and a photosensitive adhesive layer (22) is arranged on the copper-plated antenna (21). The bottom of the ink layer (13) of the plate layer (1) and the top of the photosensitive adhesive layer (22) of the antenna layer (2) are bonded and connected via an adhesive layer (3), and a contact (210) penetrating the film substrate (20) is arranged on the bottom of the copper-plated antenna (21).

2. The smart phone back cover with an antenna according to claim 1, characterized in that: The transparent base plate (10) is any one of a PC plate, a PMMA plate, a PET plate, an ABS plate, a PVC plate, and a glass fiber plate, or any combination thereof, and the thickness of the transparent base plate (10) is 0.25 mm to 0.8 mm.

3. The smart phone back cover with an antenna according to claim 1, characterized in that: The texture layer (11) is any one of UV liquid ultraviolet curing adhesive and PU thermal curing adhesive.

4. The smart phone back cover with an antenna according to claim 1, characterized in that: The electroplating layer (12) is formed by any one of resistive evaporation plating, magnetron sputtering plating, and electron gun evaporation plating, using elements such as indium, tin, zirconium, chromium, silicon, titanium, and oxides of the aforementioned elements, and the thickness of the electroplating layer (12) is 50nm-500nm.

5. The smart phone back cover with an antenna according to claim 1, characterized in that: The ink layer (13) and the partial printing layer (15) are any one of solvent-based ink, UV-based ink, water-based ink, and resin-based ink, and have a thickness of 0.01 mm to 0.1 mm.

6. The smart phone back cover with an antenna according to claim 1, characterized in that: The film substrate (20) is any one of PET, COP, and LCP, and the thickness of the film substrate (20) is 0.05 mm-0.5 mm.

7. The smart phone back cover with an antenna according to claim 1, characterized in that: The copper-plated antenna (21) is any one of evaporation coating, magnetron coating, and electron gun coating. The copper-plated antenna (21) is any pattern structure formed by etching. The thickness of the copper-plated antenna (21) is 0.0002 mm-0.002 mm.

8. The smart phone back cover with an antenna according to claim 1, characterized in that: The photosensitive adhesive layer (22) is printed by any one of coating, offset printing, gravure printing, screen printing and inkjet printing.

9. The smart phone back cover with an antenna according to claim 1, characterized in that: The adhesive layer (3) is any one of UV liquid adhesive, hot melt adhesive, pressure sensitive adhesive, epoxy resin adhesive, anaerobic adhesive, and latex.

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