High-voltage retest sorting device for integrated circuit chips

Abstract

The utility model relates to an integrated circuit chip high-voltage retest sorting device which comprises an obliquely arranged gravity conveying line, a detection assembly, a collection assembly and a retest assembly which are sequentially arranged in the conveying direction of the gravity conveying line, and the collection assembly comprises a collection air cylinder and a pressing position air cylinder which are vertically arranged. The telescopic end of the top of the collecting cylinder is fixedly connected with an ejector rod used for preventing the chip from entering the retest assembly, and the telescopic end of the bottom of the pressing cylinder is fixedly connected with a pressing rod used for limiting the secondary chip blocked by the ejector rod; the retest assembly comprises a vertically arranged limiting cylinder, the bottom end of the limiting cylinder is fixedly connected with a baffle to limit the chip from sliding down, retest cylinders are symmetrically arranged on the two sides of the gravity conveying line, and the opposite ends of the two retest cylinders are both provided with high-voltage test row claws used for abutting against optocoupler pins on the two sides of the chip. According to the high-voltage retesting and sorting device for the integrated circuit chips, barrier-free conveying of good product chips in batches can be completed through cooperation of the collecting assembly and the retesting assembly, retesting and sorting of single chips can be carried out in order in defective product batches, efficient collection of good products is guaranteed, and stable, convenient and efficient detection is achieved.

Description

Technical Field

[0001] The utility model relates to a high-voltage retesting and sorting device for integrated circuit chips. Background Art

[0002] Optical coupler (OCEP) is also called photoelectric isolator or photoelectric coupler, or optocoupler for short. It is a device that uses light as a medium to transmit electrical signals. The coupler uses light as a medium to transmit electrical signals. It has a good isolation effect on input and output electrical signals, so it is widely used in various circuits.

[0003] Optocouplers need to be tested with a high-voltage instrument to detect the withstand voltage value. Traditional testing methods mostly use manual operation, which is inefficient. The currently disclosed optocoupler high-voltage test mechanism - CN214669404U, can be used with a high-voltage instrument to test the withstand voltage value of optocouplers. However, if unqualified optocouplers are found after the test, all the optocouplers in the batch need to be re-introduced into the unqualified channel or taken out and re-tested individually. The operation is complicated, labor-intensive, and inefficient. There is an urgent need for an efficient detection and sorting device that integrates detection and retesting. Utility Model Content

[0004] In view of the deficiencies in the prior art, the technical problem to be solved by the utility model is to provide an integrated circuit chip high-voltage retesting and sorting device, which is not only structurally reasonable but also convenient and efficient.

[0005] In order to solve the above technical problems, the technical solution of the utility model is: an integrated circuit chip high-voltage re-testing and sorting device, including an inclined gravity conveyor line, along the conveying direction of the gravity conveyor line are arranged in sequence detection components, collection components and re-test components, the collection component includes a vertically arranged collection cylinder and a pressure cylinder, the top telescopic end of the collection cylinder is fixedly connected to a push rod for blocking the chip from entering the re-test component, the bottom telescopic end of the pressure cylinder is fixedly connected to a pressure rod for limiting the secondary chip after being blocked by the push rod; the re-test component includes a vertically arranged limit cylinder, the bottom end of the limit cylinder is fixedly connected to a baffle to limit the chip from sliding down, re-test cylinders are symmetrically arranged on both sides of the gravity conveyor line, and the opposite ends of the two re-test cylinders are provided with high-voltage test claws for top-connecting the optocoupler pins on both sides of the chip.

[0006] Furthermore, the gravity conveyor line includes a detection track, a collection track and a re-measurement track which are spliced ​​in sequence. The collection track includes a track seat, and the track seat is symmetrically provided with two slide grooves for cooperating with the sliding of the optocoupler pins on both sides of the chip. A protrusion for receiving the chip body is formed between the two slide grooves. Two limit pressure blocks are symmetrically fixed on the top of the track seat, and the two limit pressure blocks extend toward each other and have stepped grooves on the bottom for cooperating with the chip.

[0007] Furthermore, a blowing hole is vertically penetrated on the limiting pressing block, a blowing groove is obliquely opened at the bottom of the limiting pressing block to facilitate blowing the chip, the blowing groove is connected to the stepped groove, and the top of the blowing hole is externally connected to an air pump.

[0008] Furthermore, the detection track is consistent with the collecting track structure, both include an upper guide plate and a lower guide plate, the bottom of the upper guide plate is provided with a straight groove for the top of the chip to embed and slide, and a sliding groove for the chip is formed between the straight groove and the lower guide plate, and detection cylinders are also symmetrically arranged on both sides of the detection track, and the facing ends of the two detection cylinders are provided with high-voltage test claws for top-connecting the optocoupler pins on both sides of the chip.

[0009] Furthermore, the detection component also includes two baffle cylinders, the telescopic ends at the bottom of the two baffle cylinders are respectively connected to the front insulating baffle and the rear insulating baffle, and the upper guide plate is vertically provided with telescopic grooves for the front insulating baffle, the rear insulating baffle and the baffle to pass through.

[0010] Furthermore, optical fiber sensing seats are provided above and below the detection track and the collecting track, and a plurality of sensing holes for vertical insertion of optical fiber sensors are provided on the optical fiber sensing seats at intervals, and through holes corresponding to the sensing holes are penetrated through the upper guide plate and the lower guide plate.

[0011] Furthermore, partitions are provided between the detection component and the collection component, and between the collection component and the re-test component, and openings for the chips to pass through are opened on the partitions, and the pressure cylinder, the limit cylinder, and the baffle cylinder are all fixedly connected to the partitions.

[0012] Furthermore, the detection track, the collection track and the re-detection track are all fixed on the same bottom plate.

[0013] Compared with the prior art, the utility model has the following beneficial effects: through the cooperation of the collection component and the retest component, it can not only complete the barrier-free transportation of batches of good chips, but also orderly retest and sort individual chips in the defective batches, ensuring the efficient collection of good products, stable, convenient and efficient detection.

[0014] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of an embodiment of the utility model;

[0016] Figure 2 It is a top view schematic diagram of an embodiment of the utility model;

[0017] Figure 3 for Figure 2 Sectional view of AA in the middle;

[0018] Figure 4 A side view of an embodiment of the utility model;

[0019] Figure 5 for Figure 4 A magnified schematic diagram of B;

[0020] Figure 6 It is a schematic diagram of the structure of the detection component in the embodiment of the utility model;

[0021] Figure 7 It is a schematic diagram of the structure of the limiting pressing block in the embodiment of the utility model.

[0022] In the figure: 1- gravity conveyor line, 2- detection component, 3- collection component, 4- retest component, 5- collection cylinder, 6- pressure cylinder, 7- ejector rod, 8- pressure rod, 9- limit cylinder, 10- baffle, 11- retest cylinder, 12- chip, 13- optocoupler pin, 14- high voltage test claw, 15- detection track, 16- collection track, 17- retest track, 18- track seat, 19- slide slot, 20- limit pressure block, 21 -Step groove, 22-blowing hole, 23-blowing groove, 24-blowing pipe, 25-upper guide plate, 26-lower guide plate, 27-straight groove, 28-detection cylinder, 29-movable block, 30-guide rail, 31-block cylinder, 32-front insulating block, 33-rear insulating block, 34-telescopic groove, 35-optical fiber sensing seat, 36-sensing hole, 37-through hole, 38-partition, 39-through port, 40-optical fiber sensor, 41-bottom plate. DETAILED DESCRIPTION

[0023] In order to make the above features and advantages of the present invention more obvious and easy to understand, embodiments are given below with reference to the accompanying drawings for detailed description as follows.

[0024] like Figures 1 to 7 As shown, the high-voltage retest and sorting device for integrated circuit chips comprises an inclined gravity conveying line 1, along which a detection component 2, a collecting component 3 and a retest component 4 are sequentially arranged along the conveying direction of the gravity conveying line, the collecting component comprises a vertically arranged collecting cylinder 5 and a pressure cylinder 6, the top telescopic end of the collecting cylinder is fixedly connected to a push rod 7 for blocking the chip from entering the retest component, the bottom telescopic end of the pressure cylinder is fixedly connected to a pressure rod 8 for limiting the secondary chip (i.e. the chip arranged in the second position) after being blocked by the push rod; the retest component comprises a vertically arranged limiting cylinder 9, the bottom end of the limiting cylinder is fixedly connected to a baffle 10 for limiting the chip from sliding down, retest cylinders 11 are symmetrically arranged on both sides of the gravity conveying line, and the opposite ends of the two retest cylinders are provided with high-voltage test claws 14 for top-connecting the optocoupler pins 13 on both sides of the chip 12.

[0025] In an embodiment of the utility model, the gravity conveyor line includes a detection track 15, a collection track 16 and a re-detection track 17 which are spliced ​​in sequence. The collection track includes a track seat 18, and the track seat is symmetrically provided with two slide grooves 19 for cooperating with the sliding of the optocoupler pins on both sides of the chip. A protrusion for receiving the chip body is formed between the two slide grooves. Two limit pressure blocks 20 are symmetrically fixed on the top of the track seat. The two limit pressure blocks extend toward each other and have stepped grooves 21 on the bottom to cooperate with the chip.

[0026] In the embodiment of the utility model, a blowing hole 22 is vertically penetrated on the limiting pressure block, and a blowing groove 23 is obliquely opened at the bottom of the limiting pressure block to facilitate blowing the chip. The blowing groove is connected to the step groove, and the top of the blowing hole is connected to an external air pump through a blowing pipe 24.

[0027] In the embodiment of the utility model, the detection track is consistent with the collecting track structure, both include an upper guide plate 25 and a lower guide plate 26, the bottom of the upper guide plate is provided with a straight groove 27 for the top of the chip to be embedded and slided, and a sliding groove for the chip is formed between the straight groove and the lower guide plate, and detection cylinders 28 are also symmetrically arranged on both sides of the detection track, and the facing ends of the two detection cylinders are provided with high-voltage test claws for top-connecting the optocoupler pins on both sides of the chip; the detection cylinder and the re-test cylinder are connected to the high-voltage test claws via a movable block 29, and the bottom of the movable block slides on the bottom plate through a guide rail 30.

[0028] In an embodiment of the utility model, the detection component also includes two baffle cylinders 31, the telescopic ends at the bottom of the two baffle cylinders are respectively connected to the front insulating baffle 32 and the rear insulating baffle 33, and the upper guide plate is vertically provided with telescopic grooves 34 for the front insulating baffle, the rear insulating baffle and the baffle to pass through.

[0029] In the embodiment of the utility model, optical fiber sensing seats 35 are provided above and below the detection track and the collecting track, and a plurality of sensing holes 36 for vertical insertion of optical fiber sensors 40 are provided at intervals on the optical fiber sensing seats, and through holes 37 corresponding to the sensing holes are opened on the upper guide plate and the lower guide plate, and the optical fiber sensing seats located above are fixed on the partition plate, and the optical fiber sensing seats located below are fixedly connected to the bottom plate.

[0030] In the embodiment of the utility model, a partition 38 is provided between the detection component and the collection component, and between the collection component and the re-test component. The partition is provided with a through hole 39 for the chip to pass through. The pressure cylinder, the limit cylinder, and the baffle cylinder are all fixedly connected to the partition.

[0031] In the embodiment of the utility model, the detection track, the collection track and the re-detection track are all fixed on the same bottom plate 41, the bottom of the partition is fixedly connected to the bottom plate, the collection cylinder is embedded in the bottom of the bottom plate, and the lower guide plate is fixedly connected to the upper surface of the bottom plate.

[0032] The working principle of the embodiment of the utility model is as follows: first, the chips are arranged on the detection track and slide under the action of gravity. At this time, the front insulating baffle moves downward under the action of the baffle cylinder to prevent the chips from continuing to move downward, and after the optical fiber sensor senses that the number of arranged chips matches the high-voltage test claws, the baffle cylinder drives the rear insulating baffle to move downward to prevent the chips from continuing to move downward. At this time, the detection cylinders on both sides extend to push the high-voltage test claws on both sides to connect to the chip optocoupler pins to complete the high-voltage detection. After the detection is completed, the baffle cylinder drives the front insulating baffle to reset, and multiple chips after the detection are completed slide into the collection component, and this cycle is repeated. At this time, the push rod moves upward under the action of the collection cylinder to block. If there is no problem with the chips collected on the track seat, the collection cylinder is reset and Under the action of air blowing in the air blowing slot, it is transported obliquely downward and directly passes through the retest component to enter the next collection station; if there are problematic chips collected on the track seat, the pressure rod will move downward under the action of the pressure cylinder and be pressed on the second position blocked by the push rod, that is, the second chip, and the push rod will move downward, the first chip will slide onto the retest track, and the baffle will be blocked in front of the chip by the downward movement of the limit cylinder, and the retest cylinder will be driven by the optical fiber sensor to sense the chip so that the high-voltage test claws on both sides are pushed and connected to the chip optocoupler pins to complete the high-voltage retest. After the test is completed, the limit cylinder will move upward to transport the retested chip to the next station, that is, if there is a problem chip, it can be transported to another station to complete the sorting, and this cycle will complete the retest of this batch of chips with problems.

[0033] The present invention is not limited to the above-mentioned best implementation mode. Anyone can derive other various forms of high-voltage retesting and sorting devices for integrated circuit chips under the inspiration of the present invention. All equivalent changes and modifications made according to the scope of the patent application of the present invention shall fall within the scope of the present invention.

Claims

1. An integrated circuit chip high voltage retest and sorting device, characterized in that: It includes an inclined gravity conveyor line, along the conveying direction of the gravity conveyor line, a detection component, a collection component and a re-test component are sequentially arranged, the collection component includes a vertically arranged collection cylinder and a pressure cylinder, the top telescopic end of the collection cylinder is fixedly connected to a push rod for blocking the chip from entering the re-test component, the bottom telescopic end of the pressure cylinder is fixedly connected to a pressure rod for limiting the secondary chip after being blocked by the push rod; the re-test component includes a vertically arranged limit cylinder, the bottom end of the limit cylinder is fixedly connected to a baffle to limit the chip from sliding down, re-test cylinders are symmetrically arranged on both sides of the gravity conveyor line, and the opposite ends of the two re-test cylinders are provided with high-voltage test claws for top-connecting the optocoupler pins on both sides of the chip.

2. The integrated circuit chip high voltage retesting and sorting device according to claim 1, characterized in that: The gravity conveyor line includes a detection track, a collection track and a re-test track which are spliced ​​in sequence. The collection track includes a track seat, and the track seat is symmetrically provided with two slide grooves for cooperating with the sliding of the optocoupler pins on both sides of the chip. Two limit pressure blocks are symmetrically fixed on the top of the track seat, and the two limit pressure blocks extend toward each other and have stepped grooves on the bottom to cooperate with the chip.

3. The integrated circuit chip high voltage retesting and sorting device according to claim 2, characterized in that: The limiting pressing block is provided with a blowing hole vertically through it, and the bottom of the limiting pressing block is provided with a blowing groove obliquely to facilitate blowing the chip, the blowing groove is connected with the stepped groove, and the top of the blowing hole is connected with an external air pump.

4. The integrated circuit chip high voltage retesting and sorting device according to claim 2, characterized in that: The detection track has the same structure as the collecting track, and both include an upper guide plate and a lower guide plate. The bottom of the upper guide plate is provided with a straight groove for the top of the chip to be embedded and slide, and a sliding groove for the chip is formed between the straight groove and the lower guide plate. Detection cylinders are also symmetrically arranged on both sides of the detection track, and the facing ends of the two detection cylinders are provided with high-voltage test claws for top-connecting the optocoupler pins on both sides of the chip.

5. The integrated circuit chip high voltage retesting and sorting device according to claim 4, characterized in that: The detection component also includes two baffle cylinders, the telescopic ends at the bottom of the two baffle cylinders are respectively connected to the front insulating baffle and the rear insulating baffle, and the upper guide plate is vertically provided with telescopic grooves for the front insulating baffle, the rear insulating baffle and the baffle to pass through.

6. The integrated circuit chip high voltage retesting and sorting device according to claim 4, characterized in that: Optical fiber sensing seats are provided above and below the detection track and the collecting track. The optical fiber sensing seats are provided with a plurality of sensing holes for vertical insertion of optical fiber sensors at intervals. Through holes corresponding to the sensing holes are penetrated through the upper guide plate and the lower guide plate.

7. The integrated circuit chip high voltage retesting and sorting device according to claim 1, characterized in that: Partitions are provided between the detection component and the collection component, and between the collection component and the re-test component. Through holes for the chip to pass through are opened on the partitions. The pressure cylinder, the limit cylinder, and the baffle cylinder are all fixedly connected to the partitions.

8. The integrated circuit chip high voltage retesting and sorting device according to claim 2, characterized in that: The bottoms of the detection track, the collection track and the re-detection track are all fixedly arranged on the same bottom plate.

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