Insulation packaging structure for preventing EBAPS short circuit and EBAPS chip

Abstract

The utility model discloses an insulation packaging structure for preventing EBAPS short circuit, and an EBAPS chip. The insulation packaging structure comprises an insulation silicone rubber layer; and the insulating silicone rubber layer is coated on the outer side walls of the glass cover 1, the cathode ring 2 and the ceramic tube shell 3. The cathode ring, the side face of the glass cover and the side face of the ceramic tube shell are coated with the insulating silicon rubber layer to isolate the external environment and air, so that devices in the insulating silicon rubber layer are effectively protected, the devices are prevented from being infected by dirt and dust in the using process, and the function failure of the circuit board caused by short circuit is effectively avoided.

Description

Technical Field

[0001] The present application relates to the field of EBAPS technology, and in particular to an insulating packaging structure and an EBAPS chip for preventing EBAPS from short circuiting. Background Art

[0002] EBAPS (Electronic Bombarded Active Pixel Sensor), also known as electron bombarded active pixel sensor, is a new type of night vision imaging digital device. Due to its low readout noise and high resolution, EBAPS is particularly suitable for video imaging in ultra-weak illumination conditions. The complete product using EBAPS devices has the advantages of all-weather, small size, light weight, and large dynamic range.

[0003] The current domestic EBAPS products have a maximum imaging illumination of 5E-5lx and 1E-4lx, but the related research on the current domestic EBAPS product devices is still in the theoretical research stage.

[0004] Since EBAPS is a digital device, it is necessary to realize the input and output of video stream digital signals, mainly through the back-end ISP circuit for data collection and processing. However, when the back-end circuit works at negative high voltage, it will have a probability of failure due to short circuit.

[0005] The short circuit situation in EBAPS is mainly related to negative high voltage, and the analysis is as follows:

[0006] 1. The cathode ring is exposed to the air and is wrapped by the air. The air may break down at high voltage, which may cause a short circuit between the cathode ring and the back-end circuit under high voltage use.

[0007] 2. The ceramic tube shell and circuit board are in direct contact with the outside world, and it is impossible to completely avoid residual dirt during transportation and use. The residual dirt will cause regional short circuits and creepage;

[0008] In order to avoid possible breakdown and short circuits caused by creepage, the design sets spacing requirements between the cathode ring and other circuits, and formulates a cleaning process for the device. However, the movement cannot be completely sealed. During long-term use, the probability of connectivity in the creepage area caused by various types of dirt will increase over time. When the humidity of the operating environment increases, the probability of the cathode ring breaking through the air will also greatly increase, causing a short circuit. Utility Model Content

[0009] In response to the above technical problems, the present application provides an insulating packaging structure for preventing EBAPS short circuit. This structure can effectively avoid the connection of creepage areas caused by dirt contaminating the surface during use, and can also avoid the occurrence of breakdown short circuits in high-voltage use environments, effectively improving the safety of EBAPS use.

[0010] The present application provides an insulating packaging structure for preventing an EBAPS from short-circuiting, comprising: an insulating silicone rubber layer; the insulating silicone rubber layer is coated on an outer side wall of a glass cover, a cathode ring, and a ceramic tube shell.

[0011] Preferably, the insulating silicone rubber layer is made of silicone rubber.

[0012] Preferably, the thickness of the insulating silicone rubber layer is set to 3 mm to 10 mm.

[0013] Preferably, a gap is provided between the glass cover and the cathode ring, and an insulating silicone rubber layer is filled in the gap.

[0014] Preferably, a gap is provided between the ceramic tube shell and the cathode ring, and an insulating silicone rubber layer is filled in the gap.

[0015] Preferably, an EBAPS is arranged on the center area of ​​the top surface of the cathode ring, and a glass cover is arranged on the EBAPS.

[0016] Preferably, an insulating silicone rubber layer is provided on the top surface of the cathode ring outside the glass cover.

[0017] Another aspect of the present application provides an EBAPS chip, comprising: the insulating packaging structure as described above for preventing the EBAPS from short circuiting.

[0018] The beneficial effects of this application include:

[0019] 1) The insulating packaging structure provided in the present application for preventing EBAPS short circuit uses an insulating silicone rubber layer to cover the cathode ring, the side of the glass cover, and the side of the ceramic tube shell to isolate the external environment and air, thereby effectively protecting the various devices in the insulating silicone rubber layer, preventing the devices from being contaminated by dirt and dust during use, and effectively preventing short circuits from causing circuit board function failure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of an insulating packaging structure for preventing an EBAPS from short-circuiting in at least one embodiment provided in the present application;

[0021] Figure 2 A schematic diagram of a three-dimensional structure of an insulating package for preventing an EBAPS from short-circuiting in at least one embodiment provided in the present application;

[0022] Figure 3A schematic diagram of the main structure of the insulating silicone rubber layer in at least one embodiment provided in the present application;

[0023] Legend:

[0024] Glass cover 1, cathode ring 2, ceramic tube shell 3, high voltage pin 5, insulating silicone rubber layer 4. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical scheme and advantages of the embodiments of the present invention clearer, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. The components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0026] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.

[0027] The technical means that are not described in detail in this application and are not used to solve the technical problems of this application are all set according to the common knowledge in the field, and can be implemented in a variety of common knowledge settings.

[0028] See also Figures 1 to 3 The insulating packaging structure for preventing EBAPS short circuit provided in the present application includes: an insulating silicone rubber layer; the insulating silicone rubber layer is coated on the outer side wall of the glass cover 1, the cathode ring 2, and the ceramic tube shell 3.

[0029] In a specific embodiment, the insulating silicone rubber layer is made of silicone rubber.

[0030] The setting of the structure includes the following steps: in order to avoid air breakdown, the glass cover 1, cathode ring 2, and ceramic tube shell 3 are covered with an insulating layer to isolate the air. Before the wrapping process is implemented, the device is soaked in acetone for 20 minutes and then dried in a dust-free room, thereby effectively ensuring that the surface cleanliness of the glass cover 1, cathode ring 2, and ceramic tube shell 3 meets the standard. After that, the silicone rubber is evenly and tightly covered, and the insulating silicone rubber layer is covered. The dirt and dust generated subsequently will not cause creepage, thereby effectively avoiding short circuits and effectively protecting the circuit board function from failure. At the same time, because the air is isolated, the breakdown problem caused by the high humidity environment during the use of the device can be avoided.

[0031] In a specific embodiment, the thickness of the insulating silicone rubber layer is set to 3 mm to 10 mm. By setting the insulating silicone rubber layer with this thickness, the charged parts of the device can be effectively isolated from possible contact with air and other conductors, thereby preventing high voltage breakdown.

[0032] In a specific embodiment, a gap is provided between the glass cover 1 and the cathode ring 2, and an insulating silicone rubber layer 4 is filled in the gap.

[0033] In a specific embodiment, a gap is provided between the ceramic tube shell 3 and the cathode ring 2, and an insulating silicone rubber layer 4 is filled in the gap.

[0034] In a specific embodiment, an EBAPS is disposed on the center area of ​​the top surface of the cathode ring 2 , and the glass cover 1 is disposed on the EBAPS.

[0035] In a specific embodiment, an insulating silicone rubber layer 4 is disposed on the top surface of the cathode ring 2 outside the glass cover 1. The insulating silicone rubber layer 4 can be fully covered to effectively protect the EBAPS and avoid short circuits caused by air breakdown in high-voltage environments.

[0036] Another aspect of the present application provides an EBAPS chip, comprising: the above-mentioned insulating packaging structure for preventing EBAPS short circuit. The chip can effectively avoid breakdown short circuit and creepage short circuit caused by high voltage in long-term use.

[0037] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An insulating packaging structure for preventing EBAPS short circuit, characterized in that: include: Insulating silicone rubber layer; The insulating silicon rubber layer is coated on the outer side wall of the glass cover, the cathode ring and the ceramic tube shell.

2. The insulating packaging structure for preventing EBAPS short circuit according to claim 1, characterized in that: The insulating silicone rubber layer is made of silicone rubber.

3. The insulating packaging structure for preventing EBAPS short circuit according to claim 1, characterized in that: The thickness of the insulating silicone rubber layer is set to 3 mm to 10 mm.

4. The insulating packaging structure for preventing EBAPS short circuit according to claim 1, characterized in that: A gap is arranged between the glass cover and the cathode ring, and an insulating silicone rubber layer is filled in the gap.

5. The insulating packaging structure for preventing EBAPS short circuit according to claim 1, characterized in that: A gap is arranged between the ceramic tube shell and the cathode ring, and an insulating silicone rubber layer is filled in the gap.

6. The insulating packaging structure for preventing EBAPS short circuit according to claim 1, characterized in that: An EBAPS is arranged on the center area of ​​the top surface of the cathode ring, and a glass cover is arranged on the EBAPS.

7. The insulating packaging structure for preventing EBAPS short circuit according to claim 1, characterized in that: An insulating silicon rubber layer is arranged on the top surface of the cathode ring outside the glass cover.

8. An EBAPS chip, characterized in that: include: An insulating packaging structure for preventing EBAPS from short circuiting as claimed in any one of claims 1 to 7.

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