Protective shell of chip
By designing corresponding windows and through holes on the chip protective case and combining the heat dissipation effect of the aluminum block, the problem of insufficient heat dissipation of the chip protective case is solved, achieving a more efficient heat dissipation effect, extending the service life of the chip and improving the user experience.
Patent Information
- Application Number
- CN202421144016.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-23
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-05-23
AI Technical Summary
The existing chip protective case has insufficient heat dissipation, resulting in excessive chip temperature, affecting service life and user experience.
A chip protective case is designed, by opening corresponding windows on the first cover and the second cover, the heat generation of the chip can be quickly dissipated through these windows. At the same time, through holes are provided at the fishtail end of the protective case, and aluminum blocks are connected at the through holes to enhance the heat dissipation effect.
It effectively reduces the temperature on the chip surface, avoids chip restart and signal interruption caused by excessive temperatures, and improves the service life and user experience of the chip.
Smart Images
Figure CN222674679U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of chips, and in particular to a protective shell for a chip. Background Art
[0002] Chips are the carriers of integrated circuits and are the final products formed after the integrated circuits are designed, manufactured, packaged and tested. However, chips are vulnerable parts, and chips are generally thin and small in size. Improper protection will cause electronic components to be crushed, resulting in defective products; if the chip is not protected externally, the chip will be easily scratched and damaged. Therefore, packaging technology and larger-sized shells are required to protect the chip.
[0003] In the related art, the chip protection shell is a strip-shaped plastic shell that fully wraps the chip to prevent the chip from being squeezed and damaged. However, the signal chip with photoelectric conversion has relatively high power and generates a lot of heat. The chip protection shell fully wraps the chip so that the heat cannot be dissipated. The heat is retained on the surface of the chip, causing the chip temperature to be too high. If the chip temperature is too high, the chip will restart, resulting in interruption of signal transmission, affecting the use of the chip and reducing the user experience. In addition, if the chip is in an overheated state for a long time during operation, the product life will be shortened. Utility Model Content
[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application embodiment provides a chip protective shell, which is beneficial to prevent the chip from being damaged, and is also beneficial to the efficient heat dissipation of the chip, ensuring the normal operation of the chip and increasing the service life of the chip.
[0005] In a first aspect, an embodiment of the present application provides a chip protection case, comprising:
[0006] A first cover body, wherein the first cover body is provided with a first window;
[0007] A second cover body, wherein the second cover body is provided with a second window, and the second cover body and the first cover body are combined to form a protective shell;
[0008] The positions of the first window and the second window correspond to each other, and the positions of the first window and the second window correspond to the positions of the chips on the circuit board; a first card block module is arranged in the accommodating cavity of the second cover body, and the shapes of the first card block module and the circuit board cooperate to fix the circuit board.
[0009] According to some embodiments of the present application, a second card block module is further provided in the accommodating cavity of the second cover body, a latch module is respectively provided on the first card block module and the second card block module, a socket module is provided in the accommodating cavity of the first cover body, and the latch and the socket are matched and connected.
[0010] According to some embodiments of the present application, one end of the first cover body and the second cover body are both in a fishtail shape, and when the first cover body and the second cover body are covered together, one end of the fishtail shape forms a first through hole.
[0011] According to some embodiments of the present application, an aluminum block for heat dissipation is further included, and the aluminum block is connected to the first through hole.
[0012] According to some embodiments of the present application, a card slot is provided inside the accommodating cavity at one end of the fishtail shape of the first cover body and the second cover body, and the card slot is used to fix the aluminum block.
[0013] According to some embodiments of the present application, grooves are provided on the surface of the aluminum block to increase the heat dissipation area of the surface of the aluminum block.
[0014] According to some embodiments of the present application, surfaces of the first cover body and the second cover body are both provided with grooves, and the grooves are used to accommodate glue.
[0015] According to some embodiments of the present application, a non-slip strip is provided on the surface of the first cover.
[0016] According to some embodiments of the present application, the first cover body and the second cover body are made of ABS engineering plastic.
[0017] According to some embodiments of the present application, an aluminum shell is further included, and the aluminum shell is used to wrap the protective shell formed by the first cover body and the second cover body by the glue contained in the groove.
[0018] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or understood by practicing the present application. The purpose and other advantages of the present application can be realized and obtained by the structures specifically pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a schematic diagram of the structural decomposition of a chip protection shell provided in an embodiment of the present application;
[0020] Figure 2 It is a schematic diagram of the structural decomposition of another chip protective shell provided in an embodiment of the present application;
[0021] Figure 3 It is a schematic structural diagram of a chip protection shell provided in an embodiment of the present application;
[0022] Figure 4 It is a schematic diagram of the structure of another chip protection shell provided in an embodiment of the present application. DETAILED DESCRIPTION
[0023] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0024] The terms "first", "second", "third", "fourth", etc. (if any) in the specification of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.
[0025] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.
[0026] It should be understood that in the description of the embodiments of the present application, the meaning of multiple (or multiple items) is more than two, greater than, less than, exceed, etc. are understood to not include the number, and above, below, within, etc. are understood to include the number.
[0027] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.
[0028] Chips are the carriers of integrated circuits and are the final products formed after the integrated circuits are designed, manufactured, packaged and tested. However, chips are vulnerable parts, and chips are generally thin and small in size. Improper protection will cause electronic components to be crushed, resulting in defective products; if the chip is not protected externally, the chip will be easily scratched and damaged. Therefore, packaging technology and larger-sized shells are required to protect the chip.
[0029] In the related art, the chip protection shell is a strip-shaped plastic shell that fully wraps the chip to prevent the chip from being squeezed and damaged. However, the signal chip with photoelectric conversion has relatively high power and generates a lot of heat. The chip protection shell fully wraps the chip so that the heat cannot be dissipated. The heat is retained on the surface of the chip, causing the chip temperature to be too high. If the chip temperature is too high, the chip will restart, resulting in interruption of signal transmission, affecting the use of the chip and reducing the user experience. In addition, if the chip is in an overheated state for a long time during operation, the product life will be shortened.
[0030] Based on this, the embodiment of the present application provides a chip protective shell, which is beneficial to preventing the chip from being damaged, and is also beneficial to efficient heat dissipation of the chip, ensuring the normal operation of the chip and increasing the service life of the chip.
[0031] Reference Figure 1 and Figure 2 As shown, the protective shell of the chip includes a first cover body 100 and a second cover body 200, the first cover body 100 is provided with a first window 110, the second cover body 200 is provided with a second window 210, and the second cover body 200 is combined with the first cover body 100 to form a protective shell; wherein, the positions of the first window 110 and the second window 210 correspond, and the positions of the first window 110 and the second window 210 correspond to the positions of the chip on the circuit board; a first card block module 220 is arranged in the accommodating cavity of the second cover body 200, and the shape of the first card block module 220 and the circuit board cooperate to fix the circuit board.
[0032] By combining the first cover 100 and the second cover 200 to form a protective shell to wrap the chip, the chip can be prevented from being squeezed and damaged; by opening the first window 110 and the second window 210 in the first cover 100 and the second cover 200 respectively, the heat generated by the chip on the circuit board during operation can be quickly dissipated through the first window 110 and the second window 210, thereby reducing the temperature of the chip surface, avoiding the chip from being burned due to excessive temperature, and increasing the service life of the chip. In addition, the rapid dissipation of the temperature of the chip surface through the first window 110 and the second window 210 can also avoid the situation where the chip temperature is too high, causing the chip to restart or the signal transmission to be interrupted due to excessive temperature, thereby improving the user experience.
[0033] It should be noted that the positions of the first window 110 and the second window 210 correspond to the positions of the chip on the circuit board, which can improve the heat dissipation efficiency of the heat generated by the chip on the circuit board during operation; the corresponding positions of the first window 110 and the second window 210 can make the heat dissipation of the chip on the circuit board uniform, and can further improve the heat dissipation efficiency of the heat generated by the chip during operation, thereby increasing the service life of the chip.
[0034] It should be noted that the shape coordination between the first card block module 220 and the circuit board can fix the circuit board and prevent the circuit board from shifting, so that the position of the chip on the circuit board corresponds to the position of the first window 110 and the second window 210, thereby improving the heat dissipation efficiency of the heat generated by the chip on the circuit board during operation; in addition, the first card block module 220 can also support the circuit board and prevent the circuit board from slipping.
[0035] In some embodiments of the present application, a second card block module 230 is further provided in the accommodation cavity of the second cover 200, a plug 240 is respectively provided on the first card block module 220 and the second card block module 230, and a socket module (not shown) is provided in the accommodation cavity of the first cover 100, and the plug 240 and the socket are matched and connected. The first cover 100 and the second cover 200 are combined to form a protective shell through the matching connection of the plug 240 and the socket, so as to wrap the chip on the circuit board and prevent the chip from being squeezed and damaged.
[0036] The latch module includes two latches 240, and the socket module includes two sockets. The positions of the two latches 240 and the two sockets correspond to each other, so that the latches 240 and the sockets are matched and connected to realize the combination of the first cover body 100 and the second cover body 200 to form a protective shell.
[0037] It should be noted that, in some embodiments of the present application, the pin module may include three pins 240 and the socket module may include three sockets. The pin module may also include four pins 240 and the socket module may include four sockets. The number of pins 240 and the number of sockets may correspond. The embodiments of the present application do not limit the number of pins 240 in the pin module and the number of sockets in the socket module.
[0038] Reference Figures 1 to 4 In some embodiments of the present application, one end of the first cover 100 and the second cover 200 are both fishtail-shaped, and after the first cover 100 and the second cover 200 are covered, one end of the fishtail forms a first through hole 300. It should be noted that the heat generated by the chip on the circuit board during operation can be dissipated through the first through hole 300, further increasing the heat dissipation path, further reducing the temperature of the chip surface, and ensuring the normal operation of the chip.
[0039] In some embodiments of the present application, the protective shell of the chip also includes an aluminum block 310 for heat dissipation, and the aluminum block 310 is connected to the first through hole 300. Since the aluminum sheet is an excellent thermal conductive material and has a high thermal conductivity, the heat generated by the chip when it is working can be quickly transferred to the surface of the aluminum sheet. The first through hole 300 is provided to accelerate air convection, and connecting the aluminum block 310 to the first through hole 300 can transfer heat to the air through air convection, effectively reducing the surface temperature of the chip and ensuring the stable performance of the chip.
[0040] In some embodiments of the present application, a card slot 250 is provided inside the accommodating cavity at one end of the fishtail shape of the first cover body 100 and the second cover body 200. The card slot 250 is used to fix the aluminum block 310 to ensure a stable connection between the aluminum block 310 and the first through hole 300. The first through hole 300 accelerates air convection, so that the heat generated by the chip when it is working is transferred to the aluminum sheet for rapid heat dissipation, thereby reducing the temperature of the chip surface and ensuring the normal operation of the chip.
[0041] In some embodiments of the present application, a groove 120 is provided on the surface of the aluminum block 310 to increase the heat dissipation area of the surface of the aluminum block 310, so that the heat generated by the chip during operation can be transferred to the aluminum sheet for rapid heat dissipation, thereby improving the heat dissipation efficiency of the aluminum sheet.
[0042] In some embodiments of the present application, the surfaces of the first cover body 100 and the second cover body 200 are both provided with grooves 120, and the grooves 120 are used to accommodate glue. The glue accommodated in the grooves 120 can prevent the glue from overflowing, thereby improving the practicality and aesthetics of the protective shell. The protective shell of the chip also includes an aluminum shell, which is used to wrap the protective shell formed by the first cover body 100 and the second cover body 200 through the glue accommodated in the grooves 120. By using the aluminum shell to wrap the protective shell formed by the first cover body 100 and the second cover body 200, the chip can be further protected and the chip can be prevented from being damaged by extrusion. In addition, since the aluminum sheet is an excellent thermal conductive material and the thermal conductivity of the aluminum sheet is high, the aluminum shell wrapping the protective shell of the chip can increase the heat exchange area, and the heat emitted by the chip can be transferred to the aluminum shell through the first window 110 and the second window 210 for rapid heat dissipation, effectively reducing the temperature of the chip surface and ensuring the normal operation of the chip.
[0043] In some embodiments of the present application, an anti-slip strip 130 is provided on the surface of the first cover 100, and the anti-slip strip 130 can increase the friction of the first cover 100 to prevent the protective shell of the chip from falling off when the protective shell is held.
[0044] In some embodiments of the present application, the first cover body 100 and the second cover body 200 are made of ABS engineering plastics. ABS engineering plastics have excellent heat resistance, weather resistance, dimensional stability and impact resistance of resins, and have excellent processing fluidity. The protective shell formed by the combination of the first cover body 100 and the second cover body 200 made of ABS engineering plastics has heat resistance and stability, and has good impact resistance, thereby improving the reliability of the chip protective shell.
[0045] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
[0046] The above is a specific description of the preferred implementation of the present application, but the present application is not limited to the above-mentioned implementation mode. Technical personnel familiar with the field can also make various equivalent deformations or substitutions without violating the spirit of the present application. These equivalent deformations or substitutions are all included in the scope defined by the claims of the present application.
Claims
1. A chip protective shell, characterized in that: include: A first cover body, wherein the first cover body is provided with a first window; A second cover body, wherein the second cover body is provided with a second window, and the second cover body and the first cover body are combined to form a protective shell; The positions of the first window and the second window correspond to each other, and the positions of the first window and the second window correspond to the positions of the chips on the circuit board; a first card block module is arranged in the accommodating cavity of the second cover body, and the shapes of the first card block module and the circuit board cooperate to fix the circuit board.
2. The chip protection shell according to claim 1, characterized in that: A second card block module is also arranged in the accommodating cavity of the second cover body, a latch module is arranged on the first card block module and the second card block module respectively, a socket module is arranged in the accommodating cavity of the first cover body, and the latch and the socket are matched and connected.
3. The chip protection shell according to claim 1, characterized in that: One end of the first cover body and the second cover body are both in a fishtail shape, and when the first cover body and the second cover body are covered, one end of the fishtail shape forms a first through hole.
4. The chip protection shell according to claim 3, characterized in that: It also includes an aluminum block for heat dissipation, and the aluminum block is connected to the first through hole.
5. The chip protection shell according to claim 4, characterized in that: A clamping groove is provided inside the accommodation cavity at one end of the fishtail shape of the first cover body and the second cover body, and the clamping groove is used to fix the aluminum block.
6. The chip protection shell according to claim 4, characterized in that: The surface of the aluminum block is provided with grooves to increase the heat dissipation area of the surface of the aluminum block.
7. The chip protection shell according to claim 1, characterized in that: The surfaces of the first cover body and the second cover body are both provided with grooves, and the grooves are used to accommodate glue.
8. The chip protection shell according to claim 1, characterized in that: The surface of the first cover is provided with an anti-slip strip.
9. The chip protection shell according to claim 1, characterized in that: The first cover body and the second cover body are made of ABS engineering plastics.
10. The chip protection shell according to claim 7, characterized in that: It also includes an aluminum shell, which is used to wrap the protective shell formed by the first cover body and the second cover body through the glue contained in the groove.