Lateral entrance type Mini LED

Abstract

The utility model provides a side-entry Mini LED, which comprises a support and a groove arranged in the support, the bottom of the groove is provided with a base, the top of the base is provided with a bonding pad assembly and an insulation area, the bonding pad assembly comprises a first arrangement group arranged along the length direction of the base and a second arrangement group arranged corresponding to the first arrangement group in a staggered manner, and the insulation area is arranged in the first arrangement group. Each of the first arrangement group and the second arrangement group comprises a plurality of first bonding pad structures which are sequentially arranged at intervals, first connecting points and second connecting points are arranged on the first bonding pad structures, the first connecting points are negative bonding pads, the second connecting points are positive bonding pads, second bonding pad structures are arranged at the tail ends of the first arrangement groups, and the second bonding pad structures are arranged at the tail ends of the second arrangement groups. A first bonding pad structure is arranged at the front end of the first arrangement group, a second bonding pad structure is arranged at the front end of the second arrangement group, a third bonding pad structure is arranged at the front end of the second arrangement group, the first bonding pad structure, the second bonding pad structure and the third bonding pad structure are separated by insulating areas, a plurality of MiniLED chips are arranged on the first arrangement group and the second arrangement group in series, and the polarities of the MiniLED chips connected to the first arrangement group and the second arrangement group are opposite.

Description

Technical Field

[0001] The utility model relates to the field of LED packaging, and in particular to a side-entry Mini LED. Background Art

[0002] With the development of science and technology, LED devices are increasingly used in backlight applications due to their long life, energy saving, environmental protection, high brightness and other characteristics. At the same time, Mini LED products are gradually favored by consumers due to their unique regional dimming performance.

[0003] In the prior art, the existing edge-entry Mini LED often has glue overflow during the glue dispensing process, which greatly affects the production efficiency. In addition, the light-emitting angle of the edge-entry Mini LED is small and there is no regional dimming effect. Utility Model Content

[0004] Based on this, the purpose of the present invention is to provide a side-entry Mini LED, which can effectively solve the deficiencies in the above-mentioned prior art.

[0005] A side-entry Mini LED comprises a bracket and a groove arranged inside the bracket for accommodating a MiniLED chip, a base for connecting the MiniLED chip is arranged at the bottom of the groove, a pad assembly for connecting the MiniLED chip and an insulating area are arranged on the top of the base, the pad assembly comprises a first arrangement group arranged along the length direction of the base and a second arrangement group arranged alternately and correspondingly with the first arrangement group, the first arrangement group and the second arrangement group each comprise a plurality of first pad structures arranged in sequence, a first connection point and a second connection point are arranged on the first pad structure, the first connection point is a negative electrode pad, and the second connection point is a positive electrode pad, a second pad structure is arranged at the end of the first arrangement group, a third pad structure is arranged at the front end of the second arrangement group, the first pad structure, the second pad structure and the third pad structure are separated by the insulating area, a plurality of the MiniLED chips are arranged in series on the first arrangement group and the second arrangement group, and each of the MiniLED chips connected to the first arrangement group and the second arrangement group has opposite polarities.

[0006] Furthermore, the side walls of the groove in the length direction are inclined so that the top of the groove forms a trumpet-shaped opening, and the side walls of the groove in the length direction are connected to the arc of the base.

[0007] Furthermore, a slide is provided in the groove, the slide is arranged on both sides of the base, the side of the slide facing the base is connected to the arc of the base, and the height of the top of the slide is higher than the height of the MiniLED chip.

[0008] Furthermore, slides are provided on both sides of the slide table in the length direction of the groove to facilitate glue dispensing. The slides are inclined toward the base, and the slope of the slides is 15°.

[0009] Furthermore, a Zener diode is provided on the third pad structure, and the Zener diode is connected to the first pad structure adjacent thereto via a metal wire, and the heights of the Zener diode and the metal wire are both lower than the height of the top of the slide.

[0010] Furthermore, the second pad structure is a negative electrode pad, and the third pad structure is a positive electrode pad.

[0011] Furthermore, the first pad structure, the second pad structure and the third pad structure all penetrate the base and the bracket and are connected to the bottom of the bracket.

[0012] Furthermore, the bracket is made of insulating material, and a hole for attaching a logo is opened on the top of the bracket.

[0013] Compared with the prior art, the beneficial effect of the utility model is as follows: by setting a pad assembly, each MiniLED chip can be individually controlled, thereby achieving regional dimming performance; specifically, by setting a first arrangement group and a second arrangement group along the length direction of the base, the first arrangement group and the second arrangement group are arranged in an alternating manner, the first arrangement group and the second arrangement group each include a plurality of first pad structures arranged in sequence, a first connection point and a second connection point are arranged on the first pad structure, the first connection point is a negative pad, and the second connection point is a positive pad, a second pad structure is arranged at the end of the first arrangement group, and a third pad structure is arranged at the front end of the second arrangement group, the first pad structure, the second pad structure and the third pad structure are separated by an insulating area, and a plurality of MiniLED chips are arranged in series on the first arrangement group and the second arrangement group, and each MiniLED chip is connected to the first arrangement group and the second arrangement group with opposite polarities, so that each MiniLED chip realizes a series path, and then the MiniLED chip on each first pad structure can be individually or regionally controlled, thereby achieving regional dimming performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall structure of the side-entry Mini LED in the embodiment of the utility model;

[0015] Figure 2 This is a schematic cross-sectional view of the overall structure of the side-entry Mini LED in the embodiment of the utility model;

[0016] Description of main component symbols:

[0017] Bracket 10 First pad structure 413 vacancy 11 Second pad structure 414 Mini LED Chip 20 The third pad structure 415 Grooves 30 First connection point 416 Base 40 Second connection point 417 Pad Components 41 Slide 50 Insulation area 42 landslide 51 The first permutation group 411 Zener diode 60 The second arrangement group 412 Metal wire 61

[0018] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0019] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0020] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0022] See also Figure 1 to Figure 2The side-entry Mini LED in the embodiment of the utility model comprises a bracket 10 and a groove 30 arranged inside the bracket 10 for accommodating the MiniLED chip 20. The bracket 10 is made of an insulating material. A base 40 for connecting the MiniLED chip 20 is arranged at the bottom of the groove 30. A pad assembly 41 and an insulating area 42 for connecting the MiniLED chip 20 are arranged on the top of the base 40. The pad assembly 41 comprises a first arrangement group 411 arranged along the length direction of the base 40 and a second arrangement group 412 arranged in an alternating manner with the first arrangement group 411. The first arrangement group 411 and the second arrangement group 412 both comprise a plurality of first pad structures 413 arranged in sequence and at intervals. A first connection point 416 and a second connection point 417 are arranged on the structure 413, the first connection point 416 is a negative pad, the second connection point 417 is a positive pad, a second pad structure 414 is arranged at the end of the first arrangement group 411, and a third pad structure 415 is arranged at the front end of the second arrangement group 412, the first pad structure 413, the second pad structure 414 and the third pad structure 415 are separated by the insulating area 42, and a plurality of the MiniLED chips 20 are arranged in series on the first arrangement group 411 and the second arrangement group 412, and each of the MiniLED chips 20 is connected to the first arrangement group 411 and the second arrangement group 412 with opposite polarity.

[0023] Furthermore, the second pad structure 414 is a negative electrode pad, and the third pad structure 415 is a positive electrode pad.

[0024] It can be understood that by arranging the first arrangement group 411 and the second arrangement group 412 along the length direction of the base 40, the first arrangement group 411 and the second arrangement group 412 are arranged in an alternating manner so that each of the MiniLED chips 20 can achieve a series path, and then each of the MiniLED chips on the first pad structure 413 can be individually or regionally controlled, thereby achieving regional dimming performance.

[0025] Furthermore, the first pad structure 413 , the second pad structure 414 and the third pad structure 415 all penetrate the base 40 and the bracket 10 and are connected to the bottom of the bracket 10 .

[0026] It can be understood that by passing the first pad structure 413 , the second pad structure 414 and the third pad structure 415 through the base 40 and the bracket 10 and connecting to the bottom of the bracket 10 , the utility model can be more conveniently installed on a substrate.

[0027] Furthermore, the side wall of the groove 30 in the length direction is inclined so that the top of the groove 30 forms a trumpet-shaped opening, and the side wall of the groove 30 in the length direction is connected to the base 40 in an arc shape.

[0028] It can be understood that by setting the side wall of the groove 30 in an inclined manner in the length direction and forming a trumpet-shaped opening at the top of the groove 30, the light-emitting angle of the MiniLED chip 20 can be increased.

[0029] Furthermore, a slide 50 is provided in the groove 30 , and the slide 50 is arranged on both sides of the base 40 . The side of the slide 50 facing the base 40 is connected to the base 40 in an arc, and the height of the top of the slide 50 is higher than the height of the MiniLED chip 20 .

[0030] It can be understood that by providing the slide 50 , the light-emitting angle of the side of the MiniLED chip 20 can be increased.

[0031] Furthermore, slideways 51 for facilitating glue dispensing are provided on both sides of the slide platform 50 in the length direction of the groove 30 , and the slideways 51 are inclined toward the base 40 , and the slope of the slideways 51 is 15°.

[0032] It can be understood that by providing the slide 51 , during the glue dispensing process, the glue can flow from the slide 51 onto the base 40 , and then the height of the glue can be observed through the slide 51 to prevent the glue from overflowing.

[0033] Furthermore, a Zener diode 60 is provided on the third pad structure 415, and the Zener diode 60 is connected to the adjacent first pad structure 413 via a metal wire 61, and the heights of the Zener diode 60 and the metal wire 61 are both lower than the height of the top of the slide.

[0034] It can be understood that by providing the Zener diode 60 , a higher stable voltage can be obtained.

[0035] It should be noted that when the number of the first pad structures 413 in the first arrangement group 411 and the second arrangement group 412 is greater than one, the Zener diode 60 may not be required.

[0036] Furthermore, a hole 11 for attaching a logo is provided on the top of the bracket 10 .

[0037] It can be understood that by providing the gap 11, a label can be attached to the gap 11 to facilitate identification of the positive and negative poles during use.

[0038] In summary, the side-entry Mini LED in the above-mentioned embodiments of the utility model: by setting a pad assembly, each Mini LED chip can be individually controlled, thereby achieving regional dimming performance; specifically, by setting a first arrangement group and a second arrangement group along the length direction of the base, the first arrangement group and the second arrangement group are arranged in an alternating manner, and the first arrangement group and the second arrangement group each include a plurality of first pad structures arranged in sequence, a first connection point and a second connection point are arranged on the first pad structure, the first connection point is a negative pad, and the second connection point is a positive pad, a second pad structure is arranged at the end of the first arrangement group, and a third pad structure is arranged at the front end of the second arrangement group, the first pad structure, the second pad structure and the third pad structure are separated by an insulating area, and a plurality of MiniLED chips are arranged in series on the first arrangement group and the second arrangement group, and each MiniLED chip is connected to the first arrangement group and the second arrangement group with opposite polarities, so that each MiniLED chip realizes a series path, and then the MiniLED chip on each first pad structure can be individually or regionally controlled, thereby achieving regional dimming performance.

[0039] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0040] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A side-entry Mini LED, characterized in that: The invention comprises a support and a groove arranged inside the support for accommodating a MiniLED chip, a base for connecting the MiniLED chip is arranged at the bottom of the groove, a pad assembly for connecting the MiniLED chip and an insulating area are arranged on the top of the base, the pad assembly comprises a first arrangement group arranged along the length direction of the base and a second arrangement group arranged alternately and correspondingly with the first arrangement group, the first arrangement group and the second arrangement group each comprise a plurality of first pad structures arranged in sequence and at intervals, a first connection point and a second connection point are arranged on the first pad structure, the first connection point is a negative electrode pad, and the second connection point is a positive electrode pad, a second pad structure is arranged at the end of the first arrangement group, a third pad structure is arranged at the front end of the second arrangement group, the first pad structure, the second pad structure and the third pad structure are separated by the insulating area, a plurality of the MiniLED chips are arranged in series on the first arrangement group and the second arrangement group, and each of the MiniLED chips connected to the first arrangement group and the second arrangement group has opposite polarities.

2. The edge-type Mini LED according to claim 1, characterized in that: The side wall of the groove in the length direction is inclined so that the top of the groove forms a trumpet-shaped opening, and the side wall of the groove in the length direction is connected to the arc of the base.

3. The edge-type Mini LED according to claim 1, characterized in that: A slide is also provided in the groove, and the slide is arranged on both sides of the base. The side of the slide facing the base is connected to the arc of the base, and the height of the top of the slide is higher than the height of the MiniLED chip.

4. The edge-type Mini LED according to claim 3, characterized in that: Slides are provided on both sides of the slide table in the length direction of the groove to facilitate glue dispensing. The slides are inclined toward the base, and the slope of the slides is 15°.

5. The edge-type Mini LED according to claim 4, characterized in that: A Zener diode is arranged on the third pad structure, and the Zener diode is connected to the first pad structure adjacent to it through a metal wire. The heights of the Zener diode and the metal wire are both lower than the height of the top of the slide.

6. The edge-type Mini LED according to claim 1, characterized in that: The second pad structure is a negative electrode pad, and the third pad structure is a positive electrode pad.

7. The edge-type Mini LED according to claim 1, characterized in that: The first pad structure, the second pad structure and the third pad structure all penetrate the base and the bracket and are connected to the bottom of the bracket.

8. The edge-type Mini LED according to claim 1, characterized in that: The bracket is made of insulating material, and a hole for attaching a logo is provided on the top of the bracket.

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