Display module and display device

Abstract

The utility model discloses a display module and a display device. The display module comprises a display substrate; the cover plate is arranged on the light emitting side of the display substrate; the protection frame comprises a bottom wall and a side wall connected with the bottom wall, and the bottom wall is located on the side, away from the cover plate, of the display substrate; the side wall is connected with the cover plate, a containing space is defined by the side wall, the cover plate and the bottom wall, and the display substrate is located in the containing space; the orthographic projection of the protection frame on a reference plane perpendicular to the thickness direction of the cover plate is located in the orthographic projection range of the cover plate on the reference plane.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] In an OLED (Organic Light-Emitting Diode) display module, a support layer is usually provided on the backlight side of a display substrate. In current display modules, during the process of laminating the support layer to the display substrate, surface defects such as orange peel texture are easily generated on the display substrate. Utility Model Content

[0003] The present disclosure aims to solve at least one of the technical problems existing in the prior art, and proposes a display module and a display device.

[0004] In order to achieve the above object, the present disclosure provides a display module, comprising:

[0005] Display substrate;

[0006] A cover plate, the cover plate being arranged on the light emitting side of the display substrate;

[0007] a protection frame, the protection frame comprising a bottom wall and a side wall connected to the bottom wall, the bottom wall being located on a side of the display substrate away from the cover plate; the side wall being connected to the cover plate, and defining a receiving space with the cover plate and the bottom wall, the display substrate being located in the receiving space;

[0008] The orthographic projection of the protection frame on a reference plane perpendicular to the thickness direction of the cover plate is located within the range of the orthographic projection of the cover plate on the reference plane.

[0009] In some embodiments, the sidewall is a continuous ring structure surrounding the display substrate.

[0010] In some embodiments, the bottom wall is provided with an opening, and the display module further comprises:

[0011] A driving circuit board, the driving circuit board is located on a side of the bottom wall away from the cover plate;

[0012] A connection structure passes through the opening, and two ends of the connection structure are electrically connected to the display substrate and the driving circuit board respectively.

[0013] In some embodiments, the display substrate is a flexible display substrate and includes a display portion, a driving portion, and a bending portion connected between the display portion and the driving portion, the display portion is arranged opposite to the cover plate, the driving portion is located on a side of the display portion away from the cover plate, and is electrically connected to the connecting structure; the bending portion does not contact the protective frame.

[0014] In some embodiments, the display module further includes:

[0015] a first back film, the first back film being arranged on a surface of the display portion facing the bottom wall;

[0016] a second backing film, the second backing film being arranged on a surface of the driving part away from the bottom wall;

[0017] A support portion, wherein the support portion is located between the first back film and the second back film, and an orthographic projection of the support portion on the cover plate is located within a range of an orthographic projection of the second back film on the cover plate.

[0018] In some embodiments, the bottom wall includes a first sub-wall, a second sub-wall, and a connecting sub-wall connected between the first sub-wall and the second sub-wall, and the first sub-wall and the second sub-wall are both connected to the side wall; the driving circuit board is located on a side of the first sub-wall away from the cover plate; the connecting structure includes a connecting portion electrically connected to the display substrate, and the connecting portion is located on a side of the second sub-wall facing the cover plate; the opening is provided on the connecting sub-wall;

[0019] Wherein, the distance between the first sub-wall and the cover plate is less than or equal to the distance between the second sub-wall and the cover plate.

[0020] In some embodiments, any one of the display substrate and the connection structure has no contact with the second sub-wall.

[0021] In some embodiments, an air gap exists between the first sub-wall and the display substrate.

[0022] In some embodiments, the display module includes a plurality of connected driving circuit boards, and the connection structure is electrically connected to one of the driving circuit boards;

[0023] Wherein, a support column is arranged between at least one of the driving circuit boards and the bottom wall, and two ends of the support column are respectively connected to the driving circuit board and the bottom wall.

[0024] In some embodiments, the display module further includes a mounting post, the mounting post is fixed to a surface of the bottom wall facing away from the cover plate, and the mounting post has no overlap with an orthographic projection of the driving circuit board on the cover plate.

[0025] In some embodiments, at least one of a buffer layer and a heat insulation layer is disposed on a side of the bottom wall facing the display substrate.

[0026] In some embodiments, the display substrate includes a display area, and the cover plate includes: a light-transmitting area arranged opposite to the display area and a light-shielding area surrounding the light-transmitting area; the orthographic projection of the side wall on the cover plate is located in the light-shielding area.

[0027] In some embodiments, a surface of at least one of the bottom wall and the side wall is provided with a functional layer, and the functional layer includes at least one of an antistatic layer, an electrostatic shielding layer, and a flame retardant layer.

[0028] In some embodiments, an adhesive layer is disposed between the side wall and the cover plate.

[0029] In some embodiments, the bonding layer includes at least one of a buffer adhesive layer, a thermal conductive adhesive layer, and an electrically conductive adhesive layer.

[0030] In some embodiments, the material of the protection frame includes any one of a metal material, a polymer composite material, and a ceramic-based material.

[0031] The embodiment of the present disclosure further provides a display device, comprising the above-mentioned display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0033] Figure 1 FIG. 4 is a plan view of a display module provided in some embodiments.

[0034] Figure 2 For along Figure 1 Sectional view along line A-A'.

[0035] Figure 3 FIG. 1 is a plan view of a display module provided in some other embodiments.

[0036] Figure 4 For along Figure 3 Cross-sectional view along line BB'.

[0037] Figure 5 It is a rear view of a display module provided in some embodiments of the present disclosure.

[0038] Figure 6 For along Figure 5 Cross-sectional view along line C-C'.

[0039] Figure 7Schematic diagram of the positions of the side walls of the protection frame, the display substrate, and the cover plate provided in some embodiments of the present disclosure.

[0040] Figure 8 It is a rear view of a display module provided in some other embodiments of the present disclosure.

[0041] Fig. 9 For along Figure 8 Sectional view along line D-D'.

[0042] Fig.10 A schematic diagram of the position of a buffer layer provided in some embodiments of the present disclosure.

[0043] Fig.11 Another schematic diagram of the position of the buffer layer provided in some embodiments of the present disclosure.

[0044] Fig.12 It is a cross-sectional view of a display module provided in some other embodiments of the present disclosure.

[0045] Fig.13 It is a rear view of a display module provided in some further embodiments of the present disclosure.

[0046] Fig.14 This is a schematic diagram of the membrane layer of the bottom wall provided in some embodiments of the present disclosure.

[0047] Fig.15 Schematic diagram of the membrane layer of the bottom wall provided in some other embodiments of the present disclosure.

[0048] Fig.16 This is a schematic diagram of a display unit provided in some embodiments of the present disclosure. DETAILED DESCRIPTION

[0049] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0050] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0051] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not represent any order, quantity or importance, but are only used to distinguish different components. Similarly, "including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0052] As used herein, "parallel" and "perpendicular" include the described situation and the situation similar to the described situation, and the range of the similar situation is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the error associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°.

[0053] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0054] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include deviations in shape due to, for example, manufacturing. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0055] Figure 1 is a plan view of a display module provided in some embodiments, Figure 2 For along Figure 1 The cross-sectional view of the A-A' line is as follows: Figure 1 and Figure 2As shown, the display module includes: a display substrate 10, an optical function layer 60, a cover plate 20, a back film 52, a support layer 50, a connection structure 30 and a driving circuit board 40. The cover plate 20 is arranged on the light-emitting side of the display substrate 10, the optical function layer 60 is arranged between the cover plate 20 and the display substrate 10, and the optical function layer 60 is, for example, a polarizer, and an optical adhesive layer 61 is arranged between the optical function layer 60 and the cover plate 20. The back film 52 is arranged on the side of the display substrate 10 away from the cover plate 20, and the support layer 50 is arranged on the side of the back film 52 away from the display substrate 10, which is used to support the display substrate 10 to improve the structural stability and impact resistance of the display substrate 10. One end of the connection structure 30 is electrically connected to the display substrate 10, and the other end is electrically connected to the driving circuit board 40, wherein the connection structure 30 can be a flexible circuit board (FPC) or a chip on film (COF). The driving circuit board 40 is located on the side of the support layer 50 away from the display substrate 10. For example, the driving circuit board 40 is fixed to the side of the support layer 50 away from the display substrate 10 through the first adhesive layer 70. The driving circuit board 40 is used to provide a driving signal to the display substrate 10, and the connecting structure 30 provides the driving signal to the display substrate 10 to drive the display substrate 10 to display.

[0056] Figure 3 is a plan view of a display module provided in some other embodiments, Figure 4 For along Figure 3 The cross-sectional view of the B-B' line is as follows: Figure 3 and Figure 4 As shown, in other embodiments, the display module includes: a display substrate 10, an optical function layer 60, a cover plate 20, a first back film 53, a second back film 54, a support layer 50, a connection structure 30 and a driving circuit board 40. Among them, the display substrate 10 includes a display part 11, a bending part 12 and a driving part 13 connected in sequence, the cover plate 20 is arranged on the light emitting side of the display part 11, and the driving part 13 is located on the side of the display part 11 away from the cover plate 20. A protective layer 71 may be arranged on the outer side of the bending part 12 to protect the signal line on the bending part 12. The optical function layer 60 is arranged between the cover plate 20 and the display substrate 10, and the optical function layer 60 is, for example, a polarizer, and an optical adhesive layer 61 is arranged between the optical function layer 60 and the cover plate 20. The first back film 53 is disposed on the surface of the display unit 11 away from the cover plate 20, the second back film 54 is disposed on the surface of the driving unit 13 facing the cover plate 20, the support layer 50 is located on the side of the first back film 53 facing the second back film 54, and the support layer 50 is used to support the display unit 11. One end of the connection structure 30 is electrically connected to the display substrate 10, and the other end is electrically connected to the driving circuit board 40, and the driving circuit board 40 is located on the side of the support layer 50 away from the display substrate 10. The connection structure 30 can be a flexible circuit board (FPC) or a chip on film (COF).

[0057] exist Figure 2 and Figure 4 In the embodiment, the support layer 50 can be made of a rigid material with relatively high strength, such as metal; Figure 2 In the embodiment, the support layer 50 is bonded to the back film 52 through the second bonding layer 51. Figure 4 In the embodiment, the support layer 50 is bonded to the first back film 53 through the second bonding layer 51. However, for a display module with a larger size, the uniformity of the second bonding layer 51 is poor, so that after the support layer 50 is attached, it is easy to cause surface defects such as orange peel on the display substrate 10.

[0058] In order to solve the above technical problems, the present disclosure provides a display module. Figure 5 is a rear view of a display module provided in some embodiments of the present disclosure, Figure 6 For along Figure 5 The cross-sectional view of the C-C' line, Figure 7 Schematic diagram of the positions of the side walls of the protection frame, the display substrate, and the cover plate provided in some embodiments of the present disclosure.

[0059] like Figure 5 and Figure 6 As shown, the display module includes: a display substrate 10, a cover plate 20 and a protective frame 80. In one example, the display substrate 10 can be a flexible display substrate. The cover plate 20 is arranged on the light-emitting side of the display substrate 10, and the orthographic projection of the cover plate 20 on the reference plane covers and exceeds the orthographic projection of the display substrate 10 on the reference plane, and the reference plane is a plane perpendicular to the thickness direction of the cover plate 20. The protective frame 80 includes a bottom wall 81 and a side wall 82 connected to the bottom wall 81, and the bottom wall 81 is located on the side of the display substrate 10 away from the cover plate 20; the side wall 82 is connected to the cover plate 20, for example, the side wall 82 is bonded to the cover plate 20. Among them, the bottom wall 81, the side wall 82 and the cover plate 20 define a receiving space sp, and the display substrate 10 is located in the receiving space sp. The orthographic projection of the protective frame 80 on the reference plane is located within the orthographic projection range of the cover plate 20 on the reference plane.

[0060] In the embodiment of the present disclosure, by providing the protection frame 80, the bottom wall 81, the side wall 82 and the cover plate 20 of the protection frame 80 form a receiving space sp for receiving the display substrate 10, so that the display substrate 10 can be protected, the impact resistance of the display substrate 10 is improved, and the display substrate 10 is prevented from being damaged. Figure 2 and Figure 4 Compared with the supporting layer 50 in the embodiment of the present invention, the protection frame 80 is connected to the cover plate 20, and there is no need to provide an adhesive layer between the protection frame 80 and the display substrate 10, thereby avoiding the problem of surface defects of the display substrate 10 caused by the uneven thickness of the adhesive layer.

[0061] In some embodiments, the protection frame 80 may be made of a relatively strong rigid material, such as a metal material, or a polymer composite material, a ceramic-based material, or the like.

[0062] In some embodiments, the protection frame 80 and the display substrate 10 may not be in contact with each other to prevent the display substrate 10 from being damaged by an interaction force generated therebetween.

[0063] In some embodiments, there may be a gap between the orthographic projection boundary of the protection frame 80 on the cover plate 20 and the edge of the cover plate 20 ; or, the orthographic projection boundary of the protection frame 80 on the cover plate 20 coincides with the edge of the cover plate 20 .

[0064] In some embodiments, Figure 7 As shown, the side wall 82 is a continuous ring structure surrounding the display substrate 10, thereby improving the protection effect of the display substrate 10. For example, the orthographic projection of the display substrate 10 on the cover plate 20 is a rectangle, and accordingly, the orthographic projection of the side wall 82 on the cover plate 20 is a rectangular ring structure.

[0065] In some embodiments, the side wall 82 of the protective frame 80 can be bonded to the cover plate 20 through an adhesive layer 83, wherein the adhesive layer 83 can include at least one of a buffer adhesive layer, a thermal conductive adhesive layer, and a conductive adhesive layer. For example, the adhesive layer 83 includes a buffer adhesive layer. In this case, when the protective frame 80 is impacted by the outside world, the adhesive layer 83 can buffer the force between the protective frame 80 and the cover plate 20 to prevent the cover plate 20 from being damaged. For another example, the adhesive layer 83 can include a conductive adhesive layer. In this case, the protective frame 80 can be connected to the ground terminal in the display product, so that the static electricity on the cover plate 20 can be introduced into the ground terminal to prevent the static electricity accumulated on the cover plate 20 from affecting the performance and display effect of the display substrate 10. For another example, the adhesive layer 83 can include a thermal conductive adhesive layer. In this case, the heat generated by the display substrate 10 can be evenly dispersed through the cover plate 20 and the thermal conductive adhesive layer to prevent local overheating.

[0066] In some embodiments, Figure 5 and Figure 6 As shown, the display module also includes: a driving circuit board 40 and a connecting structure 30, and the two ends of the connecting structure 30 are electrically connected to the display substrate 10 and the driving circuit board 40 respectively. Among them, the display module can be used in a display device. In addition to the display module, the display device can also include a driving main board and a mounting shell and other structures. The driving main board is electrically connected to the driving circuit board 40 to provide a control signal to the driving circuit board 40. The driving circuit board 40 generates a driving signal according to the control signal and drives the display substrate 10 to display through the connecting structure 30. Among them, as Figure 5 and Figure 6As shown, a connector 41 may be provided on the driving circuit board 40, and the driving circuit board 40 may be electrically connected to the driving main board of the display device through the connector 41. The connecting structure 30 may be a flexible circuit board or a chip-on-film. Figure 6 In the figure, the connection structure 30 is a flip chip film as an example for illustration. The connection structure 30 may specifically include a circuit board 32 and a driving chip 31 disposed on the circuit board 32 .

[0067] It should be noted that the display substrate 10 has a display area and a binding area located at least on one side of the display area, and a binding pad is provided in the binding area. The electrical connection between the connection structure 30 and the display substrate 10 means that the connection structure 30 is electrically connected to the binding pad. Figure 5 and Figure 6 As shown, the driving circuit board 40 is located on the side of the bottom wall 81 away from the cover plate 20. An opening V1 is provided on the bottom wall 81 of the protection frame 80, and the connecting structure 30 passes through the opening V1.

[0068] Since a large number of electronic components are arranged on the driving circuit board 40, these electronic components will generate a large amount of heat when the driving circuit board 40 provides driving signals to the display substrate 10. The embodiment of the present disclosure arranges the driving circuit board 40 on the side of the bottom wall 81 away from the cover plate 20, thereby reducing the impact of the heat of the driving circuit board 40 on the display substrate 10.

[0069] Furthermore, an air gap s1 is provided between at least a portion of the display substrate 10 and the bottom wall 81 of the protection frame 80, thereby further reducing the influence of the heat of the driving circuit board 40 on the display substrate 10. Of course, in other embodiments, a heat insulating layer with a low thermal conductivity coefficient may also be provided between the bottom wall 81 of the protection frame 80 and the display substrate 10.

[0070] In some embodiments, the bottom wall 81 includes a first sub-wall 811, a second sub-wall 812, and a connecting sub-wall 813 connected between the first sub-wall 811 and the second sub-wall 812. The first sub-wall 811 and the second sub-wall 812 are both connected to the side wall 82, and the first sub-wall 811, the second sub-wall 812 and the connecting sub-wall 813 can be an integrally formed structure. Exemplarily, the first sub-wall 811 and the second sub-wall 812 are both parallel to the cover plate 20, and the connecting sub-wall 813 is perpendicular to the first sub-wall 811 and the second sub-wall 812. The opening V1 is set on the connecting sub-wall 813. The number of the connecting structures 30 can be one or more. When the number of the connecting structures 30 is multiple, the number of the openings V1 can be one, and multiple connecting structures 30 pass through the same opening V1; or, the number of the openings V1 is multiple, and the connecting structures 30 correspond to the openings V1 one by one.

[0071] The driving circuit board 40 is located on the side of the first sub-wall 811 away from the cover plate 20; the connecting structure 30 includes a connecting portion electrically connected to the display substrate 10, and the connecting portion is located on the side of the second sub-wall 812 facing the cover plate 20. The distance h1 between the first sub-wall 811 and the cover plate 20 is smaller than the distance h2 between the second sub-wall 812 and the cover plate 20, thereby saving the space occupied by the display module in the entire display product. Of course, in other embodiments, the distance h1 between the first sub-wall 811 and the cover plate 20 can also be equal to the distance h2 between the second sub-wall 812 and the cover plate 20, that is, the bottom wall 81 is a flat plate structure as a whole.

[0072] In some embodiments, an air gap s1 exists between the first sub-wall 811 and the display substrate 10 , thereby further reducing the influence of the heat of the driving circuit board 40 on the display substrate 10 .

[0073] In some embodiments, any one of the display substrate 10 and the connection structure 30 is not in contact with the second sub-wall 812. It should be noted that the display substrate 10 includes a base substrate and electronic components such as signal lines, thin film transistors, capacitors, and pads disposed on the base substrate. Similarly, the connection structure 30 also includes a flexible substrate and a plurality of electronic components disposed on the flexible substrate. Any one of the display substrate 10 and the connection structure 30 is not in contact with the second sub-wall 812 means that the base substrate and the electronic components of the display substrate 10, and the flexible substrate and the electronic components of the connection structure 30 are not in contact with the second sub-wall 812.

[0074] like Figure 5 and Figure 6 As shown, in some embodiments, the display substrate 10 is a flexible display substrate, and includes a display portion 11, a driving portion 13, and a bending portion 12 connected between the display portion 11 and the driving portion 13. The display portion 11 is arranged opposite to the cover plate 20, and the driving portion 13 is located on the side of the display portion 11 away from the cover plate 20, and is electrically connected to the connection structure 30. Among them, the display portion 11 is used for image display; the driving portion 13 is provided with a binding pad, and the binding pad is connected to the connection structure 30; the orthographic projection of the driving portion 13 on the cover plate 20 is located within the orthographic projection range of the second sub-wall 812 on the cover plate 20. The bending portion 12 is provided with a connecting wire, and the connecting wire transmits the signal received on the binding pad to the display portion 11 for image display.

[0075] The curved portion 12 is not in contact with the protective frame 80. For example, when the side wall 82 of the protective frame 80 is an annular structure, there is a gap between the side wall 82 and the curved portion 12 to prevent the curved portion 12 from being hit due to process errors during the alignment and connection of the protective frame 80 and the cover plate 20, thereby preventing the connection line on the curved portion 12 from being damaged.

[0076] Among them, and Figure 4akin, Figure 6 A protective layer can also be provided on the outside of the curved portion 12 ( Figure 6 (not shown) to protect the signal line on the bent portion 12.

[0077] In some embodiments, there may be a gap between the display portion 11 and the side wall 82 of the protection frame 80 to prevent the display portion 11 from being hit due to process errors during the alignment and connection of the protection frame 80 and the cover plate 20 .

[0078] In some embodiments, the display module further includes: a first back film 53 and a second back film 54, wherein the first back film 53 is disposed on the surface of the display portion 11 facing the bottom wall 81; the second back film 54 is disposed on the surface of the driving portion 13 facing away from the bottom wall 81; and the support portion 55 is located between the first back film 53 and the second back film 54. The orthographic projection of the support portion 55 on the cover plate 20 may be within the orthographic projection range of the second back film 54 on the cover plate 20. In one example, the support portion 55 may be made of materials such as foam glue.

[0079] In some embodiments, Figure 6 As shown, a filling space s2 is formed between the bending portion 12 , the first back film 53 , the second back film 54 and the supporting portion 55 . The filling space s2 may be a cavity or may be provided with a filling glue, so as to support the bending portion 12 .

[0080] In some embodiments, the first back film 53 includes a first portion and a second portion, the first portion of the first back film 53 is disposed opposite to the first sub-wall 811, and the second portion of the first back film 53 is disposed opposite to the second sub-wall 812. The second portion is bonded to the support portion 55, an air gap s1 is formed between the first portion of the first back film 53 and the first sub-wall 811, and the first portion of the first back film 53 is in contact with the air gap s1, that is, the first portion of the first back film 53 away from the side of the cover plate 20 is no longer connected to other film layers.

[0081] Figure 8 is a rear view of a display module provided in some other embodiments of the present disclosure, Fig. 9 For along Figure 8 The cross-sectional view of the D-D' line is as follows: Figure 8 and Fig. 9 As shown, the display module may further include a buffer layer 84, which is disposed on the side of the bottom wall 81 facing the display substrate 10. The buffer layer 84 can reduce or prevent the protective frame 80 from squeezing the display substrate 10 when the protective frame 80 is subjected to external impact.

[0082] When the bottom wall 81 of the protection frame 80 includes a first sub-wall 811, a second sub-wall 812, and a connecting sub-wall 813, the buffer layer 84 may be disposed on the side of the first sub-wall 811 facing the display substrate 10. When the display substrate 10 includes a display portion 11, a bending portion 12, and a driving portion 13, and a first back film 53 is disposed on a side of the display portion 11 away from the cover plate 20, and a first back film 53 is disposed on a side of the display portion 11 of the display substrate 10 away from the cover plate 20, the buffer layer 84 may be in contact with the first back film 53, or there may be a gap between the buffer layer 84 and the first back film 53.

[0083] The buffer layer 84 may be made of foam glue.

[0084] In other embodiments, a heat insulating layer may be provided on the side of the bottom wall 81 facing the display substrate 10, or the buffer layer 84 and the heat insulating layer may be provided at the same time; the buffer layer 84 may also be made of a heat insulating material having a certain buffering effect, so that the buffer layer 84 can be reused as the heat insulating layer. By providing the heat insulating layer, the influence of the heat generated by the driving circuit board 40 on the display substrate 10 can be further reduced.

[0085] like Fig. 9 As shown, the display substrate 10 includes a display area, and the cover plate 20 includes: a light-transmitting area arranged opposite to the display area and a light-shielding area surrounding the light-transmitting area. For example, the cover plate 20 includes a transparent cover plate body 21 and a light-shielding layer 22 located on the cover plate body 21. The cover plate body 21 is, for example, glass, or an organic material such as polyimide (PI); the light-shielding layer 22 is, for example, an ink layer. The area where the light-shielding layer 22 is located is used as the light-shielding area, and the area on the cover plate body 21 where the light-shielding layer 22 is not provided is used as the light-transmitting area. Among them, the orthographic projection of the side wall 82 of the protective frame 80 on the cover plate 20 is located in the light-shielding area.

[0086] Fig.10 is a schematic diagram of the position of the buffer layer provided in some embodiments of the present disclosure, Fig.11 FIG. 1 is another schematic diagram of the position of the buffer layer provided in some embodiments of the present disclosure. In one example, Fig.10 As shown, the positive projection of the buffer layer 84 on the cover plate 20 is located in the light shielding area, and the positive projection of the buffer layer 84 and the driving circuit board 40 on the cover plate 20 do not overlap. Of course, in other examples, such as Fig.11 As shown, the orthographic projection of the buffer layer 84 on the cover plate 20 may also exceed the light shielding area. In addition, the orthographic projection of the buffer layer 84 on the cover plate 20 and the orthographic projection of the driving circuit board 40 on the cover plate 20 may also overlap.

[0087] In some embodiments, Fig. 9As shown, the display module may further include a mounting post 85, which is fixed to the surface of the bottom wall 81 away from the cover plate 20. The mounting post 85 is used to connect with the mounting shell of the display device, and may also fix the driving motherboard or other components in the display device. Fig. 9 As shown, the mounting column 85 has no overlap with the orthographic projection of the driving circuit board 40. In one example, there are a plurality of mounting columns 85, and the mounting columns 85 may include studs.

[0088] Fig.12 is a cross-sectional view of a display module provided in some further embodiments of the present disclosure, Fig.13 FIG. 1 is a rear view of a display module provided in some other embodiments of the present disclosure, such as Fig.12 and Fig.13 As shown, in some embodiments, the display module may include a plurality of connected driving circuit boards 40, and the connection structure 30 is electrically connected to one of the driving circuit boards 40. For example, two adjacent driving circuit boards 40 are connected through at least one connecting circuit board 43, and both ends of the connecting circuit board 43 are electrically connected to the connectors 41 on the two adjacent driving circuit boards 40. One of the driving circuit boards 40 is also electrically connected to the control mainboard of the display device through the connector 41, and the connector 41 connected to the control mainboard is different from the connector 41 connected to the connecting circuit board 43.

[0089] A support column 86 is disposed between at least one driving circuit board 40 and the bottom wall 81 , and two ends of the support column 86 are connected to the driving circuit board 40 and the bottom wall 81 , respectively.

[0090] exist Fig.12 and Fig.13 In the illustrated embodiment, the electronic components originally concentrated on one driving circuit board 40 are dispersed on a plurality of driving circuit boards 40, so that the heat can be dispersed; and the influence of the heat of the driving circuit board 40 on the display substrate 10 can be further reduced by the provision of the support column 86. In one example, there are two driving circuit boards 40, the electronic components on one driving circuit board 40 generate more heat, and the electronic components on the other driving circuit board 40 generate less heat, and the support column 86 is provided between the driving circuit board 40 where the electronic components generating more heat are located and the protective frame 80.

[0091] Fig.14 Schematic diagram of the membrane layer of the bottom wall provided in some embodiments of the present disclosure, Fig.15 Schematic diagram of the membrane layer of the bottom wall provided in some other embodiments of the present disclosure. In some embodiments, such as Fig.14 and Fig.15 As shown, a functional layer 87 is provided on the surface of the bottom wall 81 , and the functional layer 87 includes at least one of an antistatic layer 871 , an electrostatic shielding layer 872 , and a flame retardant layer 873 .

[0092] The surface of the bottom wall 81 may include the surface of the first sub-wall 811, the surface of the connecting sub-wall 813, and the surface of the second sub-wall 812. When the functional layer 87 on the surface of the bottom wall 81 includes an antistatic layer 871 or an electrostatic shielding layer 872, the influence of external static electricity on the display substrate 10 can be reduced; when the functional layer 87 on the surface of the bottom wall 81 includes a flame retardant layer 873, the flame retardant performance of the display module can be improved.

[0093] In a specific example, if Fig.14 As shown, functional layers 87 are provided on opposite sides of the bottom wall 81 along its thickness direction, wherein the functional layer 87 on one side is an antistatic layer 871, and the functional layer 87 on the other side is a flame retardant layer 873; of course, the functional layers 87 on both sides may also be other film layers, and the materials of the functional layers 87 on both sides may be the same or different.

[0094] In another specific example, Fig.15 As shown, the bottom wall 81 is provided with functional layers 87 on both sides along the thickness direction thereof, and the functional layers 87 on each side include multiple types of antistatic layers 871, electrostatic shielding layers 872, and flame retardant layers 873. The materials of the functional layers 87 on both sides can be the same or different. In particular, on the same side of the bottom wall 81, different film layers can be provided in different areas; or, on the same side of the bottom wall 81, different film layers can also be provided in a stacked manner.

[0095] Fig.14 and Fig.15 The functional layer 87 is provided on the surface of the bottom wall 81 as an example for explanation. In other embodiments, the functional layer 87 may be provided on the surface of the side wall 82, while the functional layer 87 is not provided on the surface of the bottom wall 81; or the functional layer 87 may be provided on the surface of both the side wall 82 and the surface of the bottom wall 81. When the functional layer 87 is provided on the surface of the side wall 82, the functional layer 87 may also include at least one of the antistatic layer 871, the electrostatic shielding layer 872 and the flame retardant layer 873, so as to improve the antistatic performance and / or flame retardant performance of the display module. The surface of the side wall 82 may include the inner surface of the side wall 82 facing the display substrate 10, and the outer surface of the side wall 82 facing away from the display substrate 10.

[0096] In addition, when the functional layer 87 is provided on the surface of the second sub-wall 812 facing the display substrate 10, the display substrate 10 and the connection structure 30 have no contact with the functional layer 87. When the functional layer 87 is provided on the surface of the first sub-wall 811 facing the display substrate 10, and the buffer layer 84 is not provided between the first sub-wall 811 and the first back film 53, an air gap s1 may be provided between the functional layer 87 and the first back film 53; when the functional layer 87 is provided on the surface of the first sub-wall 811 facing the display substrate 10, and the buffer layer 84 is provided between the first sub-wall 811 and the first back film 53, the buffer layer 84 may be provided on the side of the functional layer 87 close to the display substrate 10. When the functional layer 87 is provided on the surface of the side wall 82 facing the display substrate 10, there may be a gap between the functional layer 87 on the side wall 82 and the display substrate 10.

[0097] Fig.16 Schematic diagram of a display unit provided in some embodiments of the present disclosure, wherein in the above embodiments of the present disclosure, the display substrate 10 may be an OLED display substrate, such as Fig.16 As shown, the display portion 11 includes a driving circuit layer 120 disposed on a base substrate 110, a light emitting structure layer 130 disposed on the driving circuit layer 120, and an encapsulation layer 140 disposed on the light emitting structure layer 130. In some possible implementations, the display substrate 10 may include other film layers, which are not limited in the present disclosure.

[0098] In an exemplary embodiment, the base substrate 110 may be a flexible base substrate, for example, a material such as polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer soft film may be used.

[0099] In an exemplary embodiment, the driving circuit layer 120 may include transistors and storage capacitors constituting a pixel circuit. Fig.16Only one transistor and one storage capacitor in each pixel circuit are shown, and the transistor includes an active layer 122, a gate electrode 121, a source electrode 123, and a drain electrode 124. In some possible implementations, the driving circuit layer 120 of each sub-pixel may include: a buffer layer BFL disposed on the base substrate 110, an active layer 122 disposed on the buffer layer BFL, a first gate insulating layer GI1 covering the active layer 122, a gate electrode 121 and a first capacitor electrode 125 disposed on the first gate insulating layer GI1, a second gate insulating layer GI2 covering the gate electrode 121 and the first capacitor electrode 125, a second capacitor electrode 126 disposed on the second gate insulating layer GI2, an interlayer insulating layer ILD covering the second capacitor electrode 126, a via hole being provided on the interlayer insulating layer ILD, and the via hole exposing the active layer 122. The source electrode 123 and the drain electrode 124 are disposed on the interlayer insulating layer ILD, and the source electrode 123 and the drain electrode 124 are connected to the active layer 122 through the via holes, respectively. The flat layer PLN is located on the side of the source electrode 123 and the drain electrode 124 away from the substrate 110. The first capacitor electrode 125 and the second capacitor electrode 126 form a storage capacitor. In some possible implementations, the buffer layer BFL, the first gate insulating layer GI1, the second gate insulating layer GI2 and the interlayer insulating layer ILD can be made of any one or more of silicon oxide (SiOx), silicon nitride (SiNx) and silicon oxynitride (SiON), and can be a single layer, a multilayer or a composite layer. The gate electrode 121, the source electrode 123, the drain electrode 124, the first capacitor electrode 125 and the second capacitor electrode 126 can be made of metal materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo), or alloy materials of the above metals, such as aluminum neodymium alloy (AlNd) or molybdenum niobium alloy (MoNb), and can be a single layer structure, or a multilayer composite structure, such as Ti / Al / Ti, etc. The active layer 122 may be made of amorphous indium gallium zinc oxide material (a-IGZO), zinc oxynitride (ZnON), indium zinc tin oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), sexithiophene or polythiophene, and the like, that is, the present disclosure is applicable to transistors manufactured based on oxide technology, silicon technology or organic technology. The active layer 122 based on oxide technology may be made of oxides containing indium and tin, oxides containing tungsten and indium, oxides containing tungsten, indium and zinc, oxides containing titanium and indium, oxides containing titanium, indium and tin, oxides containing indium and zinc, oxides containing silicon, indium and tin, oxides containing indium, gallium and zinc, and the like.

[0100] In an exemplary embodiment, the light-emitting structure layer 130 may include an anode 131, a pixel definition layer PDL, an organic light-emitting layer 133 and a cathode 132. The anode 131 is arranged on the flat layer PLN and is connected to the drain electrode 124 through a via hole opened on the flat layer PLN. The pixel definition layer PDL is arranged on the anode 131 and the flat layer PLN, and a pixel opening is arranged thereon. The pixel opening exposes the anode 131. The organic light-emitting layer 133 is arranged in the pixel opening. The cathode 132 is arranged on the organic light-emitting layer 133. The organic light-emitting layer 133 emits light of corresponding color under the action of voltage applied by the anode 131 and the cathode 132.

[0101] In an exemplary embodiment, the organic light emitting layer 133 may include at least a stacked hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL) and an electron injection layer (EIL), the hole injection layer and the hole transport layer may be collectively referred to as a hole layer, and the electron transport layer and the electron injection layer may be collectively referred to as an electron layer.

[0102] In an exemplary embodiment, the encapsulation layer 140 may include a stacked first encapsulation layer 141, a second encapsulation layer 142 and a third encapsulation layer 143. The first encapsulation layer 141 and the third encapsulation layer 143 may be made of inorganic materials, the second encapsulation layer 142 may be made of organic materials, and the second encapsulation layer 142 is arranged between the first encapsulation layer 141 and the third encapsulation layer 143, which can ensure that external water vapor cannot enter the light-emitting structure layer 130.

[0103] In the above embodiments, Figure 6 , Fig. 9 and Fig.12 As shown, an optical function layer 60 and an optical adhesive layer 61 may be further provided between the display substrate 10 and the cover plate 20. The optical function layer 60 covers the display area of ​​the display substrate 10. For example, the optical function layer 60 is a polarizer, which may be a circular polarizer, to reduce the reflection of the display module to the external ambient light. The optical adhesive layer 61 is provided between the optical function layer 60 and the cover plate 20.

[0104] It should be noted that in Figures 6 to 12 In the figures, the display substrate 10 is a curved structure (i.e., including a display portion 11, a curved portion 12 and a driving portion 13), and one side of the display substrate 10 is bent as an example. In other embodiments, the display substrate 10 may be bent on both sides, i.e., both sides of the display substrate 10 have a curved portion 12 and a driving portion 13. In this case, the bottom wall 81 may include a first sub-wall 811 and two second sub-walls 812.

[0105] It should also be noted that, in other embodiments, the display substrate 10 may also be a plate-like structure, and the connection structure 30 is connected between the driving circuit board 40 and the display substrate 10. By bending the connection structure 30, the driving circuit board 40 is located on the side of the display substrate 10 away from the cover plate 20. In this case, the structure of the display module is similar to that of the above embodiment, and the connection structure 30 can also pass through the opening on the bottom wall 81, and the opening can also be set on the connecting sub-wall 813. Different from the above embodiment, the backlight side of the display substrate 10 may no longer be provided with a support portion 55. In addition, there is a gap between the side wall 82 of the protection frame 80 and the connection structure 30 to prevent the protection frame 80 from colliding with the connection structure 30 due to process tolerance during the assembly process of the protection frame 80 and the cover plate 20, thereby preventing the devices or signal lines on the connection structure 30 from being damaged.

[0106] The present disclosure also provides a display device, including the display module in the above embodiment. The display device may include any device or product with a display function. For example, the display device may be a vehicle-mounted display device, a smart phone, a mobile phone, an e-book reader, a desktop computer (PC), a laptop PC, a netbook PC, a personal digital assistant (PDA), a portable multimedia player (PMP), a digital audio player, a mobile medical device, a camera, a wearable device (such as a head-mounted device, an electronic bracelet, or a smart watch), etc.

[0107] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present disclosure, but the present disclosure is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and substance of the present disclosure, and these modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A display module, characterized in that: include: Display substrate; A cover plate, the cover plate being arranged on the light emitting side of the display substrate; a protection frame, the protection frame comprising a bottom wall and a side wall connected to the bottom wall, the bottom wall being located on a side of the display substrate away from the cover plate; The side wall is connected to the cover plate, and defines a receiving space with the cover plate and the bottom wall, and the display substrate is located in the receiving space; The orthographic projection of the protection frame on a reference plane perpendicular to the thickness direction of the cover plate is located within the range of the orthographic projection of the cover plate on the reference plane.

2. The display module according to claim 1, characterized in that: The side wall is a continuous ring structure surrounding the display substrate.

3. The display module according to claim 1, characterized in that: The bottom wall is provided with an opening, and the display module further comprises: A driving circuit board, the driving circuit board is located on a side of the bottom wall away from the cover plate; A connection structure passes through the opening, and two ends of the connection structure are electrically connected to the display substrate and the driving circuit board respectively.

4. The display module according to claim 3, characterized in that: The display substrate is a flexible display substrate, and includes a display portion, a driving portion, and a bending portion connected between the display portion and the driving portion, the display portion is arranged opposite to the cover plate, the driving portion is located on a side of the display portion away from the cover plate, and is electrically connected to the connection structure; The bent portion does not contact the protection frame.

5. The display module according to claim 4, characterized in that: The display module also includes: a first back film, the first back film being arranged on a surface of the display portion facing the bottom wall; a second backing film, the second backing film being arranged on a surface of the driving part away from the bottom wall; A support portion, wherein the support portion is located between the first back film and the second back film, and an orthographic projection of the support portion on the cover plate is located within a range of an orthographic projection of the second back film on the cover plate.

6. The display module according to any one of claims 3 to 5, characterized in that: The bottom wall comprises a first sub-wall, a second sub-wall and a connecting sub-wall connected between the first sub-wall and the second sub-wall, wherein the first sub-wall and the second sub-wall are both connected to the side wall; the driving circuit board is located on a side of the first sub-wall away from the cover plate; the connecting structure comprises a connecting portion electrically connected to the display substrate, and the connecting portion is located on a side of the second sub-wall facing the cover plate; the opening is provided on the connecting sub-wall; Wherein, the distance between the first sub-wall and the cover plate is less than or equal to the distance between the second sub-wall and the cover plate.

7. The display module according to claim 6, characterized in that: Neither the display substrate nor the connection structure is in contact with the second sub-wall.

8. The display module according to claim 6, characterized in that: An air gap exists between the first sub-wall and the display substrate.

9. The display module according to any one of claims 3 to 5, characterized in that: The display module comprises a plurality of driving circuit boards connected to each other, and the connecting structure is electrically connected to one of the driving circuit boards; Wherein, a support column is arranged between at least one of the driving circuit boards and the bottom wall, and two ends of the support column are respectively connected to the driving circuit board and the bottom wall.

10. The display module according to any one of claims 3 to 5, characterized in that: The display module further includes a mounting post, which is fixed on a surface of the bottom wall away from the cover plate, and the mounting post has no overlap with an orthographic projection of the driving circuit board on the cover plate.

11. The display module according to any one of claims 1 to 5, characterized in that: At least one of a buffer layer and a heat insulation layer is disposed on a side of the bottom wall facing the display substrate.

12. The display module according to any one of claims 1 to 5, characterized in that: The display substrate comprises a display area, and the cover plate comprises: a light-transmitting area arranged opposite to the display area and a light-shielding area surrounding the light-transmitting area; the orthographic projection of the side wall on the cover plate is located in the light-shielding area.

13. The display module according to any one of claims 1 to 5, characterized in that: A functional layer is disposed on a surface of at least one of the bottom wall and the side wall, and the functional layer includes at least one of an antistatic layer, an electrostatic shielding layer, and a flame retardant layer.

14. The display module according to any one of claims 1 to 5, characterized in that: An adhesive layer is provided between the side wall and the cover plate.

15. The display module according to claim 14, characterized in that: The bonding layer includes at least one of a buffer adhesive layer, a thermal conductive adhesive layer and an electrically conductive adhesive layer.

16. The display module according to any one of claims 1 to 5, characterized in that: The material of the protection frame includes any one of metal materials, polymer composite materials, and ceramic-based materials.

17. A display device, characterized in that: A display module comprising any one of claims 1 to 16.

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