Electronic device

Abstract

The utility model provides electronic equipment, and relates to the technical field of electronic equipment. The electronic equipment comprises an integrated optical port cage which comprises a plurality of plugging spaces arranged along a first direction, and each plugging space is used for plugging an optical module; the light guide column assembly is arranged on one side, in the first direction, of the integrated light port cage and comprises a plurality of light guide column bodies, each light guide column body corresponds to a light-emitting point position on a circuit board, and the arrangement directions of the light guide column bodies comprise the first direction and the second direction; the panel is arranged on the opening side of the plugging space of the integrated light port cage and comprises a plurality of plugging ports corresponding to the plugging space and first light holes corresponding to the light guide column bodies; wherein the first direction and the second direction meet a vertical condition, and the second direction is vertical to the circuit board.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] The integrated card adopts the full-height and half-length PCIE standard size. To increase the number of external interfaces, it is necessary to achieve a reasonable layout of the board and solve the heat dissipation problem caused by the compact layout to improve the performance of the board. Utility Model Content

[0003] The purpose of the embodiments of the present application is to provide an electronic device, which mainly provides the following technical solutions:

[0004] The present application provides an electronic device, the electronic device comprising: a circuit board;

[0005] An integrated optical port cage includes a plurality of plug-in spaces arranged along a first direction, each plug-in space being used to plug in an optical module;

[0006] a light guide column assembly, disposed on one side of the integrated light port cage in the first direction, comprising a plurality of light guide column bodies, each light guide column body corresponding to a light-emitting point on the circuit board, and the plurality of light guide column bodies being arranged in the first direction and the second direction;

[0007] A panel is provided on the opening side of the plug-in space of the integrated light port cage, and includes a plug-in interface corresponding to the plurality of plug-in spaces and a first light-transmitting hole corresponding to each of the light guide pillar bodies;

[0008] The first direction and the second direction meet a vertical condition, and the second direction is perpendicular to the circuit board.

[0009] In some modified embodiments of the present application, the present invention further includes: a heat sink disposed on a side of the integrated optical port cage opposite to the panel, the heat sink comprising a plurality of heat dissipation fins spaced apart along a first direction and extending along a third direction;

[0010] Wherein, the third direction satisfies the perpendicular condition to the first direction and the second direction respectively. In some modified embodiments of the present application, the circuit board is provided with two columns of light-emitting points spaced apart along the first direction, and each column includes three light-emitting points spaced apart along the third direction;

[0011] The light guide column assembly also includes:

[0012] A light guide column housing, wherein the light guide column housing is respectively provided with three light guide troughs spaced apart from each other on both sides in the first direction, each light guide trough having a bent portion and a first portion and a second portion separated by the bent portion, the first portions of the three light guide troughs located on the same side respectively extending along the second direction and corresponding to the three light-emitting points in the same column, and the second portions of the three light guide troughs located on the same side respectively extending along the third direction and having a height difference in the second direction;

[0013] The number of the light guide column bodies corresponds to the number of the light guide slots and their shapes are adapted.

[0014] In some modified embodiments of the present application, a plurality of elastic hooks are provided at the bottom of the light guide column housing, and a card interface corresponding to each of the elastic hooks is provided on the circuit board, so that the light guide column housing can be detachably connected to the circuit board.

[0015] In some modified implementations of the present application, each of the light guide column bodies is respectively provided with a plug-in end corresponding to and adapted to the first light-transmitting hole, and the plug-in end is plugged into the corresponding first light-transmitting hole.

[0016] In some modified implementations of this application, the following are also included:

[0017] Two indicator lights are arranged on the other side of the integrated light port cage in the first direction, and the panel is provided with two second light-transmitting holes corresponding to the two indicator lights respectively.

[0018] In some modified implementations of the present application, a target chip is provided on the side of the circuit board in the third direction away from the integrated optical port cage, and the heat sink has an avoidance area corresponding to the target chip;

[0019] A baffle is provided on the air outlet surface of the avoidance area of ​​the heat sink facing the target chip.

[0020] In some modified implementations of this application, the following are also included:

[0021] a radio frequency cable, located on one side of the integrated optical port cage and the heat sink in the first direction;

[0022] The panel is provided with a first RF connector for connecting one end of the RF cable, and the circuit board is provided with a second RF connector on a side away from the integrated optical port cage in the third direction for connecting the other end of the RF cable.

[0023] In some modified embodiments of the present application, a routing portion of the radio frequency cable between its two ends is arranged in a heat dissipation gap formed between two adjacent heat dissipation fins of the heat sink.

[0024] In some modified implementations of the present application, the wiring portion is connected to at least two locking members locked to the heat sink, and the heat sink is provided with avoidance grooves corresponding to and adapted to the locking members. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and other objects, features and advantages of the exemplary embodiments of the present application will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0026] Figure 1 Schematically shows a schematic diagram of the disassembled structure of an electronic device provided in an embodiment of the present application;

[0027] Figure 2 Schematically shows a schematic diagram of the disassembled structure of the electronic device provided in an embodiment of the present application from another angle;

[0028] Figure 3 The following schematically shows a disassembled structural diagram of a light guide column body of an electronic device provided in an embodiment of the present application;

[0029] Description of Figure Numbers:

[0030] 1. Circuit board; 11. Light-emitting point; 12. Target chip; 101. Card interface; 2. Light guide assembly; 21. Light guide body; 211. Connector; 22. Light guide housing; 221. Elastic hook; 2201. Light guide trough; 3. Integrated optical port cage; 4. Panel; 401. Connector; 402. First light-transmitting hole; 403. Second light-transmitting hole; 5. Heat sink; 501. Avoidance area; 502. Avoidance slot; 6. Indicator light; 7. Baffle; 8. RF cable; 9. Locking piece; 10. Locking nut

[0031] x, first direction; y, second direction; z, third direction. DETAILED DESCRIPTION

[0032] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0033] It should be noted that, unless otherwise specified, the technical or scientific terms used in this application should have the common meanings understood by those skilled in the art to which this application belongs.

[0034] Example 1

[0035] Reference Attachment Figure 1 and attached Figure 2 , Embodiment 1 of the present application proposes an electronic device, which includes: a circuit board 1; an integrated optical port cage 3, which includes a plurality of plug-in spaces arranged along a first direction x, each plug-in space being used to plug in an optical module; a light guide column assembly 2, which is arranged on one side of the integrated optical port cage 3 in the first direction x, and includes a plurality of light guide column bodies 21, each light guide column body 21 corresponding to a light-emitting point 11 on the circuit board 1, and the arrangement direction of the plurality of light guide column bodies 21 includes the first direction x and the second direction y; and a panel 4, which is arranged on the opening side of the plug-in space of the integrated optical port cage 3, and includes a plug-in port 401 corresponding to the plurality of plug-in spaces and a first light-transmitting hole 402 corresponding to each of the light guide column bodies 21; wherein the first direction x and the second direction y meet the vertical condition, and the second direction y is perpendicular to the circuit board 1.

[0036] Specifically, the electronic device provided in this embodiment can be an integrated card with functions such as high-speed data transmission and wireless communication, or a server, desktop computer and other devices with an integrated card. The structure of the electronic device mainly includes a circuit board 1 and an optical port cage on the circuit board 1, which is used to plug in optical modules. By increasing the number of optical port cages, the number of optical modules that can be plugged in can be increased, thereby achieving high-speed data transmission and adapting to application scenarios with large bandwidth and low latency. However, increasing the number of optical port cages will occupy a larger space on the circuit board 1, which requires a more compact and reasonable layout on the circuit board 1. Therefore, in the technical solution adopted in this application, the electronic device adopts an integrated optical port cage 3, and the electronic device also includes a panel 4. The integrated optical port cage 3 has a plurality of plug-in spaces arranged along the first direction x. The number of plug-in spaces can be but is not limited to 6, and each plug-in space is used to adapt and plug in a plurality of optical modules. The optical module realizes rapid transmission and processing of data through photoelectric conversion. The integrated optical port cage 3 fixes and protects the optical module and ensures that the optical port of the optical module is correctly and stably connected to other devices. The panel 4 is arranged on the opening side of the plug-in space of the integrated optical port cage 3, and the panel 4 has a plug-in interface 401. The plug-in interface 401 corresponds to all the plug-in spaces of the integrated optical port cage 3 and is connected to each plug-in space respectively. Each optical module is plugged into the corresponding plug-in space of the integrated optical port cage 3 through the plug-in interface 401 of the panel 4. The use of the integrated optical port cage 3 can realize a compact layout of the optical port cage part, and realize the setting of more plug-in spaces in a limited space to plug in optical modules.

[0037] The electronic device proposed in the present application also includes a light guide column assembly 2, which is arranged on the circuit board 1 and located on one side of the integrated light port cage 3 in the first direction x. The light guide column assembly 2 includes a plurality of light guide column bodies 21, the number of which is at least 3, and can be specifically but not limited to 6. The positions on the circuit board 1 corresponding to the light guide column assembly 2 are provided with light-emitting points 11 equal in number to the light guide column bodies 21. Each light guide column body 21 corresponds to a light-emitting point 11 on the circuit board 1, and a first light-transmitting hole 402 corresponding to each light guide column body 21 is provided on the panel 4. The light guide column is an optical transmission device, one end of which is connected to the light-emitting point 11, and the other end is connected to the corresponding first light-transmitting hole 402 on the panel 4. It can transmit the light emitted by the light-emitting point 11 to the first light-transmitting hole 402 to realize the indication function; since the integrated light port cage 3 occupies a larger size in the first direction x, the size that the light guide column assembly 2 can occupy in this direction is smaller. Therefore, in order to further improve the compactness of the layout on the circuit board 1, the arrangement of the multiple light guide column bodies 21 is set to include the first direction x and the second direction y, that is, the light guide column bodies 21 are arranged and laid out from two directions, where the second direction y is perpendicular to the first direction x, the first direction x is parallel to the circuit board 1, and the second direction y is perpendicular to the circuit board 1. Arranging from two directions can reduce the area occupied on the circuit board 1, thereby further realizing the compactness and rationality of the layout on the circuit board 1.

[0038] According to the above, an embodiment of the present application proposes an electronic device. By adopting an integrated optical port cage 3, it is possible to connect a larger number of optical modules and improve the high-speed data transmission performance of the electronic device. At the same time, the integrated setting can reduce the size of the optical port cage and the space occupied on the circuit board 1. By setting the arrangement direction of the multiple light guide column bodies 21 of the light guide column assembly 2 to include a first direction x and a second direction y, the area occupied by the light guide column assembly 2 on the circuit board 1 can be reduced, thereby achieving compactness and rationality of the layout on the circuit board 1, which is conducive to improving the performance of the electronic device.

[0039] For further information, see the attached Figure 1 and attached Figure 2 In a specific implementation, the electronic device proposed in this application further includes: a heat sink 5, which is arranged on a side of the integrated optical port cage 3 opposite to the panel 4, and the heat sink 5 includes a plurality of heat dissipation fins arranged at intervals along the first direction x and extending along the third direction z; wherein the third direction z satisfies the perpendicular conditions with the first direction x and the second direction y respectively.

[0040] Specifically, in order to achieve a compact layout of the electronic equipment while improving its heat dissipation performance, in the technical solution adopted by the present application, a heat sink 5 is further provided on the circuit board 1. The heat sink 5 is located on the side of the integrated optical port cage 3 away from the panel 4, and the heat sink 5 is composed of a plurality of heat dissipation fins arranged at intervals along the first direction x, and each heat dissipation fin extends along the third direction z, where the third direction z is perpendicular to the first direction x and the second direction y, respectively. The heat sink 5 has a large area and covers the heating element in a certain area on the circuit board 1. It can absorb the heat generated by this part of the heating element by heat conduction, and helps The third direction z is also the flow direction of the cooling air when the electronic device is dissipating heat. The cooling air flows from the plug interface 401 of the panel 4 to the plug space, and uses the wind force to take away the heat of the optical module. In the process of flowing in the heat dissipation gap formed between adjacent heat dissipation fins, it exchanges heat with the heat sink 5, quickly takes away the heat of the heat sink 5, and thus reduces the temperature of the heat sink 5. The setting and layout of the heat sink 5 can improve the heat dissipation effect and heat dissipation efficiency of the electronic device, ensure the stable operation of the electronic device, and increase the service life of the electronic device.

[0041] For further information, see the attached Figure 1 -Attached Figure 3 In a specific implementation, the circuit board 1 is provided with two columns of light-emitting points 11 spaced apart along the first direction x, and each column includes three light-emitting points 11 spaced apart along the third direction z; the light guide column assembly 2 also includes: a light guide column shell 22, and the light guide column shell 22 is provided with three light guide grooves 2201 spaced apart from each other on both sides in the first direction x, each light guide groove 2201 has a bending portion and a first part and a second part separated by the bending portion, the first parts of the three light guide grooves 2201 located on the same side extend respectively along the second direction y and correspond to the three light-emitting points 11 in the same column, and the second parts of the three light guide grooves 2201 located on the same side extend respectively along the third direction z and have a height difference in the second direction y; wherein, the number of the light guide column bodies 21 corresponds to the number of the light guide grooves and the shapes are adapted.

[0042] Specifically, in order to achieve the positioning and compact layout of multiple light guide column bodies 21, in the technical solution adopted in the present application, the light guide column assembly 2 also includes a light guide column shell 22 located outside the multiple light guide column bodies 21. Taking the number of light guide column bodies 21 as six as an example, the light guide column can be provided with three light guide trough bodies 2201 spaced apart from each other on both sides of the first direction x. The light guide trough bodies 2201 on both sides can be symmetrically distributed, or can also be staggered. Each light guide trough body 2201 is independent of each other, and there is no optical fiber interference.

[0043] Reference Attachment Figure 1 -Attached Figure 3 In order to realize optical fiber transmission from the light-emitting point 11 to the first light-transmitting hole 402, two columns of light-emitting points 11 are arranged at intervals along the first direction x on the circuit board 1, and each column includes three light-emitting points 11 arranged at intervals along the third direction z. Two columns of light-transmitting holes are arranged along the first direction x on the panel 4, and each column of light-transmitting holes includes three first light-transmitting holes 402 arranged at intervals along the second direction y. Each light guide trough 2201 is respectively configured to include: a first part, a second part, and a bending part connecting the first part and the second part. The first parts of the three light guide troughs 2201 located on the same side extend respectively along the second direction y and correspond to the three light-emitting points 11 located in the same column. The second parts of the three light guide troughs 2201 located on the same side extend respectively along the third direction z, and there is a height difference between the three in the second direction y, and respectively correspond to the three first light-transmitting holes 402 located in the same column. The light guide column conforms to and adapts to the corresponding light guide trough and is embedded inside the light guide trough, which can achieve miniaturization of occupied space and effectively transmit light.

[0044] Among them, refer to the attached Figure 3 Each light guide column body 21 is respectively provided with a plug-in end 211 corresponding to and adapted to the first light transmission hole 402. The plug-in end 211 is plugged into the corresponding first light transmission hole 402, which can achieve reliable light transmission and can further position and limit the light guide column body 21.

[0045] For further information, see the attached Figure 1 -Attached Figure 3 In order to achieve the positioning of the light guide column assembly 2 on the circuit board 1, in a specific implementation, a plurality of elastic hooks 221 can be provided at the bottom of the light guide column housing 22, and a card interface 101 corresponding to each elastic hook 221 is provided on the circuit board 1. Through the snap-fitting of the elastic hook 221 and the card interface 101, the light guide column assembly 2 can be detachably snapped onto the circuit board 1, and the installation and disassembly methods are convenient; and through the cooperation of the first light-transmitting hole 402 of the panel 4 and each light guide column body 21, the double limiting of the light guide column assembly 2 can be achieved, thereby improving its assembly reliability.

[0046] For further information, see the attached Figure 2 In order to further enhance the indication function of the electronic device, in a specific implementation, the electronic device proposed in this application further includes: two indicator lights 6, which are arranged on the other side of the integrated light port cage 3 opposite to the light guide column assembly 2 in the first direction x, and the panel 4 is provided with two second light-transmitting holes 403 corresponding to the two indicator lights 6 respectively.

[0047] Among them, the light emitted by the first light hole 402 and the second light hole 403 can be used as an indication, and the information indicated by each light hole can be different. The above-mentioned indication function can include but is not limited to the following aspects: it can be used to indicate working status, indicate fault information, indicate warning information, indicate display information, etc., and different states can also be indicated through color changes, brightness changes, mode changes, etc.; of course, the light emitted by the first light hole 402 and / or the second light hole 403 can also be set to play a role in improving aesthetics or interactivity, which can be set specifically according to actual needs.

[0048] For further information, see the attached Figure 1 and attached Figure 2 In a specific implementation, the circuit board 1 is provided with a target chip 12 on the side away from the integrated optical port cage 3 in the third direction z, and the heat sink 5 has an avoidance area 501 corresponding to the target chip 12; the avoidance area 501 of the heat sink 5 is provided with a baffle 7 on the air outlet surface facing the target chip 12.

[0049] Specifically, in order to avoid the high-speed cooling airflow directly blowing the target chip 12 at the end of the circuit board 1, in the technical solution adopted in this application, the heat sink 5 can be provided with an avoidance area 501 corresponding to the target chip 12, and the target chip 12 is located in the avoidance area 501, and a baffle 7 is provided on the air outlet surface of the avoidance area 501 of the heat sink 5 facing the target chip 12, thereby blocking the cooling airflow and protecting the target chip 12 to meet its use environment requirements. In addition, parts that are prone to wear or shaking can also be arranged in the avoidance area 501. By blocking the baffle 7, these parts can be reliably fixed and their service life can be improved.

[0050] For further information, see the attached Figure 1 and attached Figure 2 In a specific implementation, the electronic device proposed in this application also includes: a radio frequency cable 8, which is located on one side of the integrated optical port cage 3 and the heat sink 5 in the first direction x, and can specifically be on the side opposite to the light guide column assembly 2; in order to achieve the connection of the radio frequency cable 8, a first radio frequency connector is provided on the panel 4 for connecting one end of the radio frequency cable 8. The first radio frequency connector can specifically be an SMA connector in the form of a through-wall connector. The SMA connector is a widely used small threaded coaxial connector with the advantages of wide bandwidth, excellent performance, high reliability and long life. Specifically, it can be locked to the panel 4 using a locking nut 10 and a gasket; the circuit board 1 is provided with a second radio frequency connector on the side away from the integrated optical port cage 3 in the third direction z for connecting the other end of the radio frequency cable 8. The second radio frequency connector can be an MMCX connector, which is a miniature radio frequency coaxial connector with small size and weight and high performance.

[0051] Among them, in order to further achieve a compact layout on the circuit board 1, in a specific implementation, the routing portion of the RF cable 8 between its two ends can be arranged in the heat dissipation gap formed between two adjacent heat dissipation fins of the heat sink 5, so that the RF cable 8 can be arranged without occupying additional space on the circuit board 1, and the heat dissipation effect of the RF cable 8 can be improved.

[0052] For details, please refer to the attached Figure 1 and attached Figure 2 In order to fix the routing portion of the RF cable 8 on the heat sink 5, at least two locking members 9 can be connected to the routing portion to lock it to the heat sink 5. In order to avoid the locking members 9, the heat dissipation fins at the corresponding positions on the heat sink 5 form avoidance grooves 502 corresponding to and adapted to the locking members 9.

[0053] It should be noted that, in the description of this specification, the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application; the terms "connect", "install", "fixed", etc. should be understood in a broad sense, for example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0054] Throughout this specification, terms such as "one embodiment," "some embodiments," and "specific embodiments" mean that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0055] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An electronic device, characterized in that: include: Circuit boards; An integrated optical port cage, comprising a plurality of plug-in spaces arranged along a first direction, each plug-in space being used for plugging in an optical module; A light guide column assembly is arranged on one side of the integrated light port cage in the first direction, and includes a plurality of light guide column bodies, each of which corresponds to a light-emitting point on the circuit board, and the arrangement direction of the plurality of light guide column bodies includes the first direction and the second direction; A panel, arranged at the opening side of the plug-in space of the integrated light port cage, comprising a plug-in interface corresponding to the plurality of the plug-in spaces and a first light-transmitting hole corresponding to each of the light guide column bodies; The first direction and the second direction meet a vertical condition, and the second direction is perpendicular to the circuit board.

2. The electronic device according to claim 1, characterized in that: Also includes: A heat sink is disposed on a side of the integrated optical port cage opposite to the panel, the heat sink comprising a plurality of heat sink fins arranged at intervals along a first direction and extending along a third direction; The third direction satisfies perpendicularity to the first direction and the second direction respectively.

3. The electronic device according to claim 2, characterized in that: The circuit board is provided with two columns of light-emitting points spaced apart along the first direction, and each column includes three light-emitting points spaced apart along the third direction; The light guide column assembly also includes: A light guide column housing, wherein three mutually spaced light guide slots are respectively arranged on both sides of the light guide column housing in the first direction, each light guide slot having a bending portion and a first portion and a second portion separated by the bending portion, the first portions of the three light guide slots located on the same side respectively extend along the second direction and correspond to the three light-emitting points in the same column, and the second portions of the three light guide slots located on the same side respectively extend along the third direction and have a height difference in the second direction; The number of the light guide column bodies corresponds to the number of the light guide grooves and their shapes are adapted.

4. The electronic device according to claim 3, characterized in that: A plurality of elastic hooks are arranged at the bottom of the light guide column housing, and a card interface corresponding to each of the elastic hooks is arranged on the circuit board, so that the light guide column housing can be detachably connected to the circuit board.

5. The electronic device according to claim 1 or 2, characterized in that: Each of the light guide column bodies is respectively provided with a plug-in end corresponding to and adapted to the first light transmission hole, and the plug-in end is plugged into the corresponding first light transmission hole.

6. The electronic device according to claim 1, characterized in that: Also includes: Two indicator lights are arranged on the other side of the integrated light port cage in the first direction, and the panel is provided with two second light-transmitting holes corresponding to the two indicator lights respectively.

7. The electronic device according to claim 2, characterized in that: The circuit board is provided with a target chip on a side of the circuit board in the third direction away from the integrated optical port cage, and the heat sink has a avoidance area corresponding to the target chip; A baffle is provided on the air outlet surface of the avoidance area of ​​the heat sink facing the target chip.

8. The electronic device according to claim 2, characterized in that: Also includes: A radio frequency cable, located on one side of the integrated optical port cage and the heat sink in the first direction; The panel is provided with a first RF connector for connecting one end of the RF cable, and the circuit board is provided with a second RF connector on a side of the circuit board in the third direction away from the integrated optical port cage for connecting the other end of the RF cable.

9. The electronic device according to claim 8, characterized in that: The routing portion of the radio frequency cable between the two ends thereof is arranged in a heat dissipation gap formed between two adjacent heat dissipation fins of the heat sink.

10. The electronic device according to claim 9, characterized in that: The wiring portion is connected to at least two locking members that are locked to the heat sink, and the heat sink is provided with avoidance grooves that correspond to and fit with the locking members.

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