Top light-emitting panel structure packaged by hard board glass

Abstract

The utility model discloses a top light-emitting panel structure packaged by hard board glass in the technical field of hard screen panels, which comprises a glass substrate, a glass cover plate, a grid circuit layer, a color filter film layer and a light resistance supporting layer, and a grid insulating layer, a source-drain insulating layer and a semiconductor conducting layer are attached to the top of the glass substrate. The color filter film can be prepared on the glass cover plate with the hard board characteristic, packaging can be carried out through the hard board packaging technology, meanwhile, the front light emitting rate is effectively improved through the color filter film and the micro lens on the top of the color filter film, and product power consumption is effectively reduced; by reasonably designing the distance between the color filter film layer and the OLED evaporation layer and the relation between the height of the glass powder glue and the height of the film layer between the glass, the color filter film layer can be prevented from being influenced by packaging and pressing pressure, and the problem of abnormal light emission caused by interference of the evaporation layer is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of hard screen panels, in particular to a top light-emitting panel structure encapsulated by hard plate glass. Background Art

[0002] White OLED is known as the next generation of lighting source after LED. It has the advantages of surface emission, soft light color, no blue pollution, etc. It is also ultra-thin and flexible. When used as indoor lighting, it can provide good protection for human health and eyes. White OLED also has great development prospects in LCD panels such as TVs and other products. White OLED TV products have been launched. However, white OLED devices have complex structures and preparation processes, low power efficiency, poor color quality and color stability, etc., which greatly restricts their large-scale commercial promotion and application.

[0003] Large-size white OLED panels use bottom-emitting light. The principle is that the holes generated by the anode and the electrons generated by the cathode combine in the light-emitting layer to generate excitons. The excitons radiate and transition to generate energy and emit light. The light is scattered in all directions. The upward light is reflected downward by the opaque cathode. In addition, the light scattered downward by itself is emitted through the color filter layer, and the emitted light is emitted from the substrate surface. The light emitted has two light-emitting modes: red, green, and blue light (RGB) or additional warm white light (RGBW). Because bottom emission needs to avoid the opaque circuit structure on the substrate, the aperture ratio is low, and the pixel density (PPI) of the product is low. In addition, because its color filter layer is designed on the substrate, it is not necessary to use a high-precision metal salt template (FMM) in the evaporation process. It is necessary to avoid process abnormalities such as color mixing and color deviation caused by the droop of the high-precision metal salt template. The above process limitations make bottom-emitting OLED panels only suitable for large-size products, such as TVs.

[0004] Since small and medium-sized displays generally require higher pixel density to display clearer images, white OLEDs are not widely used in small and medium-sized displays. The use of white OLED technology in small and medium-sized displays requires a top-emitting structure, that is, light is emitted from the cover side. In this way, a color filter film needs to be set on the vapor-deposited layer to convert white light into different colors for display. How to improve the light extraction efficiency in the top-emitting structure to reduce power consumption is an urgent problem to be solved.

[0005] In the prior art, in the bottom-emitting device structure, there is a method of preparing a microlens on the side of the pixel definition layer on the side of the substrate to improve the path of the side light and make it emit as forward as possible, thereby increasing the forward light output and reducing power consumption. For the top-emitting light-emitting method, there is also a method of adding a patterned array and a filling layer on the flexible packaging layer, using the graphic interface and the refractive index difference of the film layer to achieve forward light output, thereby improving the brightness. However, this technology is currently difficult to use in hard-screen white light OLED packaging because the hard screen will generate an upward reaction force and the pressing force of the color filter film during packaging will cause abnormal light emission.

[0006] Based on this, the utility model designs a top-lighting panel structure encapsulated by hard plate glass to solve the above problems. Utility Model Content

[0007] The purpose of the utility model is to provide a top-emitting panel structure encapsulated by hard plate glass, which can prepare a color filter film on a glass cover plate with hard plate characteristics, and can also be encapsulated by hard plate encapsulation technology, while effectively improving the front light output rate through the color filter film and the microlens on the top thereof, and effectively reducing the power consumption of the product; by reasonably designing the distance between the color filter film layer and the OLED vapor deposition layer, and the relationship between the glass powder glue height and the glass inter-film layer height, the color filter film layer can be prevented from being affected by the packaging pressing pressure, and the problem of abnormal luminescence caused by interference of the vapor deposition layer can be avoided.

[0008] The utility model is implemented as follows: a top light-emitting panel structure encapsulated by hard plate glass, comprising:

[0009] Glass substrate, glass cover, grid circuit, color filter film and photoresist support layer;

[0010] A gate insulating layer is laminated on the top of the glass substrate;

[0011] A gate circuit is also arranged on the top of the glass substrate, the gate circuit is coated under the gate insulating layer, a source-drain insulating layer is also arranged on the top of the gate insulating layer, a semiconductor conducting layer is also wrapped between the gate insulating layer and the source-drain insulating layer, and the semiconductor conducting layer is directly above the gate circuit; vias are also arranged between the source-drain insulating layers, a planarization layer is covered on the top of the source-drain insulating layer, and a pixel definition layer is covered on the top of the planarization layer;

[0012] An anode layer is arranged between the planarization layer and the pixel definition layer; the via hole vertically penetrates the source-drain insulating layer and the planarization layer, and the anode layer covers the top of the via hole;

[0013] The left and right sides of the semiconductor conductive layer are each connected to a source-drain circuit, the source-drain circuit on one side is connected to the bottom of the via hole, and the top of the semiconductor conductive layer is connected to the anode layer through the source-drain circuit and the via hole;

[0014] The top of the pixel definition layer is covered with an organic vapor deposition layer, the top of the organic vapor deposition layer is covered with a cathode layer, a plurality of color filter films are arranged on the top of the cathode layer, and the gap between the cathode layer and the color filter film is a hollow spacer filling layer, and the spacer filling layer is filled with an inert gas;

[0015] A plurality of photoresist support layers are also arranged between the organic vapor deposition layer and the pixel definition layer;

[0016] A plurality of micro lenses are arranged on the top of the color filter film;

[0017] The glass cover is a flat glass panel, and the color filter film, cathode layer and spacing filling layer are all laminated and covered on the bottom of the glass cover.

[0018] Furthermore, the height between the bottom plane edge of the color filter film and the cathode layer is h, the thickness of the cathode layer is h1, and the thickness of the organic vapor-deposited layer is h2;

[0019] And h>h1+h2;

[0020] The four edges of the glass cover plate are tightly covered with the glass substrate, and the glass substrate and the glass cover plate are bonded by glass powder glue;

[0021] The thickness between the glass substrate and the glass cover is w

[0022] The thickness of the glass powder glue is d, and d=h1+h2.

[0023] Furthermore, the width L2 of the color filter film is greater than the opening width L1 between the pixel definition layers.

[0024] Furthermore, two adjacent microlenses do not interfere with each other.

[0025] Further, the spacer filling layer is sealed between the glass substrate and the glass cover plate;

[0026] The spacer filling layer is filled with nitrogen or argon.

[0027] The beneficial effects of the utility model are as follows: 1. The device is packaged on a hard screen glass substrate by laser sintering of glass powder glue, which is simpler because the hard board sintering can fully melt the glue, with higher adhesion and better packaging effect;

[0028] 2. This device sets high refractive index micro-prism structures on the left and right sides of the light-emitting part in the filter film layer, so that the light emitted at an oblique angle is refracted by these micro-prism structures and then emitted vertically upward, thereby improving the front light output rate and reducing the power consumption of the product;

[0029] 3. By reasonably designing the distance between the color filter film layer and the organic vapor-deposited layer, the relationship between the condensation height of the glass powder glue and the height of the spacing filling layer is adjusted, and the thickness of the glass powder glue is used to support the glass substrate and the glass cover plate, which can avoid the color filter film layer from interfering with the organic vapor-deposited layer under the packaging pressing pressure. A photoresist support layer is also added to play a certain supporting role, which can avoid the upper cover plate from crushing the organic vapor-deposited layer below, and effectively avoid the abnormal luminescence caused by this. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings.

[0031] Figure 1 This is a schematic diagram of the laminated layer structure of the utility model;

[0032] Figure 2 It is a partial enlarged structural schematic diagram of the utility model;

[0033] Figure 3 This is a schematic diagram of the overall planar structure of the panel of the utility model;

[0034] Figure 4 It is a schematic diagram of the thickness state structure of the edge gap of the glass substrate and the glass cover plate of the utility model bonded by glass powder glue;

[0035] Figure 5 This is a schematic diagram of the thickness structure of a metal layer added between the glass substrate and the glass cover plate of the utility model;

[0036] Figure 6 It is a schematic diagram of the thickness relationship between the organic vapor deposition layer and the cathode layer of the utility model.

[0037] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0038] 1-glass substrate, 11-gate insulating layer, 111-glass powder glue, 12-source and drain insulating layer, 13-planarization layer, 14-anode layer, 15-pixel definition layer, 16-glass cover, 17-organic vapor deposition layer, 18-cathode layer, 19-spacer filling layer, 2-gate circuit, 21-semiconductor conduction layer, 22-source and drain circuit, 23-via, 3-color filter film, 31-microlens, 4-photoresistance support layer, 5-effective display area. DETAILED DESCRIPTION

[0039] See also Figures 1 to 6As shown, the utility model provides a top-emitting panel structure encapsulated by hard plate glass. In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings in the specification and specific implementation methods.

[0040] In a specific embodiment of the technical solution of the utility model:

[0041] It includes a glass substrate 1, a glass cover plate 16, a gate circuit 2, a color filter film 3, and a photoresist support layer 4;

[0042] A gate insulating layer 11 is laminated on the top of the glass substrate 1;

[0043] A gate circuit 2 is also arranged on the top of the glass substrate 1. The gate circuit 2 is covered under the gate insulating layer 11. A source-drain insulating layer 12 is also arranged on the top of the gate insulating layer 11. A semiconductor conduction layer 21 is also wrapped between the gate insulating layer 11 and the source-drain insulating layer 12. The semiconductor conduction layer 21 is directly above the gate circuit 2. A via 23 is also arranged between the source-drain insulating layer 12. The top of the source-drain insulating layer 12 is covered with a planarization layer 13, and the top of the planarization layer 13 is covered with a pixel definition layer 15.

[0044] An anode layer 14 is disposed between the planarization layer 13 and the pixel definition layer 15; a via hole 23 vertically penetrates the source-drain insulating layer 12 and the planarization layer 13, and the anode layer 14 covers the top of the via hole 23;

[0045] The semiconductor conductive layer 21 is connected to a source-drain circuit 22 on both sides. The source-drain circuit 22 on one side is connected to the bottom of the via 23. The top of the semiconductor conductive layer 21 is connected to the anode layer 14 through the source-drain circuit 22 and the via 23.

[0046] The top of the pixel definition layer 15 is covered with an organic vapor deposition layer 17, the top of the organic vapor deposition layer 17 is covered with a cathode layer 18, a plurality of color filter films 3 are arranged on the top of the cathode layer 18, and the gap between the cathode layer 18 and the color filter film 3 is a hollow spacer filling layer 19, and the spacer filling layer 19 is filled with an inert gas; the spacer filling layer 19 is sealed between the glass substrate 1 and the glass cover plate 16;

[0047] The spacer filling layer 19 is filled with nitrogen or argon.

[0048] A plurality of photoresist support layers 4 are also provided between the organic vapor deposition layer 17 and the pixel definition layer 15;

[0049] A plurality of micro lenses 31 are arranged on the top of the color filter film 3; two adjacent micro lenses 31 do not interfere with each other. Light interference is avoided between each micro lens 31, and the arrangement method should refract the light upward as much as possible to improve the light transmittance.

[0050] The glass cover plate 16 is a flat glass panel, and the color filter film 3 , the cathode layer 18 and the spacer filling layer 19 are all adhered and covered on the bottom of the glass cover plate 16 .

[0051] The height between the bottom plane edge of the color filter film 3 and the cathode layer 18 is h, the thickness of the cathode layer 18 is h1, and the thickness of the organic vapor deposition layer 17 is h2;

[0052] And h>h1+h2

[0053] The four edges of the glass cover plate 16 are tightly covered with the glass substrate 1, and the glass substrate 1 and the glass cover plate 16 are bonded by glass powder glue 111;

[0054] The thickness between the glass substrate 1 and the glass cover 16 is w

[0055] The thickness of the glass powder paste 111 is d, and d=h1+h2.

[0056] When a metal layer is bonded between the glass substrate 1 and the glass cover plate 16, the thickness of the metal layer is s, and at this time s+d=h1+h2, that is, whether it is the glass powder glue 111 or the metal layer, the sum of the thickness of the bonding medium is equal to the sum of the thickness of the organic vapor deposition layer 17 and the cathode layer 18. The metal layer can be provided with a certain number of pits or protrusions in an array, and the metal layer can enhance the contact adhesion of the glass powder glue, and the reflection effect of the metal layer can make the laser energy better focused in the glue to fully melt the glue.

[0057] Moreover, the width L1 of the color filter film 3 is greater than the opening width L2 between the pixel definition layers. This can display a higher brightness, improve light transmittance, and increase the light transmission area. Since light is scattered in all directions and it is necessary to inject light into the color filter film 3 as much as possible, the range covered by the color filter film 3 should be as large as possible. The side slopes of the color filter film 3 on both sides of the device need to be made parallel to the side slopes of the pixel definition layer 15. At the same time, the width range of the bottom plane of the color filter film 3 is L2 ≥ L1. In this way, the color filter film layer can obtain the white light emitted from the OLED light-emitting layer to the greatest extent and convert it into colored light.

[0058] When preparing the present invention, it is necessary to first prepare a gate circuit 2, a gate insulating layer 11, a source-drain insulating layer 12, a planarizing layer 13, an anode layer 14, a pixel definition layer 15 and a photoresist support layer in sequence on the lower glass substrate 1.

[0059] Then, a color filter film 3 and a microlens 31 are prepared on the glass cover plate 16.

[0060] Next, an evaporation process is performed on the preliminarily prepared glass substrate 1 to prepare an organic evaporation layer 17 and a cathode layer 18 thereon.

[0061] A glass powder glue 111 is prepared at the edge of the glass cover plate 16, and the glass powder glue 111 fills and blocks the effective display area 5 of the OLED panel. Figure 3 As shown, the glass powder glue 111 needs to be packaged around the effective display area 5 and pre-sintered in an environment of 400-500 degrees Celsius. Pay attention to controlling the thickness d of the glass powder glue 111. Finally, in an inert gas environment, the upper glass cover plate 16 is aligned on the glass substrate 1 and pressed together. Finally, the glass powder glue 111 is sintered and packaged to complete the production of the entire OLED panel.

[0062] Although the specific implementation methods of the present invention are described above, those skilled in the art should understand that the specific embodiments described are only illustrative and are not intended to limit the scope of the present invention. Equivalent modifications and changes made by those skilled in the art in accordance with the spirit of the present invention should be included in the scope of protection of the claims of the present invention.

Claims

1. A top-emitting panel structure encapsulated by hard plate glass, characterized in that: include: A glass substrate (1), a glass cover plate (16), a gate circuit (2), a color filter film (3) and a photoresist support layer (4); A gate insulating layer (11) is laminated on the top of the glass substrate (1); A gate circuit (2) is also arranged on the top of the glass substrate (1), the gate circuit (2) is coated below the gate insulating layer (11), a source-drain insulating layer (12) is also arranged on the top of the gate insulating layer (11), a semiconductor conducting layer (21) is also wrapped between the gate insulating layer (11) and the source-drain insulating layer (12), and the semiconductor conducting layer (21) is located directly above the gate circuit (2); via holes (23) are also arranged between the source-drain insulating layers (12), a planarization layer (13) is covered on the top of the source-drain insulating layer (12), and a pixel definition layer (15) is covered on the top of the planarization layer (13); An anode layer (14) is provided between the planarization layer (13) and the pixel definition layer (15); the via hole (23) vertically penetrates the source-drain insulating layer (12) and the planarization layer (13), and the anode layer (14) covers the top of the via hole (23); The left and right sides of the semiconductor conductive layer (21) are each connected to a source-drain circuit (22), the source-drain circuit (22) on one side is connected to the bottom of the via hole (23), and the top of the semiconductor conductive layer (21) is connected to the anode layer (14) through the source-drain circuit (22) and the via hole (23); The top of the pixel definition layer (15) is covered with an organic vapor deposition layer (17), the top of the organic vapor deposition layer (17) is covered with a cathode layer (18), a plurality of color filter films (3) are arranged on the top of the cathode layer (18), the gap between the cathode layer (18) and the color filter film (3) is a hollow spacer filling layer (19), and the spacer filling layer (19) is filled with an inert gas; A plurality of photoresist support layers (4) are also arranged between the organic vapor deposition layer (17) and the pixel definition layer (15); A plurality of micro lenses (31) are arranged on the top of the color filter film (3); The glass cover plate (16) is a flat glass panel, and the color filter film (3), cathode layer (18) and spacer filling layer (19) are all laminated and covered on the bottom of the glass cover plate (16).

2. The top-emitting panel structure encapsulated by hard plate glass according to claim 1, characterized in that: The height between the bottom plane edge of the color filter film (3) and the cathode layer (18) is h, the thickness of the cathode layer (18) is h1, and the thickness of the organic vapor deposition layer (17) is h2; And h>h1+h2; The four edges of the glass cover plate (16) are tightly attached to the glass substrate (1), and the glass substrate (1) and the glass cover plate (16) are bonded together by glass powder glue (111); The thickness between the glass substrate (1) and the glass cover plate (16) is w The thickness of the glass powder glue (111) is d, and d=h1+h2.

3. The top-emitting panel structure encapsulated by hard plate glass according to claim 1, characterized in that: The width L2 of the color filter film (3) is greater than the width L1 of the opening between the pixel definition layers.

4. The top-emitting panel structure encapsulated by hard plate glass according to claim 1, characterized in that: Two adjacent microlenses (31) do not interfere with each other.

5. The top-emitting panel structure encapsulated by hard plate glass according to claim 2, characterized in that: The spacer filling layer (19) is sealed between the glass substrate (1) and the glass cover plate (16); The spacer filling layer (19) is filled with nitrogen or argon.

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