Light emitting diode

Abstract

The utility model relates to the technical field of semiconductors, in particular to a light-emitting diode, which comprises a PCB (printed circuit board) substrate, an epoxy resin rubber seat and a light-transmitting rubber cover which are integrally formed are fixed on the PCB substrate, the light-transmitting rubber cover is fixedly connected above the epoxy resin rubber seat, a connecting seat is fixed at the inner bottom of the light-transmitting rubber cover, and the connecting seat is fixedly connected with the light-transmitting rubber cover. An opening is formed in the upper portion of the connecting base, the opening is in an inverted trapezoidal conical shape, a plurality of continuously-arranged reflection structures are fixed to the position, located at the opening, in the connecting base, a light-emitting chip is fixed to the middle of the connecting base, and transparent solid crystal glue is fixedly connected to the outer side of the light-emitting chip. The light-emitting chip and the transparent solid crystal glue are fixedly connected with an anti-blue-light film and a fluorescent film. According to the utility model, the PCB substrate and the epoxy resin are integrally formed by high-temperature mould pressing, which is different from the traditional silica gel RGB structure, so that the service life of the light-emitting diode can be prolonged, the utilization rate of a light source can be improved, and the backlight effect can be optimized.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a light emitting diode. Background Art

[0002] Light-emitting diode, abbreviated as LED, is a commonly used light-emitting device that releases energy through the recombination of electrons and holes to emit light. It has a wide range of uses in modern society, such as lighting, flat panel displays, medical devices, etc.

[0003] In the prior art, a light-emitting diode is usually composed of a structure including an emitting area, an electrode, a chip and a packaging material. The packaging material is usually a silicone RGB structure, but the silicone packaging structure is easily affected by moisture and gradually fails. In addition, the light-emitting diode emits light through a light-emitting chip, and the bottom of the light-emitting chip is fixed on a PCB substrate. However, the PCB substrate is made of an opaque material, and part of the light source scattered on the PCB substrate is easily absorbed by the PCB substrate, thereby easily affecting the refractive index and reflectivity of the light, thereby reducing the utilization rate of the light source and the lighting effect.

[0004] Therefore, those skilled in the art have provided a light emitting diode to solve the problems raised in the above background technology. Utility Model Content

[0005] The purpose of the utility model is to provide a light emitting diode to solve the following technical problems:

[0006] How to improve the utilization rate and lighting effect of light sources, and extend the service life of light-emitting diodes.

[0007] The purpose of the utility model can be achieved through the following technical solutions:

[0008] The light emitting diode comprises a PCB substrate, on which an epoxy resin adhesive seat and a light-transmitting adhesive cover formed in one piece are fixed, and the light-transmitting adhesive cover is fixedly connected above the epoxy resin adhesive seat;

[0009] A connecting seat is fixed to the inner bottom of the light-transmitting rubber cover, an opening is provided above the connecting seat, the opening is arranged in an inverted trapezoidal cone shape, and a plurality of continuously arranged reflective structures are fixed in the connecting seat at the opening;

[0010] A light-emitting chip is fixed in the middle of the connecting seat, and a transparent bonding adhesive is fixedly connected to the outer side of the light-emitting chip. An anti-blue light film and a fluorescent film are fixedly connected between the light-emitting chip and the transparent bonding adhesive. The bottom of the anti-blue light film and the fluorescent film are circular and the top is hemispherical.

[0011] Furthermore, the epoxy resin adhesive seat and the light-transmitting adhesive cover are both made of transparent epoxy resin adhesive, and the light-transmitting adhesive cover is arranged in a hemispherical shape.

[0012] Furthermore, a high-reflection layer is fixed on the outside of the reflective structure. The high-reflection layer is made of white colloid and covers the outside of the reflective structure in a thin film. The cross-section of the reflective structure is triangular, and the reflective structure is annular as a whole. The inner diameter of the reflective structure becomes smaller and smaller from the top of the connecting seat to the bottom.

[0013] Furthermore, a conductive gold wire is fixedly connected between one side of the light-emitting chip and the PCB substrate.

[0014] Furthermore, arc-shaped grooves are provided on both sides of the upper part of the PCB substrate, and green paint is fixedly connected to both sides of the PCB substrate located on the epoxy resin adhesive seat.

[0015] Furthermore, a substrate pad is fixedly connected to the upper middle portion of the PCB substrate, and the substrate pad is fixedly connected to the light-emitting chip.

[0016] Furthermore, the connection seat is provided with a through hole at the bottom of the opening, and the through hole cooperates with the light-emitting chip, the transparent solid crystal glue, the anti-blue light film and the fluorescent film.

[0017] Beneficial effects of the utility model:

[0018] (1) The utility model is provided with a connecting seat, a plurality of continuous reflective structures, an anti-blue light film, and a fluorescent film. The light-emitting chip is arranged inside the anti-blue light film and the fluorescent film. The light-emitting chip is composed of three primary color chips of red, green and blue. When emitting light, it will refract outward through the fluorescent film and the anti-blue light film. The top of the anti-blue light film and the fluorescent film is a hollow hemispherical shape, which is convenient for light reflection and refraction. At the same time, it can effectively block ultraviolet light rays, short-wave blue light rays, and soft and dazzling light source stimulation, making the light more uniform and soft, and improving the luminous efficiency and color uniformity. The opening of the connecting seat is an inverted trapezoidal cone, and a plurality of continuous reflective structures are fixed at its opening, which can reflect and refract the light scattered at the bottom of the light-transmitting cover again, thereby improving the light source utilization rate and backlight effect.

[0019] (2) The utility model is provided with an integrated epoxy resin adhesive seat and a light-transmitting adhesive cover, and the size is small, which is more commonly used in various decorative lamps. Different from the traditional silicone RGB packaging structure, the epoxy resin adhesive seat and the light-transmitting adhesive cover are formed by molding, sealing and pressing the mold cavity under high temperature conditions, and have the effect of moisture resistance and not easy to be damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The utility model is further described below in conjunction with the accompanying drawings.

[0021] Figure 1 It is a plan view of the utility model;

[0022] Figure 2 It is a side view of the utility model;

[0023] Figure 3 The internal structure of the utility model is shown in FIG. Figure 1 ;

[0024] Figure 4 The internal structure of the utility model is shown in FIG. Figure 2 ;

[0025] Figure 5 It is a three-dimensional structural schematic diagram of the connecting seat of the utility model.

[0026] Reference numerals:

[0027] 1. PCB substrate; 2. Epoxy resin glue seat; 3. Transparent glue cover; 4. Green paint; 5. Arc groove; 6. High reflective layer; 7. Conductive gold wire; 8. Reflective structure; 9. Light-emitting chip; 10. Substrate pad; 11. Connecting seat; 12. Transparent solid crystal glue; 13. Anti-blue light film; 14. Fluorescent film; 15. Cavity; 111. Through hole; 112. Support base; 113. Opening. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] Please see attached Figure 1-5 The light-emitting diode in the embodiment of the utility model includes a PCB substrate 1, on which an integrally formed epoxy resin adhesive seat 2 and a transparent adhesive cover 3 are fixed, and the transparent adhesive cover 3 is fixedly connected above the epoxy resin adhesive seat 2. The PCB substrate 1, the epoxy resin adhesive seat 2 and the transparent adhesive cover 3 are pressed together by a mold cavity, and require independent molds to produce, and are small in size and have a wide range of applications. The production process is as follows: first, the PCB substrate 1 and the epoxy resin adhesive cake are placed in the mold cavity in sequence, and then pressed and molded at high temperature. During this process, the epoxy resin adhesive cake is converted from solid to liquid, and is bonded to the PCB substrate 1 at high temperature. After cooling, the mold is opened and finally shaped. Different from the traditional silicone RGB packaging structure, it has the effects of moisture resistance, pressure resistance, and not easy to be damaged;

[0030] A connecting seat 11 is fixed to the inner bottom of the light-transmitting rubber cover 3, and an opening 112 is provided above the connecting seat 11. The opening 112 is arranged in an inverted trapezoidal cone shape, and the inner side of the connecting seat 11 is inclined, which is more convenient to improve the refractive index and reflectivity of light when connected with the reflective structure 8. A plurality of continuously arranged reflective structures 8 are fixed at the opening 112 in the connecting seat 11. The cross-section of the reflective structure 8 is triangular, and the reflective structure 8 is annular as a whole. The inner diameter of the reflective structure 8 is getting smaller and smaller from the top to the bottom of the connecting seat 11, and can be matched with the inclined angle of the opening 112, so as to better utilize the light source scattered by reflection and refraction on the PCB substrate 1, and can optimize the reflection and diffusion of light, so that the light can be more evenly and widely distributed after reflection;

[0031] A light-emitting chip 9 is fixed in the middle of the connecting seat 11, and a transparent solid crystal glue 12 is fixedly connected to the outer side of the light-emitting chip 9. The main function of the transparent solid crystal glue 12 is to fix the light-emitting chip 9 to prevent the light-emitting chip 9 from moving or falling off during the packaging process, while ensuring the insulation performance between the chip and the packaging material. The light-emitting chip 9 and the transparent solid crystal glue 12 are fixedly connected with an anti-blue light film 13 and a fluorescent film 14. The bottom of the anti-blue light film 13 and the fluorescent film 14 are circular and the top is hemispherical. The anti-blue light film 13 adopts blue light blocking technology to absorb and convert blue light, thereby effectively blocking blue light, and can effectively block ultraviolet light rays, short-wave blue light rays, and soft dazzling light source stimulation. The fluorescent film 14 has a fluorescent effect, which can convert ultraviolet light or blue light into visible light, thereby improving the luminous efficiency and color uniformity of LED lamp beads.

[0032] The epoxy resin adhesive seat 2 and the light-transmitting adhesive cover 3 are both made of transparent epoxy resin adhesive. The light-transmitting adhesive cover 3 is hemispherical in shape, which is convenient for light reflection and refraction in structure. In terms of material, the epoxy resin packaging structure has a higher packaging stress, a harder and more brittle adhesive layer, and better air tightness. It is more reliable than the traditional silicone RGB packaging structure and can increase the service life.

[0033] A high reflection layer 6 is fixed to the outside of the reflection structure 8 . The high reflection layer 6 is made of white colloid and is in the form of a thin film covering the outside of the reflection structure 8 , which is beneficial to increasing the reflectivity and refractive index of the reflection structure 8 .

[0034] A conductive gold wire 7 is fixedly connected between one side of the light emitting chip 9 and the PCB substrate 1 , so that the light emitting chip 9 can easily convert electrical energy into light energy.

[0035] Arc grooves 5 are provided on both sides of the top of the PCB substrate 1. Green paint 4 is fixedly connected to both sides of the PCB substrate 1 located on the epoxy resin adhesive seat 2. The green paint 4 is made of fluorescent powder and its function is to absorb invisible light, that is, ultraviolet light or blue light, and stimulate visible light, that is, green light.

[0036] The connecting seat 11 is located at the bottom of the opening 112 and is provided with a through hole 111. The through hole 111 cooperates with the light-emitting chip 9, the transparent solid crystal glue 12, the anti-blue light film 13 and the fluorescent film 14. The light-emitting chip 9, the transparent solid crystal glue 12, the anti-blue light film 13 and the fluorescent film 14 can be exposed through the through hole 111. A substrate pad 10 is fixedly connected to the upper middle part of the PCB substrate 1. The substrate pad 10 is fixedly connected to the light-emitting chip 9. The substrate pad 10 is a copper foil on the PCB substrate 1 for soldering the light-emitting chip 9. The light-emitting chip 9 is composed of three chips with different primary colors (red, green, and blue). More than 16 million lights can be programmed to meet various requirements for backlight colors, and can be used in various keyboards, mice, and decorative lights.

[0037] The above is a detailed description of an embodiment of the utility model, but the content is only a preferred embodiment of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A light emitting diode, comprising a PCB substrate (1), characterized in that: An integrally formed epoxy resin adhesive seat (2) and a light-transmitting adhesive cover (3) are fixed on the PCB substrate (1); the light-transmitting adhesive cover (3) is fixedly connected above the epoxy resin adhesive seat (2); A connecting seat (11) is fixed to the inner bottom of the light-transmitting rubber cover (3); an opening (112) is provided above the connecting seat (11); the opening (112) is arranged in an inverted trapezoidal cone shape; a plurality of continuously arranged reflective structures (8) are fixed in the connecting seat (11) at the opening (112); A light-emitting chip (9) is fixed in the middle of the connection seat (11), a transparent solid crystal adhesive (12) is fixedly connected to the outer side of the light-emitting chip (9), an anti-blue light film (13) and a fluorescent film (14) are fixedly connected between the light-emitting chip (9) and the transparent solid crystal adhesive (12), and the bottom of the anti-blue light film (13) and the fluorescent film (14) are in a circular ring shape and the top is in a hemispherical shape.

2. The light emitting diode according to claim 1, characterized in that: The epoxy resin adhesive seat (2) and the light-transmitting adhesive cover (3) are both made of transparent epoxy resin adhesive, and the light-transmitting adhesive cover (3) is arranged in a hemispherical shape.

3. The light emitting diode according to claim 1, characterized in that: A high reflective layer (6) is fixed on the outside of the reflective structure (8); the high reflective layer (6) is made of white colloid and covers the outside of the reflective structure (8) in the form of a thin film; the cross-section of the reflective structure (8) is triangular; the reflective structure (8) is annular as a whole, and the inner diameter of the reflective structure (8) decreases from the top of the connecting seat (11) to the bottom.

4. The light emitting diode according to claim 1, characterized in that: A conductive gold wire (7) is fixedly connected between one side of the light-emitting chip (9) and the PCB substrate (1).

5. The light emitting diode according to claim 1, characterized in that: Arc-shaped grooves (5) are provided on both sides of the upper part of the PCB substrate (1), and green paint (4) is fixedly connected to both sides of the PCB substrate (1) located on the epoxy resin adhesive seat (2).

6. The light emitting diode according to claim 1, characterized in that: A substrate pad (10) is fixedly connected to the upper middle portion of the PCB substrate (1), and the substrate pad (10) is fixedly connected to the light-emitting chip (9).

7. The light emitting diode according to claim 1, characterized in that: The connection seat (11) is provided with a through hole (111) at the bottom of the opening (112), and the through hole (111) cooperates with the light-emitting chip (9), the transparent solid crystal glue (12), the anti-blue light film (13) and the fluorescent film (14).

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