Laser tin soldering device for FPC flexible flat cable of optical module

Abstract

According to the laser tin soldering device for the FPC flexible flat cable of the optical module, when the PCB, the FPC flexible flat cable and the optical device are mutually welded, the PCB, the FPC flexible flat cable and the optical device are fixed to the base, the corresponding overturning assemblies are arranged at the two ends of the base, the FPC flexible flat cable and the PCB which are fixed to the base are pressed through the overturning assemblies, and therefore the PCB and the FPC flexible flat cable are fixed to the base. The FPC flexible flat cable is tightly attached to the PCB and the optical device, so that the welding effectiveness and stability are ensured while efficient welding is performed.

Description

Technical Field

[0001] The utility model relates to the technical field of optical device production and processing, and in particular to an optical module FPC soft flat cable laser soldering device. Background Art

[0002] With the miniaturization of optical modules, the integration of optical devices is getting higher and higher, and the integration density of the internal circuits of optical devices is even higher. In order to connect the printed circuit board (PCB) with each optical device, a flexible printed circuit (FPC) cable is usually used for welding connection between the optical device and the PCB board to meet the requirements of photoelectric conduction. At the same time, it also puts forward higher requirements on the accuracy and consistency of the welding position.

[0003] Based on the above requirements, when soldering PCB boards, FPC flexible cables and optical devices, it is difficult to effectively and efficiently fit the corresponding joint parts tightly together, and it is difficult to ensure the stability and effectiveness of the soldering.

[0004] In view of this, overcoming the defects of the prior art is an urgent problem to be solved in the field of this technology. Utility Model Content

[0005] The problem to be solved by the utility model is how to ensure the effectiveness and stability of welding while performing high-efficiency welding on a PCB board, an FPC flexible flat cable and an optical device.

[0006] In a first aspect, a laser soldering device for an optical module FPC flexible flat cable is provided, comprising: a base 1, a first flip assembly 2, and a second flip assembly 3, wherein:

[0007] The first flip assembly 2 is axially connected to one end of the base 1; the second flip assembly 3 is axially connected to the other end of the base 1;

[0008] The base 1 is used to set a PCB board 4, at least two FPC flexible flat cables 5 and at least two optical devices 6, the PCB board 4 is butted with one end of all the FPC flexible flat cables 5, and each optical device 6 is butted with the other end of each FPC flexible flat cable 5;

[0009] When the first flip assembly 2 flips toward the inside of the base 1 and is fixedly docked with the base 1, the first flip assembly 2 is pressed on the FPC flexible cable 5 and the optical device 6;

[0010] When the second flip assembly 3 flips toward the inside of the base 1 and is fixedly docked with the base 1 , the second flip assembly 3 is pressed onto the PCB board 4 .

[0011] Preferably, a positioning block 11 is provided on the base 1, and a first positioning groove 111 and a second positioning groove 112 are provided on the positioning block 11;

[0012] The first positioning groove 111 and the second positioning groove 112 are both used to set the corresponding FPC flexible cable 5 .

[0013] Preferably, a first profiling groove 12 and a second profiling groove 13 are provided on one side of the positioning block 11;

[0014] The first profiling groove 12 corresponds to the first positioning groove 111, and the second profiling groove 13 corresponds to the second positioning groove 112;

[0015] The first profiling groove 12 and the second profiling groove 13 are both used to set corresponding optical devices 6. The optical device 6 in the first profiling groove 12 is connected to the FPC flexible cable 5 in the first positioning groove 111, and the optical device 6 in the second profiling groove 13 is connected to the FPC flexible cable 5 in the second positioning groove 112.

[0016] Preferably, a plurality of limit platforms 14 are arranged on the other side of the positioning block 11, and each two limit platforms 14 form a group and are arranged side by side, and the connecting lines between different groups of limit platforms 14 are parallel to each other;

[0017] The PCB board 4 is disposed on the limiting platform 14 , and the limiting platform 14 limits the PCB board 4 .

[0018] Preferably, the first flip assembly 2 comprises: a first flip arm 21, a second flip arm 22, a first pressing piece 23 and a second pressing piece 24, and a first rotating shaft seat 15 is disposed at one end of the base 1;

[0019] The first rotating shaft seat 15 is axially connected to one end of the first flip arm 21 and one end of the second flip arm 22 respectively;

[0020] The first pressing piece 23 is disposed at the other end of the first flip arm 21, and the second pressing piece 24 is disposed at the other end of the second flip arm 22;

[0021] When the first flip arm 21 flips toward the inside of the base 1 and is fixedly docked with the base 1, the first pressing piece 23 is pressed on the optical device 6 and the FPC flexible flat cable 5, and the front end of the first pressing piece 23 is pressed on the docking position between the FPC flexible flat cable 5 and the PCB board 4;

[0022] When the second flip arm 22 flips toward the inside of the base 1 and is docked and fixed with the base 1, the second clamping plate 24 is pressed on the optical device 6 and the FPC flexible cable 5, and the front end of the second clamping plate 24 is pressed on the docking position between the FPC flexible cable 5 and the PCB board 4.

[0023] Preferably, the first pressing piece 23 and the second pressing piece 24 are both provided with welding holes 25;

[0024] When the first flip arm 21 flips toward the inside of the base 1 and is fixedly docked with the base 1, the welding hole 25 of the first pressing piece 23 is located in the middle of the upper end of the first profiling groove 12, and the first pressing piece 23 around the welding hole 25 is pressed on the outer ring position of the upper end of the optical device 6;

[0025] When the second flip arm 22 flips toward the inside of the base 1 and is docked and fixed with the base 1, the welding hole 25 of the second clamping plate 24 is located in the middle position of the upper end of the second contoured groove 13, and the second clamping plate 24 around the welding hole 25 is pressed on the outer ring position of the upper end of the optical device 6.

[0026] Preferably, both sides of the front end of the first pressing piece 23 and both sides of the front end of the second pressing piece 24 are provided with avoidance notches 26;

[0027] The avoidance notch 26 of the first pressing piece 23 is used to expose the welding position between the FPC flexible flat cable 5 and the PCB board 4 on the first positioning groove 111;

[0028] The avoidance notch 26 of the second pressing piece 24 is used to expose the welding position between the FPC flexible flat cable 5 and the PCB board 4 on the second positioning groove 112 .

[0029] Preferably, a first magnetic sheet 211 is disposed inside the first flip arm 21, and a second magnetic sheet 221 is disposed inside the second flip arm 22;

[0030] The base 1 is provided with a third magnetic sheet 16 and a fourth magnetic sheet 17, the projection position of the first magnetic sheet 211 on the base 1 at least partially overlaps with the position where the third magnetic sheet 16 is located, and the projection position of the second magnetic sheet 221 on the base 1 at least partially overlaps with the position where the fourth magnetic sheet 17 is located;

[0031] When the first flip arm 21 flips toward the inside of the base 1, the first magnetic sheet 211 and the third magnetic sheet 16 are correspondingly adsorbed to fix the first flip arm 21 on the base 1;

[0032] When the second flip arm 22 flips toward the inside of the base 1 , the second magnetic sheet 221 and the fourth magnetic sheet 17 are attracted to each other to fix the second flip arm 22 on the base 1 .

[0033] Preferably, the second flip assembly 3 comprises: a third flip arm 31 and a third pressing sheet 32, and the other end of the base 1 is provided with a second rotating shaft seat 18;

[0034] The second rotating shaft seat 18 is axially connected to one end of the third flip arm 31;

[0035] The third pressing piece 32 is disposed at the other end of the third flip arm 31;

[0036] When the third turning arm 31 turns toward the inner side of the base 1 and is fixedly docked with the base 1 , the third pressing piece 32 is pressed on the PCB board 4 .

[0037] Preferably, a fifth magnetic sheet 311 and a sixth magnetic sheet 312 are disposed inside the third flip arm 31;

[0038] The base 1 is provided with a seventh magnetic sheet 19 and an eighth magnetic sheet 10, the projection position of the fifth magnetic sheet 311 on the base 1 at least partially overlaps with the position where the seventh magnetic sheet 19 is located, and the projection position of the sixth magnetic sheet 312 on the base 1 at least partially overlaps with the position where the eighth magnetic sheet 10 is located;

[0039] When the third flip arm 31 flips toward the inside of the base 1 and is fixedly docked with the base 1 , the fifth magnetic piece 311 and the seventh magnetic piece 19 are adsorbed correspondingly, and the sixth magnetic piece 312 and the eighth magnetic piece 10 are adsorbed correspondingly, so as to fix the third flip arm 31 on the base 1 .

[0040] The utility model provides an optical module FPC flexible flat cable laser soldering device. When a PCB board 4, an FPC flexible flat cable 5 and an optical device 6 are soldered to each other, the PCB board 4, the FPC flexible flat cable 5 and the optical device 6 are fixed on a base 1. Corresponding flip components are provided at both ends of the base 1. The FPC flexible flat cable 5 and the PCB board 4 fixed on the base 1 are pressed by the flip components, so that the FPC flexible flat cable 5 is tightly fitted with the PCB board 4 and the optical device 6, thereby ensuring the effectiveness and stability of welding while achieving efficient welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0042] Figure 1 A schematic diagram of the structure of a laser soldering device for an optical module FPC flexible flat cable provided in an embodiment of the utility model;

[0043] Figure 2 A schematic diagram of the structure of an optical module FPC flexible flat cable laser soldering device provided by an embodiment of the utility model with the flip component hidden;

[0044] Figure 3 A schematic diagram of the structure of an optical module FPC flexible flat cable laser soldering device provided by an embodiment of the utility model, with the FPC flexible flat cable, optical components and a pressing sheet hidden;

[0045] Figure 4 A schematic diagram of the structure of a laser soldering device for an optical module FPC flexible flat cable provided in an embodiment of the utility model;

[0046] Figure 5 A schematic diagram of the structure of a first flip assembly and a first rotating shaft seat in a laser soldering device for an optical module FPC flexible flat cable provided by an embodiment of the utility model;

[0047] Figure 6 A schematic diagram of the structure of a first flip arm in a laser soldering device for an optical module FPC flexible flat cable provided by an embodiment of the utility model;

[0048] Figure 7 A schematic diagram of the structure of a second flip arm in a laser soldering device for an optical module FPC flexible flat cable provided by an embodiment of the utility model;

[0049] Figure 8 A schematic diagram of the structure of an optical module FPC flexible flat cable laser soldering device provided by an embodiment of the utility model with some components hidden;

[0050] Fig. 9 A schematic diagram of the structure of another optical module FPC flexible cable laser soldering device provided in an embodiment of the utility model;

[0051] Fig.10 A schematic diagram of the structure of another optical module FPC flexible flat cable laser soldering device provided by an embodiment of the utility model with some components hidden;

[0052] Fig.11A schematic diagram of the structure of a third flip arm in another optical module FPC flexible flat cable laser soldering device provided by an embodiment of the utility model;

[0053] The accompanying drawings are numbered as follows:

[0054] Base 1; positioning block 11; first positioning groove 111; second positioning groove 112; first profiling groove 12; second profiling groove 13; limiting platform 14; first rotating shaft seat 15; third magnetic sheet 16; fourth magnetic sheet 17; second rotating shaft seat 18; seventh magnetic sheet 19; eighth magnetic sheet 10; first flip assembly 2; first flip arm 21; first magnetic sheet 211; second flip arm 22; second magnetic sheet 221; first clamping sheet 23; second clamping sheet 24; welding hole 25; avoidance gap 26; second flip assembly 3; third flip arm 31; fifth magnetic sheet 311; sixth magnetic sheet 312; third clamping sheet 32; PCB board 4; FPC flexible cable 5; optical device 6. DETAILED DESCRIPTION

[0055] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0056] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0057] In the description of the present utility model, the terms "first" and "second" are used for descriptive purposes only, and shall not be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of "multiple" is two or more. In addition, for example, the description may also use the method of adding "A" and "B" at the end to describe the same type of nouns as two independent individuals. In this case, the corresponding features defined as "A" and "B" are only used to distinguish the same type of individuals for description purposes, and shall not be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.

[0058] When describing some embodiments, the expressions "coupling", "coupling" and "connection" and their derivatives may be used. For example, when describing some embodiments, the term "connection" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupling" may be used to indicate that two or more components are in direct physical or electrical contact. However, the terms "connection" or "coupling" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other, such as "optical path coupling", "wireless connection", etc. The embodiments disclosed here are not necessarily limited to the contents of the present utility model.

[0059] In the description of the present utility model, "A and / or B" will be involved, wherein A and B are used to formally represent specific characteristic contents, and the corresponding expressions include the following three combinations: only A, only B, and a combination of A and B.

[0060] As used herein, “about,” “substantially,” or “approximately” includes the stated value and an average value that is within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity, i.e., the limitations of the measurement system.

[0061] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open inclusion, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner, that is, although they may be carried in the embodiments or examples of the above terms due to reasons such as the order and position of appearance, it is not limited to that they can be carried in combination by one embodiment or example.

[0062] In addition, the technical features involved in each embodiment of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0063] Embodiment 1:

[0064] Embodiment 1 of the present utility model provides a laser soldering device for an optical module FPC flexible flat cable, such as Figure 1 As shown, it includes: a base 1, a first flip assembly 2 and a second flip assembly 3, wherein:

[0065] like Figure 1 and Figure 2 As shown, the first flip assembly 2 is axially connected to one end of the base 1; the second flip assembly 3 is axially connected to the other end of the base 1; the base 1 is used to set a PCB board 4, at least two FPC flexible cables 5 and at least two optical devices 6, the PCB board 4 is connected to one end of all the FPC flexible cables 5, and each optical device 6 is connected to the other end of each FPC flexible cable 5.

[0066] like Figure 1 and Figure 2 As shown, the first flip component 2 is axially connected to one end of the base 1, which means that the first flip component 2 can be flipped with one end of the base 1 as the axis; the second flip component 3 is axially connected to the other end of the base 1, which means that the second flip component 3 can be flipped with the other end of the base 1 as the axis. Figure 1 The arrows in the figure represent the flipping directions of the first flipping assembly 2 and the second flipping assembly 3 .

[0067] like Figure 1 and Figure 2 As shown, in this embodiment, the optical module FPC flexible cable laser soldering device is used to set the PCB board 4, the FPC flexible cable 5 and the optical device 6 on the base 1, and while the PCB board 4, the FPC flexible cable 5 and the optical device 6 are limited and fixed, the PCB board 4 and one end of the FPC flexible cable 5 are connected to each other, and the other end of the FPC flexible cable 5 is connected to the optical device 6, and at the same time, the docking positions between the PCB board 4, the FPC flexible cable 5 and the optical device 6 are welded.

[0068] During the welding process, the PCB board 4, the FPC flexible cable 5 and the optical device 6 need to be closely connected with each other to ensure the welding effect. Therefore, the following designs are involved in this embodiment: Figure 1 and Figure 2 As shown, when the first flip assembly 2 is flipped toward the inner side of the base 1 and fixedly docked with the base 1 , the first flip assembly 2 is pressed on the FPC flexible cable 5 and the optical device 6 .

[0069] like Figure 1 and Figure 2As shown, when the PCB board 4, the FPC flexible cable 5 and the optical device 6 are connected to each other, the lower surface of one end of the FPC flexible cable 5 needs to be connected to the upper surface of one end of the PCB board 4, and the lower surface of the other end of the FPC flexible cable 5 needs to be connected to the upper surface of the optical device 6. Therefore, in this embodiment, the first flip component 2 is flipped toward the inner side of the base 1 and covered on the corresponding position on the FPC flexible cable 5. At this time, the first flip component 2 is fixed on the base 1, which can suppress the upper surface of the FPC flexible cable 5. The FPC flexible cable 5 is subjected to a downward pressing force, while the PCB board 4 and the optical device 6 on the lower surface of the FPC flexible cable 5 are subjected to an upward supporting force from the base 1, so that the docking position between the FPC flexible cable 5 and the PCB board 4 and the docking position between the FPC flexible cable 5 and the optical device 6 are more closely fitted, thereby ensuring the stability of subsequent welding.

[0070] It is worth mentioning that, in the present embodiment, the welding method between the PCB board 4, the FPC flexible flat cable 5 and the optical device 6 can be laser soldering; and in the present embodiment, the PCB board 4 needs to be docked with at least two FPC flexible flat cables 5 at the same time, and each FPC flexible flat cable 5 corresponds to being docked with one optical device 6.

[0071] Accordingly, since the FPC flexible flat cable 5 is only connected to one end of the PCB board 4, when the first flip assembly 2 presses the FPC flexible flat cable 5 downward, one end of the PCB board 4 will receive a downward force, which may cause the other end of the PCB board 4 to warp up, so it is necessary to press the other end of the PCB board 4. Therefore, this embodiment also involves the following design:

[0072] like Figure 1 and Figure 2 As shown, when the second flip assembly 3 flips toward the inside of the base 1 and is docked and fixed with the base 1 , the second flip assembly 3 is pressed on the PCB board 4 .

[0073] The PCB board 4 is pressed by the second flip assembly 3 so that the PCB board 4 as a whole can be pressed on the base 1 , thereby ensuring stable connection between the PCB board 4 and the FPC flexible cable 5 .

[0074] In this embodiment, when the PCB board 4, the FPC flexible cable 5 and the optical device 6 are welded to each other, the PCB board 4, the FPC flexible cable 5 and the optical device 6 are fixed on the base 1, and corresponding flip components are provided at both ends of the base 1. The FPC flexible cable 5 and the PCB board 4 fixed on the base 1 are pressed by the flip components, so that the FPC flexible cable 5 fits tightly with the PCB board 4 and the optical device 6, thereby ensuring the effectiveness and stability of welding while achieving efficient welding.

[0075] In this embodiment, since the lower surfaces of both ends of the FPC flexible flat cable 5 need to be connected to the PCB board 4 and the optical device 6, the FPC flexible flat cable 5 is fixedly arranged on the base 1, and a certain space needs to be reserved under both ends of the FPC flexible flat cable 5 to accommodate the PCB board 4 and the optical device 6. Therefore, this embodiment also involves the following designs: Figure 2 and Figure 3 As shown, a positioning block 11 is disposed on the base 1 , and a first positioning groove 111 and a second positioning groove 112 are disposed on the positioning block 11 ; the first positioning groove 111 and the second positioning groove 112 are both used to set the corresponding FPC flexible cable 5 .

[0076] In this embodiment, the first positioning groove 111 and the second positioning groove 112 are arranged side by side on the positioning block 11, and the width of the first positioning groove 111 and the second positioning groove 112 is slightly larger than the width of the middle position of the FPC flexible flat cable 5. The first positioning groove 111 and the second positioning groove 112 are both used to accommodate the middle position of the FPC flexible flat cable 5. The two ends of the FPC flexible flat cable 5 extend from the two sides of the positioning block 11 to be connected to the optical device 6 and the PCB board 4 respectively.

[0077] Correspondingly, for the position limiting and fixing of the optical device 6 on the base 1, this embodiment also involves the following designs: Figure 2 and Figure 3 As shown, a first profiling groove 12 and a second profiling groove 13 are provided on one side of the positioning block 11 on the base 1; the first profiling groove 12 corresponds to the first positioning groove 111, and the second profiling groove 13 corresponds to the second positioning groove 112.

[0078] The first profiling groove 12 and the second profiling groove 13 are both used to set corresponding optical devices 6. The optical device 6 in the first profiling groove 12 is connected to the FPC flexible cable 5 in the first positioning groove 111, and the optical device 6 in the second profiling groove 13 is connected to the FPC flexible cable 5 in the second positioning groove 112.

[0079] In this embodiment, the first profiling groove 12 and the second profiling groove 13 both pass through the base 1, and the optical device 6 is arranged in the corresponding first profiling groove 12 or the second profiling groove 13, and the upper end portion of the optical device 6 is exposed from above the profiling groove for docking with the lower surface of one end of the corresponding FPC soft cable 5.

[0080] Correspondingly, for the position limiting and fixing of the PCB board 4 on the base 1, this embodiment also involves the following designs: Figure 2 and Figure 3As shown, a plurality of limit platforms 14 are arranged on the other side of the positioning block 11, and each two limit platforms 14 form a group and are arranged side by side, and the connecting lines between different groups of limit platforms 14 are parallel to each other; the PCB board 4 is arranged on the limit platform 14, and the limit platform 14 limits the PCB board 4.

[0081] In this embodiment, since the chip routing on the surface of the PCB board 4 is complex and the surface is uneven, the PCB board 4 cannot be directly attached and fixed on the upper surface of the base 1. Therefore, in this embodiment, the PCB board 4 is fixed at a certain height by a plurality of limit platforms 14. In this embodiment, the limit platforms 14 can be the following two structures:

[0082] One of the upper ends of the limiting platforms 14 is provided with abutment grooves, and the edge positions on both sides of the PCB board 4 are respectively arranged in a group of abutment grooves of the limiting platforms 14, so as to limit and fix the PCB board 4 at a certain height position.

[0083] The lower end of another limiting platform 14 is a base, and a cylindrical platform is arranged on the base. The two side edges of the PCB board 4 are provided with holes matching the cylindrical platform, and the holes are sleeved on the circumference of the cylindrical platform. The lower surface of the circumference of the hole is supported by the upper surface of the base, so that the PCB board 4 is limited and fixed at a certain height position.

[0084] Furthermore, the gold finger portion of the PCB board 4 is relatively flat, and corresponding support platforms can be provided at corresponding positions of the gold fingers of the PCB board 4 on the base 1 for support, so that the overall limiting fixation of the PCB board 4 is more stable.

[0085] In this embodiment, since the number of the FPC flexible cable 5 and the optical device 6 is more than one, and the docking positions between the FPC flexible cable 5 and the optical device 6, and between the flexible cable 5 and the PCB board 4 are also different, the corresponding structural design of the first flip assembly 2 is required to take into account the above problems at the same time. Therefore, this embodiment also involves the following designs: Figure 4 As shown, the first flip assembly 2 includes: a first flip arm 21, a second flip arm 22, a first pressing piece 23 and a second pressing piece 24. A first rotating shaft seat 15 is disposed at one end of the base 1; the first rotating shaft seat 15 is axially connected to one end of the first flip arm 21 and one end of the second flip arm 22. The first pressing piece 23 is disposed at the other end of the first flip arm 21, and the second pressing piece 24 is disposed at the other end of the second flip arm 22.

[0086] In this embodiment, two shaft grooves are provided on the first shaft seat 15, and the two shaft grooves can be connected by a shaft. The first flip arm 21 and the second flip arm 22 are connected to the shaft through different bearing sleeves to realize asynchronous rotation of the first flip arm 21 and the second flip arm 22, making actual operation more convenient.

[0087] In this embodiment, the first flip arm 21 and the second flip arm 22 are further provided with corresponding handles extending toward both sides of the base 1 for facilitating manual flipping operations on the first flip arm 21 and the second flip arm 22 .

[0088] Since the first flip arm 21 and the second flip arm 22 need to be axially connected and docked with the first rotating shaft seat 15, and also need to be docked and fixed with the surface of the base 1 later, there are certain requirements for the thickness of the first flip arm 21 and the second flip arm 22, so the first flip arm 21 and the second flip arm 22 are not convenient for pressing the FPC soft flat cable 5; on the other hand, since the temperature of laser welding is relatively high, in order to prevent the laser from irradiating the parts that do not need to be welded during the welding process and causing damage to the surfaces of these parts, it is also necessary to cover the parts of the PCB board 4, the FPC soft flat cable 5 and the optical device 6 that do not need to be welded; therefore, in this embodiment, corresponding compression plates are correspondingly arranged at the front ends of the first flip arm 21 and the second flip arm 22, which are used to press the FPC soft flat cable 5 and protect the surfaces of part of the PCB board 4, the FPC soft flat cable 5 and the optical device 6.

[0089] In this embodiment, the first pressing piece 23 can be set on the corresponding first flip arm 21 by screws, and the second pressing piece 24 can be set on the corresponding second flip arm 22 by screws.

[0090] like Figure 3 and Figure 4 As shown, when the first flip arm 21 flips toward the inside of the base 1 and is docked and fixed with the base 1, the first clamping plate 23 is pressed on the optical device 6 and the FPC flexible cable 5, and the front end of the first clamping plate 23 is pressed on the docking position between the FPC flexible cable 5 and the PCB board 4.

[0091] The first pressing sheet 23 is used to press the docking position between the FPC flexible flat cable 5 and the optical device 6. The first pressing sheet 23 is also used to cover the FPC flexible flat cable 5 in the first positioning groove 111 to prevent the FPC flexible flat cable 5 at the position of the first positioning groove 111 from being damaged by laser irradiation.

[0092] like Figure 3 and Figure 4As shown, when the second flip arm 22 flips toward the inside of the base 1 and is docked and fixed with the base 1, the second clamping plate 24 is pressed on the optical device 6 and the FPC flexible cable 5, and the front end of the second clamping plate 24 is pressed on the docking position between the FPC flexible cable 5 and the PCB board 4.

[0093] The second pressing sheet 24 is used to press the docking position between the FPC flexible flat cable 5 and the optical device 6. The second pressing sheet 24 is also used to cover the FPC flexible flat cable 5 in the second positioning groove 112 to prevent the FPC flexible flat cable 5 at the position of the second positioning groove 112 from being damaged by laser irradiation.

[0094] Through the design of the first pressing piece 23 and the second pressing piece 24, the FPC flexible flat cable 5 and the corresponding docking position can be pressed, and at the same time, the part that does not need to be welded can be covered and protected.

[0095] On the other hand, for the positions on the FPC flexible flat cable 5 that need to be welded, corresponding notches need to be provided on the corresponding pressing sheets so that these positions are exposed for welding, while other parts should be used for pressing and shielding protection. Therefore, this embodiment also involves the following designs: Figure 4 and Figure 5 As shown, welding holes 25 are provided on the first pressing piece 23 and the second pressing piece 24 .

[0096] like Figure 4 and Figure 5 As shown, when the first flip arm 21 flips toward the inside of the base 1 and is docked and fixed with the base 1, the welding hole 25 of the first clamping plate 23 is located in the middle position of the upper end of the first contoured groove 12, and the first clamping plate 23 around the welding hole 25 is pressed on the outer ring position of the upper end of the optical device 6.

[0097] like Figure 4 and Figure 5 As shown, when the second flip arm 22 is flipped toward the inside of the base 1 and docked and fixed with the base 1, the welding hole 25 of the second clamping plate 24 is located in the middle position of the upper end of the second contoured groove 13, and the second clamping plate 24 around the welding hole 25 is pressed on the outer ring position of the upper end of the optical device 6.

[0098] In this embodiment, since the position where the FPC flexible cable 5 and the optical device 6 are connected and need to be welded is located in the middle area of ​​the profiling groove, the first clamping sheet 23 in this embodiment has a welding hole 25 in the middle area of ​​the corresponding first profiling groove 12, and the diameter of the welding hole 25 on the first clamping sheet 23 is smaller than the diameter of the first profiling groove 12; the second clamping sheet 24 has a welding hole 25 in the middle area of ​​the corresponding second profiling groove 13, and the diameter of the welding hole 25 on the second clamping sheet 24 is smaller than the diameter of the second profiling groove 13.

[0099] like Figure 4 and Figure 5 As shown, both sides of the front end of the first pressing piece 23 and both sides of the front end of the second pressing piece 24 are provided with avoidance notches 26 .

[0100] The avoidance notch 26 of the first pressing piece 23 is used to expose the welding position between the FPC flexible flat cable 5 and the PCB board 4 on the first positioning groove 111 .

[0101] The avoidance notch 26 of the second pressing piece 24 is used to expose the welding position between the FPC flexible flat cable 5 and the PCB board 4 on the second positioning groove 112 .

[0102] In this embodiment, the peripheral side of one end of the docking position between the FPC flexible cable 5 and the PCB board 4 needs to be welded, so the middle area of ​​the docking part between the FPC flexible cable 5 and the PCB board 4 needs to be suppressed, and the other areas can be exposed through the avoidance gaps 26 on both sides of the front end of the first clamping plate 23 or the second clamping plate 24.

[0103] In this embodiment, in order to ensure the fixation between the first flip arm 21 and the second flip arm 22 and the base 1, thereby ensuring the pressing strength, this embodiment is implemented by magnetic fixation, and the pressing strength is ensured without damaging each component. The relevant design is as follows:

[0104] like Figure 6-Figure 8 As shown, a first magnetic sheet 211 is arranged on the inner side of the first flip arm 21, and a second magnetic sheet 221 is arranged on the inner side of the second flip arm 22; a third magnetic sheet 16 and a fourth magnetic sheet 17 are arranged on the base 1, and the projection position of the first magnetic sheet 211 on the base 1 at least partially overlaps with the position where the third magnetic sheet 16 is located, and the projection position of the second magnetic sheet 221 on the base 1 at least partially overlaps with the position where the fourth magnetic sheet 17 is located.

[0105] like Figure 6-Figure 8 As shown, when the first flip arm 21 flips toward the inside of the base 1 , the first magnetic sheet 211 and the third magnetic sheet 16 are correspondingly adsorbed to fix the first flip arm 21 on the base 1 .

[0106] like Figure 6-Figure 8 As shown, when the second flip arm 22 flips toward the inside of the base 1 , the second magnetic sheet 221 and the fourth magnetic sheet 17 are correspondingly adsorbed to fix the second flip arm 22 on the base 1 .

[0107] Similar to the first flip assembly 2, the related structure design of the second flip assembly 3 is as follows: Fig. 9As shown, the second flip assembly 3 includes: a second rotating shaft seat 18, a third flip arm 31 and a third pressing piece 32, wherein the second rotating shaft seat 18 is arranged at the other end of the base 1; the second rotating shaft seat 18 is axially connected with one end of the third flip arm 31; and the third pressing piece 32 is arranged at the other end of the third flip arm 31. When the third flip arm 31 flips toward the inner side of the base 1 and is fixedly docked with the base 1, the third pressing piece 32 is pressed on the PCB board 4.

[0108] In this embodiment, a rotating shaft groove is provided on the second rotating shaft seat 18, and a rotating shaft is provided in the rotating shaft groove. The third flip arm 31 is sleeved on the rotating shaft to realize the rotation of the third flip arm 31; further, the third flip arm 31 is also extended with corresponding handles on both sides of the base 1 to facilitate manual flipping operation of the third flip arm 31.

[0109] Since the third flip arm 31 needs to be connected and docked with the first rotating shaft seat 15, and needs to be docked and fixed with the surface of the base 1 later, there are certain requirements for the thickness of the third flip arm 31, so the third flip arm 31 is not convenient for pressing the FPC soft flat cable 5; on the other hand, due to the high temperature of laser welding, in order to prevent the laser from irradiating the parts of the PCB board 4 that do not need to be welded during the welding process, thereby causing damage to the surface of these parts, it is also necessary to cover the parts of the PCB board 4 that do not need to be welded; therefore, in this embodiment, a corresponding pressing piece is correspondingly arranged at the front end of the third flip arm 31, which is used to press the PCB board 4 and protect part of the surface of the PCB board 4. The third pressing piece 32 can be set on the corresponding third flip arm 31 by screws.

[0110] In this embodiment, in order to ensure the fixation between the third flip arm 31 and the base 1, thereby ensuring the pressing strength, this embodiment is implemented by magnetic fixation, which ensures the pressing strength without damaging each component. The relevant design is as follows: Fig.10 and Fig.11 As shown, a fifth magnetic piece 311 and a sixth magnetic piece 312 are arranged on the inner side of the third flip arm 31; a seventh magnetic piece 19 and an eighth magnetic piece 10 are arranged on the base 1, and the projection position of the fifth magnetic piece 311 on the base 1 at least partially overlaps with the position where the seventh magnetic piece 19 is located, and the projection position of the sixth magnetic piece 312 on the base 1 at least partially overlaps with the position where the eighth magnetic piece 10 is located.

[0111] When the third flip arm 31 flips toward the inside of the base 1 and is fixedly docked with the base 1 , the fifth magnetic piece 311 and the seventh magnetic piece 19 are adsorbed correspondingly, and the sixth magnetic piece 312 and the eighth magnetic piece 10 are adsorbed correspondingly, so as to fix the third flip arm 31 on the base 1 .

[0112] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A laser soldering device for optical module FPC flexible cable, characterized in that: include: A base (1), a first flip assembly (2) and a second flip assembly (3), wherein: The first flip assembly (2) is axially connected to one end of the base (1); the second flip assembly (3) is axially connected to the other end of the base (1); The base (1) is used to arrange a PCB board (4), at least two FPC flexible flat cables (5) and at least two optical devices (6); the PCB board (4) is butt-jointed with one end of all the FPC flexible flat cables (5), and each optical device (6) is butt-jointed with the other end of each FPC flexible flat cable (5); When the first flip assembly (2) flips toward the inside of the base (1) and is docked and fixed with the base (1), the first flip assembly (2) is pressed onto the FPC flexible cable (5) and the optical device (6); When the second flip assembly (3) flips toward the inside of the base (1) and is docked and fixed with the base (1), the second flip assembly (3) is pressed onto the PCB board (4).

2. According to claim 1, the optical module FPC flexible cable laser soldering device is characterized in that: The base (1) is provided with a positioning block (11), and the positioning block (11) is provided with a first positioning groove (111) and a second positioning groove (112); The first positioning groove (111) and the second positioning groove (112) are both used to arrange the corresponding FPC flexible flat cable (5).

3. According to claim 2, the optical module FPC flexible cable laser soldering device is characterized in that: A first profiling groove (12) and a second profiling groove (13) are provided on one side of the positioning block (11); The first profiling groove (12) and the first positioning groove (111) correspond in position, and the second profiling groove (13) and the second positioning groove (112) correspond in position; The first profiling groove (12) and the second profiling groove (13) are both used to arrange corresponding optical devices (6); the optical device (6) in the first profiling groove (12) and the FPC flexible flat cable (5) in the first positioning groove (111) are connected to each other, and the optical device (6) in the second profiling groove (13) and the FPC flexible flat cable (5) in the second positioning groove (112) are connected to each other.

4. According to claim 2, the optical module FPC flexible cable laser soldering device is characterized in that: A plurality of limit platforms (14) are arranged on the other side of the positioning block (11), with each two limit platforms (14) forming a group and arranged side by side, and the connecting lines between different groups of limit platforms (14) being parallel to each other; The PCB board (4) is arranged on the limiting platform (14), and the limiting platform (14) limits the position of the PCB board (4).

5. According to claim 3, the laser soldering device for optical module FPC flexible cable is characterized in that: The first flip assembly (2) comprises: a first flip arm (21), a second flip arm (22), a first pressing plate (23) and a second pressing plate (24); a first rotating shaft seat (15) is provided at one end of the base (1); The first rotating shaft seat (15) is axially connected to one end of the first flip arm (21) and one end of the second flip arm (22); The first pressing piece (23) is arranged at the other end of the first flip arm (21), and the second pressing piece (24) is arranged at the other end of the second flip arm (22); When the first flip arm (21) flips toward the inside of the base (1) and is docked and fixed with the base (1), the first pressing piece (23) is pressed onto the optical device (6) and the FPC flexible flat cable (5), and the front end of the first pressing piece (23) is pressed onto the docking position between the FPC flexible flat cable (5) and the PCB board (4); When the second flip arm (22) flips toward the inside of the base (1) and is docked and fixed with the base (1), the second pressing piece (24) is pressed onto the optical device (6) and the FPC flexible flat cable (5), and the front end of the second pressing piece (24) is pressed onto the docking position between the FPC flexible flat cable (5) and the PCB board (4).

6. The optical module FPC flexible cable laser soldering device according to claim 5, characterized in that: The first pressing piece (23) and the second pressing piece (24) are both provided with welding holes (25); When the first flip arm (21) flips toward the inside of the base (1) and is docked and fixed with the base (1), the welding hole (25) of the first pressing piece (23) is located at the middle position of the upper end of the first contoured groove (12), and the first pressing piece (23) around the welding hole (25) is pressed at the outer ring position of the upper end of the optical device (6); When the second flip arm (22) flips toward the inside of the base (1) and is docked and fixed with the base (1), the welding hole (25) of the second pressing piece (24) is located in the middle of the upper end of the second contoured groove (13), and the second pressing piece (24) around the welding hole (25) is pressed on the outer ring position of the upper end of the optical device (6).

7. The optical module FPC flexible cable laser soldering device according to claim 5, characterized in that: Both sides of the front end of the first pressing piece (23) and both sides of the front end of the second pressing piece (24) are provided with avoidance notches (26); The avoidance notch (26) of the first pressing sheet (23) is used to expose the welding position between the FPC flexible flat cable (5) on the first positioning groove (111) and the PCB board (4); The avoidance notch (26) of the second pressing sheet (24) is used to expose the welding position between the FPC flexible flat cable (5) on the second positioning groove (112) and the PCB board (4).

8. The optical module FPC flexible cable laser soldering device according to claim 5, characterized in that: A first magnetic sheet (211) is arranged on the inner side of the first flip arm (21), and a second magnetic sheet (221) is arranged on the inner side of the second flip arm (22); A third magnetic sheet (16) and a fourth magnetic sheet (17) are arranged on the base (1), the projection position of the first magnetic sheet (211) on the base (1) at least partially overlaps with the position of the third magnetic sheet (16), and the projection position of the second magnetic sheet (221) on the base (1) at least partially overlaps with the position of the fourth magnetic sheet (17); When the first flip arm (21) flips toward the inside of the base (1), the first magnetic sheet (211) and the third magnetic sheet (16) are correspondingly adsorbed to fix the first flip arm (21) on the base (1); When the second flip arm (22) flips toward the inside of the base (1), the second magnetic sheet (221) and the fourth magnetic sheet (17) are correspondingly adsorbed to fix the second flip arm (22) on the base (1).

9. The optical module FPC flexible cable laser soldering device according to claim 1, characterized in that: The second turning assembly (3) comprises: a third turning arm (31) and a third pressing plate (32); the other end of the base (1) is provided with a second rotating shaft seat (18); The second rotating shaft seat (18) is axially connected to one end of the third flip arm (31); The third pressing piece (32) is arranged at the other end of the third turning arm (31); When the third flip arm (31) flips toward the inside of the base (1) and is docked and fixed with the base (1), the third pressing piece (32) is pressed onto the PCB board (4).

10. The optical module FPC flexible cable laser soldering device according to claim 9, characterized in that: A fifth magnetic sheet (311) and a sixth magnetic sheet (312) are arranged inside the third flip arm (31); A seventh magnetic sheet (19) and an eighth magnetic sheet (10) are arranged on the base (1); a projection position of the fifth magnetic sheet (311) on the base (1) at least partially overlaps with a position where the seventh magnetic sheet (19) is located; and a projection position of the sixth magnetic sheet (312) on the base (1) at least partially overlaps with a position where the eighth magnetic sheet (10) is located; When the third flip arm (31) flips toward the inside of the base (1) and is docked and fixed with the base (1), the fifth magnetic sheet (311) and the seventh magnetic sheet (19) are adsorbed correspondingly, and the sixth magnetic sheet (312) and the eighth magnetic sheet (10) are adsorbed correspondingly, thereby fixing the third flip arm (31) on the base (1).

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