Horizontal plating jet device capable of preventing plate surface from being scratched

Abstract

The utility model belongs to the technical field of solar component coating, and relates to a horizontal plating jet device capable of preventing a plate surface from being scratched, which comprises an electroplating bath, and an inlet water-blocking roller group, two front line contact roller groups, a rear line contact roller group and an outlet water-blocking roller group which are sequentially arranged in the electroplating bath along the same conveying surface, an anode net parallel to the conveying face is arranged between the two front line contact roller sets, a plurality of hollow conductive needles are arranged between the rear line contact roller set and the outlet water blocking roller set side by side, the anode net is electrically connected with the positive electrode of a power source, and the tail end of each hollow conductive needle is a nozzle with the jet flow direction perpendicular to the conveying face. The hollow conductive needle is electrically connected with the negative electrode of the power supply. According to the utility model, metal can be uniformly electroplated on a to-be-plated surface during constant-speed conveying, and the surface of the to-be-plated surface cannot be damaged due to the fact that a hard cathode component is pressed on the to-be-plated surface.

Description

Technical Field

[0001] The utility model relates to the technical field of solar module coating, in particular to a horizontal jet coating device for preventing a plate surface from being scratched. Background Art

[0002] At present, in the horizontal electroplating process, the commonly used electroplating method is the continuous spraying method. The plate to be plated is horizontally transferred in the electroplating tank, and anode plates parallel to the plate to be plated are arranged on the upper and lower sides of the plate to be plated. Several groups of jet components are arranged in the plating tank, and the liquid outlet of the jet component is vertically arranged on the surface of the electroplated part. The cathode contacts the plate to be plated through a cathode brush or a cathode roller to realize continuous electroplating.

[0003] Chinese patent CN217298052U discloses a crystalline silicon solar cell electroplating device, in which the anode roller is partially immersed in the electroplating solution, and a cathode module is arranged directly above the electroplating tank. The cathode module includes an adjustment component and a conductive brush detachably connected to the adjustment component. The cell passes through the gap between the anode roller and the conductive brush, and the conductive brush is perpendicular to and in contact with the surface of the cell. The adjustment component is used to adjust the interference of the conductive brush on the surface of the cell. Here, the conductive brush is connected to the cathode, so that the surface of the cell is negatively charged, and the anode roller will apply the electroplating solution to the lower surface of the cell in contact with it, so that metal can be plated on the cell due to oxidation reaction. However, since the cathode brush or cathode roller is in an electric field environment and contacts the electroplating solution for a long time, metal will be deposited synchronously on the surface of the cathode brush or cathode roller during the electroplating process. Therefore, it is necessary to stop the cathode brush or cathode roller surface for deplating treatment every once in a while, which will reduce the effective utilization rate of the equipment and increase the maintenance cost of the equipment. Since the cathode brush or cathode roller needs to be in close contact with the workpiece to be transferred, during the horizontal transmission of the workpiece, fragments or deformation may occur due to surface force, reducing the yield rate.

[0004] Therefore, it is necessary to develop a new electroplating equipment to solve the above problems. Summary of the invention

[0005] The main purpose of the utility model is to provide a horizontal jet plating device that avoids scratches on the plate surface. The device can use a nozzle to spray negatively charged plating liquid onto the surface of the plate to be plated, making it a negatively charged equipotential body. A current field with uniform thickness is formed at the part facing the anode mesh, so that the metal is evenly plated on the surface to be plated during uniform speed transportation.

[0006] The utility model achieves the above-mentioned purpose through the following technical scheme: a horizontal jet plating device for avoiding scratches on a plate surface, comprising an electroplating tank, an inlet water-blocking roller group, two front-line contact roller groups, a rear-line contact roller group and an outlet water-blocking roller group arranged in sequence in the electroplating tank along the same conveying surface, an insoluble anode net arranged parallel to the conveying surface is provided between the two front-line contact roller groups, a plurality of hollow-type conductive needles are arranged side by side between the rear-line contact roller group and the outlet water-blocking roller group, the insoluble anode net is electrically connected to the positive pole of a power supply, the end of each hollow-type conductive needle is a nozzle whose jet direction is perpendicular to the conveying surface, and the hollow-type conductive needle is electrically connected to the negative pole of a power supply.

[0007] Specifically, the insoluble anode mesh includes an upper anode mesh located above the conveying surface and a lower anode mesh located below the conveying surface, the height of the upper anode mesh is lower than the highest point of the imported water-blocking roller group, the height of the lower anode mesh is higher than the lowest point of the imported water-blocking roller group, and the distance between the insoluble anode mesh and the conveying surface is 1-10mm; an inner hollow conductive needle is respectively provided in the upper and lower directions of the conveying surface.

[0008] Furthermore, the distance between the end of the hollow conductive needle and the conveying surface is 1-2 mm, and the side surface of the hollow conductive needle has an insulating layer.

[0009] Specifically, the inner hollow conductive needle is arranged on an insulating liquid storage box, and the liquid storage box includes a uniform flow chamber close to the conveying surface and a cavity away from the conveying surface, the cavity is isolated from the uniform flow chamber, the head of the inner hollow conductive needle extends out of the liquid storage box, the part of the inner hollow conductive needle located in the uniform flow chamber is provided with a plating liquid inlet connected to the nozzle, the middle part of the inner hollow conductive needle passes through the isolation surface between the uniform flow chamber and the cavity, and a conductive copper bus electrically connected to the tails of all the inner hollow conductive needles is provided in the cavity, and the conductive copper bus is electrically connected to the negative pole of the power supply.

[0010] Furthermore, the liquid storage box is composed of a main body, a pressure equalizing plate, a cofferdam and a bottom plate connected in sequence, the lower part of the main body is recessed and the recessed position and the upper surface of the pressure equalizing plate form the flow equalizing cavity, the inner hollow conductive needle passes through the upper part of the main body and the pressure equalizing plate, the cofferdam is a hollow prism, and the lower surface of the pressure equalizing plate, the inner wall of the cofferdam and the upper surface of the bottom plate form the cavity.

[0011] The beneficial effects of the technical solution of the utility model are:

[0012] The utility model can utilize the nozzle of the hollow conductive needle to spray the negatively charged electroplating solution onto the surface of the plate to be plated so as to make it a negatively charged equipotential body, and a current field with uniform thickness will be formed at the part of the plate to be plated that is directly opposite to the insoluble anode mesh, so that the metal is evenly electroplated on the surface to be plated during uniform speed transportation, and no harder cathode component will damage the surface due to pressing on the surface to be plated. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a working principle diagram of the horizontal plating jet device of the embodiment when electroplating the plate to be plated;

[0014] Figure 2 This is the assembly structure diagram of the liquid storage box;

[0015] Figure 3 This is a diagram showing the position relationship between the front contact roller group and the upper and lower anode grids.

[0016] The numbers in the figure represent:

[0017] 1- Horizontal plating jet device,

[0018] 11- Plating tank,

[0019] 12a-inlet water-blocking roller group, 12b-front line contact roller group, 12c-rear line contact roller group, 12d-exit water-blocking roller group,

[0020] 13a-upper anode mesh, 13b-lower anode mesh,

[0021] 14-hollow conductive needle, 141-nozzle, 142-electroplating liquid inlet,

[0022] 15-liquid storage box, 1501-flow chamber, 1502-cavity, 151-main body, 152-pressure plate, 153-cofferdam, 154-bottom plate,

[0023] 16-conductive copper busbar;

[0024] 2-plate to be plated;

[0025] 3- Plating solution. DETAILED DESCRIPTION

[0026] The utility model is further described in detail below in conjunction with specific embodiments.

[0027] Example:

[0028] like Figures 1 to 3As shown, a horizontal jet plating device 1 for avoiding scratches on a plate surface of the utility model comprises an electroplating tank 11, an inlet water-blocking roller group 12a, two front line contact roller groups 12b, a rear line contact roller group 12c and an outlet water-blocking roller group 12d which are sequentially arranged in the electroplating tank 11 along the same conveying surface, an insoluble anode net (upper anode net 13a, lower anode net 13b) arranged parallel to the conveying surface is provided between the two front line contact roller groups 12b, a plurality of inner hollow conductive needles 14 are arranged side by side between the rear line contact roller group 12c and the outlet water-blocking roller group 12d, the insoluble anode net is electrically connected to the positive electrode of a power supply, the end of each inner hollow conductive needle 14 is a nozzle 141 whose jet direction is perpendicular to the conveying surface, and the inner hollow conductive needle 14 is electrically connected to the negative electrode of the power supply.

[0029] Before work, the plating solution 3 exceeding the height of the conveying surface will be injected into the plating tank 11, so that the insoluble anode net is also immersed. The front line contact roller group 12b needs to be arranged on both sides of the conveying direction to avoid the insoluble anode net, and is transmitted through the side of the plate 2 to be plated. A coating area will be formed between the inlet water-blocking roller group 12a and the rear line contact roller group 12c, and a polarization area will be formed between the rear line contact roller group 12c and the outlet water-blocking roller group 12d. The nozzle 141 of the hollow conductive needle 14 in the polarization area sprays the negatively charged plating solution onto the surface of the plate 2 to be plated, making it a negatively charged equipotential body, and the plate 2 to be plated and the insoluble anode net The part opposite will form a current field with uniform thickness, so that the metal is evenly plated on the surface to be plated when conveyed at a uniform speed, and there will be no harder cathode parts that damage the surface because they are pressed on the surface to be plated.

[0030] like Figure 1 As shown, the insoluble anode mesh includes an upper anode mesh 13a located above the conveying surface and a lower anode mesh 13b located below the conveying surface. The height of the upper anode mesh 13a is lower than the highest point of the imported water-blocking roller group 12a, and the height of the lower anode mesh 13b is higher than the lowest point of the imported water-blocking roller group 12a. The distance between the insoluble anode mesh and the conveying surface is 1-10mm; an inner hollow conductive needle 14 is provided in the upper and lower directions of the conveying surface.

[0031] In this embodiment, both the front and back sides of the plate 2 to be plated need to be plated, so it is preferred to use two upper and lower hollow conductive needles 14 for spraying liquid, and correspondingly, an upper anode net 13a and a lower anode net 13b are also required to generate a uniform electric field to meet the needs of double-sided electroplating uniformity. Because electroplating is accompanied by the movement of cations, gravity will make the downward movement speed of cations different from the upward movement speed, so the distance between the upper anode net 13a and the lower anode net 13b and the conveying surface is generally inconsistent, and the spacing is between 1-10mm, which is relatively high for electroplating efficiency.

[0032] like Figure 1As shown, the distance between the end of the hollow conductive needle 14 and the conveying surface is 1-2 mm, and the side surface of the hollow conductive needle 14 has an insulating layer.

[0033] The main function of the hollow conductive needle 14 is to allow the plating solution to carry a large amount of negative charge, but the periphery itself must avoid electroplating due to the accumulation of negative charges, so an insulating layer is required here, and the plating solution can only exchange charges with the inner wall of the nozzle 141.

[0034] like Figure 1 and Figure 2 As shown, the inner hollow conductive needle 14 is arranged on an insulating liquid storage box 15, and the liquid storage box 15 includes a uniform flow chamber 1501 close to the conveying surface and a cavity 1502 away from the conveying surface. The cavity 1502 is isolated from the uniform flow chamber 1501, and the head of the inner hollow conductive needle 14 extends out of the liquid storage box 15. The part of the inner hollow conductive needle 14 located in the uniform flow chamber 1501 is provided with a plating liquid inlet 142 connected to the nozzle 141, and the middle part of the inner hollow conductive needle 14 passes through the isolation surface between the uniform flow chamber 1501 and the cavity 1502. A conductive copper bus 16 electrically connected to the tail of all the inner hollow conductive needles 14 is provided in the cavity 1502, and the conductive copper bus 16 is electrically connected to the negative pole of the power supply.

[0035] The uniform flow chamber 1501 is where the circulating plating solution is transferred before passing through the hollow conductive needles 14. After being decelerated in the uniform flow chamber 1501, the plating solution enters the hollow conductive needles 14 through the plating solution inlet 142, and then is ejected through the nozzle 141. The negative pole of the power supply needs to provide negative charges to all the hollow conductive needles 14 through the conductive copper bus 16, but the plating solution cannot be infiltrated to cause electroplating on the conductive copper bus 16, so the conductive copper bus 16 must be electrically connected to the hollow conductive needles 14 in the dry cavity 1502.

[0036] like Figure 2 As shown, the liquid storage box 15 is composed of a main body 151, a uniform pressure plate 152, a cofferdam 153 and a bottom plate 154 connected in sequence. The lower part of the main body 151 is recessed and the recessed position and the upper surface of the uniform pressure plate 152 form a uniform flow cavity 1501. The hollow conductive needle 14 passes through the upper part of the main body 151 and the uniform pressure plate 152 (i.e., the component where the above-mentioned isolation surface is located). The cofferdam 153 is in the shape of a hollow prism, and the lower surface of the uniform pressure plate 152, the inner wall of the cofferdam 153 and the upper surface of the bottom plate 154 form a cavity 1502.

[0037] Due to the existence of the flow-uniforming chamber 1501 and the cavity 1502 , the liquid storage box 15 needs to be made into an assembled structure for easy processing and assembly.

[0038] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A horizontal jet plating device for preventing scratches on the board surface, characterized in that: The invention comprises an electroplating tank, an inlet water-blocking roller group, two front line contact roller groups, a rear line contact roller group and an outlet water-blocking roller group which are sequentially arranged in the electroplating tank along the same conveying surface, an anode net arranged parallel to the conveying surface is provided between the two front line contact roller groups, a plurality of hollow-type conductive needles are arranged side by side between the rear line contact roller group and the outlet water-blocking roller group, the anode net is electrically connected to the positive electrode of a power supply, the end of each hollow-type conductive needle is a nozzle whose jet direction is perpendicular to the conveying surface, and the hollow-type conductive needle is electrically connected to the negative electrode of a power supply.

2. The horizontal jet plating device for preventing board surface scratches according to claim 1 is characterized in that: The anode net comprises an upper anode net located above the conveying surface and a lower anode net located below the conveying surface, the height of the upper anode net is lower than the highest point of the imported water-blocking roller group, the height of the lower anode net is higher than the lowest point of the imported water-blocking roller group, and the distance between the anode net and the conveying surface is 1-10mm; an inner hollow conductive needle is respectively provided in the upper and lower directions of the conveying surface.

3. The horizontal jet plating device for preventing the board surface from being scratched according to claim 2 is characterized in that: The distance between the end of the hollow conductive needle and the conveying surface is 1-2 mm, and the side surface of the hollow conductive needle has an insulating layer.

4. The horizontal jet plating device for preventing board surface scratches according to claim 1, characterized in that: The inner hollow conductive needle is arranged on an insulating liquid storage box, and the liquid storage box includes a uniform flow cavity close to the conveying surface and a cavity away from the conveying surface. The cavity is isolated from the uniform flow cavity. The head of the inner hollow conductive needle extends out of the liquid storage box. The part of the inner hollow conductive needle located in the uniform flow cavity is provided with a plating liquid inlet connected to the nozzle. The middle part of the inner hollow conductive needle passes through the isolation surface between the uniform flow cavity and the cavity. A conductive copper busbar electrically connected to the tails of all the inner hollow conductive needles is provided in the cavity, and the conductive copper busbar is electrically connected to the negative pole of the power supply.

5. The horizontal jet plating device for preventing the board surface from being scratched according to claim 4 is characterized in that: The liquid storage box is composed of a main body, a uniform pressure plate, a cofferdam and a bottom plate connected in sequence. The lower part of the main body is recessed and the recessed position and the upper surface of the uniform pressure plate form the uniform flow cavity. The inner hollow conductive needle passes through the upper part of the main body and the uniform pressure plate. The cofferdam is a hollow prism. The lower surface of the uniform pressure plate, the inner wall of the cofferdam and the upper surface of the bottom plate form the cavity.

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