Dispensing and laminating all-in-one machine

Abstract

The utility model provides an adhesive dispensing and laminating all-in-one machine. The adhesive dispensing and laminating all-in-one machine comprises an equipment rack, an adhesive dispensing mechanism and a laminating mechanism, the sealing strip laminating mechanism is arranged on the equipment rack; the supporting frame is arranged on the equipment rack in the mode that the supporting frame can move linearly along the X axis. The bipolar plate adsorption jig is arranged on the supporting frame in a rotatable mode. According to the utility model, the bipolar plate is adsorbed through the bipolar plate adsorption jig so as to realize the fixation of the bipolar plate; the bipolar plate is driven to turn over by turning over the bipolar plate adsorption jig relative to the supporting frame, so that the bonding surface of the bipolar plate can be turned over to the orientation arrangement; the supporting frame moves linearly along the X axis to drive the bipolar plate adsorption jig and the bipolar plate to move to the position over the sealing strip attaching mechanism, the sealing strip attaching mechanism is used for pressing and bonding the sealing strip to the bonding face of the bipolar plate, and gluing is completed.

Description

Technical Field

[0001] The utility model relates to the technical field of hydrogen fuel cells, and in particular to a glue dispensing and laminating integrated machine. Background Art

[0002] A hydrogen fuel cell is a device that converts the chemical energy of an oxidant and a reductant directly into electrical energy through an electrocatalytic reaction. It is a new type of power generation technology that is efficient, safe, clean and flexible. Among them, proton exchange membrane fuel cells have broad application prospects due to their significant advantages such as high efficiency, high energy density, low reaction temperature, no noise and no pollution. The interior of a fuel cell is mainly composed of a proton exchange membrane, an electrochemical reaction catalyst, a diffusion layer and a bipolar plate. When the fuel cell is working, the following reaction process occurs inside it: the reaction gas diffuses in the diffusion layer, and when the reaction gas reaches the catalytic layer, it is adsorbed by the catalyst in the catalytic layer and an electrocatalytic reaction occurs; the protons generated by the anode reaction are transferred to the cathode side through the proton exchange membrane, and the electrons reach the cathode through the external circuit, react with oxygen molecules to form water, and release heat at the same time. The sealing of the bipolar plate refers to sandwiching a sealing ring between the two bipolar plates or evenly applying glue, which forms a sealing ring after solidification to prevent hydrogen and oxygen from mutual crosstalk, causing safety accidents, or causing polarization of the stack due to insufficient reaction gas flow.

[0003] The Chinese publication number is: CN 115256966 A, which discloses an automatic processing device for bipolar plates of fuel cells and its pressing mechanism, including: a feeding mechanism 100, a glue dispensing mechanism 200, a robotic arm 300 and a pressing mechanism 400. The feeding mechanism 100 includes a feeding table 1 for placing bipolar plates. The glue dispensing mechanism 200 includes a three-axis glue dispensing device 2, and the three-axis glue dispensing device 2 applies glue to the bipolar plate on the feeding table 1. The robotic arm 300 transfers the bipolar plate from the feeding table 1 to the pressing mechanism 400. The pressing mechanism 400 is used to bond the sealing ring P to the bipolar plate after gluing. The above-mentioned feeding mechanism 100, glue dispensing mechanism 200, robotic arm 300 and pressing mechanism 400 are arranged in sequence on the platform T of the equipment.

[0004] The above technical solution provides an automatic processing device for bipolar plates of fuel cells, which glues the bipolar plates on the feeding mechanism through a glue dispensing mechanism, and transfers the bipolar plates from the feeding mechanism to the flap of the pressing mechanism through a mechanical arm, and flips the bipolar plates onto the pressing seat through the flap, so that the bipolar plates are covered on the pressing seat, and the lifting device is connected to the pressing seat, and drives the pressing seat to press against the flap, so as to push the sealing strip profiling plate to keep the sealing ring P pressed against the bipolar plate on the flap, so as to achieve the bonding of the sealing ring. However, in the above technical solution, the transfer of the bipolar plates through the mechanical arm requires multiple positioning of the bipolar plates, resulting in inaccurate positioning of the bipolar plates and inaccurate bonding positions of the sealing strips. Summary of the invention

[0005] In view of this, the utility model proposes a glue dispensing and laminating integrated machine, which aims to solve the problem of inaccurate positioning of bipolar plates caused by the transfer of bipolar plates by a mechanical arm in existing bipolar plate automatic processing equipment.

[0006] The utility model proposes a glue dispensing and laminating all-in-one machine, which includes: an equipment frame; a sealing strip laminating mechanism, which is arranged on the equipment frame; a support frame, which is arranged on the equipment frame in a manner that can be linearly moved along the X-axis, and is used to move from one side of the X-axis of the sealing strip laminating mechanism to directly above the sealing strip laminating mechanism; a bipolar plate adsorption fixture, which is rotatably arranged on the support frame, is used to adsorb the bipolar plate, and can drive the bipolar plate to rotate relative to the support frame, so that the bipolar plate bonding surface can rotate from an upward arrangement to a downward arrangement, and move with the support frame to directly above the sealing strip laminating mechanism, so that the sealing strip is pressed and bonded to the bonding surface of the bipolar plate through the sealing strip laminating mechanism.

[0007] Furthermore, in the above-mentioned glue dispensing and laminating integrated machine, the bipolar plate adsorption jig is connected to a flipping mechanism for driving the bipolar plate adsorption jig to flip.

[0008] Furthermore, in the above-mentioned glue dispensing and bonding machine, the flipping mechanism includes: a flipping motor; and a flipping shaft, which is connected to the power output end of the flipping motor and is used to drive the bipolar plate adsorption fixture to rotate around the axis of the flipping shaft.

[0009] Furthermore, in the above-mentioned glue dispensing and laminating integrated machine, the flip axis is arranged along the length direction of the bipolar plate adsorption fixture and directly below the transverse symmetry axis of the bipolar plate adsorption fixture.

[0010] Furthermore, the above-mentioned glue dispensing and laminating machine also includes: a glue dispensing mechanism, which is arranged on the equipment frame and is used to dispense glue on the bipolar plate; the glue dispensing mechanism is arranged above the support frame along the Y-axis in a manner that can be moved linearly, and is used to move along the Y-axis to move it to the Y-axis position of the bipolar plate glue dispensing part, and the bipolar plate can also move along the X-axis with the support frame to move the bipolar plate glue dispensing part to the corresponding position of the glue dispensing mechanism, thereby dispensing glue on the glue dispensing part of the bipolar plate; a glue wiping mechanism, which is arranged on the equipment frame and is used to wipe the glue dispensing mechanism.

[0011] Furthermore, in the above-mentioned glue dispensing and laminating machine, the glue dispensing mechanism includes: a support seat; a glue dispensing valve, which is arranged on the support seat in a position-adjustable manner along the Z axis and is used to move to the glue dispensing position of the bipolar plate and perform glue dispensing.

[0012] Furthermore, in the above-mentioned glue dispensing and laminating machine, the support frame is connected with an X-axis translation mechanism for driving the support frame to move linearly along the X-axis; the glue dispensing mechanism is connected with a Y-axis translation mechanism for driving the glue dispensing mechanism to move linearly along the Y-axis; the glue dispensing valve is connected with a Z-axis translation mechanism for driving the glue dispensing valve to move linearly along the Z-axis.

[0013] Furthermore, in the above-mentioned glue dispensing and bonding machine, the support frame is a planar frame structure, and a flip hole compatible with the bipolar plate adsorption fixture is provided at the middle position thereof, so that the bipolar plate can be flipped at the flip hole.

[0014] Furthermore, in the above-mentioned glue dispensing and laminating machine, the bipolar plate adsorption fixture is a vacuum adsorption component, and the adsorption wall surface of the bipolar plate adsorption fixture is provided with a plate profiling groove for positioning the bipolar plate.

[0015] Furthermore, in the above-mentioned glue dispensing and laminating integrated machine, the sealing strip laminating mechanism comprises: a fixed plate; a bearing plate, which is arranged above the fixed plate in a manner that can be adjusted in height, and the bearing plate is connected to a jacking assembly for driving the bearing plate to move up and down; a profiling cavity, which is arranged above the bearing plate, and an elastic guide is provided between the profiling cavity and the bearing plate, which is used for compressing the elastic guide when the bearing plate continues to move upward after the profiling cavity moves upward with the bearing plate until it abuts against the bipolar plate, and can apply a reset force to the profiling cavity; the sealing strip profiling plate is arranged in a manner that can move up and down The sealing strip profiling plate is arranged in the profiling cavity, and the sealing strip profiling plate is connected to the bearing plate for placing the sealing strip. The profiling cavity and the sealing strip profiling plate are adjusted in height direction along with the bearing plate to move toward the bipolar plate on the bipolar plate adsorption fixture until the top wall of the profiling cavity is pressed and contacted with the bipolar plate, and the bearing plate continues to push the sealing strip profiling plate to move toward the bipolar plate. The elastic guide is compressed, so that the sealing strip profiling plate moves toward the bipolar plate relative to the profiling cavity, thereby driving the sealing strip to move toward the bipolar plate, so as to be embedded in the sealing strip groove of the bipolar plate, thereby realizing the bonding and pressing of the sealing strip.

[0016] The utility model provides a glue dispensing and bonding integrated machine, which adsorbs the bipolar plate by a bipolar plate adsorption fixture to achieve the fixation of the bipolar plate; and drives the bipolar plate to be flipped by flipping the bipolar plate adsorption fixture relative to the support frame, so that the bonding surface of the bipolar plate can be flipped to a facing arrangement; the support frame is moved linearly along the X-axis to drive the bipolar plate adsorption fixture and the bipolar plate to move to just above the sealing strip bonding mechanism, and the sealing strip is pressed and bonded to the bonding surface of the bipolar plate by the sealing strip bonding mechanism to complete the glue bonding. The glue dispensing and bonding integrated machine realizes position adjustment by linear movement of the support frame, that is, adjustment of different workstations, such as adjustment of the loading position and the bonding position, so that the position control of the bipolar plate is more accurate, and the accuracy of the sealing strip bonding position can be improved, which solves the problem of inaccurate positioning of the bipolar plate caused by the transfer of the bipolar plate by the mechanical arm in the existing bipolar plate automatic processing equipment.

[0017] Furthermore, the rotation axis of the bipolar plate adsorption jig and the transverse symmetry axis (the symmetry axis in the length direction) of the bipolar plate adsorption jig are on the same vertical plane, so that its horizontal position remains unchanged after flipping 180°. Compared with flipping around the side, the driving torque and occupied space required for flipping are reduced, which is not only suitable for the processing of small-sized bipolar plates, but also for the processing of large-sized bipolar plates. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] By reading the detailed description of the preferred embodiment below, various other advantages and benefits will become clear to those of ordinary skill in the art. The accompanying drawings are only used for the purpose of illustrating the preferred embodiment and are not considered to be limiting of the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0019] Figure 1 A schematic diagram of the structure of the glue dispensing and laminating integrated machine provided in an embodiment of the utility model;

[0020] Figure 2 A schematic diagram of the structure of the dispensing and laminating machine in another direction provided by an embodiment of the utility model;

[0021] Figure 3 A top view of the support frame, flip mechanism, etc. in the glue dispensing and laminating all-in-one machine provided in an embodiment of the utility model;

[0022] Figure 4 A bottom view of the support frame and the flip mechanism of the glue dispensing and laminating integrated machine provided in an embodiment of the utility model;

[0023] Figure 5 A schematic diagram of the structure of the sealing strip laminating mechanism provided in an embodiment of the utility model;

[0024] Figure 6A front view of the sealing strip laminating mechanism provided by an embodiment of the utility model laminating with a bipolar plate;

[0025] Figure 7 A top view of the sealing strip laminating mechanism provided in an embodiment of the utility model;

[0026] Figure 8 for Figure 7 Sectional view at AA in the middle;

[0027] Fig. 9 for Figure 7 Sectional view at the middle BB;

[0028] Fig.10 A schematic diagram of the structure of the connection between the load-bearing plate and the sealing strip profiling plate provided in an embodiment of the utility model;

[0029] Fig.11 A schematic diagram of the structure of the contoured cavity provided in an embodiment of the utility model;

[0030] Description of reference numerals: 1-equipment frame, 11-linear guide rail, 12-guide rail connecting plate, 13-gantry, 2-sealing strip laminating mechanism, 21-fixed plate, 22-load-bearing plate, 23-profile cavity, 231-external profile plate, 232-inner profile plate, 24-sealing strip profile plate, 241-sealing strip profile groove, 25-lifting assembly, 26-elastic guide member, 261-spring, 262-movable guide column, 27-guide column, 28-transmission connecting plate, 3-support frame, 31-flip hole, 32-bearing seat, 33-drive support seat, 4-bipolar plate adsorption fixture, 41-fixture fixing plate, 5-X-axis translation mechanism, 51-translation connecting plate, 6-flip mechanism, 61-flip motor, 62-flip axis, 7-glue dispensing mechanism, 71-support seat, 72-glue dispensing valve, 73-Z-axis translation mechanism, 8-glue wiping mechanism, 9-Y-axis translation mechanism. DETAILED DESCRIPTION

[0031] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that, in the absence of conflict, the embodiments in the present utility model and the features in the embodiments can be combined with each other. The present utility model will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0032] See also Figure 1 to Figure 2, which shows the preferred structure of the glue dispensing and laminating machine provided by the embodiment of the utility model. As shown in the figure, the glue dispensing and laminating machine includes: an equipment frame 1, a sealing strip laminating mechanism 2, a support frame 3, a bipolar plate adsorption fixture 4, a translation mechanism, a flip mechanism 6, a glue dispensing mechanism 7 and a glue wiping mechanism 8; wherein,

[0033] The sealing strip laminating mechanism 2 is arranged on the equipment rack 1. Specifically, the sealing strip laminating mechanism 2 is arranged on the right side of the equipment rack 1 (relative to the right side of the equipment rack 1). Figure 1 As for the position shown), the sealing strip of the bipolar plate can be pressed and bonded on the right side of the equipment rack 1.

[0034] The support frame 3 is arranged on the equipment frame 1 along the X-axis in a manner that it can move linearly, and is used to move from one side of the X-axis of the sealing strip bonding mechanism 2 to directly above the sealing strip bonding mechanism 2. Specifically, the lateral direction, that is, the length direction, of the equipment frame 1 is the X-axis direction, the width direction, that is, the longitudinal direction, is the Y-axis direction, and the vertical direction is the Z-axis direction. In order to facilitate the adjustment of the position of the support frame 3, preferably, the support frame 3 is slidably arranged on the equipment frame 1 along the X-axis; further preferably, the support frame 3 may be provided with a linear guide rail 11 arranged along the X-axis, and the linear guide rail 11 may be a double guide rail and is arranged on both sides of the width direction of the equipment frame 1, and can respectively guide the bottom two sides of the support frame 3 for sliding; wherein the linear guide rail 11 can be installed on the equipment frame 1 via a guide rail connecting plate 12. The support frame 3 can slide to the left side (relative to the left side) along the X-axis. Figure 1 For the position shown), the bipolar plate adsorption jig 4 on the support frame 3 is in the loading position, and then the bipolar plate can be loaded. The loading position is on the left side of the sealing strip bonding mechanism 2, and corresponding actions can be performed respectively. In this embodiment, the setting height of the support frame 3 is higher than the setting height of the sealing strip bonding mechanism 2, so that the bipolar plate adsorption jig 4 can move laterally with the support frame 3 to the top of the sealing strip bonding mechanism 2 to perform the bonding and pressing of the sealing strip. In this embodiment, the support frame 3 can be connected to an X-axis translation mechanism 5, which is used to drive the support frame 3 to move linearly along the X-axis; wherein, the X-axis translation mechanism 5 can be a linear motor module, and its power output end can be connected to the support frame 3 through a translation connecting plate 51, so that the support frame 3 can move linearly with the power output end of the X-axis translation mechanism 5. Of course, the X-axis translation mechanism 5 can also be a driving mechanism for other linear motions, which is not limited in this embodiment.

[0035] The bipolar plate adsorption jig 4 is rotatably arranged on the support frame 3, and is used to adsorb the bipolar plate, and can drive the bipolar plate to rotate relative to the support frame 3, so that the bipolar plate bonding surface can be rotated from an upward arrangement to a downward arrangement, and move with the support frame 3 to the top of the sealing strip bonding mechanism 2, so that the sealing strip can be pressed and bonded to the bonding surface of the bipolar plate through the sealing strip bonding mechanism 2. Specifically, the bipolar plate adsorption jig 4 is adapted to the bipolar plate and has a rectangular structure. The bipolar plate adsorption jig 4 can be a vacuum adsorption part, which can adsorb the bipolar plate through vacuum, and can release the vacuum to remove the bipolar plate with the sealing body attached. In this embodiment, the adsorption wall surface (such as Figure 1 The top wall shown in the figure is provided with a plate profiling groove (not shown in the figure) for positioning the bipolar plate so that the bipolar plate is accurately positioned and adsorbed on the adsorption wall surface of the bipolar plate adsorption jig 4. The support frame 3 is a planar frame structure, and a flip hole 31 adapted to the bipolar plate adsorption jig 4 is provided at the middle position thereof, so that the bipolar plate can be flipped at the flip hole 31, and the rotation axis of the bipolar plate adsorption jig 4 and the transverse symmetry axis (the symmetry axis in the length direction) of the bipolar plate adsorption jig 4 are on the same vertical plane, so that the horizontal position remains unchanged before and after flipping 180°, and compared with flipping around the side, the required flipping driving torque and occupied space are reduced, and at the same time, it is not only suitable for the processing of small-sized bipolar plates, but also for the processing of large-sized bipolar plates. In this embodiment, the bipolar plate adsorption jig 4 is connected to a flipping mechanism 6 for driving the bipolar plate adsorption jig 4 to flip. Specifically, the flipping mechanism 6 can be arranged on the support frame 3, and its power output end is connected to the bipolar plate adsorption jig 4, so as to drive the bipolar plate adsorption jig 4 to flip.

[0036] The glue dispensing mechanism 7 is arranged on the equipment frame 1 and is used for dispensing glue on the bipolar plate. Specifically, a longitudinally arranged gantry 13 may be provided on the equipment frame 1, and the glue dispensing mechanism 7 may be installed on the gantry 13 and may be placed above the support frame 3 to dispense glue on the bipolar plate adsorbed on the bipolar plate adsorption fixture 4. In the present embodiment, the glue dispensing mechanism 7 is arranged above the support frame 3 along the Y-axis in a manner that it can move linearly. The glue dispensing mechanism 7 can be slidably arranged on the gantry 13 along the Y-axis, and is used to move along the Y-axis, that is, to move longitudinally, so that the glue dispensing mechanism 7 can be moved to the Y-axis position of the glue dispensing part of the bipolar plate. The bipolar plate can also move along the X-axis with the support frame 3, so that the glue dispensing part of the bipolar plate is moved to the corresponding position of the glue dispensing mechanism 7, that is, to move the glue dispensing part laterally. By adjusting the longitudinal position of the glue dispensing mechanism 7 and the lateral position of the bipolar plate, the position adjustment on the horizontal plane is realized, so that the glue dispensing mechanism 7 can be adapted to the glue dispensing part of the bipolar plate to dispense glue to the glue dispensing part of the bipolar plate. In this embodiment, the dispensing mechanism 7 is connected to a Y-axis translation mechanism 9, which is used to drive the dispensing mechanism 7 to move linearly along the Y-axis; wherein the Y-axis translation mechanism 9 can be a linear motor module, and its power output end is fixedly connected to the dispensing mechanism 7, so that the dispensing mechanism 7 can move linearly with the power output end of the Y-axis translation mechanism 9. Of course, the Y-axis translation mechanism 9 can also be other linear motion driving mechanisms, which are not limited in this embodiment. In this embodiment, the gantry 13 is set in the lateral middle position of the equipment frame 1, for example, it can be between the loading position and the sealing strip fitting mechanism 2.

[0037] The glue wiping mechanism 8 is arranged on the equipment frame 1, and is used to wipe the glue dispensing mechanism 7. Specifically, the glue wiping mechanism 8 can be fixed on the gantry 13, and can wipe the glue dispensing mechanism 7 to clean the glue dispensing mechanism 7, and then prepare for a new round of glue dispensing operation, which can improve the accuracy of glue dispensing.

[0038] The working process of the glue dispensing and laminating machine is as follows: the initial position of the support frame 3 is at the loading position on the left side of the equipment mechanism, and the bipolar plate is manually placed on the bipolar plate adsorption fixture 4, positioned by the profiling groove, and fixed by vacuum adsorption, that is, the bipolar plate is installed on the adsorption wall of the bipolar plate adsorption fixture 4, so that the bipolar plate is vacuum adsorbed by the bipolar plate adsorption fixture 4, and the sealing strip can also be placed in the profiling groove of the sealing strip laminating mechanism 2; the equipment is started, and the support frame 3 is driven to move to the right by the X-axis translation mechanism 5, so as to move linearly along the X-axis toward the glue dispensing mechanism 7, and the glue dispensing mechanism 7 is driven to move linearly along the Y-axis by the Y-axis translation mechanism 9, so that the glue dispensing part of the bipolar plate is placed directly below the glue dispensing mechanism 7, and the glue dispensing part of the bipolar plate is glued by the glue dispensing mechanism 7; after the glue dispensing is completed, the bipolar plate can be driven by the flipping mechanism 6 The adsorption jig 4 is flipped 180° so that the bonding surface of the bipolar plate faces downward; if at this position, interference occurs between the bipolar plate adsorption jig 4 and the sealing strip bonding mechanism 2 when flipped, the support frame 3 is driven to move back to the left to a non-interference position or a loading position by the X-axis translation mechanism 5, and then flipped; after flipping, the support frame 3 is driven to continue to move to the right by the X-axis translation mechanism 5 to move linearly toward the sealing strip bonding mechanism 2 until the bipolar plate moves to just above the sealing strip bonding mechanism 2, and the sealing strip placed on the sealing strip bonding mechanism 2 is pressed and bonded to the bonding surface of the bipolar plate by the sealing strip bonding mechanism 2 to complete the pressing and bonding of the sealing strip; the X-axis translation mechanism 5 moves the flipping mechanism 6 and the bipolar plate adsorption jig 4 to the initial position and flips 180°; the vacuum is released, and the bipolar plate is manually taken out after bonding.

[0039] Continue to see 1 and Figure 2, the dispensing mechanism 7 may include: a support seat 71 and a dispensing valve 72; wherein the dispensing valve 72 is arranged on the support seat 71 in a position-adjustable manner along the Z axis, and is used to move to the dispensing position of the bipolar plate and perform dispensing. Specifically, the support seat 71 is arranged on the equipment frame 1, especially on the gantry 13, in a linearly movable manner along the Y axis. For example, the support seat 71 is slidably arranged on the gantry 13 along the length direction of the gantry 13, i.e., the Y axis. The power output end of the Y-axis translation mechanism 9 can be connected to the support seat 71 to drive the support seat 71 to move linearly along the Y axis, thereby driving the dispensing valve 72 on the support seat 71 to move along the Y axis, thereby adjusting the Y-axis position of the dispensing valve 72. In this embodiment, the dispensing valve 72 is connected to a Z-axis translation mechanism 73, which is used to drive the dispensing valve 72 to move linearly along the Z-axis; wherein the Z-axis translation mechanism 73 may be a linear motor module, whose power output end is fixedly connected to the dispensing valve 72, so that the dispensing valve 72 can move linearly with the power output end of the Z-axis translation mechanism 73. Of course, the Z-axis translation mechanism 73 may also be other linear motion driving mechanisms, which are not limited in this embodiment. In this embodiment, the support seat 71 is arranged on the gantry 13 in a manner that can be linearly moved along the Y-axis, that is, it is longitudinally moved, so that the dispensing valve 72 can be moved to the Y-axis position of the bipolar plate dispensing part along with the support seat 71, and the bipolar plate can also move along the X-axis with the support frame 3, so that the bipolar plate dispensing part is moved to the corresponding position of the dispensing valve 72, that is, the dispensing part is moved horizontally, and the position adjustment on the horizontal plane is achieved by adjusting the longitudinal position of the dispensing valve 72 and the horizontal position of the bipolar plate, so that the dispensing mechanism 7 can be adapted to the dispensing part of the bipolar plate, and the Z-axis position adjustment can be achieved by moving the dispensing valve 72 along the Z-axis, that is, the three-axis position adjustment of the dispensing valve 72 is achieved.

[0040] Continue to see Figure 3 and Figure 4The flipping mechanism 6 may include: a flipping motor 61 and a flipping shaft 62; wherein the flipping shaft 62 is connected to the power output end of the flipping motor 61, and is used to drive the bipolar plate adsorption jig 4 to rotate around the axis of the flipping shaft 62. Specifically, in order to facilitate driving and reduce the occupied space, preferably, the flipping shaft 62 is arranged along the length direction of the bipolar plate adsorption jig 4 directly below the transverse symmetry axis of the bipolar plate adsorption jig 4, that is, the flipping shaft 62 is arranged along the transverse symmetry axis of the bipolar plate adsorption jig 4 directly below the bipolar plate adsorption jig 4, that is, when the bipolar plate adsorption jig 4 is arranged horizontally, the transverse symmetry axis of the bipolar plate adsorption jig 4 and the axis of the flipping shaft 62 are placed on the same vertical plane, so that when the bipolar plate adsorption jig 4 and the bipolar plate are flipped 180° around the axis of the flipping shaft 62 synchronously with the flipping shaft 62, the bipolar plate adsorption jig 4 and the bipolar plate are flipped 180° around the axis of the flipping shaft 62. The horizontal positions of the plate adsorption jig 4 and the bipolar plate do not change, only the vertical position changes, that is, it flips from the top of the flip axis 62 to the bottom of the flip axis 62, which can reduce the occupied space. At the same time, the middle flip saves effort. If the rotating shaft is set on the side, the torsional torque of the motor and the reducer is required to be relatively large, so that the required equipment is large, the occupied space is large, and the requirements are high. It is mainly suitable for the processing of small-sized bipolar plates. In this embodiment, the rotating shaft is set directly below the transverse symmetry axis of the bipolar plate adsorption jig 4, that is, the middle position, which reduces the rotation requirements and can process large-sized bipolar plates. In this embodiment, two bearing seats 32 are provided on the support frame 3, and a jig fixing plate 41 is provided at the bottom of the bipolar plate adsorption jig 4, and the jig fixing plate 41 is placed between the two bearing seats 32, and the flip shaft 62 passes through the bearing seat 32 in a rotatable manner, so as to support the flip shaft 62 in rotation through the bearing seat 32, and the flip shaft 62 passes through the jig fixing plate 41 and is fixedly connected to the jig fixing plate 41, so that when the flip motor 61 is driven, the flip shaft 62 can rotate under the drive of the flip motor 61, so as to drive the jig fixing plate 41 and the bipolar plate adsorption jig 4 to flip along with the flip shaft 62. In this embodiment, the flip motor 61 and the flip shaft 62 can also be connected through a reducer, and a drive support seat 71 can be provided on the support frame 3 for supporting the reducer and / or the flip motor 61, that is, the fixed housing of the reducer and / or the flip motor 61 can be fixedly mounted on the drive support seat 71; wherein, the flip motor 61 can be a servo motor.

[0041] See also Figures 5 to 10 , which shows the preferred structure of the sealing strip laminating mechanism 2 provided by the embodiment of the utility model. As shown in the figure, the sealing strip laminating mechanism 2 includes: a fixing plate 21, a bearing plate 22, a contour cavity 23, a sealing strip contour plate 24 and a lifting assembly 25; wherein,

[0042] The bearing plate 22 is arranged above the fixed plate 21 in a position-adjustable manner along the height direction, and the bearing plate 22 is connected to a lifting assembly 25 for driving the bearing plate 22 to move up and down. Specifically, the fixed plate 21 can be fixedly mounted on the equipment frame 1, and the bearing plate 22 is arranged above the fixed plate 21 in a position-adjustable manner along the height direction, and can move up and down relative to the fixed plate 21; in order to improve the stability of the up and down movement of the bearing plate 22, preferably, a guide column 27 is provided on the fixed plate 21, and the bearing plate 22 can be slidably arranged on the guide column 27. In this embodiment, a guide column 27 is provided at each of the four corners of the fixed plate 21, and sliding holes are provided at corresponding positions of the bearing plate 22, which can be slidably mounted on the guide columns 27, respectively, so as to guide the bearing plate 22 to move up and down through the four guide columns 27. The bearing plate 22 is connected with a lifting assembly 25, which is used to drive the bearing plate 22 to move up and down along the guide column 27, so that the profiling cavity 23 and the sealing strip profiling plate 24 can move upward, that is, toward the bipolar plate, and then the sealing strip can be bonded and pressed on the bipolar plate. In this embodiment, the lifting assembly 25 can be fixed on the fixed plate 21, and the lifting assembly 25 can be an inductor or other driving mechanism, which is not limited in this embodiment. Among them, one end of the lifting assembly 25 can be installed with a pressure sensor, which is connected to the bearing plate 22 of the lifting assembly 25 to form a floating fixture mechanism.

[0043] The profiling cavity 23 is arranged above the bearing plate 22 in a manner that allows it to be adjusted in height, and an elastic guide 26 is provided between the profiling cavity 23 and the bearing plate 22. After the profiling cavity 23 moves upward with the bearing plate 22 until it abuts against the bipolar plate, when the bearing plate 22 continues to move upward, the elastic guide 26 is compressed and a reset force is applied to the profiling cavity 23. Specifically, the profiling cavity 23 is arranged above the bearing plate 22 in a manner that allows it to move up and down relative to the bearing plate 22, and an elastic guide 26 is provided between the profiling cavity 23 and the bearing plate 22. The profiling cavity 23 can be guided and elastically deformed in its up and down movement. The elastic guide 26 can provide auxiliary support for the profiling cavity 23, so that the profiling cavity 23 can move toward the bipolar plate along with the bearing plate 22, that is, move upward (relative to the profiling cavity 23). Figure 6 shown in the figure), until Figure 6 The top wall of the contoured cavity 23 shown is pressed against the bipolar plate or the bipolar plate adsorption fixture 4, and the load-bearing plate 22 continues to move upward, which can compress and deform the elastic guide member 26 and push the contoured cavity 23 to reset when the load-bearing plate 22 moves downward.

[0044] The sealing strip profiling plate 24 is arranged in the profiling cavity 23 in a manner that it can move up and down, and the sealing strip profiling plate 24 is connected to the bearing plate 22 for placing the sealing strip. The profiling cavity 23 and the sealing strip profiling plate 24 are adjusted in height along with the bearing plate 22 to move toward the bipolar plate on the bipolar plate adsorption fixture 4 until the top wall of the profiling cavity 23 is pressed and contacted with the bipolar plate, and the bearing plate 22 continues to push the sealing strip profiling plate 24 to move toward the bipolar plate, and the elastic guide member 26 is compressed, so that the sealing strip profiling plate 24 moves toward the bipolar plate relative to the profiling cavity 23, thereby driving the sealing strip to move toward the bipolar plate to be embedded in the annular groove of the bipolar plate to achieve bonding and pressing of the sealing strip. Specifically, the sealing strip profiling plate 24 is arranged in the profiling cavity 23 in a manner that it can move up and down, and the sealing strip profiling plate 24 can be connected to the bearing plate 22 through a transmission connecting plate 28, wherein the sealing strip profiling plate 24 and the transmission connecting plate 28, and the bearing plate 22 and the transmission connecting plate 28 can be fixed by bolts, and the bearing plate 22, the transmission connecting plate 28, and the sealing strip profiling plate 24 are fixed by bolts to form a sealing strip groove composed of a lifting assembly 25, which can support and lift the sealing strip. Among them, there can be multiple elastic guides 26, and the specific number can be determined according to actual conditions.

[0045] In this embodiment, the elastic guide member 26 includes: a spring 261 and a movable guide column 27262; wherein the movable guide column 27262 is arranged between the bearing plate 22 and the sealing strip profiling plate 24, and is used to guide the up and down movement of the profiling cavity 23. The spring 261 is sleeved on the movable guide column 27262 and is located between the bearing plate 22 and the profiling cavity 23, and is used to elastically support the profiling cavity 23.

[0046] See also Fig.11 , which is a schematic diagram of the structure of the profiling cavity 23 provided in an embodiment of the utility model. As shown in the figure, the profiling cavity 23 includes: an outer profiling plate 231 and an inner profiling plate 232 connected to each other. Among them, the outer profiling plate 231 is buckled on the upper part of the inner profiling plate 232, and a cavity structure is formed between the two. The thickness of the cavity structure is greater than the thickness of the sealing strip profiling plate 24, so that the sealing strip profiling plate 24 can move up and down in the cavity structure. In this embodiment, the outer profiling plate 231 and the inner profiling plate 232 can be connected by bolts.

[0047] The sealing strip laminating mechanism 2 may also refer to the pressing mechanism in the automatic processing equipment for bipolar plates of a fuel cell and the pressing mechanism thereof disclosed in Chinese Publication No. CN 115256966 A.

[0048] The specific working process of the glue dispensing and laminating machine is as follows: the cathode or anode sealing strip is placed in the sealing strip groove, especially in the sealing strip groove of the sealing strip profiling plate 24; the metal bipolar plate is placed on the bipolar plate adsorption fixture 4, the vacuum adsorption is turned on, and after the glue dispensing mechanism 7 dispenses glue on the bipolar plate, the flipping mechanism 6 flips the bipolar plate adsorption fixture 4 and the metal bipolar plate 180° and moves them to the top of the fixture. The electric cylinder is started, driving the profiling cavity 23 and the lifting assembly 25 upward. When the profiling cavity 23 contacts the metal bipolar plate on the upper bipolar plate adsorption fixture 4, the profiling cavity 23 no longer moves upward, and the lifting assembly 25 continues to rise. The spring 261 between the profiling cavity 23 and the lifting assembly 25 is compressed, and the cathode or anode sealing strip in the sealing strip groove rises to contact the metal bipolar plate and starts to fit. When the lifting pressure reaches the set value, the electric cylinder stops rising and keeps for several seconds, and the gluing is completed. After the gluing is completed, the electric cylinder starts to move downward, the pressure is released, and the contour cavity 23 is acted upon by the spring 261 to return to the initial position. At the same time, the bipolar plate adsorption plate drives the metal double-acting plate with the cathode or anode sealing strip attached to return to the flipping station, and the flipping mechanism 6 flips 180° in the opposite direction, so that the metal bipolar plate faces upward, the vacuum is released, and the metal bipolar plate with the sealing strip attached is removed.

[0049] In summary, the glue dispensing and bonding machine provided in this embodiment adsorbs the bipolar plate through the bipolar plate adsorption fixture 4 to achieve the fixation of the bipolar plate; and drives the bipolar plate to flip through the flipping of the bipolar plate adsorption fixture 4 relative to the support frame 3, so that the bonding surface of the bipolar plate can be flipped to the right direction arrangement; through the linear movement of the support frame 3 along the X-axis, the bipolar plate adsorption fixture 4 and the bipolar plate are driven to move to the top of the sealing strip bonding mechanism 2, and the sealing strip is pressed and bonded to the bonding surface of the bipolar plate through the sealing strip bonding mechanism 2 to complete the glue bonding. The glue dispensing and bonding machine realizes position adjustment through the linear movement of the support frame 3, that is, the adjustment of different workstations, such as the adjustment of the loading position and the bonding position, so that the position control of the bipolar plate is more accurate, and the accuracy of the sealing strip bonding position can be improved, which solves the problem of inaccurate positioning of the bipolar plate caused by the transfer of the bipolar plate by the robotic arm in the existing bipolar plate automatic processing equipment.

[0050] Furthermore, the rotation axis of the bipolar plate adsorption jig 4 and the transverse symmetry axis (the symmetry axis in the length direction) of the bipolar plate adsorption jig 4 are on the same vertical plane, so that its horizontal position remains unchanged after flipping 180°. Compared with flipping around the side, the driving torque and occupied space required for flipping are reduced, which is not only suitable for the processing of small-sized bipolar plates, but also for the processing of large-sized bipolar plates.

[0051] It should be noted that, in the description of the present invention, terms such as "up", "down", "left", "right", "inside", and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is merely for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0052] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0053] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A glue dispensing and laminating machine, characterized in that: include: Equipment racks; A sealing strip laminating mechanism, wherein the sealing strip laminating mechanism is arranged on the equipment frame; A support frame is arranged on the equipment frame in a manner capable of linear movement along the X-axis, and is used to move from one side of the X-axis of the sealing strip laminating mechanism to directly above the sealing strip laminating mechanism; The bipolar plate adsorption jig is rotatably arranged on the support frame, used for adsorbing the bipolar plate, and can drive the bipolar plate to rotate relative to the support frame, so that the bipolar plate bonding surface can be rotated from an upward arrangement to a downward arrangement, and move with the support frame to just above the sealing strip bonding mechanism, so that the sealing strip can be pressed and bonded to the bonding surface of the bipolar plate through the sealing strip bonding mechanism.

2. The glue dispensing and laminating machine according to claim 1, characterized in that: The bipolar plate adsorption jig is connected to a flipping mechanism for driving the bipolar plate adsorption jig to flip.

3. The glue dispensing and laminating machine according to claim 2, characterized in that: The turning mechanism comprises: Flip motor; A flip shaft is connected to the power output end of the flip motor and is used to drive the bipolar plate adsorption fixture to rotate around the axis of the flip shaft.

4. The glue dispensing and laminating machine according to claim 3, characterized in that: The flip axis is arranged along the length direction of the bipolar plate adsorption fixture and directly below the transverse symmetry axis of the bipolar plate adsorption fixture.

5. The glue dispensing and laminating machine according to any one of claims 1 to 4, characterized in that: Also includes: A glue dispensing mechanism, arranged on the equipment frame, for dispensing glue on the bipolar plate; The dispensing mechanism is arranged above the support frame in a manner capable of linear movement along the Y axis, and is used to move along the Y axis so as to move to the Y axis position of the dispensing part of the bipolar plate. The bipolar plate can also move along the X axis with the support frame so that the dispensing part of the bipolar plate moves to the corresponding position of the dispensing mechanism, thereby dispensing the dispensing part of the bipolar plate; The glue wiping mechanism is arranged on the equipment frame and is used for wiping the glue dispensing mechanism.

6. The glue dispensing and laminating machine according to claim 5, characterized in that: The dispensing mechanism comprises: Support seat; The dispensing valve is arranged on the support seat in a position-adjustable manner along the Z axis, and is used to move to the dispensing position of the bipolar plate and perform dispensing.

7. The glue dispensing and laminating integrated machine according to claim 6, characterized in that: The support frame is connected to an X-axis translation mechanism for driving the support frame to move linearly along the X-axis; The dispensing mechanism is connected to a Y-axis translation mechanism for driving the dispensing mechanism to move linearly along the Y-axis; The dispensing valve is connected to a Z-axis translation mechanism for driving the dispensing valve to move linearly along the Z-axis.

8. The glue dispensing and laminating integrated machine according to any one of claims 1 to 4, characterized in that: The support frame is a planar frame structure, and a flip hole matched with the bipolar plate adsorption fixture is provided at the middle position thereof, so that the bipolar plate can be flipped at the flip hole.

9. The glue dispensing and laminating integrated machine according to any one of claims 1 to 4, characterized in that: The bipolar plate adsorption fixture is a vacuum adsorption component, and a plate profiling groove is provided on the adsorption wall surface of the bipolar plate adsorption fixture for positioning the bipolar plate.

10. The glue dispensing and laminating integrated machine according to any one of claims 1 to 4, characterized in that: The sealing strip laminating mechanism comprises: Fixed plate; A load-bearing plate is arranged above the fixing plate in a height-adjustable manner, and the load-bearing plate is connected to a jacking assembly for driving the load-bearing plate to move up and down; A contoured cavity is arranged above the bearing plate, and an elastic guide is arranged between the contoured cavity and the bearing plate, so that after the contoured cavity moves upward with the bearing plate until it abuts against the bipolar plate, when the bearing plate continues to move upward, the elastic guide is compressed and a restoring force can be applied to the contoured cavity; A sealing strip profiling plate is arranged in the profiling cavity in a movable manner up and down, and the sealing strip profiling plate is connected to the bearing plate and is used to place the sealing strip. The profiling cavity and the sealing strip profiling plate are adjusted in height along with the bearing plate to move toward the bipolar plate on the bipolar plate adsorption fixture until the top wall of the profiling cavity is pressed and contacted with the bipolar plate, and the bearing plate continues to push the sealing strip profiling plate to move toward the bipolar plate. The elastic guide is compressed, so that the sealing strip profiling plate moves toward the bipolar plate relative to the profiling cavity, thereby driving the sealing strip to move toward the bipolar plate to be embedded in the sealing strip groove of the bipolar plate to achieve bonding and pressing of the sealing strip.

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