LED packaging structure

Abstract

The utility model discloses an LED packaging structure comprising a packaging colloid, the packaging colloid is provided with at least one cutting surface formed by cutting technology, and the cutting surface is provided with a waterproof protection layer. According to the LED packaging structure, the waterproof protection layer is additionally arranged on the cutting surface of the packaging colloid, so that fluoride fluorescent powder, silicate fluorescent powder or quantum dot fluorescent powder in the light-emitting layer in the packaging colloid can be effectively prevented from generating hydrolysis reaction with external water molecules; the problem of poor variation of color temperature, x / y coordinates and brightness of a white light product due to hydrolysis of powder in a packaging body is solved, the reliability of an LED lamp bead product is effectively improved, and the service life of the LED lamp bead product is effectively prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, in particular to an LED packaging structure. Background Art

[0002] As a new type of solid semiconductor device, LED has been widely used in various industries due to its advantages of small size, light weight, high luminous efficiency, energy saving and environmental protection. Among them, multi-faceted LED has broad application prospects in the fields of lighting and indication due to its high efficiency luminous performance, excellent heat dissipation performance, low power consumption and long life.

[0003] In order to improve production efficiency and reduce costs, this type of multi-faceted LED is not packaged one by one during the packaging process, but multiple LEDs are packaged at the same time, and the packaging colloid is subsequently cut to obtain individual LEDs. However, during the cutting process, the blade presses the packaging colloid downward, and the packaging colloid rebounds upward due to its elasticity, thus generating two forces in opposite directions, causing slight deformation of the cut surface of the side wall of the packaging colloid, thereby increasing the contact area between the packaging colloid and external substances (such as water vapor), accelerating the erosion of the lamp beads by external substances, increasing the failure rate of the lamp beads, and affecting the service life of the lamp beads. Utility Model Content

[0004] The technical problem solved by the utility model is to provide an LED packaging structure with a long lamp bead service life.

[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is: an LED packaging structure, including a packaging colloid, the packaging colloid has at least one cutting surface formed by a cutting process, and a waterproof protective layer is provided on the cutting surface.

[0006] In one embodiment, the waterproof protective layer is transparent or translucent.

[0007] In one embodiment, the surface of the waterproof protection layer away from the encapsulation colloid is a plane.

[0008] In one embodiment, the waterproof protective layer covers the entire area of ​​the cutting surface.

[0009] In one embodiment, the waterproof protective layer is spray-formed, dip-formed or roll-plated.

[0010] In one embodiment, the waterproof protective layer is made of silicone, silicone resin or epoxy resin.

[0011] The beneficial effect of the utility model is that a waterproof protective layer is added to the cut surface of the encapsulation colloid in the LED encapsulation structure, which can effectively block the fluoride phosphor (such as KSF, KGF), silicate phosphor or quantum dot (QD) phosphor in the light-emitting layer of the encapsulation colloid from hydrolyzing with external water molecules, thereby solving the problem of poor variation in color temperature, x / y coordinates and brightness of white light products caused by hydrolysis of powder in the encapsulation body, and effectively improving the reliability and service life of LED lamp bead products. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0013] Figure 1 A cross-sectional view of a local area of ​​an LED packaging structure according to Embodiment 1 of the present utility model;

[0014] Figure 2 It is a partial cross-sectional view of another LED packaging structure of the first embodiment of the utility model.

[0015] Description of Figure Numbers:

[0016] 1. Encapsulation colloid; 11. Cutting surface; 12. Light-emitting layer; 13. Light-shielding layer;

[0017] 2. Waterproof protective layer. DETAILED DESCRIPTION

[0018] The purpose, features and advantages of the present invention will be further described in conjunction with the embodiments and with reference to the accompanying drawings.

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] It should be noted that if the embodiments of the present invention involve directional indications such as up, down, left, right, front, back, etc., then the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture as shown in the accompanying drawings. If the specific posture changes, the directional indication will also change accordingly.

[0021] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0022] In addition, if the meaning of "and / or" appears in the full text is to include three parallel solutions, taking "and / or" as an example, it includes solutions, or solutions, or solutions that are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

[0023] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0024] Embodiment 1

[0025] Please refer to Figure 1 , Embodiment 1 of the utility model is: an LED packaging structure, including a lead frame, a lamp bead and a packaging colloid 1, wherein the packaging colloid 1 covers a part of the lead frame and the lamp bead, wherein the packaging colloid 1 has a light-emitting layer 12 and at least one cutting surface 11 formed by a cutting process, wherein a waterproof protective layer 2 is provided on the cutting surface 11, wherein the light-emitting layer 12 contains phosphor, wherein the phosphor may be a fluoride phosphor, a silicate phosphor, a quantum dot phosphor, etc., wherein the waterproof protective layer 2 can effectively prevent external water vapor from invading the inside of the light-emitting layer 12 from the cutting surface 11 with a larger contact area, causing the phosphor to undergo a hydrolysis reaction. The waterproof protective layer 2 is formed by spraying, immersion, roll plating or other methods.

[0026] In order to reduce the influence of the waterproof protective layer 2 on the light-emitting direction of the LED lamp bead, the waterproof protective layer 2 is optionally transparent or translucent. The material of the waterproof protective layer 2 can be a mixed solution of modified acrylic resin and propylene glycol methyl ether acetate, or it can be silica gel, silicone resin, epoxy resin or other silicon-based high-refractive material. When the material of the waterproof protective layer 2 is a mixed solution of modified acrylic resin and propylene glycol methyl ether acetate, the modified acrylic resin and propylene glycol methyl ether acetate mixed solution are first evenly coated on the cut surface 11, and the waterproof protective layer 2 can be formed after the solution on the encapsulation colloid 1 evaporates, and then the waterproof protective layer 2 is cured by high-temperature baking so that the waterproof protective layer 2 is tightly combined with the encapsulation colloid 1.

[0027] The surface of the waterproof protective layer 2 away from the encapsulation colloid 1 is a plane, and the waterproof protective layer 2 covers the entire area of ​​the cutting surface 11. The waterproof protective layer 2 covering the entire area of ​​the cutting surface 11 can provide more complete protection.

[0028] Of course, when the encapsulation colloid 1 further includes a light shielding layer 13 , in order to reduce the processing precision requirement, optionally, the waterproof protection layer 2 may also cover the side surface of the light shielding layer 13 that is coplanar with the cutting surface 11 .

[0029] The above are only optional embodiments of the present invention, and do not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An LED packaging structure, characterized in that: The invention comprises a packaging colloid, wherein the packaging colloid has at least one cutting surface formed by a cutting process, and a waterproof protective layer is arranged on the cutting surface; the waterproof protective layer is transparent or translucent.

2. The LED packaging structure according to claim 1, characterized in that: The surface of the waterproof protection layer away from the encapsulation colloid is a plane.

3. The LED packaging structure according to claim 1, characterized in that: The waterproof protective layer covers the entire area of ​​the cutting surface.

4. The LED packaging structure according to claim 1, characterized in that: The waterproof protective layer is spray-formed, dip-formed or roll-plated.

5. The LED packaging structure according to claim 1, characterized in that: The waterproof protective layer is made of silica gel, silicone resin or epoxy resin.

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