High-efficiency heat-dissipation uniform-temperature water-cooling substrate

Abstract

The utility model belongs to the technical field of water-cooling heat dissipation, and provides a high-efficiency heat-dissipation uniform-temperature water-cooling substrate which comprises a chip, an evaporation plate and a substrate shell, the chip is attached to the surface of the evaporation plate, the evaporation plate is fixedly connected with the substrate shell, a working groove is formed in the surface, close to the evaporation plate, of the substrate shell, and a uniform-temperature cavity is formed between the working groove and the evaporation plate. A liquid absorbing core is installed in the temperature equalizing cavity, and a condensation plate is arranged at the bottom of the temperature equalizing cavity and makes contact with the liquid absorbing core. According to the utility model, the wave-shaped condensation plate manufactured by stamping is adopted and can be quickly manufactured by stamping, the salient point structure of the condensation plate is in direct contact with the liquid absorption core, so that the processing of a capillary core is reduced, the condensation plate with the structure plays a role of two structures of the traditional condensation plate and the capillary core, and in addition, the condensation plate is of the uneven wave-shaped structure, so that the condensation effect is greatly improved. The condensation area is increased, the condensation efficiency of the working medium in the inner cavity is improved, the heat conductivity of the substrate is improved, and the heat dissipation effect of the water-cooling substrate is accelerated.

Description

Technical Field

[0001] The utility model belongs to the technical field of water cooling and heat dissipation, and particularly relates to a water cooling substrate with high efficiency heat dissipation and uniform temperature. Background Art

[0002] At present, water-cooled substrates are made of pure copper materials with good thermal conductivity. The thermal conductivity of copper is about 381W / (mk). When the substrate area is large, there is a large temperature difference in the copper substrate and the heat dissipation effect is poor.

[0003] Application No. 202021186523 discloses an integrated temperature-averaging plate radiator, which uses a combination of heat sink fins and temperature-averaging plates for air cooling. In order to improve the heat dissipation effect, it is necessary to process a capillary core structure, which has high processing requirements and high manufacturing costs. In addition, it is necessary to process holes in the wire mesh and cooperate with the support column, and the process is complicated. In addition, the existing condenser plate is a flat plate structure, and it is necessary to process the capillary core structure and the cavity reinforcement rib structure, which is more time-consuming. Utility Model Content

[0004] In order to solve at least one problem in the background technology, the utility model provides a water-cooled substrate with high efficiency in heat dissipation and uniform temperature.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A water-cooled substrate with high efficiency heat dissipation and uniform temperature, comprising a chip, an evaporation plate and a substrate shell;

[0007] The chip is attached to the surface of the evaporation plate;

[0008] The evaporation plate is fixedly connected to the substrate housing;

[0009] A working groove is provided on the surface of the substrate shell close to the evaporation plate, and a uniform temperature cavity is formed between the working groove and the evaporation plate;

[0010] A liquid wick is installed in the temperature-averaging chamber;

[0011] The bottom of the temperature-averaging chamber is a condensation plate, and the condensation plate is in contact with the liquid-absorbing core.

[0012] Preferably, a surface of the substrate housing away from the evaporation plate is provided with a plurality of pin fins.

[0013] Preferably, the condensation plate and the substrate shell are an integrated structure.

[0014] Preferably, the surface of the condensation plate in contact with the liquid wick is wavy.

[0015] Preferably, the wick is made of a fine wire mesh, or is formed by hot-pressing and sintering aluminum powder to fill a temperature-equalizing cavity.

[0016] Preferably, a filling hole is opened on one end surface of the substrate shell, and the filling hole is connected to the temperature equalization chamber.

[0017] Preferably, the temperature-averaging chamber is also filled with a working medium, and the working medium enters the temperature-averaging chamber through a filling hole.

[0018] Preferably, the working fluid is acetone or ethanol.

[0019] Preferably, the evaporation plate and the substrate shell are welded by vacuum brazing.

[0020] Preferably, the evaporation plate and the substrate shell are both aluminum plates.

[0021] Beneficial effects of the utility model:

[0022] 1. The utility model adopts a wave-shaped condensation plate made by stamping, which can be quickly produced by stamping. The convex point structure of the condensation plate directly contacts the liquid absorption core, reducing the processing of the capillary core. The condensation plate of this structure plays the role of both the traditional condensation plate and the capillary core. In addition, since the condensation plate is an uneven wave-shaped structure, the condensation area is increased, and the condensation efficiency of the working medium in the inner cavity is improved, thereby improving the thermal conductivity of the substrate and accelerating the heat dissipation effect of the water-cooled substrate;

[0023] 2. The utility model adds a temperature-averaging cavity on the substrate, so that the heat of the chip can be efficiently transferred to various areas of the substrate. After the temperature difference between various parts of the substrate is reduced, the heat can be transferred to the coolant through the Pin-Fin. In this way, the heat dissipation efficiency of the substrate is higher.

[0024] 3. Since the material of the utility model is aluminum, compared with the pure copper substrate, the weight is lighter, the temperature distribution of the substrate is more uniform, and the heat dissipation efficiency is higher.

[0025] Other features and advantages of the utility model will be described in the following description, and partly become apparent from the description, or understood by implementing the utility model. The purpose and other advantages of the utility model can be realized and obtained by the structures indicated in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1The utility model shows a structural schematic diagram of a high-efficiency heat dissipation and uniform temperature water-cooling base plate.

[0028] In the figure: 1. chip; 2. evaporation plate; 3. substrate shell; 301. filling hole; 302. condensation plate; 303. pin fin; 304. temperature equalization chamber; 4. liquid absorption core. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] A water-cooled substrate with high efficiency and uniform temperature, such as Figure 1 As shown, it includes a chip 1, an evaporation plate 2 and a substrate shell 3. The chip 1 is attached to the surface of the evaporation plate 2, and the evaporation plate 2 is fixedly connected to the substrate shell 3. A working groove is provided on the surface of the substrate shell 3 close to the evaporation plate 2, and a temperature-averaging cavity 304 is formed between the working groove and the evaporation plate 2. A liquid wick 4 is installed in the temperature-averaging cavity 304. The bottom of the temperature-averaging cavity 304 is a condensation plate 302, and the condensation plate 302 is in contact with the liquid wick 4. A plurality of Pin-Fins (pin fins 303) are provided on the surface of the substrate shell 3 away from the evaporation plate 2.

[0031] Furthermore, the surface of the condensation plate 302 that contacts the liquid absorption core 4 is wavy, and it is an integrated structure with the substrate shell 3 , and can be manufactured by the substrate shell 3 through a stamping process.

[0032] It should be noted that the condensation plate 302 can be quickly manufactured by a stamping process, and the convex point structure of the condensation plate 302 directly contacts the liquid wick 4, reducing the processing of the capillary core. In addition, since the condensation plate 302 is an uneven wavy structure, the condensation area is increased, and the condensation efficiency of the working medium in the inner cavity is improved, thereby improving the thermal conductivity of the substrate and accelerating the heat dissipation effect of the water-cooled substrate.

[0033] Furthermore, the wick 4 is made of a fine wire mesh, or is formed by hot-pressing and sintering aluminum powder to fill the temperature-averaging cavity 304 .

[0034] It should be noted that the liquid absorbent core 4 filled with sintered aluminum powder will also contact the protrusions of the condensation plate 302. After the condensation plate 302 is cooled, the working fluid will gather in the concave area. Due to the influence of the temperature difference, the working fluid will flow back along the wall of the condensation plate 302 to the protrusions of the condensation plate 302 and be absorbed by the liquid absorbent core 4, thus completing a cycle.

[0035] Furthermore, a filling hole 301 is provided on one end surface of the substrate housing 3, and the filling hole 301 is connected to the temperature-averaging chamber 304. The temperature-averaging chamber 304 is also filled with a working medium, and the working medium enters the temperature-averaging chamber 304 through the filling hole 301. The working medium is acetone or ethanol.

[0036] Furthermore, the evaporation plate 2 and the substrate shell 3 are both made of aluminum plates, which are lighter and have better thermal conductivity than materials such as copper plates.

[0037] It should be noted that Figure 1 The efficient heat dissipation and uniform temperature water cooling substrate can be obtained through the following process:

[0038] Step 1, obtain the substrate shell 3 and the evaporation plate 2 by stamping. The stamping structure of the condensation plate 302 of the substrate shell 3 is an uneven wave shape. The side of the substrate shell 3 is processed with a filling hole 301. The filling hole 301 makes the inner cavity communicate with the outside. The processed materials are all aluminum.

[0039] Step 2: Install a fine wire mesh in the temperature-averaging cavity 304 above the condensation plate 302, or fill the cavity with aluminum powder by hot pressing and sintering.

[0040] Step 3: The evaporation plate 2 and the substrate shell 3 are welded together by vacuum brazing.

[0041] Step 4: Use a vacuum pump to evacuate the inner cavity through the filling hole 301, and the vacuum degree is 1×10 -3 Below Pa.

[0042] Step 5, filling the working fluid into the inner cavity through the filling hole 301, and the working fluid is acetone or ethanol.

[0043] Step 6, sealing the filling hole 301.

[0044] It should be noted that Figure 1 The working principle of the water-cooled baseplate is as follows:

[0045] Chip 1 is placed on one side of the evaporation plate 2. Chip 1 generates a lot of heat when working, and the heat is mainly concentrated near chip 1. The working fluid in the wick 4 near the evaporation plate 2 in the temperature-averaging chamber 304 will quickly evaporate into gas after being heated, and take away the heat, and transfer the heat to the side of the condensation plate 302 with a lower temperature. The working fluid will condense into liquid after being cooled, and release heat. The liquid accumulates on one side of the condensation plate 302. Since the convex points of the condensation plate 302 are in contact with the wick 4, the working fluid liquid will flow back to the side of the wick 4 under the action of its own capillary force. When the working fluid liquid is heated again, it will evaporate into gas again to take away the heat. In this cycle, the temperature of chip 1 is continuously transferred from the side of the evaporation plate 2 to the side of the condensation plate 302, and the heat of the condensation plate 302 is then transferred to the Pin-Fin. When the coolant flows through the Pin-Fin, the heat is taken away again due to the convection heat exchange.

[0046] Therefore, during the entire process, the working fluid in the temperature-averaging chamber 304 evenly transfers heat to one side of the condensation plate 302, so that the temperature distribution of the entire substrate is uniform, the temperature on the Pin-Fin is also more uniform, and the heat dissipation efficiency of the entire substrate is higher.

[0047] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A water-cooled substrate with high efficiency heat dissipation and uniform temperature, characterized in that: It comprises a chip (1), an evaporation plate (2) and a substrate housing (3); The chip (1) is placed on the surface of the evaporation plate (2); The evaporation plate (2) is fixedly connected to the substrate shell (3); A working groove is provided on the surface of the substrate shell (3) close to the evaporation plate (2), and a temperature-averaging cavity (304) is formed between the working groove and the evaporation plate (2); A liquid wick (4) is installed in the temperature-averaging chamber (304); The bottom of the temperature-averaging chamber (304) is a condensation plate (302), and the condensation plate (302) is in contact with the liquid absorption core (4).

2. The high-efficiency heat dissipation and uniform temperature water-cooling substrate according to claim 1, characterized in that: A plurality of pin fins (303) are provided on the surface of the substrate shell (3) away from the evaporation plate (2).

3. The high-efficiency heat dissipation and uniform temperature water-cooling substrate according to claim 1, characterized in that: The condensation plate (302) and the substrate shell (3) are an integrated structure.

4. The high-efficiency heat dissipation and uniform temperature water-cooling substrate according to claim 1, characterized in that: The surface of the condensation plate (302) in contact with the liquid absorption core (4) is wavy.

5. The high-efficiency heat dissipation and uniform temperature water-cooling substrate according to claim 4, characterized in that: The liquid wick (4) is made of a fine wire mesh, or is formed by hot-pressing and sintering aluminum powder to fill the temperature-averaging cavity (304).

6. The high-efficiency heat dissipation and uniform temperature water-cooling substrate according to claim 1, characterized in that: A filling hole (301) is provided on one end surface of the substrate shell (3), and the filling hole (301) is connected to the temperature-averaging chamber (304).

7. The high-efficiency heat dissipation and uniform temperature water-cooling substrate according to claim 6, characterized in that: The temperature-averaging chamber (304) is also filled with a working medium, and the working medium enters the temperature-averaging chamber (304) through the filling hole (301).

8. The high-efficiency heat dissipation and uniform temperature water-cooling substrate according to claim 7, characterized in that: The working fluid is acetone or ethanol.

9. A water-cooled substrate with high efficiency heat dissipation and uniform temperature according to any one of claims 1 to 8, characterized in that: The evaporation plate (2) and the substrate shell (3) are welded by vacuum brazing.

10. The high-efficiency heat dissipation and uniform temperature water-cooling substrate according to claim 9, characterized in that: The evaporation plate (2) and the substrate shell (3) are both aluminum plates.

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