Printed circuit board (PCB) turning mechanism

Abstract

The utility model discloses a PCB (printed circuit board) turning mechanism which comprises a turning structure, a conveying belt used for clamping and conveying PCBs is formed on the turning structure, the conveying belt is located in a conveying channel formed by the turning structure, and the turning structure can turn the conveyed PCBs; the object placing plate is mounted in the conveying channel and is arranged right above the conveying belt; the semiconductor chilling plate is arranged on the storage plate, so that the cold end of the semiconductor chilling plate faces the conveying belt, and the hot end of the semiconductor chilling plate faces the side away from the conveying belt; the cold conduction assembly is configured on the object placing plate and is used for conveying a cold source generated at the cold end of the semiconductor chilling plate to the PCB between the conveying belts; the board turnover machine can solve the problems that a traditional board turnover machine only cools the PCB through a fan, the cooling effect is poor, cooling is uniform and inconsistent, and the cooling effect of the PCB is affected.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB boards, and in particular to a PCB board flipping mechanism. Background Art

[0002] PCB is a printed circuit board, also known as a printed circuit board. It is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. Because it is made using electronic printing technology, it is called a "printed" circuit board.

[0003] The traditional flipping machine mainly consists of an outer shell, conveying rollers, and a driving motor. During use, the PCB board is first conveyed to the conveying rollers, and then the outer shell is flipped by the driving motor, and then the PCB board is controlled to move out of the outer shell by the conveying rollers to achieve the flipping effect of the PCB board. However, since the PCB board is a hot plate after the tin spraying process, it needs to be cooled down in time. The traditional flipping machine only uses a fan to cool the PCB board, which has the problems of poor cooling effect and uneven cooling, which affects the cooling effect of the PCB board. Utility Model Content

[0004] In order to overcome the above disadvantages, the purpose of the utility model is to provide a PCB board flipping mechanism.

[0005] In order to achieve the above objectives, the technical solution adopted by the utility model includes:

[0006] A flap structure, wherein the flap structure is formed with a conveyor belt for clamping and conveying the PCB board, the conveyor belt is located in a conveying channel formed by the flap structure, and the flap structure can flip the conveyed PCB board;

[0007] A storage plate, which is installed in the transport channel and placed directly above the conveyor belt;

[0008] A semiconductor refrigeration sheet, wherein the semiconductor refrigeration sheet is arranged on the placement plate so that the cold end of the semiconductor refrigeration sheet faces the conveyor belt and the hot end faces a side away from the conveyor belt;

[0009] A cooling component is arranged on the storage plate and is used to transport the cold source generated by the cold end of the semiconductor refrigeration plate to the PCB board between the conveyor belts.

[0010] In the preferred technical solution of the above-mentioned PCB board flipping mechanism, it also includes a heat dissipation component, which is arranged on the storage plate and directly opposite to the hot end of the semiconductor refrigeration plate. The heat dissipation component can dissipate the heat generated by the hot end of the semiconductor refrigeration plate.

[0011] In the preferred technical solution of the above-mentioned PCB board flip mechanism, the heat dissipation assembly includes heat dissipation fins and a heat dissipation fan, the heat dissipation fins are installed on the top surface of the storage plate and contact the hot end of the semiconductor refrigeration plate, and the heat dissipation fan is installed on the heat dissipation fins.

[0012] In the preferred technical solution of the above-mentioned PCB board flipping mechanism, the cooling assembly includes cooling fins and a cooling fan, the cooling fins are in contact with the cold end of the semiconductor refrigeration plate, and the cooling fan is installed on the cooling fins and configured toward the conveyor belt.

[0013] In the preferred technical solution of the above-mentioned PCB board flip mechanism, the cooling assembly includes an air intake grille and an air intake fan, the air intake grille is arranged in the transport channel of the flip structure, the top end of the air intake grille is not connected to the bottom surface of the storage plate, so that an air flow channel is formed between the air intake grille and the storage plate, and the air intake fan is installed on the side of the storage plate to face the air flow channel.

[0014] In the preferred technical solution of the above-mentioned PCB board flip mechanism, the air intake grille has a first symmetrical part, a second symmetrical part and a third symmetrical part from the outside to the inside, all of which are acute-angle structures.

[0015] In the preferred technical solution of the above-mentioned PCB board flipping mechanism, the top end of the first symmetrical portion away from the side of the air intake fan extends to the bottom surface of the storage plate.

[0016] In the preferred technical solution of the above-mentioned PCB board flip mechanism, the material of the air intake grille is any one of pure copper, pure aluminum, copper alloy or aluminum alloy.

[0017] In the preferred technical solution of the above-mentioned PCB board flip mechanism, an air outlet is formed through the bottom end of the first symmetrical part.

[0018] In the preferred technical solution of the above-mentioned PCB board flip mechanism, a polytetrafluoroethylene coating is sprayed on the surface of the air intake grille.

[0019] The beneficial effect of the utility model is that the application installs a semiconductor cooling plate and a cooling fan on the flip machine, and the cooling fan converts the cold source generated by the semiconductor cooling plate into cold air that is blown toward the PCB board, thereby achieving efficient heat exchange and cooling of the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of an existing panel turning machine;

[0021] Figure 2 Schematic diagram of the PCB board flipping machine in Example 1 Figure 1 ;

[0022] Figure 3 Schematic diagram of the PCB board flipping machine in Example 1 Figure 2 ;

[0023] Figure 4 Schematic diagram of the PCB board flipping machine in Example 2 Figure 1 ;

[0024] Figure 5 This is a diagram showing the internal structure of the PCB board flipping machine in the second embodiment;

[0025] Figure 6 Schematic diagram of the PCB board flipping machine in Example 2 Figure 2 ;

[0026] In the figure: a flap structure 1, an outer shell 11, a transport channel 12, a conveyor belt 13, a servo motor 14, a storage plate 2, cooling fins 31, a cooling fan 32, an air intake grille 33, a first symmetrical portion 331, a second symmetrical portion 332, a third symmetrical portion 333, an air intake fan 34, heat dissipation fins 41, a heat dissipation fan 42, an air flow channel 5, and an air outlet 6. DETAILED DESCRIPTION

[0027] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0028] It should be noted that in the description of the present invention, the terms "upper", "lower", "left", "right", "front", "rear" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for the convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0029] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "disposed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] Embodiment 1:

[0031] like Figures 1 to 3 As shown, the PCB board flipping mechanism of the utility model includes:

[0032] Flap structure 1, flip structure 1 is Figure 1 The flipping machine shown in the figure comprises a flipping structure 1 including an outer shell 11, a transport channel 12 for the PCB board to pass through is formed in the outer shell 11, a conveyor belt 13 is arranged in the transport channel 12, and a servo motor 14 is arranged on the outer shell 11, and the servo motor 14 is used to drive the outer shell 11 to rotate, thereby realizing the flipping operation of the PCB board.

[0033] See also Figures 2 to 3 The PCB board flipping mechanism also includes a placement plate 2, a semiconductor refrigeration plate, a cooling component and a heat dissipation component; wherein the placement plate 2 is installed on two outer shells 11 and placed in a conveying channel 12, the placement plate 2 is located directly above the conveyor belt 13, and a plurality of accommodating channels are opened on the placement plate 2. The semiconductor refrigeration plate is arranged in the accommodating channel of the placement plate 2 so that the cold end of the semiconductor refrigeration plate faces the conveyor belt 13, and the hot end faces the side away from the conveyor belt 13.

[0034] See also Figure 3 In one embodiment, the cooling assembly configured on the bottom surface of the storage plate 2 can be a cooling fin 31 and a cooling fan 32. The cooling fin 31 is installed on the lower surface of the storage plate 2 and contacts the cold end of the semiconductor refrigeration plate. The cooling fan 32 is installed at the bottom end of the cooling fin 31. The cooling fan 32 can transport the cold source generated by the semiconductor refrigeration plate to the PCB board on the conveyor belt 13 in the form of cold air, so as to achieve rapid heat exchange and cooling of the PCB board.

[0035] See also Figure 2 In one embodiment, the heat dissipation component configured on the bottom surface of the storage plate 2 can be a heat dissipation fin 41 and a heat dissipation fan 42, wherein the heat dissipation fin 41 is installed on the top surface of the storage plate 2 and connected to the hot end of the semiconductor refrigeration plate, and the heat dissipation fan 42 is installed on the top of the heat dissipation fin 41. The heat dissipation fin 41 can guide the airflow to the heat dissipation fin 41, thereby allowing the heat dissipation fin 41 to cool down quickly, thereby achieving rapid cooling of the semiconductor refrigeration plate, ensuring the operation of the semiconductor refrigeration plate, and ensuring continuous heat dissipation of the PCB board on the conveyor belt 13.

[0036] Embodiment 2:

[0037] As the second embodiment of the present utility model, the components identical or corresponding to those in the first embodiment are marked with the same reference numerals as those in the first embodiment, and only the differences between the second embodiment and the first embodiment are described below.

[0038] The second embodiment differs from the first embodiment only in that the structure of the cooling component is different.

[0039] See also Figure 4-Figure 6In the second embodiment, the cooling components are an air intake grille 33 and an air intake fan 34, wherein the air intake grille 33 is arranged on the outer shell 11 of the flap structure 1, the air intake grille 33 is located in the conveying channel 12 and is placed directly below the storage plate 2, the top of the air intake grille 33 is not connected to the bottom surface of the storage plate 2, so that an air flow channel 5 for gas flow is formed between the air intake grille 33 and the storage plate 2, and the air intake fan 34 is installed on the side of the storage plate 2, that is, the air intake fan 34 is above the conveying inlet of the conveyor belt 13 on the storage plate 2, and the air intake fan 34 is directly opposite to the air flow channel 5 formed between the air intake grille 33 and the storage plate 2.

[0040] When cooling the PCB board on the conveyor belt 13, the air intake fan 34 guides the external air to the air flow channel 5. The air flow in the air flow channel 5 is cooled by the heat exchange at the cold end of the semiconductor refrigeration plate to form cold air. The cold air flows toward the PCB board on the conveyor belt 13 through the air intake grille 33, and then the cold air exchanges heat with the PCB board, thereby achieving efficient heat exchange of the PCB board and improving the heat exchange efficiency of the PCB board of the utility model.

[0041] In a specific embodiment, the air intake grille 33 is composed of a first symmetrical portion 331, a second symmetrical portion 332 and a third symmetrical portion 333 in an "eight" shape from outside to inside. In other possible embodiments, the air intake grille 33 also has a fourth symmetrical portion and a fifth symmetrical portion in an "eight" structure.

[0042] See also Figure 5 Three grilles in an "eight" symmetrical structure form a complete air intake grille 33, so that the airflow entering the air intake grille 33 can be guided along a certain path, thereby accelerating the flow rate of the airflow between the PCB board and the air intake grille 33, and then accelerating the cooling efficiency of the PCB board.

[0043] In a specific embodiment, the first symmetrical portion 331 extends from the top of the side away from the air intake fan 34 to the bottom surface of the storage plate 2. Figure 2 Through this arrangement, one side of the air flow channel 5 can be blocked, reducing the probability that the air flow stirred by the air intake fan 34 does not blow toward the PCB board, thereby ensuring the cooling effect of the utility model on the PCB board on the conveyor belt 13.

[0044] In a specific embodiment, the air intake grille 33 is made of any one of pure copper, pure aluminum, copper alloy or aluminum alloy.

[0045] In a specific implementation, an air outlet 6 is formed through the bottom end of the first symmetrical portion 331 .

[0046] See also Figure 4 , Figure 6, the air outlet 6 is arranged toward the air intake fan 34. Through this arrangement, the airflow between the first symmetrical portion 331 and the second symmetrical portion 332 can be partially blown to the air intake fan 34, and the temperature of the airflow blown between the first symmetrical portion 331 and the second symmetrical portion 332 is lower than the temperature of the airflow driven by the air intake fan 34. Through the above arrangement, heat exchange of the airflow driven by the air intake fan 34 can be achieved, the cooling power of the semiconductor refrigeration sheet can be reduced, energy consumption can be saved, and the stability of the airflow temperature in the airflow channel 5 can be guaranteed.

[0047] In a specific embodiment, a polytetrafluoroethylene coating is sprayed on the surface of the air intake grille 33. It should be noted that polytetrafluoroethylene has a certain anti-corrosion effect, reduces the probability of rust on the air intake grille 33, and prolongs the service life of the PCB board flipping machine of the present application.

[0048] The above implementation modes are only for illustrating the technical concept and features of the utility model, and their purpose is to allow people familiar with this technology to understand the content of the utility model and implement it. It cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A PCB board flipping mechanism, characterized in that: include: A flap structure, wherein the flap structure is formed with a conveyor belt for clamping and conveying the PCB board, the conveyor belt is located in a conveying channel formed by the flap structure, and the flap structure can flip the conveyed PCB board; A storage plate, which is installed in the transport channel and placed directly above the conveyor belt; A semiconductor refrigeration sheet, wherein the semiconductor refrigeration sheet is arranged on the placement plate so that the cold end of the semiconductor refrigeration sheet faces the conveyor belt and the hot end faces a side away from the conveyor belt; A cooling component is arranged on the storage plate and is used to transport the cold source generated by the cold end of the semiconductor refrigeration plate to the PCB board between the conveyor belts.

2. The PCB board flipping mechanism according to claim 1, characterized in that: It also includes a heat dissipation component, which is arranged on the storage plate and directly opposite to the hot end of the semiconductor refrigeration chip. The heat dissipation component can dissipate the heat generated by the hot end of the semiconductor refrigeration chip.

3. The PCB board flipping mechanism according to claim 2, characterized in that: The heat dissipation assembly includes heat dissipation fins and a heat dissipation fan. The heat dissipation fins are installed on the top surface of the storage plate and are in contact with the hot end of the semiconductor refrigeration plate. The heat dissipation fan is installed on the heat dissipation fins.

4. The PCB board flipping mechanism according to claim 1, characterized in that: The cooling assembly includes cooling fins and a cooling fan. The cooling fins are in contact with the cold end of the semiconductor refrigeration plate. The cooling fan is installed on the cooling fins and is arranged toward the conveyor belt.

5. The PCB board turning mechanism according to claim 1, characterized in that: The cooling assembly includes an air intake grille and an air intake fan. The air intake grille is arranged in the transport channel of the flap structure. The top of the air intake grille is not connected to the bottom surface of the storage plate so that an air flow channel is formed between the air intake grille and the storage plate. The air intake fan is installed on the side of the storage plate to face the air flow channel.

6. The PCB board turning mechanism according to claim 5, characterized in that: The air intake grille comprises a first symmetrical portion, a second symmetrical portion and a third symmetrical portion, all of which are acute-angle structures, from the outside to the inside.

7. The PCB board turning mechanism according to claim 6, characterized in that: The first symmetrical portion extends from the top end of a portion on a side away from the air intake fan to the bottom surface of the storage plate.

8. The PCB board turning mechanism according to claim 5, characterized in that: The material of the air intake grille is any one of pure copper, pure aluminum, copper alloy or aluminum alloy.

9. The PCB board turning mechanism according to claim 6 or 7, characterized in that: An air outlet is formed through the bottom end of the first symmetrical part.

10. The PCB board turning mechanism according to claim 5, characterized in that: The surface of the air intake grille is sprayed with a polytetrafluoroethylene coating.

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