Conducting strip stamping die

Abstract

The utility model relates to the technical field of conducting strip stamping dies, in particular to a conducting strip stamping die which comprises a lower die base, a lower die containing groove is formed in the center of the top of the lower die base, limiting blocks are fixedly connected to the positions, located on the left side and the right side of the lower die containing groove, of the top of the lower die base, and a replaceable lower die mechanism is arranged in the lower die containing groove. An upper die base is arranged above the lower die base, a connecting block is fixedly connected to the center of the bottom of the upper die base, clamping grooves are formed in the left side and the right side of the connecting block, an upper die is arranged at the bottom of the upper die base, a connecting groove is formed in the center of the top of the upper die, and two dismounting and replacing mechanisms which are symmetrically arranged are arranged at the tops of the left side and the right side of the upper die. According to the conducting strip stamping die, the replaceable lower die mechanism, the upper die base, the upper die and the dismounting and replacing mechanism are used in cooperation, so that when the conducting strip stamping die is used, dies at different punching positions can be replaced according to conducting strips at different hole positions, and the practicability of the stamping die is improved.

Description

Technical Field

[0001] The utility model mainly relates to the technical field of conductive sheet stamping dies, in particular to a conductive sheet stamping die. Background Art

[0002] Conductive sheets are electronic components used to conduct current. They are usually made of conductive materials and come in many different shapes and sizes. They are widely used in electronic equipment, communication equipment, automobiles, and other fields. According to different applications, conductive sheets can be divided into various precision conductive sheets, grounding sheets, heat sinks, etc. During the processing of conductive sheets, specific molds need to be used to stamp and shape them. Therefore, conductive sheet stamping molds are required.

[0003] After searching, the utility model patent with announcement number CN218532598U discloses a conductive sheet stamping die, including a lower die base, whose upper surface is provided with a die cavity; an upper die base, which is arranged above the lower die base, and the upper die base can move upward or downward in the vertical direction relative to the lower die base; an upper module, which is fixedly mounted on the lower surface of the upper die base, and the upper module can be embedded in the die cavity when the upper die base moves downward; a mounting plate assembly, which is mounted on the upper module, and the mounting plate assembly is detachably connected to the upper module; in this patent, due to the different thicknesses of the conductive sheet, the user can adjust the thickness of the mounting plate assembly as needed before stamping, and when the hydraulic press drives the upper die base upward, the upper module and the mounting plate assembly can move upward, and the adjustable elastic guide component can also lift the support plate upward, so that the conductive sheet pops up, avoiding the problem that the conductive sheet is difficult to remove after being stamped.

[0004] However, the above patented technical solution still has the following shortcomings when used:

[0005] 1. Although the above patented technical solution can adjust the thickness of the mounting plate assembly according to the thickness of the conductive sheet, since the conductive sheet has many different shapes, the above patented technical solution can only perform stamping processing on the conductive sheets with the same hole positions, and cannot replace the dies with different punching positions for the conductive sheets with different hole positions, resulting in a decrease in the practicality of the stamping die;

[0006] 2. Although the above patented technical solution can lift the support plate upward through the adjustable elastic guide component to avoid the problem that the conductive sheet is difficult to remove after being stamped, the position of the adjustable elastic guide component in the above patented technical solution interferes with the position of the mounting plate assembly. When the mounting plate assembly contacts the support plate, it is affected by the sliding rod and cannot continue to push the support plate downward. Therefore, the conductive sheet cannot be ejected upward, resulting in a decrease in the stability of the mold during use.

[0007] Therefore, we provide a conductive sheet stamping die to solve the defects of the above solution. Utility Model Content

[0008] The utility model mainly provides a conductive sheet stamping die, which is used to solve the technical problems raised in the above background technology.

[0009] The technical solution adopted by the utility model to solve the above technical problems is:

[0010] A conductive sheet stamping die comprises a lower die base, a lower die placement groove is provided at the top center of the lower die base, limiting blocks are fixedly connected to the top of the lower die base and on the left and right sides of the lower die placement groove, a replaceable lower die mechanism is provided inside the lower die placement groove, guide pillars are fixedly connected to the four corners of the top of the lower die base, an upper die base is provided above the lower die base, a connecting block is fixedly connected to the bottom center of the upper die base, clamping grooves are provided on the left and right sides of the connecting block, an upper die is provided at the bottom of the upper die base, a connecting groove is provided at the top center of the upper die, a plurality of evenly distributed through holes are provided on the left and right sides of the bottom end of the connecting groove, and two symmetrically arranged disassembly and replacement mechanisms are provided on the top of the left and right sides of the upper die.

[0011] Furthermore, the replaceable lower mold mechanism includes a lower mold shell located inside the lower mold placement groove, the top of the left and right sides of the lower mold shell are fixedly connected to limit plates, the top of the limit plate is provided with a limit slot, the side of the limit plate away from the lower mold shell is fixedly connected with a carrying rod, the inner walls on the left and right sides of the lower mold shell are provided with vertical slide grooves, the bottom end of the vertical slide groove is fixedly connected with a return spring 1, a support plate is provided inside the lower mold shell, the left and right sides of the support plate are fixedly connected with sliders, the left and right sides of the top of the support plate are fixedly connected with baffles, the left and right sides of the top of the support plate are provided with a number of evenly distributed jacks, and the left and right sides of the bottom end of the lower mold shell are fixedly connected with a number of evenly distributed push rods.

[0012] Furthermore, the lower mold shell is slidably connected to the lower mold placement groove, the position of the limiting groove corresponds to the position of the limiting block, and the limiting groove and the limiting block are slidably connected.

[0013] Furthermore, the support plate is slidably connected to the vertical sliding grooves opened on the left and right inner walls of the lower mold shell through sliders arranged on the left and right sides, the bottom of the slider is fixedly connected to the top of the return spring, the number and position of the push rods correspond to the number and position of the sockets, the push rods are slidably connected to the sockets, the number and position of the sockets correspond to the number and position of the through holes, and a damper is provided inside the return spring.

[0014] Furthermore, the disassembly and replacement mechanism includes a clamping box fixedly connected to the top of the left and right sides of the upper mold, and transverse sliding grooves are provided on the inner walls of the front and rear sides of the clamping box. A movable plate is provided inside the clamping box close to the upper mold, and guide sliders are fixedly connected to the front and rear sides of the movable plate. The movable plate is fixedly connected to the clamping plate close to the upper mold, and a pull rod is fixedly connected to the center of the movable plate away from the upper mold. The pull rod passes through one end of the clamping box and is fixedly connected to a hand-pull plate. The movable plate is away from the upper mold and is fixedly connected to two reset springs on both sides of the pull rod.

[0015] Furthermore, the movable plate is slidably connected to the transverse sliding grooves opened on the inner walls of the front and rear sides of the snap-in box through guide sliders arranged on the front and rear sides, the pull rod is slidably connected to the through-point of the snap-in box, the second return spring is fixedly connected to the inner wall of the snap-in box at one end away from the movable plate, and a damper is provided inside the second return spring.

[0016] Furthermore, the snap-in plate passes through the snap-in box and the upper mold, the upper mold is slidably connected to the connecting block via an opened connecting groove, the connecting block is snap-connected to the snap-in plate via the opened snap-in groove, and the snap-in plate is slidably connected to the snap-in box and the upper mold at the penetration point.

[0017] Furthermore, T-shaped slide grooves are provided on the left and right sides of the bottom of the upper mold, and a mounting plate is provided at the bottom of the upper mold. The mounting plate is provided with hole grooves corresponding to the number and positions of the through holes, and T-shaped slide bars are fixedly connected on the left and right sides of the top of the mounting plate. The mounting plate is slidably connected to the T-shaped slide grooves provided on the left and right sides of the bottom of the upper mold through the T-shaped slide bars provided on the left and right sides of the top.

[0018] Compared with the prior art, the beneficial effects of the utility model are:

[0019] 1. The utility model cooperates with a replaceable lower mold mechanism, an upper mold base, an upper mold and a disassembly and replacement mechanism for use. When punching conductive sheets with different hole positions, the processing personnel can lift the replaceable lower mold mechanism for replacement, and the upper mold can be removed by the disassembly and replacement mechanism, and then the upper and lower molds corresponding to the hole positions of the conductive sheets can be replaced and reassembled. When the conductive sheet stamping mold is used, the molds of different punching positions can be replaced for conductive sheets with different hole positions, thereby improving the practicality of the stamping mold.

[0020] 2. The utility model cooperates with a support plate, a slider, a vertical slide groove, a return spring and a baffle plate for use. By fixing the slider to the return spring, when the support plate moves downward and loses the downward pressure, the return spring can drive the support plate to return to its original position, thereby bouncing the conductive sheet. The return spring is arranged inside the vertical slide groove, which can not only avoid the problem that the conductive sheet is difficult to take out after being stamped, but also prevent conflict with the movement direction of the upper mold. At the same time, the baffle plate can block the vertical slide groove to prevent the conductive sheet from being deformed during stamping, so that when the conductive sheet stamping mold is used, the stability of the mold during use and the quality of the conductive sheet after stamping can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0022] Figure 2 This is a schematic diagram of the internal structure of the lower die base of the utility model;

[0023] Figure 3 This is a schematic diagram of the replaceable lower mold mechanism structure of the utility model;

[0024] Figure 4 This is a schematic diagram of the internal structure of the replaceable lower mold mechanism of the utility model;

[0025] Figure 5 This is a schematic diagram of the upper mold structure of the utility model;

[0026] Figure 6 This is a schematic diagram of the internal top view of the upper mold of the utility model;

[0027] Figure 7 It is a schematic diagram of the internal top view of the disassembly, assembly and replacement mechanism of the utility model.

[0028] In the figure: 1, lower die base; 101, guide column; 102, lower die placement groove; 103, limit block; 2, upper die base; 201, connection block; 202, clamping groove; 3, replaceable lower die mechanism; 301, lower die shell; 302, limit plate; 303, limit groove; 304, hand lever; 305, vertical slide groove; 306, support plate; 307, jack; 308, slider; 309, ejector rod; 310, reset spring 1; 311, baffle; 4, upper mold; 401, connecting groove; 402, through hole; 403, T-shaped slide groove; 404, mounting plate; 405, T-shaped slide bar; 5, disassembly and replacement mechanism; 501, snap-in box; 502, horizontal slide groove; 503, movable plate; 504, guide slider; 505, pull rod; 506, hand pull plate; 507, reset spring 2; 508, snap-in plate. DETAILED DESCRIPTION

[0029] In order to facilitate the understanding of the present invention, the present invention will be described in more detail below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings, but the present invention can be implemented in different forms and is not limited to the embodiments described in the text. On the contrary, these embodiments are provided to make the content disclosed in the present invention more thorough and comprehensive.

[0030] For examples, please refer to the attached Figure 1-7 As shown, a conductive sheet stamping die comprises a lower die base 1, a lower die placement groove 102 is provided at the top center of the lower die base 1, limited blocks 103 are fixedly connected to the top of the lower die base 1 and on the left and right sides of the lower die placement groove 102, a replaceable lower die mechanism 3 is provided inside the lower die placement groove 102, guide pillars 101 are fixedly connected to the four corners of the top of the lower die base 1, an upper die base 2 is provided above the lower die base 1, a connecting block 201 is fixedly connected to the bottom center of the upper die base 2, and clamping grooves 202 are provided on the left and right sides of the connecting block 201, an upper die 4 is provided at the bottom of the upper die base 2, a connecting groove 401 is provided at the top center of the upper die 4, a plurality of evenly distributed through holes 402 are provided on the left and right sides of the bottom end of the connecting groove 401, and two symmetrically arranged disassembly and replacement mechanisms 5 are provided on the left and right sides of the upper die 4.

[0031] The replaceable lower mold mechanism 3 includes a lower mold shell 301 located inside the lower mold placement groove 102, the tops of the left and right sides of the lower mold shell 301 are fixedly connected to limit plates 302, the tops of the limit plates 302 are provided with limit grooves 303, the side of the limit plate 302 away from the lower mold shell 301 is fixedly connected with a carrying rod 304, the inner walls of the left and right sides of the lower mold shell 301 are provided with vertical slide grooves 305, the bottom ends of the vertical slide grooves 305 are fixedly connected with a return spring 310, a support plate 306 is provided inside the lower mold shell 301, and the left and right sides of the support plate 306 are fixedly connected with sliders 30 8. The left and right sides of the top of the support plate 306 are fixedly connected with baffles 311, and the left and right sides of the top of the support plate 306 are provided with a number of evenly distributed jacks 307. The left and right sides of the bottom of the lower mold shell 301 are fixedly connected with a number of evenly distributed ejector rods 309. The lower mold shell 301 is slidably connected to the lower mold placement groove 102. The position of the limit groove 303 corresponds to the position of the limit block 103, and the limit groove 303 is slidably connected to the limit block 103. The support plate 306 is connected to the vertical slide grooves 308 provided on the left and right sides of the inner wall of the lower mold shell 301. 5 is slidably connected, the bottom of the slider 308 is fixedly connected to the top of the return spring 310, the number and position of the push rod 309 correspond to the number and position of the socket 307, the push rod 309 is slidably connected to the socket 307, the number and position of the socket 307 correspond to the number and position of the through hole 402, and a damper is arranged inside the return spring 310. During stamping, the hydraulic press pushes the upper die seat downward, so that the mounting plate 404 enters the lower die shell 301, and cooperates with the support plate 306 to stamp the conductive sheet. When the support plate 306 is pushed downward by the mounting plate 404, it will drive the slider 308 When the upper die seat 2 moves downward, the return spring 310 contracts. When the hydraulic press drives the upper die seat 2 upward, the force acting on the support plate 306 disappears. The return of the return spring 310 can drive the support plate 306 to return to its original position, thereby bouncing the conductive sheet. The return spring 310 is set inside the vertical slide groove 305, which can not only avoid the problem that the conductive sheet is difficult to remove after being stamped, but also prevent conflict with the movement direction of the upper die. At the same time, the baffle 311 can block the vertical slide groove 305 to prevent the conductive sheet from being deformed during stamping, thereby improving the stability of the mold during use and the quality of the conductive sheet after stamping.

[0032] The disassembly and replacement mechanism 5 includes a clamping box 501 fixedly connected to the top of the left and right sides of the upper mold 4, and the inner walls of the front and rear sides of the clamping box 501 are provided with transverse sliding grooves 502. A movable plate 503 is provided inside the clamping box 501 near the upper mold 4. The movable plate 503 is fixedly connected with guide sliders 504 on the front and rear sides. The movable plate 503 is fixedly connected with a clamping plate 508 on the side close to the upper mold 4. A pull rod 505 is fixedly connected to the center of the movable plate 503 away from the upper mold 4. The pull rod 505 penetrates the clamping box 501. One end of the connecting box 501 is fixedly connected with a hand-pulled plate 506, and the movable plate 503 is away from the side of the upper mold 4 and is fixedly connected with a second return spring 507 on both the front and rear sides of the pull rod 505. The movable plate 503 is slidably connected with the transverse slide grooves 502 opened on the front and rear inner walls of the connecting box 501 through the guide sliders 504 arranged on the front and rear sides. The pull rod 505 is slidably connected with the through-hole of the connecting box 501. The second return spring 507 is fixedly connected with the inner wall of the connecting box 501 at one end away from the movable plate 503, and the second return spring 507 is fixedly connected with the inner wall of the connecting box 501. A damper is provided inside, and the clamping plate 508 penetrates the clamping box 501 and the upper mold 4. The upper mold 4 is slidably connected to the connecting block 201 through the opening of the connecting groove 401. The connecting block 201 is clamped to the clamping plate 508 through the opening of the clamping groove 202, and the clamping plate 508 is slidably connected to the penetration of the clamping box 501 and the upper mold 4. The processing personnel select the upper and lower molds at the corresponding positions according to the positions of the holes of the conductive sheet, and then directly lift the original lower mold shell 301 upwards through the carrying rod 304 to replace it. The new lower mold shell 301 only needs to be replaced in the lower mold placement groove 102. When replacing the upper mold 4, the processing personnel only need to pull the two hand-pull plates 506 to both sides to retract the snap-on plate 508 into the snap-on box 501, and then remove the original upper mold 4, and then dock the connecting groove 401 opened on the top of the new upper mold 4 with the connecting block 201, and then release the hand-pull plate 506 to push the snap-on plate 508 to snap into the snap-on groove 202 under the action of the reset spring 2 507 to complete the assembly.

[0033] Among them, T-shaped slide grooves 403 are opened on the left and right sides of the bottom of the upper mold 4, and a mounting plate 404 is provided at the bottom of the upper mold 4. Hole grooves corresponding to the number and positions of the through holes 402 are opened on the mounting plate 404, and T-shaped slide bars 405 are fixedly connected on the left and right sides of the top of the mounting plate 404. The mounting plate 404 is slidably connected to the T-shaped slide grooves 403 opened on the left and right sides of the bottom of the upper mold 4 through the T-shaped slide bars 405 arranged on the left and right sides of the top. When stamping the conductive sheet, the processing personnel can also pull out the mounting plate 404 according to the thickness of the conductive sheet to be stamped, and replace it with the mounting plate 404 of the corresponding thickness.

[0034] The specific operation mode of the utility model is as follows:

[0035] First, the processing personnel select the upper and lower molds at the corresponding positions according to the positions of the holes of the conductive sheet, and then directly lift up the original lower mold shell 301 through the carrying rod 304 to replace it. The new lower mold shell 301 only needs to be replaced into the lower mold placement slot 102. When replacing the upper mold 4, the processing personnel only need to pull the two hand-pull plates 506 to both sides to retract the clamping plate 508 into the clamping box 501 to remove the original upper mold 4, and then dock the connecting groove 401 opened on the top of the new upper mold 4 with the connecting block 201, and then release the hand-pull plate 506 to push the clamping plate 508 to clamp with the clamping groove 202 under the action of the reset spring 2 507 to complete the assembly. At the same time, when stamping the conductive sheet, the processing personnel can also pull out the mounting plate 404 according to the thickness of the conductive sheet to be stamped, and replace it with a mounting plate 4 of corresponding thickness. 04. During stamping, the hydraulic press pushes the upper die seat downward, allowing the mounting plate 404 to enter the lower die shell 301 and cooperate with the support plate 306 to stamp the conductive sheet. When the support plate 306 is pushed downward by the mounting plate 404, it will drive the slider 308 to move downward, causing the return spring 310 to contract. When the hydraulic press drives the upper die seat 2 upward, the force acting on the support plate 306 disappears, and the return spring 310 can return to its original position to drive the support plate 306 to bounce up the conductive sheet. Setting the return spring 310 inside the vertical slide groove 305 can not only avoid the problem that the conductive sheet is difficult to remove after being stamped, but also prevent conflict with the movement direction of the upper die. At the same time, the baffle 311 can block the vertical slide groove 305 to prevent the conductive sheet from deforming during stamping, thereby improving the stability of the mold during use and the quality of the conductive sheet after stamping.

[0036] The above description of the utility model in combination with the accompanying drawings is an exemplary description. Obviously, the specific implementation of the utility model is not limited to the above-mentioned method. As long as the non-substantial improvements are made by adopting the method concept and technical solution of the utility model, or the concept and technical solution of the utility model are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. A conductive sheet stamping die, comprising a lower die base (1), characterized in that: A lower mold placement groove (102) is provided at the center of the top of the lower mold base (1), and limit blocks (103) are fixedly connected to the top of the lower mold base (1) and on both sides of the lower mold placement groove (102). A replaceable lower mold mechanism (3) is provided inside the lower mold placement groove (102). Guide pillars (101) are fixedly connected at the four corners of the top of the lower mold base (1). An upper mold base (2) is provided above the lower mold base (1), and a connecting block (201) is fixedly connected at the center of the bottom of the upper mold base (2). The connecting block (201) is provided with clamping grooves (202) on both sides. An upper mold (4) is provided at the bottom of the upper mold base (2), and a connecting groove (401) is provided at the center of the top of the upper mold (4). A plurality of evenly distributed through holes (402) are provided on both sides of the bottom end of the connecting groove (401), and two symmetrically arranged disassembly and replacement mechanisms (5) are provided at the top of the left and right sides of the upper mold (4).

2. A conductive sheet stamping die according to claim 1, characterized in that: The replaceable lower mold mechanism (3) comprises a lower mold shell (301) located inside the lower mold placement groove (102), the tops of the left and right sides of the lower mold shell (301) are fixedly connected to limit plates (302), the tops of the limit plates (302) are provided with limit grooves (303), the side of the limit plates (302) away from the lower mold shell (301) is fixedly connected to a carrying rod (304), the inner walls of the left and right sides of the lower mold shell (301) are provided with vertical slide grooves (305), the vertical slide grooves (305) A return spring (310) is fixedly connected to the inner bottom end, a support plate (306) is provided inside the lower mold shell (301), sliders (308) are fixedly connected to the left and right sides of the support plate (306), baffles (311) are fixedly connected to the left and right sides of the top of the support plate (306), a plurality of evenly distributed jacks (307) are provided on the left and right sides of the top of the support plate (306), and a plurality of evenly distributed ejector rods (309) are fixedly connected to the left and right sides of the inner bottom end of the lower mold shell (301).

3. A conductive sheet stamping die according to claim 2, characterized in that: The lower mold shell (301) is slidably connected to the lower mold placement groove (102), the position of the limiting groove (303) corresponds to the position of the limiting block (103), and the limiting groove (303) and the limiting block (103) are slidably connected.

4. The conductive sheet stamping die according to claim 2, characterized in that: The support plate (306) is slidably connected to the vertical slide grooves (305) provided on the inner walls of the left and right sides of the lower mold shell (301) through the sliders (308) provided on the left and right sides, the bottom of the slider (308) is fixedly connected to the top of the return spring (310), the number and position of the push rods (309) correspond to the number and position of the plug holes (307), the push rods (309) are slidably connected to the plug holes (307), the number and position of the plug holes (307) correspond to the number and position of the through holes (402), and a damper is provided inside the return spring (310).

5. The conductive sheet stamping die according to claim 1, characterized in that: The disassembly and assembly replacement mechanism (5) comprises a clamping box (501) fixedly connected to the top of the left and right sides of the upper mold (4), the inner walls of the front and rear sides of the clamping box (501) are both provided with transverse sliding grooves (502), a movable plate (503) is provided inside the clamping box (501) on the side close to the upper mold (4), the front and rear sides of the movable plate (503) are both fixedly connected with guide sliders (504), the side of the movable plate (503) close to the upper mold (4) is fixedly connected with a clamping plate (508), the center of the movable plate (503) away from the upper mold (4) is fixedly connected with a pull rod (505), one end of the pull rod (505) passing through the clamping box (501) is fixedly connected with a hand pull plate (506), and the movable plate (503) away from the upper mold (4) and located on the front and rear sides of the pull rod (505) are fixedly connected with a second return spring (507).

6. The conductive sheet stamping die according to claim 5, characterized in that: The movable plate (503) is slidably connected to the transverse sliding grooves (502) provided on the inner walls of the front and rear sides of the clamping box (501) through the guide sliders (504) provided on the front and rear sides, the pull rod (505) is slidably connected to the through-hole of the clamping box (501), the end of the second return spring (507) away from the movable plate (503) is fixedly connected to the inner wall of the clamping box (501), and a damper is provided inside the second return spring (507).

7. The conductive sheet stamping die according to claim 5, characterized in that: The clamping plate (508) passes through the clamping box (501) and the upper mold (4); the upper mold (4) is slidably connected to the connecting block (201) via the opening of the connecting groove (401); the connecting block (201) is clamped to the clamping plate (508) via the opening of the clamping groove (202); and the clamping plate (508) is slidably connected to the clamping box (501) and the upper mold (4) at the penetration point.

8. The conductive sheet stamping die according to claim 1, characterized in that: The upper mold (4) is provided with T-shaped slide grooves (403) on both left and right sides of the bottom, the upper mold (4) is provided with a mounting plate (404) on the bottom, the mounting plate (404) is provided with hole grooves corresponding to the number and position of the through holes (402), the mounting plate (404) is fixedly connected with T-shaped slide bars (405) on both left and right sides of the top of the mounting plate (404), and the mounting plate (404) is slidably connected with the T-shaped slide grooves (403) provided on the left and right sides of the bottom of the upper mold (4) through the T-shaped slide bars (405) provided on the left and right sides of the top.

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