Display panel and display device

Abstract

The utility model provides a display panel and a display device, and belongs to the technical field of display. The display panel is provided with a display area and a peripheral area surrounding the display area. The display panel comprises a substrate, and a light-emitting layer and a packaging layer which are sequentially arranged in the direction away from the substrate, the display panel further comprises a first crack blocking structure located in the peripheral area. The light-emitting layer and the packaging layer extend from the display area to the peripheral area and stop at the side, close to the display area, of the first crack blocking structure.

Description

Technical Field

[0001] The present disclosure belongs to the field of display technology, and particularly relates to a display panel and a display device. Background Art

[0002] Compared with liquid crystal display devices, organic light-emitting diode (OLED) display devices have self-luminous characteristics and do not require independent light sources. In addition, due to the characteristics of low power consumption, high brightness and fast response speed, OLED display devices have received more and more attention.

[0003] However, many problems with GDSH have arisen in related OLED display devices. GDSH is a defective black spot in the OLED screen. GDSH abnormality is caused by a combination of factors, such as electrical corrosion, packaging failure, organic material (IJP) overflow, or cracks. Usually, GDSH first appears at the opening (AA Hole) or edge of the display area, where water vapor invades and eventually spreads to the display area (AA), causing the display panel to fail. Utility Model Content

[0004] The present disclosure aims to solve at least one of the technical problems existing in the prior art and provides a display panel and a display device.

[0005] In a first aspect, the technical solution adopted to solve the technical problem of the present disclosure is a display panel having a display area and a peripheral area surrounding the display area; wherein the display panel comprises: a substrate, and a light-emitting layer and an encapsulation layer arranged in sequence in a direction away from the substrate;

[0006] The display panel further includes a first crack blocking structure located in the peripheral area; the light emitting layer and the encapsulation layer both extend from the display area to the peripheral area and terminate at a side of the first crack blocking structure close to the display area.

[0007] In some embodiments, the display panel further comprises: an electrode layer disposed on a side of the light emitting layer away from the base substrate;

[0008] The electrode layer extends from the display area to the peripheral area and ends at a side of the first crack barrier structure close to the display area.

[0009] In some embodiments, the display panel further comprises: an undercut structure located in the peripheral area, and the undercut structure is closer to the display area than the first crack blocking structure;

[0010] The edge of the light-emitting layer farthest from the display area is located between the undercut structure farthest from the display area and the first crack blocking structure; the edge of the electrode layer farthest from the display area is located between the undercut structure farthest from the display area and the first crack blocking structure.

[0011] In some embodiments, the display panel further comprises: an isolation column located in the peripheral area, the isolation column being closer to the display area than the first crack blocking structure;

[0012] The encapsulation layer comprises a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer which are sequentially arranged in a direction away from the substrate;

[0013] The organic encapsulation layer extends from the display area to the peripheral area and ends at a side of the isolation column close to the display area;

[0014] The first inorganic encapsulation layer and the second inorganic encapsulation layer both extend from the display area to the peripheral area, and edges of the first inorganic encapsulation layer and the second inorganic encapsulation layer are both located between the undercut structure farthest from the display area and the first crack blocking structure.

[0015] In some embodiments, the display panel further comprises: an intermediate layer disposed on a side of the light emitting layer close to the base substrate;

[0016] The intermediate layer located in the peripheral area is formed with a plurality of dams and undercut channels between adjacent dams, and the adjacent dams and the undercut channels therebetween constitute the undercut structure.

[0017] In some embodiments, a first protective layer and a second protective layer are disposed in the undercut channel, the first protective layer wraps at least a portion of the sidewall of the undercut channel, and the second protective layer covers the bottom wall of the undercut channel.

[0018] In some embodiments, the undercut structure further includes a cutting portion disposed on a side of the dam away from the substrate; the cutting portion is disposed corresponding to the dam;

[0019] The first protection layer wraps a portion of the sidewall of the undercut channel, and a surface of the first protection layer away from the substrate is spaced apart from a surface of the intermediate layer away from the substrate;

[0020] The cutting portion is disposed at an end portion of the undercut channel that is close to the undercut channel on a surface of the first protection layer that is away from the base substrate, and protrudes from the first protection layer along a direction in which the first protection layer is away from the dam.

[0021] In some embodiments, the display panel further comprises: an intermediate layer disposed on a side of the light emitting layer close to the base substrate;

[0022] The intermediate layer located in the peripheral region has a first opening, the opening direction of the first opening is away from the substrate, and the first crack blocking structure is at least filled in the first opening.

[0023] In some embodiments, the first crack blocking structure includes a first blocking portion and a second blocking portion connected to the first blocking portion, the first blocking portion fills the first opening, and the second blocking portion is disposed on a side of the intermediate layer away from the substrate.

[0024] In some embodiments, the material of the intermediate layer is an inorganic material, and the material of the first crack blocking structure is an organic material.

[0025] In some embodiments, the display panel further includes: a first touch layer, a touch insulating layer, and a second touch layer, which are sequentially arranged on the encapsulation layer in a direction away from the base substrate;

[0026] At least one of the first touch layer, the touch insulation layer and the second touch layer covers the first crack blocking structure.

[0027] In some embodiments, the display panel further includes: a third protective layer disposed on a side of the intermediate layer away from the display area, the third protective layer at least wrapping a side wall of the intermediate layer away from the display area.

[0028] In some embodiments, the display panel further has an opening area and a transition area surrounding the opening area, wherein the transition area is located between the opening area and the display area;

[0029] The display panel further includes a second crack blocking structure located in the transition region; the light emitting layer and the encapsulation layer both extend from the display region to the transition region and terminate at a side of the second crack blocking structure close to the display region.

[0030] In a second aspect, an embodiment of the present disclosure further provides a display device, comprising a display panel as described in any one of the first aspects. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A schematic diagram of a GDSH failure of a related display panel;

[0032] Figure 2 A schematic diagram of the entire paving of the light-emitting layer and the encapsulation layer in the relevant display panel;

[0033] Figure 3A schematic diagram of a display panel provided in an embodiment of the present disclosure;

[0034] Figure 4 for Figure 3 The cross-sectional view of the first example in the A-A' direction;

[0035] Figure 5 is a schematic diagram of another undercut structure;

[0036] Figure 6 A schematic diagram of a first crack barrier structure provided in an embodiment of the present disclosure;

[0037] Figure 7 for Figure 3 The cross-sectional view of the second example in the A-A' direction;

[0038] Figure 8 for Figure 3 Cross-sectional view along the BB' direction. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical scheme and advantages of the embodiments of the present disclosure clearer, the technical scheme in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all of the embodiments. The components of the embodiments of the present disclosure generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present disclosure provided in the drawings is not intended to limit the scope of the present disclosure for protection, but merely represents the selected embodiments of the present disclosure. Based on the embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present disclosure.

[0040] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0041] The "multiple or several" mentioned in this disclosure refers to two or more. "And / or" describes the association relationship of the associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship.

[0042] In related technologies, such as Figure 1 As shown, microscopic testing found that the opening (AA Hole) or edge position of the display area is prone to GDSH defects. GDSH is one of the common defects in flexible OLED products. Its occurrence may be caused by factors such as material problems, process problems or various stress problems. The following introduces the generation mechanism of GDSH: 1) Stress influence: The manufacture of flexible OLED products may produce thermal stress, mechanical stress, chemical stress, etc. Since the linear expansion coefficients of materials such as circuit boards and OLED light-emitting layer materials are different, stress concentration is prone to occur, thus forming GDSH; 2) Oxidation influence: The organic materials in the product (including but not limited to the materials of the organic light-emitting layer and the organic packaging materials, etc.) are extremely susceptible to oxidation, and oxidation will lead to the formation of GDSH; 3) Preparation process influence: During the production process, impurities or contamination on the surface of the flexible OLED product will also form GDSH; 4) In the working mode, the cathode in the light-emitting device is energized. Since the cathode layer is laid in an entire layer, electrochemical corrosion is prone to occur in a water-oxygen erosion environment.

[0043] In view of this, the embodiments of the present disclosure provide a display panel that substantially blocks the water vapor erosion path and blocks the water vapor intrusion from the source of the water vapor erosion, thereby improving GDSH defects.

[0044] Figure 3 A schematic diagram of a display panel provided in an embodiment of the present disclosure, Figure 4 for Figure 3 The cross-sectional view of the first example in the A-A' direction. Figure 3 and Figure 4 As shown, the display panel has a display area AA and a peripheral area BB surrounding the display area AA; wherein the display panel includes: a base substrate 1, and a light-emitting layer EL and an encapsulation layer 2 arranged in sequence away from the base substrate 1; the light-emitting layer EL is mainly used to realize the electroluminescence of the light-emitting device (OLED) located in the display area AA. The encapsulation layer 2 is mainly used to encapsulate the light-emitting device to prevent the display area AA from being corroded by water and oxygen.

[0045] The display panel further includes a first crack barrier structure 3 located in the peripheral area BB; the light emitting layer EL and the encapsulation layer 2 both extend from the display area AA to the peripheral area BB and terminate at a side of the first crack barrier structure 3 close to the display area AA. That is, the edges of the light emitting layer EL and the encapsulation layer 2 are closer to the display area AA than the edges of the display panel.

[0046] The material of the light emitting layer EL is very easy to absorb water and corrode. Compared with the traditional technology, the light emitting layer EL and the encapsulation layer 2 are laid in a whole layer (for example, the edge of the light emitting layer EL and the encapsulation layer 2 is the edge of the display panel, such as Figure 2 As shown in the figure, the present invention shrinks the edges of the light-emitting layer EL and the encapsulation layer 2 to the side of the first crack blocking structure 3 close to the display area AA, and there is no longer any extended light-emitting layer EL on the side of the first crack blocking structure 3 away from the substrate 1, thereby blocking the path for water vapor to invade the display area AA from the boundary along the light-emitting layer EL, thereby improving GDSH defects.

[0047] It should be noted that in the related art, multiple display panels are prepared at the same time to form a display motherboard, and then the display motherboard is cut to form multiple display panels at the same time. The display motherboard cutting area is recorded as the cutting channel area CC, and the edge of the display panel is also the edge of the cutting channel area CC. When cutting the display motherboard, cracks (Crack) are easily generated at the edge of the display panel, and the cracks (Crack) will spread and extend to the display area AA along with the inorganic layer (such as the intermediate layer 6), causing poor GDSH. The embodiment of the present disclosure sets a first crack blocking structure 3 at the edge position adjacent to the display panel, and uses the first crack blocking structure 3 to absorb energy to prevent cracks (Crack) from spreading from the edge of the display panel to the display area AA.

[0048] Optionally, the material of the first crack barrier structure 3 is an organic material, and the organic material absorbs energy to prevent cracks from spreading from the edge of the display panel to the display area AA.

[0049] In some embodiments, Figure 4 As shown, the display panel further includes: an electrode layer 4 arranged on the side of the light emitting layer EL away from the base substrate 1; the electrode layer 4 extends from the display area AA to the peripheral area BB and ends at a side of the first crack blocking structure 3 close to the display area AA.

[0050] Exemplarily, the electrode layer 4 may be the layer where the cathode of the light-emitting device is located.

[0051] In the working mode, the cathode in the light-emitting device is energized. Since the cathode layer is adjacent to the light-emitting layer EL and is laid together with the light-emitting layer EL, electrochemical corrosion is prone to occur in a water-oxygen corrosion environment. In this embodiment, by retracting the edge of the electrode layer 4 to the side of the first crack barrier structure 3 close to the display area AA, the side of the first crack barrier structure 3 facing away from the base substrate 1 no longer has an extended electrode layer 4. When powered on, it plays a power-off role and is not easy to cause electrochemical corrosion when powered on, thereby improving GDSH defects.

[0052] In some embodiments, Figure 4 As shown, the display panel further includes: an undercut structure 5 located in the peripheral area BB, and the undercut structure 5 (ie, the undercut structure) is closer to the display area AA than the first crack blocking structure 3 .

[0053] It should be noted that Figure 4 Only one undercut structure 5 is shown. In actual products, a plurality of undercut structures 5 are arranged side by side in the direction from the display area AA to the peripheral area BB of the display panel, and are all located in the peripheral area BB. Figure 4 The presence of one undercut structure 5 does not constitute a limitation to the present disclosure.

[0054] like Figure 4 As shown, the edge of the light-emitting layer EL farthest from the display area AA is located between the undercut structure 5 farthest from the display area AA and the first crack blocking structure 3; the edge of the electrode layer 4 farthest from the display area AA is located between the undercut structure 5 farthest from the display area AA and the first crack blocking structure 3.

[0055] In this embodiment, the undercut structure 5 is provided to separate the light emitting layer EL and the electrode layer 4, thereby further blocking the path of water vapor invading the display area AA along the light emitting layer EL, thereby improving the GDSH defect.

[0056] In some embodiments, Figure 4 As shown, the display panel further includes: an isolation column dam located in the peripheral area BB, the isolation column dam being closer to the display area AA than the first crack blocking structure 3. Optionally, the isolation column dam may be disposed between two adjacent undercut structures 5; or, the isolation column dam may also be disposed on a side of the undercut structure 5 close to the display area AA. Exemplarily, the isolation column dam is disposed between the undercut structure 5 closest to the display area AA and the undercut structure 5 adjacent to the undercut structure 5.

[0057] In some embodiments, the encapsulation layer 2 may be a single-layer structure or a multi-layer stacked structure.

[0058] like Figure 4As shown, the encapsulation layer 2 includes a first inorganic encapsulation layer CVD1, an organic encapsulation layer IJP1, and a second inorganic encapsulation layer CVD2 arranged in sequence in a direction away from the base substrate 1; the organic encapsulation layer IJP1 extends from the display area AA to the peripheral area BB, and ends at the side of the isolation column dam close to the display area AA. Here, the isolation column dam is used to prevent the overflow of the organic encapsulation layer IJP1 material. The first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 both extend from the display area AA to the peripheral area BB, and the edges of the first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 are both located between the undercut structure 5 farthest from the display area AA and the first crack blocking structure 3.

[0059] The first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 are easily cut to produce cracks. Compared with the traditional technology of laying the encapsulation layer 2 in a whole layer, the present embodiment shrinks the first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 so that the first crack blocking structure 3 is close to the side of the display area AA. The first crack blocking structure 3 no longer has an extended encapsulation layer 2 on the side away from the base substrate 1, thereby blocking the cracks from spreading along the first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 to the display area AA, thereby improving GDSH defects.

[0060] In some embodiments, Figure 4 As shown, the display panel also includes: an intermediate layer 6 arranged on the side of the light-emitting layer EL close to the base substrate 1; the intermediate layer 6 located in the peripheral area BB is formed with a plurality of dams 51 and undercut channels 52 between adjacent dams 51, and the adjacent dams 51 and the undercut channels 52 therebetween constitute an undercut structure 5.

[0061] Optionally, the intermediate layer 6 is a single inorganic layer or a stacked structure of multiple inorganic layers.

[0062] Optionally, the middle layer 6 is a multi-layer inorganic layer stacking structure, and the undercut channel 52 can be selected to penetrate or semi-penetrate the middle layer 6 , which can be specifically set according to whether the light emitting layer EL and the electrode layer 4 can be cut off in practice.

[0063] In this embodiment, the light emitting layer EL and the electrode layer 4 extending from the display area AA to the peripheral area BB can be cut by the step difference between the dam 51 and the undercut channel 52 adjacent thereto.

[0064] In some embodiments, Figure 4 As shown, a first protective layer 7 and a second protective layer 8 are disposed in the undercut channel 52 , the first protective layer 7 wraps at least a portion of the sidewall of the undercut channel 52 , and the second protective layer 8 covers the bottom wall of the undercut channel 52 .

[0065] In this embodiment, the first protective layer 7 is used to encapsulate the sidewall of the undercut channel 52, which can absorb energy and prevent the external collision from impacting the dam 51 (stacked inorganic layer) and causing cracks. The second protective layer 8 is used to encapsulate the film layer on the side of the undercut channel 52 close to the substrate 1 to prevent the over-etching of the undercut channel 52 during the etching process from affecting the lower film layer.

[0066] Optionally, the material of the first protective layer 7 may include but is not limited to organic materials, and the organic materials absorb energy to prevent cracks from occurring at the edge of the dam 51 (stacked inorganic layers).

[0067] Optionally, the material of the second protection layer 8 may include but is not limited to polysilicon (P-Si), and the polysilicon is used to prevent the undercut channel 52 from being over-etched and affecting the lower film layer.

[0068] In some embodiments, Figure 4 As shown, the undercut structure 5 also includes a cutting portion 53 arranged on the side of the dam 51 away from the substrate 1; the cutting portion 53 is arranged corresponding to the dam 51; the first protective layer 7 wraps part of the side wall of the undercut channel 52, and there is a distance between the surface of the first protective layer 7 away from the substrate 1 and the surface of the intermediate layer 6 away from the substrate 1; the end of the cutting portion 53 close to the undercut channel 52 is arranged on the surface of the first protective layer 7 away from the substrate 1, and protrudes from the first protective layer 7 along the direction in which the first protective layer 7 is away from the dam 51.

[0069] Here, the first protective layer 7 plays a role of supporting the cut portion 53 so as to support the cut portion 53 so that its end portion protrudes from the first protective layer 7 .

[0070] In this embodiment, under the premise of ensuring the step difference between the dam 51 and the adjacent undercut channel 52, a cutting portion 53 is further provided. The end of the cutting portion 53 protrudes from the first protective layer 7 to cut off the light-emitting layer EL and the electrode layer 4 that fall into the undercut channel 52, thereby ensuring complete cutting, thereby blocking the path for water vapor to invade the display area AA along the light-emitting layer EL, thereby improving GDSH defects.

[0071] Exemplarily, the shortest distance between two adjacent cutting portions 53 is approximately equal to the narrowest width of the undercut channel 52 .

[0072] Optionally, the first protective layer 7 wraps part of the side wall of the undercut channel 52, and the cutting portion 53 is arranged on the surface of the first protective layer 7 facing away from the substrate 1 near the end of the undercut channel 52. At this time, the cutting portion 53 falls into the undercut channel 52 and is connected to the first protective layer 7, and the two together encapsulate the side wall of the undercut channel 52.

[0073] In some embodiments, Figure 5 is a schematic diagram of another undercut structure, such as Figure 5 As shown, except Figure 4 In addition to the method of forming an undercut channel 52 in the concave middle layer 6 to cut off the light-emitting layer EL and the electrode layer 4, an undercut structure 5 can also be provided on the side of the middle layer 6 away from the base substrate 1, and the undercut structure 5 includes a first conductive part 5a, a second conductive part 5b and a third conductive part 5c arranged in sequence along a direction away from the base substrate 1; the first conductive part 5a and the third conductive part 5c both protrude from the second conductive part 5b, that is, the cross-sections of the first conductive part 5a, the second conductive part 5b and the third conductive part 5c are in the shape of an "I" to form an undercut structure 5 for cutting off the light-emitting layer EL and the electrode layer 4.

[0074] In some embodiments, Figure 4 As shown, the display panel also includes: an intermediate layer 6 arranged on the side of the light-emitting layer EL close to the base substrate 1; the intermediate layer 6 located in the peripheral area BB has a first opening 61, the opening direction of the first opening 61 is away from the base substrate 1, and the first crack blocking structure 3 is at least filled in the first opening 61.

[0075] Optionally, the middle layer 6 is a multi-layer inorganic layer stacking structure, and the first opening 61 can be selected to penetrate or semi-penetrate the middle layer 6. Specifically, the filling depth of the first crack blocking structure 3 (that is, the depth of the first opening 61) can be set according to whether the actual first crack blocking structure 3 can block cracks.

[0076] Exemplarily, the first opening 61 penetrates the intermediate layer 6, which is an inorganic layer. By interrupting the inorganic layer, the crack propagation path is interrupted; further, the first crack blocking structure 3 is filled in the first opening 61, and the first crack blocking structure 3 is used to absorb energy to prevent the crack from extending to the display area AA.

[0077] Exemplarily, the intermediate layer 6 at least includes a pixel defining layer. The pixel defining layer located in the display area has a plurality of pixel openings, and different pixel openings are used to define light-emitting layers of different light-emitting devices.

[0078] In some embodiments, the material of the intermediate layer 6 is an inorganic material, and the material of the first crack barrier structure 3 is an organic material. The organic material is used to absorb energy to prevent the crack from extending to the display area AA.

[0079] In some embodiments, Figure 4 As shown, the first crack blocking structure 3 includes a first blocking portion 31 and a second blocking portion 32 connected to the first blocking portion 31 . The first blocking portion 31 fills the first opening 61 , and the second blocking portion 32 is arranged on a side of the intermediate layer 6 away from the substrate 1 .

[0080] Optionally, the first barrier part 31 and the second barrier part 32 are connected as an integral structure, and the setting of the second barrier part 32 further encapsulates the contact position between the first barrier part 31 and the middle layer 6 to improve the connection strength. At the same time, compared with the first barrier part 31, the second barrier part 32 protrudes out of the middle layer 6 to further absorb energy and reduce the risk of crack propagation.

[0081] In some embodiments, Figure 6 A schematic diagram of a first crack barrier structure provided in an embodiment of the present disclosure, such as Figure 6 As shown, Figure 4 The difference between the first crack blocking structure 3 in FIG. 6 is that the first crack blocking structure 3 is only filled in the first opening 61 .

[0082] In some embodiments, the first crack barrier structure 3 is disposed on a side of the intermediate layer 6 facing away from the substrate 1. Figure 4 and Figure 6 The difference is that the first crack blocking structure 3 is arranged to protrude from the middle layer 6 (refer to the position of the second blocking portion 32, which is not illustrated in the figure).

[0083] In some embodiments, Figure 4 As shown, the display panel also includes: a first touch layer TMA, a touch insulation layer TLD and a second touch layer TMB, which are sequentially arranged on the encapsulation layer 2 in a direction away from the base substrate 1; at least one of the first touch layer TMA, the touch insulation layer TLD and the second touch layer TMB covers the first crack blocking structure 3.

[0084] Optionally, the first touch layer TMA covers the first crack blocking structure 3. The second touch layer TMB is away from the edge of the display area AA and the touch insulating layer TLD is away from the edge of the display area AA, and is closer to the display area AA than the first touch layer TMA is away from the edge of the display area AA.

[0085] Optionally, the touch insulating layer TLD covers the first crack blocking structure 3. The second touch layer TMB is away from the edge of the display area AA and the first touch layer TMA is away from the edge of the display area AA, which is closer to the display area AA than the touch insulating layer TLD is away from the edge of the display area AA.

[0086] Optionally, the second touch layer TMB covers the first crack blocking structure 3. The edge of the first touch layer TMA away from the display area AA and the edge of the touch insulating layer TLD away from the display area AA are closer to the display area AA than the edge of the second touch layer TMB away from the display area AA.

[0087] Optionally, the first touch layer TMA, the touch insulating layer TLD and the second touch layer TMB all cover the first crack blocking structure 3. The second touch layer TMB wraps the edge of the touch insulating layer TLD away from the display area AA, and the touch insulating layer TLD wraps the edge of the first touch layer TMA away from the display area AA.

[0088] In this embodiment, at least one of the first touch layer TMA, the touch insulating layer TLD and the second touch layer TMB is used to cover the first crack barrier structure 3 to encapsulate and protect the first crack barrier structure 3 and ensure the film bonding strength between the first crack barrier structure 3 and the intermediate layer 6.

[0089] In some embodiments, Figure 7 for Figure 3 The cross-sectional view of the second example in the A-A' direction is as follows: Figure 7 As shown, the display panel also includes: a third protective layer 9 arranged on the side of the intermediate layer 6 away from the display area AA, and the third protective layer 9 at least wraps the side wall of the intermediate layer 6 away from the display area AA. The present disclosure arranges the third protective layer 9 at the edge position of the display panel, and protects the side wall of the intermediate layer 6 by the third protective layer 9, thereby preventing cracks from occurring at the edge of the display panel.

[0090] Optionally, the third protective layer 9 is made of an organic material, which absorbs energy to prevent cracks from occurring at the edge of the display panel.

[0091] Alternatively, if Figure 7 As shown, the third protection layer 9 includes a first protection portion 91 and a second protection portion 92. The first protection portion 91 wraps the side wall of the intermediate layer 6 away from the display area AA, and the second protection portion 92 is arranged on the surface of the intermediate layer 6 away from the base substrate 1 and abuts against the touch insulation layer TLD, further protecting the end of the intermediate layer 6 away from the display area AA and preventing cracks from occurring at the edge of the intermediate layer 6.

[0092] Alternatively, if Figure 7 As shown, the first protection portion 91 and the second protection portion 92 are an integrally formed structure.

[0093] In some embodiments, Figure 8 for Figure 3 The cross-sectional view along the B-B' direction is shown in Figure 2. Figure 8 As shown, the display panel also has an opening area EE and a transition area DD surrounding the opening area EE, and the transition area DD is located between the opening area EE and the display area AA; the display panel also includes a second crack blocking structure 10 located in the transition area DD; the light-emitting layer EL and the encapsulation layer 2 both extend from the display area AA to the transition area DD, and terminate at the side of the second crack blocking structure 10 close to the display area AA.

[0094] The opening area EE is provided with an opening for accommodating devices such as a camera and a sensor.

[0095] The material of the light-emitting layer EL is very susceptible to water corrosion. Compared with the traditional technology of laying the light-emitting layer EL and the encapsulation layer 2 in a whole layer, for example, the light-emitting layer EL and the encapsulation layer 2 both extend from the display area AA to the transition area DD until they extend to the edge of the opening area EE, the present disclosure shrinks the edges of the light-emitting layer EL and the encapsulation layer 2 to the side of the second crack blocking structure 10 close to the display area AA, and there is no longer an extended light-emitting layer EL on the side of the second crack blocking structure 10 away from the base substrate 1, thereby blocking the path of water vapor invading the display area AA from the via along the light-emitting layer EL, thereby improving GDSH defects.

[0096] In addition, during the drilling process of the opening area EE, cracks are easily generated at the opening boundary, and the cracks will spread and extend to the display area AA along with the inorganic layers such as the intermediate layer 6, resulting in poor GDSH. The embodiment of the present disclosure arranges a second crack barrier structure 10 at the edge position adjacent to the opening area EE, and utilizes the second crack barrier structure 10 to absorb energy to prevent cracks from spreading from the opening boundary to the display area AA.

[0097] Optionally, the material of the second crack barrier structure 10 is an organic material, and the organic material absorbs energy to prevent cracks from spreading from the opening boundary to the display area AA.

[0098] Here, the second crack barrier structure 10 located in the transition area DD has the same design principle as the first crack barrier structure 3 located in the peripheral area BB. For details, please refer to the detailed description of the first crack barrier structure 3 in the above embodiment, and the repeated parts will not be repeated.

[0099] In some embodiments, Figure 8 As shown, the display panel further includes: an electrode layer 4 disposed on the side of the light emitting layer EL away from the base substrate 1; the electrode layer 4 extends from the display area AA to the transition area DD and ends at a side of the second crack barrier structure 10 close to the display area AA.

[0100] Here, the structure of the electrode layer 4 located in the transition area DD is the same as the structure of the electrode layer 4 located in the peripheral area BB. For details, please refer to the relevant description of the electrode layer 4 in the above embodiment, and the repeated parts will not be repeated.

[0101] In some embodiments, Figure 8 As shown, the display panel further includes: an undercut structure 5 located in the transition area DD, and the undercut structure 5 is closer to the display area AA than the second crack blocking structure 10 .

[0102] Here, the design principle of the undercut structure 5 located in the transition area DD is the same as that of the undercut structure 5 located in the peripheral area BB. For details, please refer to the relevant description of the undercut structure 5 in the above embodiment, and the repeated parts will not be repeated.

[0103] In some embodiments, Figure 8 As shown, the display panel further includes: an isolation column dam located in the transition area DD, and the isolation column dam is closer to the display area AA than the second crack blocking structure 10.

[0104] Here, the design principle of the isolation column dam located in the transition area DD is the same as that of the isolation column dam located in the peripheral area BB. For details, please refer to the relevant description of the isolation column dam in the above embodiment, and the repeated parts will not be repeated.

[0105] like Figure 8 As shown, the encapsulation layer 2 includes a first inorganic encapsulation layer CVD1, an organic encapsulation layer IJP1, and a second inorganic encapsulation layer CVD2, which are sequentially arranged in a direction away from the base substrate 1; the organic encapsulation layer IJP1 extends from the display area AA to the transition area DD, and terminates at the side of the isolation column dam close to the display area AA. Here, the isolation column dam is used to prevent the overflow of the organic encapsulation layer IJP1 material. The first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 both extend from the display area AA to the transition area DD, and the edges of the first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 are both located between the undercut structure 5 and the second crack blocking structure 10 farthest from the display area AA.

[0106] Here, the design principle of the encapsulation layer 2 located in the transition area DD is the same as that of the encapsulation layer 2 located in the peripheral area BB. For details, please refer to the relevant description of the encapsulation layer 2 in the above embodiment, and the repeated parts will not be repeated.

[0107] In some embodiments, Figure 4 or Figure 8 As shown, the display panel further includes a light shielding layer BSM disposed on the side of the intermediate layer 6 close to the base substrate 1, the light shielding layer BSM is at least partially located in the peripheral area BB, and the orthographic projection on the base substrate 1 overlaps with the orthographic projection of the first crack blocking structure 3 on the base substrate 1. Optionally, the material of the light shielding layer BSM may include but is not limited to molybdenum (Mo).

[0108] In some embodiments, Figure 4 or Figure 8 As shown, the display panel further includes a metal wiring 11 penetrating the middle layer 6 , and the metal wiring 11 can be reused as a source / drain electrode line of a thin film transistor, or a touch control lead, etc.

[0109] Alternatively, if Figure 4 or Figure 8As shown, the metal wiring 11 is electrically connected to other structures (such as a driver chip or a sensor driver device, etc.) across layers through the first opening 61 for transmitting signals.

[0110] In some embodiments, Figure 4 or Figure 8 As shown, the display panel also includes a touch protection layer TOC and a fourth protection layer IJP2 arranged on the side of the second touch layer TMB away from the touch insulation layer TLD; the touch protection layer TOC wraps the film layer structure close to the base substrate 1, and the fourth protection layer IJP2 wraps the touch protection layer TOC.

[0111] Optionally, the material of the touch protection layer TOC is an inorganic material, and the material of the fourth protection layer IJP2 is an organic material.

[0112] In some embodiments, the display panel may be a flexible display panel.

[0113] In some embodiments, the display panel further includes a driving circuit layer (not shown) disposed on the side of the light emitting layer EL close to the base substrate 1, and the driving circuit layer includes a pixel driving circuit for driving the light emitting device. The light emitting device disclosed in the present invention is, for example, an OLED light emitting device.

[0114] In addition, the embodiment of the present disclosure further provides a method for preparing a display panel, including steps S11 to S12, wherein: S11, providing a base substrate 1; the base substrate 1 has a display area AA and a peripheral area BB surrounding the display area AA.

[0115] For example, the material of the substrate 1 may include but is not limited to polyimide (PI), polyethylene naphthalene-2,6-dicarboxylate (PEN), polyethylene terephthalate (PET), a flexible plastic colorless polyimide (CPI), thermoplastic urethane (TUP) or ultra-thin glass (UTG). The substrate 1 may also be made of a rigid and transparent material such as glass, which can effectively support other film layers thereon. In practical applications, a suitable material can be selected according to actual needs. Exemplarily, the substrate 1 may be a single-layer structure or a multi-layer structure. The substrate 1 of the multi-layer structure may add an inorganic thin film between the layers to act as a buffer layer, and the material of the buffer layer may be a layer or a combination of multiple layers of amorphous silicon (a-Si), silicon nitride (SiNx), and silicon oxide (SiOx).

[0116] S12 , forming a first crack barrier structure 3 , a light emitting layer EL and an encapsulation layer 2 on the base substrate 1 .

[0117] The first crack barrier structure 3 is located in the peripheral area BB; the light emitting layer EL and the encapsulation layer 2 both extend from the display area AA to the peripheral area BB and terminate at a side of the first crack barrier structure 3 close to the display area AA.

[0118] Optionally, while forming the first crack barrier structure 3, the second crack barrier structure 10 is formed in the transition region DD. The material of the first crack barrier structure 3 is the same as that of the second crack barrier structure 10, and can be prepared by a single patterning process.

[0119] In some embodiments, before forming the first crack barrier structure 3 , the light emitting layer EL and the encapsulation layer 2 , an intermediate layer 6 material is formed on the base substrate 1 , and a pattern including the intermediate layer 6 is formed through a patterning process.

[0120] Optionally, the intermediate layer 6 located in the peripheral area BB is formed with a plurality of dams 51 and undercut channels 52 between adjacent dams 51 , wherein adjacent dams 51 and the undercut channels 52 therebetween constitute an undercut structure 5 .

[0121] Optionally, the intermediate layer 6 located in the peripheral area BB has a first opening 61 , and the opening direction of the first opening 61 is away from the substrate 1 .

[0122] In some embodiments, before forming the intermediate layer 6 , the method further includes: forming a pattern including a second protective layer 8 on the base substrate 1 through a patterning process. The second protective layer 8 is disposed corresponding to the undercut trench 52 .

[0123] In some embodiments, after forming the intermediate layer 6 , the method further includes: forming a pattern including the first protective layer 7 and the first crack blocking structure 3 on a side of the intermediate layer 6 away from the substrate 1 through a single patterning process.

[0124] The material of the first protection layer 7 is the same as that of the first crack blocking structure 3 and can be simultaneously prepared and formed through a single patterning process.

[0125] The first crack blocking structure 3 at least fills the first opening 61 . The first protection layer 7 wraps at least a portion of the sidewall of the undercut trench 52 .

[0126] In some embodiments, after forming the intermediate layer 6 , the method further includes: forming a pattern including the first protective layer 7 , the first crack blocking structure 3 and the third protective layer 9 on the side of the intermediate layer 6 facing away from the substrate 1 through a single patterning process.

[0127] The material of the first protective layer 7 , the material of the first crack blocking structure 3 and the material of the third protective layer 9 are the same and can be simultaneously prepared and formed through a single patterning process.

[0128] In some embodiments, after forming the first protective layer 7, the first crack blocking structure 3 and the third protective layer 9, the method further includes: forming a pattern including a plurality of cutting portions 53 on the side of the intermediate layer 6 away from the substrate 1 through a patterning process. The cutting portions 53 are arranged corresponding to the dam 51; the end of the cutting portion 53 close to the undercut channel 52 is arranged on the surface of the first protective layer 7 away from the substrate 1, and protrudes from the first protective layer 7 along the direction in which the first protective layer 7 is away from the dam 51.

[0129] In some embodiments, after forming the plurality of cutting portions 53 , the method further includes: forming a pattern including the light emitting layer EL on a side of the cutting portion 53 away from the intermediate layer 6 through a patterning process.

[0130] For example, the EL material of the light emitting layer may be deposited as a whole layer, and then the EL material of the light emitting layer located on the side of the first crack blocking structure 3 and the second crack blocking structure 10 away from the substrate 1 is etched away by an etching process to form the light emitting layer EL.

[0131] In some embodiments, after forming the light emitting layer EL, the method further includes: forming a pattern including the encapsulation layer 2 on the side of the light emitting layer EL away from the base substrate 1 through a patterning process.

[0132] Exemplarily, the encapsulation layer 2 includes a first inorganic encapsulation layer CVD1, an organic encapsulation layer IJP1, and a second inorganic encapsulation layer CVD2, which are sequentially arranged in a direction away from the base substrate 1. The first inorganic encapsulation layer CVD1 material can be deposited as a whole layer, and then the first inorganic encapsulation layer CVD1 material located on the side of the first crack blocking structure 3 and the second crack blocking structure 10 away from the base substrate 1 is etched away by an etching process to form the first inorganic encapsulation layer CVD1. Next, the organic encapsulation layer IJP1 material can be deposited as a whole layer, and then the organic encapsulation layer IJP1 material located on the side of the isolation column dam away from the display area AA is etched away by an etching process to form the organic encapsulation layer IJP1. Next, the second inorganic encapsulation layer CVD2 material can be deposited as a whole layer, and then the second inorganic encapsulation layer CVD2 material located on the side of the first crack blocking structure 3 and the second crack blocking structure 10 away from the base substrate 1 is etched away by an etching process to form the second inorganic encapsulation layer CVD2.

[0133] In some embodiments, after the encapsulation layer 2 is formed, the method further includes: sequentially forming a first touch layer TMA, a touch insulating layer TLD, and a second touch layer TMB on a side of the encapsulation layer 2 facing away from the base substrate 1 .

[0134] Optionally, at least one of the first touch layer TMA, the touch insulating layer TLD and the second touch layer TMB covers the first crack blocking structure 3 .

[0135] Optionally, at least one of the first touch layer TMA, the touch insulating layer TLD and the second touch layer TMB covers the second crack blocking structure 10 .

[0136] In addition, the embodiment of the present disclosure also provides another method for preparing a display panel, including S21-S22, wherein: S21, a base substrate 1, a first crack blocking structure 3, a light-emitting layer EL and an encapsulation layer 2 are sequentially formed on a supporting substrate to form a display motherboard including a plurality of display panels. The display motherboard has a display panel area and a cutting channel area CC surrounding the display panel area. The touch protection layer TOC and the fourth protection layer IJP2 extend from the display panel area to the cutting channel area CC.

[0137] S22, cutting the display motherboard to form a plurality of display panels.

[0138] The first crack barrier structure 3 is located in the peripheral area BB; the light emitting layer EL and the encapsulation layer 2 both extend from the display area AA to the peripheral area BB and terminate at a side of the first crack barrier structure 3 close to the display area AA.

[0139] In addition, an embodiment of the present disclosure further provides a display device, which includes the display panel of any one of the above embodiments.

[0140] In some embodiments, the display device may be a flexible display device. For example, the display device may be any product with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a vehicle-mounted device, etc. Other essential components of the display device are well understood by those skilled in the art, and are not described in detail here, nor should they be used as a limitation to the present disclosure.

[0141] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present disclosure, but the present disclosure is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and substance of the present disclosure, and these modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A display panel comprising a display area and a peripheral area surrounding the display area; characterized in that: The display panel comprises: a base substrate, and a light emitting layer and an encapsulation layer arranged in sequence in a direction away from the base substrate; The display panel further includes a first crack blocking structure located in the peripheral area; the light emitting layer and the encapsulation layer both extend from the display area to the peripheral area and terminate at a side of the first crack blocking structure close to the display area.

2. The display panel according to claim 1, characterized in that: The display panel further comprises: an electrode layer arranged on a side of the light emitting layer away from the base substrate; The electrode layer extends from the display area to the peripheral area and ends at a side of the first crack barrier structure close to the display area.

3. The display panel according to claim 2, characterized in that: The display panel further includes: an undercut structure located in the peripheral area, and the undercut structure is closer to the display area than the first crack blocking structure; The edge of the light-emitting layer farthest from the display area is located between the undercut structure farthest from the display area and the first crack blocking structure; the edge of the electrode layer farthest from the display area is located between the undercut structure farthest from the display area and the first crack blocking structure.

4. The display panel according to claim 3, characterized in that: The display panel further includes: an isolation column located in the peripheral area, the isolation column being closer to the display area than the first crack blocking structure; The encapsulation layer comprises a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer which are sequentially arranged in a direction away from the substrate; The organic encapsulation layer extends from the display area to the peripheral area and ends at a side of the isolation column close to the display area; The first inorganic encapsulation layer and the second inorganic encapsulation layer both extend from the display area to the peripheral area, and edges of the first inorganic encapsulation layer and the second inorganic encapsulation layer are both located between the undercut structure farthest from the display area and the first crack blocking structure.

5. The display panel according to claim 3, characterized in that: The display panel further comprises: an intermediate layer arranged on a side of the light emitting layer close to the base substrate; The intermediate layer located in the peripheral area is formed with a plurality of dams and undercut channels between adjacent dams, and the adjacent dams and the undercut channels therebetween constitute the undercut structure.

6. The display panel according to claim 5, characterized in that: A first protective layer and a second protective layer are disposed in the undercut channel, wherein the first protective layer wraps at least a portion of the sidewall of the undercut channel, and the second protective layer covers the bottom wall of the undercut channel.

7. The display panel according to claim 6, characterized in that: The undercut structure further comprises a cutting portion arranged on a side of the dam away from the substrate; the cutting portion is arranged corresponding to the dam; The first protection layer wraps a portion of the sidewall of the undercut channel, and a surface of the first protection layer away from the substrate is spaced apart from a surface of the intermediate layer away from the substrate; The cutting portion is disposed at an end portion of the undercut channel that is close to the undercut channel on a surface of the first protection layer that is away from the base substrate, and protrudes from the first protection layer along a direction in which the first protection layer is away from the dam.

8. The display panel according to claim 1, characterized in that: The display panel further comprises: an intermediate layer arranged on a side of the light emitting layer close to the base substrate; The intermediate layer located in the peripheral region has a first opening, the opening direction of the first opening is away from the substrate, and the first crack blocking structure is at least filled in the first opening.

9. The display panel according to claim 8, characterized in that: The first crack blocking structure includes a first blocking portion and a second blocking portion connected to the first blocking portion, the first blocking portion is filled into the first opening, and the second blocking portion is arranged on a side of the intermediate layer away from the base substrate.

10. The display panel according to claim 8, characterized in that: The material of the intermediate layer is an inorganic material, and the material of the first crack barrier structure is an organic material.

11. The display panel according to claim 8, characterized in that: The display panel further includes: a first touch layer, a touch insulating layer, and a second touch layer which are sequentially arranged on the encapsulation layer in a direction away from the base substrate; At least one of the first touch layer, the touch insulation layer and the second touch layer covers the first crack blocking structure.

12. The display panel according to claim 8, characterized in that: The display panel further includes: a third protective layer disposed on a side of the intermediate layer away from the display area, wherein the third protective layer at least wraps a side wall of the intermediate layer away from the display area.

13. The display panel according to claim 1, characterized in that: The display panel further comprises an opening area and a transition area surrounding the opening area, wherein the transition area is located between the opening area and the display area; The display panel further includes a second crack blocking structure located in the transition region; the light emitting layer and the encapsulation layer both extend from the display region to the transition region and terminate at a side of the second crack blocking structure close to the display region.

14. A display device, characterized in that: It comprises the display panel as claimed in any one of claims 1 to 13.

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