Computer CPU heat exchange device
By using spiral heat exchange tubes and vortex heat exchange tubes in the computer CPU heat exchange device, the cooling liquid is filled and combined with the airflow introduction structure and blower, the problem of poor heat dissipation effect of the existing CPU is solved, significantly improving the heat exchange effect of the CPU and the stability of the computer.
Patent Information
- Application Number
- CN202421449862.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-24
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-06-24
AI Technical Summary
The heat dissipation effect of existing computer CPUs is poor, mainly because the heat exchange medium in the fan or water-cooled heat dissipation structure is air, resulting in low heat transfer efficiency.
A computer CPU heat exchange device is designed, using spiral heat exchange tubes and vortex heat exchange tubes, which are filled with coolant and are used to improve heat exchange efficiency through the airflow introduction structure and the blower.
By increasing the heat exchange and heat absorption area, the heat exchange effect of the CPU is improved, the CPU temperature is effectively reduced, and the computer's stability and operation efficiency are improved.
Smart Images
Figure CN222672275U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of computers, in particular to a computer CPU heat exchange device. Background Art
[0002] The CPU is the computing and control core of the computer, mainly composed of an arithmetic unit, a controller, a register group, a cache memory and an internal bus. As the core of the computer, the CPU is responsible for the coordination, control and program operation of the entire computer system. With the advancement of large-scale integrated circuit technology and microelectronics technology, more and more electronic components are integrated into the CPU. From the perspective of external physical structure, the CPU is mainly composed of a substrate, a core, pins, fillers between substrates, and a radiator device support pad. Among them, the radiator is extremely important for the stable operation of the computer. Most existing radiators are fans or water-cooled heat dissipation structures. Although they can dissipate heat to a certain extent for the computer, the heat transfer efficiency is low because the heat exchange medium is air, resulting in poor heat exchange effect of the computer CPU. For this reason, we propose a computer CPU heat exchange device that can improve the heat exchange effect. Utility Model Content
[0003] The purpose of the utility model is to provide a computer CPU heat exchange device to solve the problems raised in the above background technology.
[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a computer CPU heat exchange device, comprising a support seat, which can support the bottom of the CPU heat exchange device, and an opening is integrally formed at the bottom of the support seat, which is conducive to airflow out of the bottom of the support seat, so that the CPU heat exchange device can exchange heat and dissipate heat from the bottom. A bottom heat exchange structure is installed at the bottom of the support seat, and the bottom heat exchange structure transfers heat from the bottom of the support seat. A spiral heat exchange tube is fixed to the top of the support seat through a positioning ring, an upper frame is welded to the top of the spiral heat exchange tube, and a functional connection component is connected to the side of the upper frame. The interior of the spiral heat exchange tube is filled with coolant, and the top of the upper frame is detachably connected to an airflow introduction structure through a slot, and the airflow introduction structure can flow air with a lower external temperature into the space surrounded by the spiral heat exchange tube to dissipate the heat of the CPU mainboard inside.
[0005] As a further solution of the utility model: lower convex parts are formed between adjacent openings, the lower convex parts are linearly arranged at equal intervals about the central axis of the support seat, the number of the lower convex parts is at least three, and the side of the support seat is penetrated by air holes, which can increase the heat exchange area between the inside and the outside of the support seat.
[0006] As a further solution of the utility model: the bottom heat exchange structure includes a protective groove, the bottom surface of the protective groove is 3cm-5cm high from the plane where the bottom of the lower convex part is located, and a plurality of heat sinks arranged in a circular array with equal spacing are welded on the side of the protective groove. A vortex heat exchange tube and a heat dissipation fan penetrate the bottom of the protective groove. The interior of the vortex heat exchange tube is sealed and filled with coolant. The vortex heat exchange tube can increase the heat exchange area between the protective groove and the outside, thereby enhancing the heat exchange effect of the protective groove.
[0007] As a further solution of the utility model: the spiral heat exchange tube is a spiral hollow aluminum alloy pipe, which can form a cylindrical space inside to install computer electronic components.
[0008] As a further solution of the utility model: the functional connection component includes a power switch button, an audio source jack, a power socket and a USB interface, which is convenient for connection with external devices.
[0009] As a further solution of the utility model: the spiral heat exchange tube is a hard spiral tube, and a protective net is welded on the side of the spiral heat exchange tube. The protective net is a steel wire mesh, which can reduce the dust from entering the heat exchange device.
[0010] As a further solution of the utility model: the spiral heat exchange tube is a flexible spiral tube, and retaining rods are welded to the inner wall of the spiral heat exchange tube. The retaining rods are arranged in a circular array with equal spacing about the central axis of the spiral heat exchange tube, and the retaining rods can maintain the height of the spiral heat exchange tube.
[0011] As a further solution of the utility model: the inner wall of the spiral heat exchange tube is connected to a CPU assembly, the CPU assembly includes brackets arranged linearly at equal intervals in the vertical direction, and the top of the bracket is connected to a CPU mainboard as a support structure of the CPU mainboard.
[0012] As a further solution of the utility model: the airflow introduction structure includes a connecting plate, a threaded hole is opened through the top of the connecting plate, and a blower is installed through the top of the connecting plate, and the blower can discharge the hot airflow in the device to the outside of the device.
[0013] Compared with the prior art, the beneficial effects of the utility model are:
[0014] 1. The utility model can form the side wall of the CPU heat exchange device by arranging a spiral heat exchange tube filled with coolant, thereby increasing the heat exchange and heat absorption area compared with the traditional computer host, which is beneficial to improving the heat exchange effect of the CPU heat exchange device. By arranging a blower and a heat dissipation fan directly opposite to the blower to guide the airflow in the CPU heat exchange device, the heat dissipation airflow can completely contact the heating element, thereby improving the heat exchange effect.
[0015] 2. The utility model welds a protective net on the side of the spiral heat exchange tube, and the protective net is set to be a wire mesh, which can reduce the entry of dust into the heat exchange device. By arranging retaining rods arranged in a circular array with equal intervals about the central axis of the spiral heat exchange tube, the retaining rods can maintain the height of the spiral heat exchange tube. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a partially exploded three-dimensional structural diagram of the utility model;
[0017] Figure 2 This is a structural diagram of the support base from the bottom perspective of the utility model.
[0018] In the figure: 1, support seat; 101, lower convex part; 2, protective groove; 3, heat sink; 4, positioning ring; 5, spiral heat exchange tube; 6, protective net; 7, retaining rod; 8, upper frame; 9, bracket; 10, functional connection component; 11, slot; 12, connecting plate; 13, blower; 14, threaded hole; 15, air hole; 16, opening; 17, vortex heat exchange tube; 18, cooling fan. DETAILED DESCRIPTION
[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0020] See also Figure 1-Figure 2 The utility model provides a technical solution: a computer CPU heat exchange device, comprising a support base 1, and the support base 1 can support the bottom of the CPU heat exchange device.
[0021] The bottom heat exchange structure includes a protective groove 2, the bottom of which is penetrated by a vortex heat exchange tube 17 and a heat dissipation fan 18, the interior of the vortex heat exchange tube 17 is sealed and filled with coolant, the bottom of the support seat 1 is integrally formed with an opening 16, the opening 16 is conducive to the airflow out of the bottom of the support seat 1, and it is convenient for the CPU heat exchange device to exchange heat and dissipate heat from the bottom, the bottom of the support seat 1 is installed with a bottom heat exchange structure, the bottom heat exchange structure transfers heat from the bottom of the support seat 1, the top of the support seat 1 is fixed with a spiral heat exchange tube 5 through a positioning ring 4, and the top of the spiral heat exchange tube 5 is welded with an upper frame 8. A functional connection component 10 is connected to the side of the upper frame 8. The interior of the spiral heat exchange tube 5 is filled with coolant. The top of the upper frame 8 is detachably connected to an airflow introduction structure through a slot 11. The airflow introduction structure can flow air with a lower external temperature into the space surrounded by the spiral heat exchange tube 5 to dissipate the heat of the CPU mainboard inside. The airflow introduction structure includes a connecting plate 12. A threaded hole 14 is formed through the top of the connecting plate 12. A blower 13 is installed through the top of the connecting plate 12. The blower 13 can discharge the hot air flow in the device to the outside of the device.
[0022] Preferably, Figure 1 As shown, a lower protrusion 101 is formed between adjacent openings 16, and the lower protrusions 101 are linearly arranged at equal intervals about the central axis of the support seat 1. The number of the lower protrusions 101 is at least three, and the side of the support seat 1 is penetrated by air holes 15, which can increase the heat exchange area between the inside and outside of the support seat 1.
[0023] Preferably, Figure 2 As shown, the height of the bottom surface of the protective groove 2 from the plane where the bottom of the lower protrusion 101 is located is 5 cm, and a plurality of heat sinks 3 arranged in a circular array with equal spacing are welded on the side of the protective groove 2. The vortex heat exchange tube 17 can increase the heat exchange area between the protective groove 2 and the outside, thereby enhancing the heat exchange effect of the protective groove 2.
[0024] Preferably, Figure 1 As shown, the spiral heat exchange tube 5 is a spiral hollow aluminum alloy pipe, which can form a cylindrical space inside to install computer electronic components.
[0025] Preferably, Figure 1 As shown, the functional connection component 10 includes a power switch button, an audio source jack, a power socket and a USB interface, which is convenient for connecting with external devices.
[0026] Preferably, Figure 1 As shown, a protective net 6 is welded on the side of the spiral heat exchange tube 5. The protective net 6 is a wire mesh that can reduce the entry of dust into the heat exchange device. Retaining rods 7 are welded on the inner wall of the spiral heat exchange tube 5. The retaining rods 7 are arranged in a circular array with equal spacing about the central axis of the spiral heat exchange tube 5. The retaining rods 7 can maintain the height of the spiral heat exchange tube 5.
[0027] Preferably, Figure 1 As shown, the inner wall of the spiral heat exchange tube 5 is connected to a CPU assembly, and the CPU assembly includes brackets 9 arranged linearly at equal intervals in the vertical direction, and the top of the brackets 9 is connected to a CPU mainboard as a supporting structure of the CPU mainboard.
[0028] Working principle: When in use, the mesh holes on the protective net 6 can increase the heat exchange area, which is convenient for dissipating the heat generated by the electronic components inside the heat exchange device. In the process of enhancing the heat exchange effect, the blower 13 and the heat dissipation fan 18 are started to guide the airflow in the heat exchange device. The external low-temperature air is introduced into the heat exchange device through the blower 13 to take away the heat generated in the heat exchange device. The heat dissipation fan 18 can discharge the airflow with increased temperature in the heat exchange device. In the process of the heated airflow flowing into the heat dissipation fan 18, the coolant liquid filled in the spiral heat exchange tube 5 can dissipate the heat of the side wall of the device. At the same time, the vortex heat exchange tube 17 can increase the heat exchange area between the protective groove 2 and the outside, thereby enhancing the heat exchange effect of the protective groove 2.
[0029] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A computer CPU heat exchange device, comprising a support seat (1), characterized in that: The bottom of the support seat (1) is integrally formed with an opening (16), the bottom of the support seat (1) is installed with a bottom heat exchange structure, the bottom heat exchange structure transfers heat from the bottom of the support seat (1), the top of the support seat (1) is fixed with a spiral heat exchange tube (5) via a positioning ring (4), the top of the spiral heat exchange tube (5) is welded with an upper frame (8), the side of the upper frame (8) is connected with a functional connection component (10), the interior of the spiral heat exchange tube (5) is filled with coolant, and the top of the upper frame (8) is detachably connected with an airflow introduction structure via a slot (11).
2. A computer CPU heat exchange device according to claim 1, characterized in that: Lower convex parts (101) are formed between adjacent openings (16), the lower convex parts (101) are linearly arranged at equal intervals about the central axis of the support seat (1), the number of the lower convex parts (101) is at least three, and the side surface of the support seat (1) is penetrated by air holes (15).
3. A computer CPU heat exchange device according to claim 2, characterized in that: The bottom heat exchange structure comprises a protective groove (2), the bottom surface of the protective groove (2) is 3 cm to 5 cm above the plane where the bottom of the lower convex portion (101) is located, a plurality of heat sinks (3) arranged in a circular array at equal intervals are welded to the side of the protective groove (2), a vortex heat exchange tube (17) and a heat dissipation fan (18) penetrate the bottom of the protective groove (2), and the interior of the vortex heat exchange tube (17) is sealed and filled with coolant.
4. A computer CPU heat exchange device according to claim 1, characterized in that: The spiral heat exchange tube (5) is a spiral hollow aluminum alloy pipe.
5. A computer CPU heat exchange device according to claim 1, characterized in that: The functional connection component (10) comprises a power switch button, an audio source jack, a power socket and a USB interface.
6. A computer CPU heat exchange device according to claim 1, characterized in that: The spiral heat exchange tube (5) is a hard spiral tube, and a protective net (6) is welded to the side of the spiral heat exchange tube (5), wherein the protective net (6) is a steel wire net.
7. A computer CPU heat exchange device according to claim 1, characterized in that: The spiral heat exchange tube (5) is a flexible spiral tube. Retaining rods (7) are welded to the inner wall of the spiral heat exchange tube (5). The retaining rods (7) are arranged in a circular array with equal spacing about the central axis of the spiral heat exchange tube (5).
8. A computer CPU heat exchange device according to claim 1, characterized in that: The inner wall of the spiral heat exchange tube (5) is connected to a CPU component, and the CPU component includes brackets (9) arranged linearly at equal intervals in the vertical direction, and the top of the bracket (9) is connected to a CPU mainboard.
9. A computer CPU heat exchange device according to claim 1, characterized in that: The airflow introduction structure comprises a connection plate (12), a threaded hole (14) is provided through the top of the connection plate (12), and a blower (13) is installed through the top of the connection plate (12).