Wafer taking device of wafer laminator
By setting up a circular groove and a placement table on the film platform of the wafer film sticker, and using the cylinder expansion and contraction mechanism to form a gap, the problem of inconvenience in the prior art is solved, and the effect of convenient removal is achieved.
Patent Information
- Application Number
- CN202421356462.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-14
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-06-14
AI Technical Summary
When taking the wafer, the existing wafer film stickers have little gaps between the wafer and the fixed plate, and it is difficult for staff to easily remove the wafer that has been pasted.
A wafer picking device for a wafer film sticker is designed, including a circular groove and a placement table on the film sticker platform. The placement table is composed of a main body, a cylinder and a fixing plate. The cylinder expands and retracts to lift the fixed plate, forming a certain gap for the sheet picking up.
Through the cylinder expansion and contraction mechanism, a gap is formed so that the wafer that has been pasted can be easily removed from the main body, solving the problem of inconvenience in chip removal.
Smart Images
Figure CN222672983U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer film mounting machines, in particular to a wafer taking device of a wafer film mounting machine. Background Art
[0002] Wafer lamination is mainly to prepare for wafer cutting. Wafer lamination is the process of covering the back of the wafer with a blue film. This process requires the use of a wafer lamination machine, which is a device that efficiently covers the wafer with a blue film.
[0003] The common wafer laminating machine now includes a laminating machine body, a laminating platform and a laminating device. A fixed plate for placing wafers or taking wafers is provided on the laminating platform. The wafer to be laminarized is placed on the fixed plate, and the laminating device is started. The laminating device laminates the wafer. Finally, the staff takes the wafer with laminarized film down from the fixed plate and places it properly.
[0004] Regarding the above technical conditions, there is still a defect that when the wafer on the fixed plate of the film laminating platform is removed after the film laminating is completed, since the wafer is completely adhered to the fixed plate, there is basically no gap between the wafer and the fixed plate, and it is not convenient for the staff to remove the wafer with the film laminating from the fixed plate.
[0005] Based on this, the utility model designs a wafer taking device for a wafer mounting machine to solve the above problems. Utility Model Content
[0006] The utility model aims to provide a wafer taking device for a wafer mounting machine to solve the above technical problems.
[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer taking device of a wafer film mounting machine, comprising a body of the film mounting machine, a film mounting platform and a film mounting device, the film mounting platform is arranged on the body, the film mounting device is arranged on the body, the film mounting platform is provided with a circular groove, a placing table is arranged in the circular groove, the placing table comprises a main body, a cylinder and a fixed plate, the main body is fixedly arranged in the circular groove, the main body is provided with an installation groove, the cylinder is fixedly arranged in the installation groove, the fixed plate is fixedly arranged on the telescopic shaft of the cylinder, the fixed plate is located in the installation groove, and when the cylinder is not working, the fixed plate is consistent in height with the main body.
[0008] Preferably, the diameter of the placement platform is smaller than the diameter of the circular groove.
[0009] Preferably, an electric telescopic rod is fixedly arranged in the circular groove, the electric telescopic rod is between the film sticking platform and the placement table, a plurality of the electric telescopic rods are arranged in the circular groove, the electric telescopic rod is fixedly connected with a positioning ring, and the placement table is located in the positioning ring.
[0010] Preferably, a fixing opening is provided on the positioning ring.
[0011] Preferably, an infrared sensor is fixedly arranged on the film sticking platform, and the infrared sensor is electrically connected to the electric telescopic rod.
[0012] Preferably, a protective cover is rotatably provided on the machine body, a rotating rod is rotatably provided on the protective cover, a cutter is fixedly provided on the rotating rod, two cutters are provided on the rotating rod, a tightening layer is fixedly provided on the rotating rod, and the tightening layer is between the two cutters.
[0013] To sum up, the present application has the following beneficial technical effects: after the wafer is pasted with film on the film laminating machine, the protective cover is opened, the cylinder is started, and the fixed plate is lifted up by the telescopic shaft of the cylinder. The wafer pasted with film moves away from the main body as the fixed plate is lifted up. At this time, there is a certain gap between the main body and the wafer, which is convenient for the staff to remove the wafer from the main body through the gap, thereby achieving the effect of facilitating the removal of the wafer pasted with film from the wafer laminating machine. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0015] Figure 1 It is a structural schematic diagram of the film laminating machine of this embodiment;
[0016] Figure 2 Schematic diagram of the cross-sectional structure of the film laminating machine of this embodiment;
[0017] Figure 3 This is a schematic diagram of the installation structure of the film laminating machine of this embodiment;
[0018] Figure 4 It is a schematic diagram of the front structure of the film laminating machine of this embodiment.
[0019] In the accompanying drawings, the components represented by the reference numerals are listed as follows:
[0020] 1. Protective cover; 2. Fixing plate; 3. Main body; 4. Positioning ring; 5. Fixing port; 6. Circular groove; 7. Infrared sensor; 8. Machine body; 9. Film sticking device; 10. Cutter; 11. Clamping layer; 12. Mounting groove; 13. Cylinder; 14. Electric telescopic rod; 15. Film sticking platform. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0022] The following is combined with Figure 1-4 This application is described in further detail.
[0023] A wafer fetching device of a wafer laminating machine comprises a body 8 of the laminating machine, a laminating platform 15 and a laminating device 9, wherein the laminating platform 15 is arranged on the body 8, the laminating device 9 is arranged on the body 8, a circular groove 6 is opened on the laminating platform 15, and a placing table is arranged in the circular groove 6.
[0024] The placement table includes a main body 3, a cylinder 13 and a fixed plate 2. The main body 3 is fixedly arranged in the circular groove 6. A mounting groove 12 is opened on the side of the main body 3 away from the body 8. The cylinder 13 is fixedly arranged in the mounting groove 12. The fixed plate 2 is fixedly arranged on the telescopic axis of the cylinder 13. The fixed plate 2 is located in the mounting groove 12. When the cylinder 13 is not working, the height of the fixed plate 2 is consistent with that of the main body 3.
[0025] The wafer to be filmed is placed on the main body 3, and the film-sticking device 9 sticks the film on the wafer. After the film is stuck on the wafer, the cylinder 13 is started, and the fixed plate 2 is lifted up by the cylinder 13. The wafer with the film stuck is moved away from the main body 3 as the fixed plate 2 is lifted up. At this time, it is convenient to remove the wafer from the main body 3.
[0026] The diameter of the placement table is smaller than the diameter of the circular groove 6. An electric telescopic rod 14 is fixedly installed in the circular groove 6. The electric telescopic rod 14 is between the film-sticking platform 15 and the placement table. There are multiple electric telescopic rods 14 in the circular groove 6. The electric telescopic rod 14 is fixedly connected to a positioning ring 4. The placement table is located in the positioning ring 4.
[0027] An infrared sensor 7 is fixedly arranged on the machine body 8, and the infrared sensor 7 is electrically connected to the electric telescopic rod 14. When the wafer to be laminated needs to be placed on the placement table, the staff touches the infrared sensor 7, the electric telescopic rod 14 is started, and the positioning ring 4 is lifted up by the electric telescopic rod 14. At this time, the top of the positioning ring 4 is higher than the top of the placement table, which makes it convenient to quickly and correctly place the wafer on the placement table without constantly adjusting the placement position of the wafer.
[0028] When the wafer is placed and touches the infrared sensor 7 again, the electric telescopic rod 14 contracts, and the positioning ring 4 moves closer to the bottom of the circular groove 6. At this time, the bottom of the positioning ring 4 is lower than the top of the placement table.
[0029] The positioning ring 4 is provided with a fixing opening 5, which is convenient for the staff to place the wafer on the placement table. A protective cover 1 is rotatably provided on the machine body 8, a rotating rod is rotatably provided on the protective cover 1, a cutter 10 is fixedly provided on the rotating rod, two cutters 10 are provided on the rotating rod, and the two cutters 10 are respectively provided at both ends of the rotating rod, and a tight layer 11 is fixedly provided on the rotating rod, and the tight layer 11 is between the two cutters 10.
[0030] When the wafer film is pasted, the protective cover 1 is closed on the machine body 8, the cutter 10 is pressed against the positioning ring 4, the pressing layer 11 is pressed against the wafer, the rotating rod is rotated, and the cutter 10 cuts off the excess film; the pressing layer 11 makes the film and the wafer fit better during the rotation of the rotating rod.
[0031] The implementation principle of this embodiment is: after the wafer is pasted with film on the film laminating machine, the protective cover 1 is opened, the cylinder 13 is started, and the fixed plate 2 is lifted up by the telescopic shaft of the cylinder 13. The wafer pasted with film is lifted up by the fixed plate 2 and moves away from the main body 3. At this time, there is a certain gap between the main body 3 and the wafer, which is convenient for the staff to remove the wafer from the main body 3 through the gap, thereby achieving the effect of facilitating the removal of the wafer pasted with film from the wafer laminating machine.
[0032] In the description of the present invention, it should be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inside", "front", "center", "both ends" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0033] In the present utility model, unless otherwise clearly stipulated and limited, the terms such as "installation", "setting", "connection", "fixation" and "screw-on" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the utility model according to the specific circumstances.
[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A wafer removal device for a wafer film mounting machine, comprising a body (8) of the film mounting machine, a film mounting platform (15) and a film mounting device (9), characterized in that: The film pasting platform (15) is arranged on the machine body (8), the film pasting device (9) is arranged on the machine body (8), the film pasting platform (15) is provided with a circular groove (6), a placing table is arranged in the circular groove (6), the placing table comprises a main body (3), a cylinder (13) and a fixing plate (2), the main body (3) is fixedly arranged in the circular groove (6), the main body (3) is provided with a mounting groove (12), the cylinder (13) is fixedly arranged in the mounting groove (12), the fixing plate (2) is fixedly arranged on the telescopic shaft of the cylinder (13), the fixing plate (2) is located in the mounting groove (12), and when the cylinder (13) is not working, the fixing plate (2) is at the same height as the main body (3).
2. The wafer taking device of the wafer mounting machine according to claim 1, characterized in that: The diameter of the placement platform is smaller than the diameter of the circular groove (6).
3. The wafer taking device of the wafer mounting machine according to claim 1, characterized in that: An electric telescopic rod (14) is fixedly arranged in the circular groove (6); the electric telescopic rod (14) is between the film sticking platform (15) and the placement table; a plurality of the electric telescopic rods (14) are arranged in the circular groove (6); the electric telescopic rod (14) is fixedly connected to a positioning ring (4); and the placement table is located in the positioning ring (4).
4. The wafer taking device of the wafer mounting machine according to claim 3, characterized in that: The positioning ring (4) is provided with a fixing opening (5).
5. The wafer taking device of the wafer mounting machine according to claim 3, characterized in that: An infrared sensor (7) is fixedly arranged on the film sticking platform (15), and the infrared sensor (7) is electrically connected to the electric telescopic rod (14).
6. The wafer taking device of the wafer mounting machine according to claim 1, characterized in that: A protective cover (1) is rotatably provided on the machine body (8), a rotating rod is rotatably provided on the protective cover (1), a cutter (10) is fixedly provided on the rotating rod, two cutters (10) are provided on the rotating rod, a tightening layer (11) is fixedly provided on the rotating rod, and the tightening layer (11) is between the two cutters (10).