Packaging structure of filter

Abstract

The utility model relates to a packaging structure of a filter, which comprises a first substrate, the upper end of the first substrate is provided with a filter chip and two functional chips, and the first substrate is provided with packaging positioning tables at positions corresponding to the peripheral sides of the filter chip and the functional chips. The utility model relates to the technical field of filter chip packaging mechanisms. According to the packaging structure of the filter, the support plate is triangular, the upper end side of the connecting guide rail is inclined, the welding metal pins are arranged through the arc-shaped grooves, and the positioning pressing sheet is similar to the connecting guide rail in shape, so that the mounting ring can be effectively attached to the connecting guide rail when the mounting ring sleeves the upper end of the outer surface of the filter chip; the stability of the filter chip is further improved, the problem of offset of the filter chip during film covering can be avoided, and the pins, connected with the first substrate, of the filter chip can be effectively protected, so that the problem of wire collapse is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of filter chip packaging mechanisms, in particular to a packaging structure of a filter. Background Art

[0002] The common structure of filter module packaging is to flip-chip the filter chip and functional chips such as switches and power amplifiers on the substrate, and then attach a layer of isolation film on the chip. The isolation film is filled with plastic packaging material and the surface is made flat. At this point, the packaging of the entire filter module is completed.

[0003] In the prior art, in order to allow specific frequency components in the signal to pass through and greatly attenuate or filter other frequency components, a cavity environment needs to be formed at the bottom of the filter chip to ensure normal operation. However, when the filter chip and other functional chips are coated with an isolation film, the film is tilted due to the different heights and installation methods of the filter chip and other functional chips, which causes different pressures on the top of the chip, making it easy for the chip to shift and the pins to break. Utility Model Content

[0004] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a packaging structure of a filter so as to solve the technical problems mentioned in the above background technology.

[0005] The above technical objectives of the utility model are achieved through the following technical solutions:

[0006] A packaging structure of a filter comprises a first substrate, wherein a filter chip and two functional chips are arranged at the upper end of the first substrate, packaging positioning platforms are arranged at positions corresponding to the outer peripheral sides of the first substrate, the upper end of the first substrate and the four corners of the bottom end of the filter chip are arranged with supporting columns, the filter chip is fixedly connected to the first substrate via the supporting columns, the outer surface of the filter chip is sleeved with a fixing ring, and a pressing frame is arranged on the top of the fixing ring.

[0007] Furthermore, the fixing ring includes a mounting ring, the mounting ring is sleeved on the upper end of the outer surface of the filter chip, and a positioning pressing sheet is arranged at a position at the bottom of the mounting ring corresponding to the packaging positioning platform.

[0008] Furthermore, the packaging positioning platform includes a support plate, which is in the shape of a right-angled triangle. The support plate is fixed to the upper end of the first substrate, and the two right-angled sides of the support plate are respectively in contact with the side wall of the filter chip and the upper end surface of the first substrate. A connecting guide rail is provided at the top end of the support plate, and an arc groove is opened at the upper end of the connecting guide rail.

[0009] Furthermore, the bottom end surface of the functional chip contacts the top surface of the first substrate, and the bottom end of the functional chip is provided with a plurality of contacts connected to the first substrate.

[0010] Furthermore, an oblique pressure plate is sleeved on the outer peripheral side of the functional chip, and a wire groove is provided inside the oblique pressure plate at a position corresponding to the connecting guide rail.

[0011] In summary, the present invention includes at least one of the following beneficial technical effects:

[0012] 1. The packaging structure of the filter, since the bracket plate is triangular, and the upper end side of the connecting guide rail is inclined, the metal pins are welded by setting the arc groove, and the positioning pressing sheet is similar in shape to the connecting guide rail. When the mounting ring is sleeved on the upper end of the outer surface of the filter chip, it can effectively fit with the connecting guide rail, further improving the stability of the filter chip, avoiding the problem of filter chip deviation during lamination, and effectively protecting the pins connecting the filter chip and the first substrate to avoid the problem of wire collapse;

[0013] 2. The packaging structure of the filter, through the setting of the pressing frame, since the bottom end of the pressing frame is flush with the upper end surface of the positioning pressing sheet, when the pressing frame is installed, the inner wall of the pressing frame can be fitted with the side of the positioning pressing sheet, and then when covering the isolation film, the isolation film can be pressed against the side of the positioning pressing sheet, so that when the isolation film is covered downward, the position with different pressures can be avoided, thereby preventing the chip from flipping over. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0015] Figure 1 The utility model is a schematic diagram of a filter packaging structure.

[0016] Figure 2 The utility model is a structural explosion diagram of a filter packaging structure.

[0017] Figure 3 The utility model is a schematic structural diagram of a fixing ring of a filter packaging structure.

[0018] Figure 4 A packaging structure of a filter of the utility model Figure 2A magnified view of the structure at A.

[0019] In the figure, 1, first substrate; 2, filter chip; 3, functional chip; 31, inclined pressure plate; 32, wire groove; 4, packaging positioning platform; 41, bracket plate; 42, connecting guide rail; 43, arc groove; 5, supporting column; 6, fixing ring; 61, mounting ring; 62, positioning pressing sheet; 7, pressing frame. DETAILED DESCRIPTION

[0020] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0021] Example:

[0022] Reference Figure 1-Figure 4 The utility model discloses a packaging structure of a filter, comprising a first substrate 1, a filter chip 2 and two functional chips 3 are arranged at the upper end of the first substrate 1, packaging positioning platforms 4 are arranged at positions corresponding to the outer peripheral sides of the first substrate 1, and supporting columns 5 are arranged at positions corresponding to the upper end of the first substrate 1 and the four corners of the bottom end of the filter chip 2. The filter chip 2 is fixedly connected to the first substrate 1 through the supporting columns 5. A fixing ring 6 is sleeved on the outer surface of the filter chip 2, and a pressing frame 7 is arranged on the top of the fixing ring 6.

[0023] In this embodiment, when in use, the first substrate 1 is used to position and install the filter chip 2 and the functional chip 3, and the packaging positioning platform 4 is used to fix the filter chip 2 and the functional chip 3. The supporting column 5 is used to provide a cavity between the filter chip 2 and the first substrate 1, so that the filter chip 2 can be used normally. The fixing ring 6 is provided in cooperation with the packaging positioning platform 4 to improve the stability of the filter chip 2 and support the side pins of the filter chip 2 to avoid the problem of displacement of the filter chip 2 during lamination. The pressing frame 7 is provided because the bottom end of the pressing frame 7 is flush with the upper end surface of the positioning pressing sheet 62. When the pressing frame 7 is installed, the inner wall of the pressing frame 7 can be fitted with the side of the positioning pressing sheet 62, and then the isolation film can be pressed against the side of the positioning pressing sheet 62 when covering the isolation film, so that when the isolation film is covered downward, different pressure positions can be avoided, thereby preventing the chip from flipping.

[0024] In a further preferred embodiment of the present invention, Figure 1-4 As shown, the fixing ring 6 includes a mounting ring 61 , which is sleeved on the upper end of the outer surface of the filter chip 2 , and a positioning pressing sheet 62 is provided at the bottom of the mounting ring 61 at a position corresponding to the packaging positioning platform 4 .

[0025] In this embodiment, by setting the mounting ring 61, when the filter chip 2 is installed on the upper end of the first substrate 1 and embedded between each packaging positioning platform 4, the mounting ring 61 is put on the upper end of the filter chip 2, and the mounting ring 61 is pressed so that the positioning pressure piece 62 installed at the bottom end of the mounting ring 61 corresponds one by one with the packaging positioning platform 4, thereby improving the stability of the filter chip 2 and preventing it from being offset.

[0026] In a further preferred embodiment of the present invention, Figure 1-4 As shown, the packaging positioning platform 4 includes a support plate 41, and the support plate 41 is in the shape of a right triangle. The support plate 41 is fixed to the upper end of the first substrate 1, and the two right-angled sides of the support plate 41 are respectively in contact with the side wall of the filter chip 2 and the upper end surface of the first substrate 1. A connecting guide rail 42 is provided at the top end of the support plate 41, and an arc groove 43 is opened at the upper end of the connecting guide rail 42.

[0027] In this embodiment, the bracket plate 41 is provided for installing the connecting guide rail 42. Since the bracket plate 41 is triangular, the upper end of the connecting guide rail 42 is inclined. The arc groove 43 is provided to weld the metal pins, and the positioning pressure plate 62 is similar in shape to the connecting guide rail 42. When the mounting ring 61 is put on the upper end of the outer surface of the filter chip 2, it can effectively fit with the connecting guide rail 42, further improving the stability of the filter chip 2, and can effectively protect the pins connecting the filter chip 2 and the first substrate 1 to avoid the problem of wire collapse.

[0028] In a further preferred embodiment of the present invention, Figure 1-4 As shown, the bottom end surface of the functional chip 3 contacts the top surface of the first substrate 1 , and the bottom end of the functional chip 3 is provided with a plurality of contacts connected to the first substrate 1 .

[0029] In this embodiment, the function chip 3 is connected to the circuit in the first substrate 1 through contacts to improve the stability of the function chip 3 .

[0030] In a further preferred embodiment of the present invention, Figure 1-4 As shown, an oblique pressure plate 31 is sleeved on the outer peripheral side of the functional chip 3 , and a wire groove 32 is provided inside the oblique pressure plate 31 at a position corresponding to the connecting guide rail 42 .

[0031] In this embodiment, the wire groove 32 is provided to protect the pins on the outer peripheral side of the functional chip 3, and the inclined pressure plate 31 is provided to keep the isolation film perpendicular to the functional chip 3 during the process of pasting the isolation film, so as to improve the stability of the functional chip 3 during the coating.

[0032] The embodiments of this specific implementation method are all preferred embodiments of the utility model, and are not intended to limit the protection scope of the utility model. Therefore, all equivalent changes made based on the structure, shape, and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A filter packaging structure, characterized in that: The invention comprises a first substrate (1), wherein a filter chip (2) and two functional chips (3) are arranged at the upper end of the first substrate (1), packaging positioning platforms (4) are arranged at positions corresponding to the outer peripheral sides of the filter chip (2) and the functional chip (3) of the first substrate (1), supporting columns (5) are arranged at positions corresponding to the upper end of the first substrate (1) and the four corners of the bottom end of the filter chip (2), the filter chip (2) is fixedly connected to the first substrate (1) via the supporting columns (5), the outer surface of the filter chip (2) is sleeved with a fixing ring (6), and a pressing frame (7) is arranged at the top of the fixing ring (6).

2. A filter packaging structure according to claim 1, characterized in that: The fixing ring (6) comprises a mounting ring (61), the mounting ring (61) being sleeved on the upper end of the outer surface of the filter chip (2), and a positioning pressing sheet (62) being provided at a position at the bottom of the mounting ring (61) corresponding to the packaging positioning platform (4).

3. A filter packaging structure according to claim 2, characterized in that: The packaging positioning platform (4) comprises a support plate (41) in the shape of a right triangle. The support plate (41) is fixed to the upper end of the first substrate (1), and the two right-angled sides of the support plate (41) are in contact with the side wall of the filter chip (2) and the upper end surface of the first substrate (1) respectively. A connecting guide rail (42) is provided at the top end of the support plate (41), and an arc groove (43) is provided at the upper end of the connecting guide rail (42).

4. The packaging structure of a filter according to claim 3, characterized in that: The bottom end surface of the functional chip (3) contacts the top surface of the first substrate (1), and the bottom end of the functional chip (3) is provided with a plurality of contacts connected to the first substrate (1).

5. The packaging structure of a filter according to claim 4, characterized in that: An inclined pressure plate (31) is sleeved on the outer peripheral side of the functional chip (3), and a wire groove (32) is provided inside the inclined pressure plate (31) at a position corresponding to the connecting guide rail (42).

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