Precursor packaging container and vapor deposition system

Abstract

The utility model discloses a precursor packaging container which comprises a first cavity, a second cavity, a buffer cavity, an on-off control assembly and a charging and pumping assembly. The first cavity is used for containing a liquid precursor and a solid precursor, the first cavity is provided with a first gas inlet pipe and a first exhaust pipe, and carrier gas input by the first gas inlet pipe carries the liquid precursor, then is mixed with steam of the solid precursor and is exhausted through the first exhaust pipe; a first baffle is arranged between the second cavity and the first cavity, and the second cavity supplements the liquid precursor to the first cavity through the first baffle. According to the precursor packaging container, the buffer cavity and the second cavity are matched with the inflation and extraction assembly, so that the liquid precursor can be supplemented to the first cavity from the outside, the service life of the packaging container can be prolonged, the capacity of the liquid precursor in the container is kept to provide an enough contact path for carrier gas, the concentration of the precursor carried by the carrier gas is ensured, and the packaging efficiency is improved. A stable precursor source is provided for a subsequent vapor deposition process, and the deposition film forming quality is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of vapor deposition equipment, in particular to a precursor packaging container and a vapor deposition system. Background Art

[0002] Precursors are important raw materials for thin film deposition processes. They are used in vapor deposition to form various thin film layers that meet the requirements of semiconductor manufacturing. They are widely used in LEDs, new generation solar cells, phase change memories, semiconductor lasers, radio frequency integrated circuit chips and other fields.

[0003] Precursors are key materials for semiconductor chip manufacturing. Precursor purity, stability, vapor pressure and other factors directly affect the film quality. In addition to the factors of the precursor itself, the precursor is usually filled and packaged in a packaging container when in use, and then supplied to the vapor deposition equipment through the precursor packaging container. As the precursor in the cylinder is consumed, the contact area and path of the carrier gas through the precursor gradually decrease, affecting the concentration of the precursor carried by the carrier gas, causing serious process fluctuations, and thus affecting the quality of the vapor deposited film, and even eventually causing the performance of the semiconductor device to be scrapped. Therefore, after the precursor has been used for a certain period of time, the precursor packaging container needs to be replaced regularly. At the same time, as the precursor is consumed, the contact area and path of the carrier gas through the precursor gradually decrease, affecting the concentration of the precursor carried by the carrier gas, causing serious process fluctuations, and further affecting the quality of the vapor deposited film, and even eventually causing the performance of the semiconductor device to be scrapped. Therefore, after the precursor has been used for a certain period of time, the precursor packaging container needs to be replaced regularly. Competition in the semiconductor industry has intensified, the size of the reaction chamber of chemical vapor deposition equipment has continued to increase, and the amount of precursors consumed has also continued to increase, which has shortened the replacement cycle of the precursor packaging container and increased the replacement frequency, reducing the effective use time of the vapor deposition equipment, affecting production capacity, and increasing production costs. In addition, the precursor may also undergo changes in structure, composition, morphology, etc. in the packaging container, and there is a possibility of changes in the precursor performance, which may further affect the stability of the vapor deposition process and the performance of the product. Therefore, during the vapor deposition process, how to maintain the stability of the precursor vapor pressure and the stability of the precursor structure and performance is of great significance for the preparation of semiconductor materials by the vapor deposition process. Utility Model Content

[0004] The utility model aims to provide a precursor packaging container and a vapor deposition system, which are used to extend the service life of the packaging container, improve the equipment utilization rate, and provide stable precursor delivery.

[0005] The purpose of the utility model is achieved by the following technical solutions:

[0006] The present application provides a precursor packaging container, comprising:

[0007] A first cavity, the first cavity is used to accommodate a liquid precursor and a solid precursor, the first cavity has a first air inlet pipe and a first exhaust pipe, the carrier gas input by the first air inlet pipe carries the liquid precursor and then mixes with the vapor of the solid precursor and is discharged through the first exhaust pipe;

[0008] a second cavity, wherein a first baffle is disposed between the second cavity and the first cavity, and the second cavity replenishes the liquid precursor to the first cavity through the first baffle;

[0009] a buffer cavity, wherein a second baffle is disposed between the buffer cavity and the second cavity, and the buffer cavity is used to receive the liquid precursor and transport the liquid precursor to the second cavity through the second baffle;

[0010] An on-off control component, the on-off control component is used to control whether the buffer cavity receives the liquid precursor, the on-off between the second cavity and the buffer cavity, and the on-off between the second cavity and the first cavity;

[0011] The filling and pumping component is used to discharge the water vapor in the buffer cavity and fill it with inert gas before the liquid precursor enters the buffer cavity.

[0012] Preferably, the on-off control assembly comprises at least a first control valve, a second control valve and a third control valve;

[0013] The first control valve is disposed on the buffer cavity and is used to control the input of the liquid precursor into the buffer cavity. The external precursor supply device inputs the liquid precursor into the buffer cavity through the first control valve.

[0014] The second control valve is disposed on the second baffle plate and is used to control the liquid precursor to be input from the buffer cavity into the second cavity;

[0015] The third control valve is disposed on the first baffle plate, and is used to control the liquid precursor to be input from the second cavity into the first cavity.

[0016] Preferably, the charging and pumping assembly comprises at least a second air inlet pipe, a second air outlet pipe, an air pumping device and a gas supply device;

[0017] The second exhaust pipe and the second intake pipe are both arranged on the buffer cavity and communicate with the inside of the buffer cavity;

[0018] The air extraction device is arranged outside the buffer cavity and connected to the second exhaust pipe to exhaust water vapor inside the buffer cavity;

[0019] The gas supply device is disposed outside the buffer cavity and connected to the second gas inlet pipe to supply inert gas to the buffer cavity.

[0020] Preferably, the first cavity has a storage component, the storage component is located above the liquid precursor and is used to hold the solid precursor; and / or,

[0021] The first air inlet pipe and the first air outlet pipe penetrate through the wall of the first cavity and respectively have an outer end and an inner end, and the inner end of the first air inlet pipe is located in the liquid precursor.

[0022] Preferably, the storage component at least comprises a gas permeable plate arranged on the inner wall of the first cavity, and the gas permeable plate is used to hold the solid precursor;

[0023] The inner end of the first air inlet pipe passes through the air permeable plate; and / or,

[0024] The inner end of the first exhaust pipe is located above or below the air permeable plate.

[0025] Preferably, the storage component at least comprises a content box arranged on the inner wall of the first cavity, at least the bottom of the content box is arranged as a first air-permeable structure, and the interior of the content box is used to hold the solid precursor;

[0026] The inner end of the first exhaust pipe is located inside or outside the content box.

[0027] Preferably, the storage component at least comprises an external accommodating box arranged on the outer wall of the first cavity, and a side of the external accommodating box connected to the first cavity is arranged as a second air-permeable structure.

[0028] Preferably, the first cavity, the second cavity and the buffer cavity are arranged as an integrated structure; and / or,

[0029] The first cavity and the second cavity are arranged side by side, and the buffer cavity is located above the second cavity.

[0030] Preferably, the first air intake pipe, the first exhaust pipe, the second air intake pipe and the second exhaust pipe are all equipped with switch valves.

[0031] The present application also provides a vapor deposition system, comprising:

[0032] The precursor packaging container;

[0033] A carrier gas supply device, used to connect to the first air inlet pipe to supply carrier gas to the first cavity;

[0034] A vapor deposition device, used to connect to the first exhaust pipe to perform vapor deposition;

[0035] A precursor supply device, used for supplying a liquid precursor to the buffer chamber;

[0036] The monitoring and control device is electrically connected to the on-off control component, the filling and pumping component and the precursor supply device respectively and is used to monitor the residual amount of the liquid precursor in the first cavity.

[0037] Compared with the prior art, the beneficial effects of the utility model include at least:

[0038] The precursor packaging container can replenish the liquid precursor from the outside to the first cavity through the buffer cavity and the second cavity cooperating with the filling and pumping component, which can extend the service life of the packaging container, maintain the liquid precursor capacity inside the container to provide a sufficient contact path for the carrier gas, ensure the concentration of the precursor carried by the carrier gas, provide a stable source of precursor for the subsequent vapor deposition process, and ensure the quality of the deposited film. At the same time, according to the trend of the increasing size of the reaction chamber of the existing vapor deposition device, the packaging container can be replenished with liquid precursor in time to meet the normal operation of the vapor deposition device with a large-sized reaction chamber, reduce the replacement cycle and replacement frequency of the packaging container, and can supply the vapor deposition device for a long time, thereby increasing the effective use time of the vapor deposition device and improving the equipment utilization rate.

[0039] Furthermore, the packaging device adopts a setting that separates the solid precursor from the liquid precursor, which not only allows the solid precursor to provide sufficient solid precursor vapor to the liquid precursor to ensure the stability of the formed liquid precursor self-assembly compound, but also can replenish the liquid precursor to the first cavity through the buffer cavity and the second cavity, thereby avoiding the waste of solid precursor due to the need to replace the packaging device as a whole in advance due to insufficient liquid precursor residue. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 This is a schematic cross-sectional structure diagram of a precursor packaging container according to an embodiment of the utility model;

[0041] Figure 2 This is another schematic cross-sectional structure diagram of a precursor packaging container according to an embodiment of the utility model;

[0042] Figure 3 This is another schematic cross-sectional structure diagram of the precursor packaging container of an embodiment of the utility model.

[0043] In the figure:

[0044] 1. First cavity; 101. First air inlet pipe; 102. First air outlet pipe; 103. Air permeable plate; 104. Internal container box; 1041. First air permeable structure; 105. External container box; 1051. Second air permeable structure;

[0045] 2. Second cavity; 201. First baffle;

[0046] 3. Buffer cavity; 301. Second air inlet pipe; 302. Second air outlet pipe; 303. Second baffle;

[0047] 4. The first control valve;

[0048] 5. Second control valve;

[0049] 6. The third control valve. DETAILED DESCRIPTION

[0050] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete and to fully convey the concepts of example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted.

[0051] The words expressing positions and directions described in the present utility model are all explained by taking the drawings as examples, but they can be changed as needed, and all the changes are included in the protection scope of the present utility model.

[0052] Reference Figures 1 to 3 The present application provides a precursor packaging container, including: a first cavity 1, a second cavity 2, a buffer cavity 3, an on-off control component and a filling and pumping component. The first cavity 1, the second cavity 2 and the buffer cavity 3 are preferably arranged as an integrated structure. Specifically, the first cavity 1, the second cavity 2 and the buffer cavity 3 can be made by existing methods such as 3D printing and injection molding. The first cavity 1 and the second cavity 2 are preferably arranged side by side, and the buffer cavity 3 is located above the second cavity 2, which helps the liquid precursor to enter the second cavity 2 under the action of gravity.

[0053] The first cavity 1 is used to accommodate a liquid precursor and a solid precursor. The liquid precursor and the solid precursor in the first cavity 1 are placed separately. The first cavity 1 has a first air inlet pipe 101 and a first exhaust pipe 102. The carrier gas input by the first air inlet pipe 101 carries the liquid precursor and then mixes with the vapor of the solid precursor and is discharged through the first exhaust pipe 102. The solid precursor (for example, solid trimethylindium (TMIn)) can generate solid precursor vapor in the first cavity 1, and can be connected with the liquid precursor in the carrier gas (which can be a liquid In precursor, a liquid Mg precursor, and the liquid In precursor is, for example, liquid triethylindium (TEIn)) through coordination bonds and secondary bonds to form a liquid self-assembled compound, thereby improving the stability of the liquid precursor. Among them, the first air inlet pipe 101 and the first exhaust pipe 102 can be installed with a switch valve, so as to control the carrier gas to enter the first cavity 1 through the first air inlet pipe 101, and the carrier gas carrying the liquid precursor and the solid precursor vapor to be discharged from the first cavity 1 through the first exhaust pipe 102. The above-mentioned switch valve can preferably be a solenoid valve.

[0054] A first baffle 201 is arranged between the second cavity 2 and the first cavity 1. At this time, the first baffle 201 can be a cavity wall shared by the first cavity 1 and the second cavity 2. The second cavity 2 replenishes the liquid precursor to the first cavity 1 through the first baffle 201. When the residual liquid precursor in the first cavity 1 is less than the threshold value, the liquid precursor can be replenished to the first cavity 1 in time to keep the liquid precursor inside sufficient.

[0055] A second baffle 303 is arranged between the buffer chamber 3 and the second chamber 2. At this time, the second baffle 303 can be a cavity wall shared by the second chamber 2 and the buffer chamber 3. The buffer chamber 3 is used to receive the liquid precursor and transport the liquid precursor to the second chamber 2 through the second baffle 303. It should be noted that the buffer chamber 3 can receive the liquid precursor provided by an external precursor supply device, and can supply the liquid precursor to the second chamber 2.

[0056] The on-off control component is used to control whether the buffer chamber 3 receives the liquid precursor, the on-off between the second chamber 2 and the buffer chamber 3, and the on-off between the second chamber 2 and the first chamber 1; as a preferred embodiment, the on-off control component includes at least a first control valve 4, a second control valve 5 and a third control valve 6; specifically, the first control valve 4 is arranged on the buffer chamber 3, and is used to control the input of the liquid precursor into the buffer chamber 3, and an external precursor supply device inputs the liquid precursor into the buffer chamber 3 through the first control valve 4; wherein, the first control valve 4 can be a solenoid valve.

[0057] The second control valve 5 is arranged on the second baffle 303, and is used for controlling the liquid precursor to be input from the buffer chamber 3 into the second chamber 2; wherein, the second baffle 303 is provided with corresponding installation holes for installing the second control valve 5, and the second control valve 5 can be a solenoid valve.

[0058] The third control valve 6 is arranged on the first baffle 201, and is used for controlling the liquid precursor to be input from the second cavity 2 into the first cavity 1; wherein, the first baffle 201 is provided with a corresponding installation hole for installing the third control valve 6, and the installation hole is preferably located at the first baffle 201 near the bottom of the first cavity 1 and the second cavity 2, to ensure that each time the first cavity 1 is replenished with liquid precursor, the liquid precursor enters the first cavity 1 from below the liquid surface of the liquid precursor in the first cavity 1, to avoid splashing when the residual amount of liquid precursor in the first cavity 1 is insufficient and the liquid surface is lower than the third control valve 6, and at the same time, the third control valve 6 can also be a solenoid valve.

[0059] It should be noted that the first control valve 4, the second control valve 5, and the third control valve 6 can adopt the same type of normally closed solenoid valves, and when the liquid precursor needs to be supplemented, the corresponding valve bodies can be controlled to open through circuit control.

[0060] Before the liquid precursor enters the buffer chamber 3, the filling and pumping assembly is used to exhaust the water vapor in the buffer chamber 3 and fill it with inert gas. As a preferred embodiment, the filling and pumping assembly at least includes a second air inlet pipe 301, a second exhaust pipe 302, an exhaust device and a gas supply device; wherein, the second air inlet pipe 301 and the second exhaust pipe 302 can be installed with a switch valve, and the switch valve can also be preferably a solenoid valve, so that the second air inlet pipe 301 can be controlled to be opened separately and the second exhaust pipe 302 can be controlled to be opened separately through circuit control, and the specific situation can be selected according to needs.

[0061] The second exhaust pipe 302 and the second intake pipe 301 are both arranged on the buffer cavity 3 and connected to the interior of the buffer cavity 3; specifically, the second intake pipe 301 and the second exhaust pipe 302 are preferably arranged on opposite sides or both ends of the buffer cavity 3, so that the second intake pipe 301 and one end of the second exhaust pipe 302 located inside the buffer cavity 3 are at a farther distance, so that the gas output through the second intake pipe 301 pushes the gas on one side or one end of the buffer cavity 3 to the other side or the other end, thereby improving the gas circulation effect inside the buffer cavity 3.

[0062] The exhaust device is arranged outside the buffer cavity 3 and is connected to the second exhaust pipe 302 to discharge water vapor inside the buffer cavity 3; specifically, in the process of removing water vapor through the exhaust device, the air inside the buffer cavity 3 will be discharged together, and a certain negative pressure will be generated inside it. Correspondingly, the structure of the wall of the buffer cavity 3 can be supported by hard materials to avoid deformation caused by negative pressure.

[0063] The gas supply device is arranged outside the buffer chamber 3 and is connected to the second air inlet pipe 301 to supply inert gas to the buffer chamber 3; specifically, in the process of removing water vapor through the gas supply device, inert gas will be filled into the buffer chamber 3 and a certain positive pressure will be generated inside it. The structure of the corresponding buffer chamber 3 wall can be supported by hard materials to avoid deformation caused by positive pressure, so that the water vapor can be removed from the buffer chamber 3 before the liquid precursor enters the buffer chamber 3, thereby preventing water vapor from contaminating the liquid precursor and reducing the purity of the liquid precursor in the first chamber 1.

[0064] It should be noted that the exhaust device and the gas supply device arranged outside the buffer cavity 3 work independently, that is, the process of filling the buffer cavity 3 with inert gas and the process of extracting gas from the buffer cavity 3 are carried out independently. In this way, all water vapor inside the buffer cavity 3 can be discharged.

[0065] Furthermore, after the first cavity 1 is replenished with liquid precursor, the filling and exhausting assembly can also be used to discharge the liquid precursor vapor in the buffer cavity 3; specifically, the exhaust device and the gas supply device work in the above-mentioned water vapor discharge manner to discharge the residual liquid precursor vapor, preparing for the subsequent replenishment of the liquid precursor.

[0066] Therefore, the precursor packaging container can replenish the liquid precursor to the first cavity 1 from the outside through the buffer cavity 3 and the second cavity 2 in cooperation with the filling and pumping assembly, which can extend the service life of the packaging container, maintain the liquid precursor capacity inside the container to provide a sufficient contact path for the carrier gas, ensure the concentration of the precursor carried by the carrier gas, provide a stable source of precursor for the subsequent vapor deposition process, and ensure the quality of the deposited film. At the same time, according to the trend of the increasing size of the reaction chamber of the existing vapor deposition device, the packaging container can be replenished with liquid precursor in time to meet the normal operation of the vapor deposition device with a large-size reaction chamber, reduce the replacement cycle and replacement frequency of the packaging container, and can supply the vapor deposition device for a long time, thereby increasing the effective use time of the vapor deposition device and improving the equipment utilization rate.

[0067] In some optional embodiments, the first cavity 1 has a storage component, which is located above the liquid precursor and is used to hold the solid precursor, so that the liquid precursor and the solid precursor are placed separately. The solid precursor can generate solid precursor vapor in the first cavity 1, and can be linked with the liquid precursor in the carrier gas through coordination bonds and secondary bonds to form a liquid self-assembled compound, and is discharged through the first exhaust pipe 102 together with the carrier gas.

[0068] The first air inlet pipe 101 and the first air outlet pipe 102 penetrate the wall of the first cavity 1 and have an outer end and an inner end respectively. The inner end of the first air inlet pipe 101 is located in the liquid precursor, so that the carrier gas enters the liquid precursor after being discharged through the first air inlet pipe 101, thereby carrying the liquid precursor.

[0069] It should be noted that the liquid precursor in the first cavity 1 and the liquid precursor for replenishing it are of the same material, specifically a liquid indium (In) precursor or a liquid magnesium (Mg) precursor. The solid precursor in the first cavity 1 contains the same indium (In) or magnesium (Mg) as the liquid precursor, or the liquid precursor in the first cavity 1 and the liquid precursor for replenishing it can also be a solid precursor and a liquid precursor connected by coordination bonds and secondary bonds to form a liquid self-assembled compound. At this time, the solid precursor in the first cavity 1 and the solid precursor for forming the self-assembled liquid compound are of the same material, so that the solid precursor in the first cavity 1 can provide sufficient solid precursor vapor for the self-assembled liquid compound to avoid decomposition of the self-assembled compound due to external factors.

[0070] In conventional packaging containers, liquid precursors must be replaced when the remaining amount is insufficient to meet process requirements. As the size of the reaction chamber of the vapor deposition device continues to increase, the amount of precursor consumed also continues to increase, shortening the replacement cycle of the precursor packaging container. Currently, the replacement cycle of conventional packaging containers is usually 1-6 months. By using the vapor deposition system of the precursor packaging container in this solution, the liquid precursor in the packaging container can be continuously replenished online, and the packaging container needs to be replaced only when the solid precursor therein is consumed. This is because the vapor pressure of the solid precursor in the packaging container is low, and its function is to replenish the vapor of the liquid precursor. The amount used in a single process is very small and can even be ignored, so that the solid precursor vapor carried by the carrier gas through the first cavity 1 has a lower consumption than the liquid precursor, and can be used for a longer time. The solid precursor in the first cavity 1 can be used for more than ten years. Under the conditions of packaging containers of the same specifications, the use time of the packaging container can be extended by more than ten times compared with conventional packaging containers.

[0071] Therefore, the packaging device adopts a setting in which the solid precursor and the liquid precursor are separated, which can not only enable the solid precursor to provide sufficient solid precursor vapor for the liquid precursor to ensure the stability of the formed liquid precursor self-assembly compound, but also can replenish the liquid precursor for the first cavity 1 through the buffer cavity 3 and the second cavity 2, thereby avoiding the situation in which the entire packaging device needs to be replaced in advance due to insufficient liquid precursor residue, resulting in precursor waste, and avoiding the situation in which the entire packaging device needs to be replaced in advance due to insufficient liquid precursor residue, resulting in solid precursor waste.

[0072] Reference Figure 1 In one embodiment, the storage component includes at least a gas permeable plate 103 arranged on the inner wall of the first cavity 1, and the gas permeable plate 103 is used to hold the solid precursor; wherein, the gas permeable plate 103 can be a plate-like structure with through holes or grids on the surface, so that the carrier gas and the solid precursor vapor can pass through the gas permeable plate 103 and enter the other side, which helps the solid precursor and the liquid precursor to form a self-assembled compound through the coordination elements and secondary bonds, and at the same time ensures that the solid precursor can provide sufficient precursor vapor to the first cavity 1 in time, and prevents the self-assembled compound from being unstable and decomposing due to external factors when the precursor discharged through the first exhaust pipe 102 passes through the vapor deposition process pipeline, thereby ensuring the stability of the precursor supply.

[0073] The inner end of the first air inlet pipe 101 passes through the air permeable plate 103, so that the inner end of the first air inlet pipe 101 can be inserted into the liquid precursor.

[0074] The inner end of the first exhaust pipe 102 is located above or below the air permeable plate 103; wherein, the difference between the inner end of the first exhaust pipe 102 being located above the air permeable plate 103 and being located below the air permeable plate 103 is that when the inner end of the first exhaust pipe 102 is located above the air permeable plate 103, the carrier gas needs to pass through the air permeable plate 103 before it can be discharged from the first exhaust pipe 102. During this process, the carrier gas can lift the solid precursor vapor carried therein through the air permeable plate 103, providing a liquid precursor self-assembly compound discharged through the first exhaust pipe 102. More sufficient solid precursor vapor can better prevent the decomposition of the self-assembled compound. When the inner end of the first exhaust pipe 102 is located below the air permeable plate 103, the carrier gas flow path can be discharged from the first exhaust pipe 102 without passing through the air permeable plate 103. In this process, the solid precursor vapor needs to pass through the air permeable plate 103 and follow the carrier gas into the first exhaust pipe 102 for discharge. It can also provide solid precursor vapor for the self-assembled compound to prevent its decomposition, but the effect is not as good as when the inner end of the first exhaust pipe 102 is located above the air permeable plate 103.

[0075] Reference Figure 2 In another embodiment, the storage component at least includes a content box 104 disposed on the inner wall of the first cavity 1, and at least the bottom of the content box 104 is provided with a first air-permeable structure 1041, and the interior of the content box 104 is used to hold the solid precursor; wherein the first air-permeable structure 1041 can be a bottom plate of the content box 104 with through holes or a grid. It should be noted that the content box 104 can also have a peripheral side wall with through holes or a grid in addition to the bottom, and in this case, the entire structure of the content box 104 is an air-permeable structure. Of course, the content box 104 can also only have a peripheral side wall with through holes or a grid, and this is not the only limitation.

[0076] The inner end of the first exhaust pipe 102 is located on the inner side or the outer side of the content box 104; wherein, the difference between the inner end of the first exhaust pipe 102 being located on the inner side of the content box 104 and being located on the outer side of the content box 104 is that when the inner end of the first exhaust pipe 102 is located on the inner side of the content box 104, the carrier gas needs to pass through the first air permeable structure 1041 before it can be discharged from the first exhaust pipe 102. During this process, the carrier gas can lift the solid precursor vapor carried therein through the first air permeable structure 1041, thereby providing a liquid precursor self-assembly compound discharged through the first exhaust pipe 102. It can provide more sufficient solid precursor vapor, and better prevent the decomposition of the self-assembled compound. When the inner end of the first exhaust pipe 102 is located on the outside of the content box 104, the carrier gas flow path does not need to pass through the first air permeable structure 1041 to be discharged from the first exhaust pipe 102. In this process, the solid precursor vapor needs to pass through the first air permeable structure 1041 and follow the carrier gas into the first exhaust pipe 102 to be discharged. It can also provide solid precursor vapor for the self-assembled compound to prevent its decomposition, but the effect is not as good as when the inner end of the first exhaust pipe 102 is located on the inside of the content box 104.

[0077] Reference Figure 3 In another embodiment, the storage component at least includes an external containing box 105 arranged on the outer cavity wall of the first cavity 1, and the side of the external containing box 105 connected to the first cavity 1 is configured as a second air permeable structure 1051; wherein, the second air permeable structure 1051 can be a cavity wall with through holes or grids. After the solid precursor is placed in the external containing box 105, the solid precursor vapor can enter the first cavity 1 through the second air permeable structure 1051, and be discharged through the first exhaust pipe 102 together with the carrier gas carrying the liquid precursor. In this way, the traditional first cavity 1 can be deformed, so that the external containing box 105 is equivalent to a part of the structure of the first cavity 1. The solid precursor is placed in the external containing box 105, so that the first cavity 1 can accommodate more liquid precursors, thereby alleviating the contradiction between the different consumption rates of the solid precursor and the liquid precursor.

[0078] The present application also provides a vapor deposition system, including: a precursor packaging container, a carrier gas supply device, a vapor deposition device, a precursor supply device and a monitoring and control device. The carrier gas supply device is used to connect the first gas inlet pipe 101 to supply carrier gas to the first cavity 1; the vapor deposition device is used to connect the first exhaust pipe 102 to perform vapor deposition; the precursor supply device is used to supply liquid precursor to the buffer cavity 3, wherein the precursor supply device is connected to the first control valve 4 to realize the supply of liquid precursor to the buffer cavity 3.

[0079] The monitoring and control device is electrically connected to the on-off control component, the filling and pumping component and the precursor supply device respectively and is used to monitor the remaining amount of the liquid precursor in the first cavity 1. When the monitoring and control device monitors that the liquid precursor in the first cavity 1 reaches the remaining amount threshold, the filling and pumping component is controlled to drain the water vapor from the buffer cavity 3, and after the water vapor is drained, the on-off control component and the precursor supply device are controlled to allow the liquid precursor to enter the second cavity 2 and to input the liquid precursor into the first cavity 1 through the filling and pumping component.

[0080] Specifically, the carrier gas supply device passes the carrier gas into the first cavity 1 through the first air inlet pipe 101, and the carrier gas carrying the liquid precursor and the solid precursor vapor enters the vapor deposition device through the first exhaust pipe 102 to perform the vapor deposition process. When the monitoring and control device detects that the liquid precursor in the first cavity 1 reaches the residual threshold, the filling and pumping components are controlled to drain the water vapor from the buffer cavity 3, and then the second air inlet pipe 301 and the second exhaust pipe 302 are closed, and the precursor supply device is controlled to input the liquid precursor into the buffer cavity 3 and then closed. Close the first control valve 4, then control the second control valve 5 to open, control the gas supply device of the filling and pumping assembly to start, and open the third control valve 6 to allow the liquid precursor to enter the second cavity 2, and transport the liquid precursor to the first cavity 1 under the action of gas pressure. After completing the liquid precursor replenishment work, close the second control valve 5 and the third control valve 6, control the gas supply device and the pumping device of the filling and pumping assembly to work alternately, and discharge the remaining liquid precursor vapor in the buffer cavity 3, in preparation for the next replenishment of the liquid precursor in the first cavity 1.

[0081] Although the embodiments of the utility model have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the utility model. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the utility model without departing from the principles and purpose of the utility model. All of these changes should fall within the scope of protection of the claims of the utility model.

Claims

1. A precursor packaging container, characterized in that: include: A first cavity, the first cavity is used to accommodate a liquid precursor and a solid precursor, the first cavity has a first air inlet pipe and a first exhaust pipe, the carrier gas input by the first air inlet pipe carries the liquid precursor and then mixes with the vapor of the solid precursor and is discharged through the first exhaust pipe; a second cavity, wherein a first baffle is disposed between the second cavity and the first cavity, and the second cavity replenishes the liquid precursor to the first cavity through the first baffle; a buffer cavity, wherein a second baffle is disposed between the buffer cavity and the second cavity, and the buffer cavity is used to receive the liquid precursor and transport the liquid precursor to the second cavity through the second baffle; An on-off control component, the on-off control component is used to control whether the buffer cavity receives the liquid precursor, the on-off between the second cavity and the buffer cavity, and the on-off between the second cavity and the first cavity; The filling and pumping component is used to discharge the water vapor in the buffer cavity and fill it with inert gas before the liquid precursor enters the buffer cavity.

2. The precursor packaging container according to claim 1, characterized in that: The on-off control assembly at least includes a first control valve, a second control valve and a third control valve; The first control valve is disposed on the buffer cavity and is used to control the input of the liquid precursor into the buffer cavity. The external precursor supply device inputs the liquid precursor into the buffer cavity through the first control valve. The second control valve is disposed on the second baffle plate and is used to control the liquid precursor to be input from the buffer cavity into the second cavity; The third control valve is disposed on the first baffle plate, and is used to control the liquid precursor to be input from the second cavity into the first cavity.

3. The precursor packaging container according to claim 1, characterized in that: The charging and pumping assembly at least comprises a second air inlet pipe, a second air outlet pipe, an air pumping device and a gas supply device; The second exhaust pipe and the second intake pipe are both arranged on the buffer cavity and communicate with the inside of the buffer cavity; The air extraction device is arranged outside the buffer cavity and connected to the second exhaust pipe to exhaust water vapor inside the buffer cavity; The gas supply device is disposed outside the buffer cavity and connected to the second gas inlet pipe to supply inert gas to the buffer cavity.

4. The precursor packaging container according to claim 1, characterized in that: The first cavity has a storage component, which is located above the liquid precursor and is used to hold the solid precursor; and / or, The first air inlet pipe and the first air outlet pipe penetrate through the wall of the first cavity and respectively have an outer end and an inner end, and the inner end of the first air inlet pipe is located in the liquid precursor.

5. The precursor packaging container according to claim 4, characterized in that: The storage component at least comprises a gas permeable plate arranged on the inner wall of the first cavity, and the gas permeable plate is used to hold the solid precursor; The inner end of the first air inlet pipe passes through the air permeable plate; and / or, The inner end of the first exhaust pipe is located above or below the air permeable plate.

6. The precursor packaging container according to claim 4, characterized in that: The storage component at least comprises a content box disposed on the inner wall of the first cavity, wherein at least the bottom of the content box is disposed with a first air-permeable structure, and the interior of the content box is used to hold the solid precursor; The inner end of the first exhaust pipe is located inside or outside the content box.

7. The precursor packaging container according to claim 4, characterized in that: The storage component at least includes an external accommodating box arranged on the outer wall of the first cavity, and a side of the external accommodating box connected to the first cavity is configured as a second air-permeable structure.

8. The precursor packaging container according to claim 1, characterized in that: The first cavity, the second cavity and the buffer cavity are arranged as an integrated structure; and / or, The first cavity and the second cavity are arranged side by side, and the buffer cavity is located above the second cavity.

9. The precursor packaging container according to claim 3, characterized in that: The first air intake pipe, the first exhaust pipe, the second air intake pipe and the second exhaust pipe are all equipped with switch valves.

10. A vapor deposition system, characterized in that: include: The precursor packaging container according to any one of claims 1 to 9; A carrier gas supply device, used to connect to the first air inlet pipe to supply carrier gas to the first cavity; A vapor deposition device, used to connect to the first exhaust pipe to perform vapor deposition; A precursor supply device, used for supplying a liquid precursor to the buffer chamber; The monitoring and control device is electrically connected to the on-off control component, the filling and pumping component and the precursor supply device respectively and is used to monitor the residual amount of the liquid precursor in the first cavity.

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